WO2002093593A1 - Foil wound low profile l-c power processor - Google Patents
Foil wound low profile l-c power processor Download PDFInfo
- Publication number
- WO2002093593A1 WO2002093593A1 PCT/IB2002/001575 IB0201575W WO02093593A1 WO 2002093593 A1 WO2002093593 A1 WO 2002093593A1 IB 0201575 W IB0201575 W IB 0201575W WO 02093593 A1 WO02093593 A1 WO 02093593A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- winding
- magnetic winding
- foil
- magnetic
- low profile
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1766—Parallel LC in series path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
- H01F2027/2857—Coil formed from wound foil conductor
Definitions
- the technical field of this disclosure is inductor devices, particularly, integrated passive components including foil wound low profile power processors having inductor and capacitor characteristics.
- Present pure planar power devices use rectangular foil alternating with rectangular insulating material, arranged in a stack.
- the insulating material typically has the undesired characteristic of low thermal conductivity accompanying the desired characteristic of low electrical conductivity.
- the insulating material lies in the primary heat flow path along the direction of the stack and impedes heat transfer.
- the rectangular shape precludes efficient conductive heat flow along the foil, because the center of the rectangle is too far from any heat sink. These factors can lead to high temperatures in the center of the device.
- litz-wire windings suffer from several disadvantages. Besides being expensive and difficult to work with, litz wire also inhibits higher winding packing densities due to the amount of insulation involved. As a result, litz- wound components often run the risk of developing hot-spot temperatures inside the windings.
- the size and weight of power conversion devices are governed by the size and weight of the passive components, i.e., capacitors, transformers, and inductors.
- the passive components i.e., capacitors, transformers, and inductors.
- a greater number of passive components not only increases the size and weight, but also increases the cost and manufacturing complexity.
- One aspect of the present invention provides a foil wound low profile power L-C processor with low profile packaging.
- Another aspect of the present invention provides a foil wound low profile power L-C processor operating at a high power density.
- Another aspect of the present invention provides a foil wound low profile power L-C processor with superior heat transfer to avoid hot spots.
- Another aspect of the present invention provides a foil wound low profile power L-C processor integrating the inductive and capacitive characteristics to reduce the number of passive components.
- FIG. 1 shows a perspective view of a prototype foil wound low profile power L-C processor made in accordance with the present invention.
- FIG. 2 shows a magnetic winding for a foil wound low profile power L-C processor made in accordance with the present invention.
- FIG. 3 shows a schematic cross section of the foil windings for a foil wound low profile power L-C processor made in accordance with the present invention.
- FIGS. 4 A & 4B show schematic cross sections of alternate embodiments of the foil windings for a foil wound low profile power L-C processor made in accordance with the present invention.
- FIG. 5 shows a schematic cross section of an alternate embodiment of the foil windings for a foil wound low profile power L-C processor made in accordance with the present invention.
- FIGS. 6 A & 6B show schematic diagrams of a foil wound low profile power L-C processor made in accordance with the present invention having a single conductive foil and connections at either end of the foil.
- FIGS. 7 A & 7B show schematic diagrams of a foil wound low profile power
- L-C processor made in accordance with the present invention having two conductive foils and connections at either end of the foils.
- FIGS. 8 A & 8B show the bi-filar winding of FIG. 7 A wired as a parallel resonator.
- FIGS. 9 A & 9B show the bi-filar winding of FIG. 7 A wired as a series resonator.
- FIGS. 10A & 10B show the bi-filar winding of FIG. 7 A used as a parallel-loaded resonant halfbridge.
- FIGS. 11 A & 1 IB show the bi-filar winding of FIG. 7 A used as a low-pass filter.
- FIG. 12 shows a top view of a foil wound low profile power L-C processor made in accordance with the method of the present invention.
- FIG. 13 shows cross-sectional view for a foil wound low profile power L-C processor made in accordance with the present invention.
