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Three-dimensional electronic device and relative manufacture method

Info

Publication number
WO2002091469A3
WO2002091469A3 PCT/IT2002/000304 IT0200304W WO2002091469A3 WO 2002091469 A3 WO2002091469 A3 WO 2002091469A3 IT 0200304 W IT0200304 W IT 0200304W WO 2002091469 A3 WO2002091469 A3 WO 2002091469A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
circuit
electronic
contact
integrated
device
Prior art date
Application number
PCT/IT2002/000304
Other languages
French (fr)
Other versions
WO2002091469A2 (en )
Inventor
Mario Palazzetti
Eugenio Faggioli
Riccardo Groppo
Original Assignee
Fiat Ricerche
Mario Palazzetti
Eugenio Faggioli
Riccardo Groppo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657Stacked arrangements of devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/04All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers
    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/0651Wire or wire-like electrical connections from device to substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/04All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers
    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/06551Conductive connections on the side of the device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/04All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers
    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/06572Auxiliary carrier between devices, the carrier having an electrical connection structure
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/04All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers
    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/06575Auxiliary carrier between devices, the carrier having no electrical connection structure
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

There is described a three-dimensional electronic device (10) having a first and a second electronic circuit (12, 14) stacked one on top of the other and having respective contact pads (22); and a substantially C-shaped spacer member (26) made of electrically conducting material and extending between the first and second electronic circuit (12, 14) to connect a first contact pad (22a) of the first integrated circuit (12) electrically to a second contact pad (22b) of the second integrated circuit (14).
PCT/IT2002/000304 2001-05-08 2002-05-07 Three-dimensional electronic device and relative manufacture method WO2002091469A3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITTO2001A000433 2001-05-08
ITTO20010433 2001-05-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20020733231 EP1419529A2 (en) 2001-05-08 2002-05-07 Three-dimensional electronic device and relative manufacture method

Publications (2)

Publication Number Publication Date
WO2002091469A2 true WO2002091469A2 (en) 2002-11-14
WO2002091469A3 true true WO2002091469A3 (en) 2004-03-04

Family

ID=11458842

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IT2002/000304 WO2002091469A3 (en) 2001-05-08 2002-05-07 Three-dimensional electronic device and relative manufacture method

Country Status (2)

Country Link
EP (1) EP1419529A2 (en)
WO (1) WO2002091469A3 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551629A (en) * 1980-09-16 1985-11-05 Irvine Sensors Corporation Detector array module-structure and fabrication
US5568356A (en) * 1995-04-18 1996-10-22 Hughes Aircraft Company Stacked module assembly including electrically interconnected switching module and plural electronic modules
US5631497A (en) * 1990-07-11 1997-05-20 Hitachi, Ltd. Film carrier tape and laminated multi-chip semiconductor device incorporating the same
US5673478A (en) * 1995-04-28 1997-10-07 Texas Instruments Incorporated Method of forming an electronic device having I/O reroute
US5818107A (en) * 1997-01-17 1998-10-06 International Business Machines Corporation Chip stacking by edge metallization
US6098278A (en) * 1994-06-23 2000-08-08 Cubic Memory, Inc. Method for forming conductive epoxy flip-chip on chip

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551629A (en) * 1980-09-16 1985-11-05 Irvine Sensors Corporation Detector array module-structure and fabrication
US5631497A (en) * 1990-07-11 1997-05-20 Hitachi, Ltd. Film carrier tape and laminated multi-chip semiconductor device incorporating the same
US6098278A (en) * 1994-06-23 2000-08-08 Cubic Memory, Inc. Method for forming conductive epoxy flip-chip on chip
US5568356A (en) * 1995-04-18 1996-10-22 Hughes Aircraft Company Stacked module assembly including electrically interconnected switching module and plural electronic modules
US5673478A (en) * 1995-04-28 1997-10-07 Texas Instruments Incorporated Method of forming an electronic device having I/O reroute
US5818107A (en) * 1997-01-17 1998-10-06 International Business Machines Corporation Chip stacking by edge metallization

Also Published As

Publication number Publication date Type
WO2002091469A2 (en) 2002-11-14 application
EP1419529A2 (en) 2004-05-19 application

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