- FIG. 1 shows a perspective view of a prototype foil wound low profile power L-C processor.
- the power processor 10 comprises a magnetic winding 20 having first winding terminals 30 and second winding terminals 32 disposed within a core 40.
- the power processor 10 differs from pure planar power devices by using a short cylindrical magnetic winding 20, rather than an assembly of stacked rectangular foils, and by using a core 40 that houses a cylindrical magnetic winding 20.
- the power processor 10 is best described as a foil-wound low-profile magnetic component. Although it is not a pure planar power device, power processor 10 maintains the low profile desirable for product design and performance.
- the use of a cylindrical winding allows much higher material utilization than stacked rectangular devices in terms of power density and energy density.
- the power processor shown in FIG. 1 is a prototype device. Further refinements are possible.
- the low profile lends itself to flat packaging the power processor within a compact shell for mounting. Terminals can be brought out of the package as required for the specific application or to meet standard board layouts.
- the flat surface can also be provided with fins, a fan, or other cooling features.
- the flat profile and vertical winding are conducive to transferring heat from the power processor: the heat generated is close to the heat sink and flows vertically along the conductive foil. Passive integration can be achieved by incorporating the capacitance and inductance of the power processor into the circuit design in which the power processor is used.
- FIG. 2 illustrates a magnetic winding 20 for a foil wound low profile power L-
- the magnetic winding 20 can have a center aperture 22 and can be formed of turns of electrically conductive foil with an insulation film. See FIG. 3.
- the tape winding can be shaped in the forms of short cylinders with the cylindrical diameter larger than its axial thickness, and are also commonly referred to as foil or barrel windings.
- the mechanical strength and electrical properties of magnetic winding 20 can be enhanced during fabrication with processes such as vacuum impregnation and encapsulation.
- the magnetic winding 20 can be any thickness required for the particular application.
- the diameter is substantially larger than the axial length, creating a vertical winding.
- the windings can have a ratio of the foil- winding diameter to the foil winding thickness of greater than or equal to 10:1, which is generally considered the ratio for planar or substantially low profile components. The low profile is desirable for circuit board mounting and heat transfer.
- the magnetic winding 20 is provided with first winding terminals 30 and second winding terminals 32.
- the winding terminals provide the electrical connections between the power processor and outside devices.
- the winding terminals can be made of any conductive material compatible with the manufacturing process and the surrounding materials, and in various embodiments, can be made of copper, gold, silver, or aluminum.
- the winding terminals are in electrical contact with individual turns of the tape winding's electrically conductive foil and can be welded or press fit in place.
- the radial location of the winding terminals is selected to achieve varied operating output characteristics during operation, such as varying voltages.
- Multiple winding terminals can be used to provide multiple taps and cross connections to provide desired inductance and capacitance as required for a particular application.
- FIG. 3 shows a schematic cross section of the foil windings for a foil wound low profile power L-C processor.
- Long strips of electrically conductive foil 26 and insulation film 24 are wound about a common axis to form alternating layers of conductive foil 26 and insulation film 24.
- the insulation film 24 acts both as the insulator and the dielectric, filling the space between adjacent conductive turns of the conductive foil 26.
- Each turn of the conductive foil 26 is insulated from the next turn by the insulation film 24, which is slightly wider than the conductive foil 26.
- the extra width of the insulation film 24 prevents shorting one turn of the conductive foil 26 to the next, and can be achieved by the initial selection of relative widths between the insulation film 24 and the conductive foil 26, or by etching the magnetic winding 20 to reduce the width of the conductive foil 26 after the magnetic winding 20 is wound.
- the conductive foil 26 can be copper and the insulation film 24 can be a polymer, such as polyethylene terephthalate (PET) film, Mylar ® brand polyester film, or nano-structure polymer-ceramic composite film. Polymer dielectric films with relative permittivities of above 5 are readily available for dielectric applications.
- the conductive foil 26 can be made of gold, silver, or aluminum, or alloys of copper, gold, silver, or aluminum to improve the workability and strength of the conductive foil 26. Different materials of different thickness can be selected to meet the desired performance and will be well understood by those skilled in the art. The thickness of the conductive foil 26 can be small compared to the skin depth at the design frequency. In an alternate embodiment, several layers of foil can be wound in parallel for each turn of insulation film 24, so that the conductive foil 26 comprises several layers of foil.
- the conductive foil 26 and the insulation film 24 can be of integral construction: the conductive foil 26 can be disposed as a surface layer on the insulation film 24 or the insulation film 24 can be disposed as a surface layer on the conductive foil 26.
- the surface layer can be applied by thin film deposition, i.e., through evaporation.
- the integral insulation film 24 disposed on the conductive foil 26 can be metal oxides, metal fluorides, or similar materials.
- the magnetic winding 20 can be made of multiple sets of conductive foil and insulation film, forming bi-filar, tri-filar, or n-filar windings, and providing individual units that can be connected or left independent, as required in a particular application.
- conductive foil thicknesses, layer combinations, and material can be used for each set.
- the illustrated embodiments show one or two conductive foils wound together to form the magnetic winding 20, as many foils as desired can be wound together to fit a particular application and will be well understood by those skilled in the art.
- using various intermediate taps, cross connections between sets, and various end cross connections provides a large number of different configurations suitable for any particular purpose, a few of which are shown for purpose of illustration in FIG. 6A & 6B through FIG. 11 A & 1 IB below.
- FIGS. 4 A & 4B show the schematic cross sections of alternate embodiments of the foil windings for a foil wound low profile power L-C processor. In FIG.
- a dielectric film 28 is wound with the alternating layers of conductive foil 26 and insulation film 24.
- the dielectric film rests on the one side of each turn and occupies all the space between adjacent conductive turns of the conductive foil 26, other than the space that is occupied by the insulation film 24.
- FIG. 4A shows an embodiment with the dielectric film 28 wound on the other side of the conductive foil 26.
- FIG. 5 shows a schematic cross section of an alternate embodiment of the foil windings for a foil wound low profile power L-C processor.
- a first conductive foil 25 and first insulation film 23 are wound simultaneously, turn-by-turn, with a second conductive foil 29 and second insulation film 27. This provides opportunities for different terminal impedances, as discussed for FIG. 6B below.
- FIGS. 6 A & 6B show one embodiment of the invention having a single conductive foil and connections at either end of the foil.
- FIG. 6 A shows a winding as described in FIGS. 3, 4 A, and 4B.
- a single conductive foil 26 is wound with insulation film and/or dielectric film (not shown). Terminals are attached to the conductive foil at the ends at inner connection 62 and outer connection 64. This produces a parallel resonator circuit having a transmission line equivalent circuit of series inductors 66 with parallel capacitors 68, as shown in FIG. 6B.
- FIGS. 7 A & 7B show one embodiment of the invention having a two conductive foils and connections at either end of the foils.
- FIG. 7 A shows a winding as described in FIG.
- first conductive foil 25 having a first outer connection 71 and a first inner connection 73
- second conductive foil 29 having a second outer connection 72 and a second inner connection 74.
- the equivalent circuit is shown in FIG. 7B.
- connection and cross connection of the inner and outer connections as discussed below.
- FIGS. 8A & 8B show the bi-filar winding of FIG. 7A wired as a parallel resonator.
- First inner connection 73 and second outer connection 72 are electrically connected, with connection to exterior circuits provided by first outer connection 71 and second inner connection 74. This produces a parallel resonator circuit having a transmission line equivalent circuit of series inductors with parallel capacitors, as shown in FIG. 8B.
- FIGS. 9 A & 9B show the bi-filar winding of FIG. 7 A wired as a series resonator.
- First inner connection 73 and second outer connection 72 are not connected. Connection to exterior circuits is provided by first outer connection 71 and second inner connection 74. This produces a series resonator circuit having a transmission line equivalent circuit of inductors and capacitors in series, as shown in FIG. 9B.
- FIGS. 10A & 10B show the bi-filar winding of FIG. 7A used as a parallel- loaded resonant halfbridge.
- An input voltage is applied across positive terminal 80 and negative terminal 81.
- first MOSFET 82 and second MOSFET 83 installed across first diode 84 and second diode 85, respectively, a chopped voltage signal is created across second diode 85.
- First outer connection 71 is connected between first diode 84 and second diode 85.
- Second outer connection 72 is not connected.
- Second inner connection 74 is connected to negative terminal 81.
- the smoothed output voltage is applied to the load between first inner connection 73 and second inner connection 74.
- the equivalent circuit is shown in FIG. 10B.
- FIGS. 11 A & 1 IB show the bi-filar winding of FIG. 7 A used as a low-pass filter.
- An input voltage is applied at first outer connection 71.
- Second outer connection 72 is not connected.
- Second inner connection 74 is grounded and the output voltage is applied to the load between first inner connection 73 and second inner connection 74.
- the equivalent circuit is shown in FIG. 1 IB.
- FIGS. 10A & 10B and FIGS. 11A & 1 IB illustrate specific applications and embodiments of the present invention, and are not intended the limit the scope of the present disclosure or claims to that which is presented therein.
- FIGS. 10A & 10B and FIGS. 11A & 1 IB illustrate specific applications and embodiments of the present invention, and are not intended the limit the scope of the present disclosure or claims to that which is presented therein.
- FIGS. 10A & 10B and FIGS. 11A & 1 IB illustrate specific applications and embodiments of the present invention, and are not intended the limit the scope of the present disclosure or claims to that which is presented therein.
- FIG. 12 shows a top view of a foil wound low profile power L-C processor.
- First half core 42 and second half core 44 (shown in FIG. 13) enclose the magnetic winding 20 to form power processor 10.
- the core halves can be made of materials typically used for transformer cores, such as ferrite.
- the core can be any shape suited to be generally disposed about the magnetic winding 20 and to provide passage for the winding terminals. Viewed along the axis of the magnetic winding 20, the core shape can be rectangular or cruciform with various cutouts for the winding terminals.
- a center post for disposition within the magnetic winding 20 can be included or omitted.
- the core geometry can be an substantial alteration of standard configurations, such as PQ, RM, or EQ core designs, flattened to allow for the low profile of the magnetic winding 20 and with different relative dimensions.
- Core 40 comprises the first half core 42 and the second half core 44.
- First center post 41 of the first half core 42 and second center post 43 of the second half core 44 pass through the center aperture 22 of the magnetic winding 20.
- the combined length of first center post 41 and second center post 43 is shorter than the thickness of the magnetic winding 20 plus insulators, so an air gap 50 is formed between the center posts in the center aperture 22.
- the center posts can be made of non-magnetic, non- conductive materials. The air gap 50 and non-magnetic center posts reduce the leakage inductance of the magnetic winding 20.
- First insulator 45, edge insulator 46, and second insulator 47 fill the space between magnetic winding 20 and the core.
- the thicknesses of the first insulator 45, edge insulator 46, and second insulator 47 control the size of integrated leakage inductance, i.e., the fraction of magnetic energy that is stored.
- the materials for the insulators are selected for high electrical resistance and low thermal resistance. The low thermal resistance of the insulators helps achieve low thermal gradients from the inside to the outside of the power processor, providing high thermal stability. Possible materials for the insulators are air, thermally conductive pads, or resin based potting material.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Of Transformers For General Uses (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02722634A EP1393331A1 (en) | 2001-05-11 | 2002-05-06 | Foil wound low profile l-c power processor |
JP2002590375A JP2004529574A (en) | 2001-05-11 | 2002-05-06 | Foil-wrapped thin power LC processor |
KR10-2003-7000263A KR20030025263A (en) | 2001-05-11 | 2002-05-06 | Foil wound low profile l-c power processor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/853,204 | 2001-05-11 | ||
US09/853,204 US6528859B2 (en) | 2001-05-11 | 2001-05-11 | Foil wound low profile L-C power processor |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002093593A1 true WO2002093593A1 (en) | 2002-11-21 |
Family
ID=25315359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2002/001575 WO2002093593A1 (en) | 2001-05-11 | 2002-05-06 | Foil wound low profile l-c power processor |
Country Status (6)
Country | Link |
---|---|
US (1) | US6528859B2 (en) |
EP (1) | EP1393331A1 (en) |
JP (1) | JP2004529574A (en) |
KR (1) | KR20030025263A (en) |
CN (1) | CN1266714C (en) |
WO (1) | WO2002093593A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7671713B2 (en) | 2007-02-07 | 2010-03-02 | Zhe Jiang University | Integrated structure of passive elements in LLC resonance converter realized by flexible circuit boards |
US7974069B2 (en) | 2008-10-29 | 2011-07-05 | General Electric Company | Inductive and capacitive components integration structure |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7118783B2 (en) * | 2002-06-26 | 2006-10-10 | Micron Technology, Inc. | Methods and apparatus for vapor processing of micro-device workpieces |
US7342300B2 (en) * | 2003-06-30 | 2008-03-11 | Zarbana Digital Fund Llc | Integrated circuit incorporating wire bond inductance |
CN101206947A (en) * | 2007-11-08 | 2008-06-25 | 浙江大学 | Inductance capacitance integrated structure implemented by flexible circuit board in EMI filter |
CN102682990B (en) * | 2012-05-13 | 2014-01-01 | 江苏有能电力自动化有限公司 | Technique for sintering foil type capacitive coil |
ITMI20121383A1 (en) * | 2012-08-03 | 2014-02-04 | Sergio Ferrarini | INTEGRATED RESONANT TRANSFORMER. |
JP6352791B2 (en) * | 2014-12-11 | 2018-07-04 | Ckd株式会社 | Coil sheet, coil, and method of manufacturing coil |
US11114232B2 (en) * | 2017-09-12 | 2021-09-07 | Raycap IP Development Ltd | Inductor assemblies |
CN115398572A (en) * | 2020-03-11 | 2022-11-25 | 瑞凯股份公司 | Inductor assembly and method for forming the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5296830A (en) * | 1991-05-27 | 1994-03-22 | Toko Kabushiki Kaisha | Choke coil |
WO1999022565A2 (en) * | 1997-11-04 | 1999-05-14 | Koninklijke Philips Electronics N.V. | Planar magnetic component with transverse winding pattern |
EP0935261A2 (en) * | 1998-02-09 | 1999-08-11 | American Superconductor Corporation | Resistive fault current limiter |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3579084A (en) * | 1969-09-10 | 1971-05-18 | Atto Lab Inc | Ferroresonant power device |
FR2249489B1 (en) * | 1973-10-29 | 1977-05-27 | Lead | |
DE4143120A1 (en) * | 1991-01-03 | 1992-07-09 | Huettlinger Fa Joh L | Tunable electric coil e.g. line resonator, filter - comprises resonant LC circuit with electronically variable inductor |
US5594397A (en) * | 1994-09-02 | 1997-01-14 | Tdk Corporation | Electronic filtering part using a material with microwave absorbing properties |
US6191676B1 (en) * | 1994-10-21 | 2001-02-20 | Spinel Llc | Apparatus for suppressing nonlinear current drawing characteristics |
DE69620859T2 (en) * | 1996-01-22 | 2002-10-31 | Telefonaktiebolaget Lm Ericsson, Stockholm | Earth-symmetrical semiconductor integrated arrangement with a parallel resonance circuit |
US6144269A (en) * | 1997-06-10 | 2000-11-07 | Fuji Electric Co., Ltd. | Noise-cut LC filter for power converter with overlapping aligned coil patterns |
-
2001
- 2001-05-11 US US09/853,204 patent/US6528859B2/en not_active Expired - Fee Related
-
2002
- 2002-05-06 CN CNB028015436A patent/CN1266714C/en not_active Expired - Fee Related
- 2002-05-06 EP EP02722634A patent/EP1393331A1/en not_active Withdrawn
- 2002-05-06 KR KR10-2003-7000263A patent/KR20030025263A/en not_active Application Discontinuation
- 2002-05-06 WO PCT/IB2002/001575 patent/WO2002093593A1/en not_active Application Discontinuation
- 2002-05-06 JP JP2002590375A patent/JP2004529574A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5296830A (en) * | 1991-05-27 | 1994-03-22 | Toko Kabushiki Kaisha | Choke coil |
WO1999022565A2 (en) * | 1997-11-04 | 1999-05-14 | Koninklijke Philips Electronics N.V. | Planar magnetic component with transverse winding pattern |
EP0935261A2 (en) * | 1998-02-09 | 1999-08-11 | American Superconductor Corporation | Resistive fault current limiter |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7671713B2 (en) | 2007-02-07 | 2010-03-02 | Zhe Jiang University | Integrated structure of passive elements in LLC resonance converter realized by flexible circuit boards |
US7974069B2 (en) | 2008-10-29 | 2011-07-05 | General Electric Company | Inductive and capacitive components integration structure |
Also Published As
Publication number | Publication date |
---|---|
CN1462458A (en) | 2003-12-17 |
KR20030025263A (en) | 2003-03-28 |
CN1266714C (en) | 2006-07-26 |
EP1393331A1 (en) | 2004-03-03 |
JP2004529574A (en) | 2004-09-24 |
US6528859B2 (en) | 2003-03-04 |
US20020167069A1 (en) | 2002-11-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6664883B2 (en) | Apparatus and method for PCB winding planar magnetic devices | |
US10403428B2 (en) | Winding module, hybrid transformer, module and circuit for DC-DC power conversion | |
CN107534424B (en) | Noise filter | |
US7911308B2 (en) | Low thermal impedance conduction cooled magnetics | |
US6528859B2 (en) | Foil wound low profile L-C power processor | |
US6529363B2 (en) | Capacitor integrated into transformer by multi-layer foil winding | |
JP3614816B2 (en) | Magnetic element and power source using the same | |
US6380834B1 (en) | Planar magnetic assembly | |
JPH0296312A (en) | Integrated power capacitor and inductor/transformer using insulated amorphous metal ribbon | |
CN109462383B (en) | Resonant circuit and filter | |
US7492240B1 (en) | Integrated capacitor and inductor | |
US20230207178A1 (en) | Thermal management of transformer windings | |
EP1782440B1 (en) | Coil form for forming an inductive element | |
EP3893256B1 (en) | Semi-planar transformer | |
US20020149459A1 (en) | Foil wound low profile L-T power processor | |
Ramakrishnan et al. | A comparison study of low-profile power magnetics for high-frequency, high-density switching converters | |
JP2010153178A (en) | Induction heating lc module | |
JP2001167930A (en) | Coil for inductor and its manufacturing method | |
JP3048593B2 (en) | Hybrid integrated circuit components | |
KR100388604B1 (en) | Reactor having rectangular coil winded in elliptical edge-wise helicies and method of manufacturing thereof | |
Hofsajer et al. | Volume considerations of planar integrated Components | |
JP7420092B2 (en) | isolation transformer | |
WO2020134000A1 (en) | Resonant circuit and filter | |
JP2020194831A (en) | Electronic component and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CN JP KR |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 028015436 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020037000263 Country of ref document: KR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2002722634 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020037000263 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2002590375 Country of ref document: JP |
|
WWP | Wipo information: published in national office |
Ref document number: 2002722634 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2002722634 Country of ref document: EP |