WO2002087024A1 - Compliant interposer for single-sided electronic package attachment - Google Patents

Compliant interposer for single-sided electronic package attachment Download PDF

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Publication number
WO2002087024A1
WO2002087024A1 PCT/US2001/032305 US0132305W WO02087024A1 WO 2002087024 A1 WO2002087024 A1 WO 2002087024A1 US 0132305 W US0132305 W US 0132305W WO 02087024 A1 WO02087024 A1 WO 02087024A1
Authority
WO
WIPO (PCT)
Prior art keywords
interposer
described
wiring board
lower surface
staircase pattern
Prior art date
Application number
PCT/US2001/032305
Other languages
French (fr)
Inventor
Lance L. Sundstrom
Original Assignee
Honeywell International Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US69174000A priority Critical
Priority to US09/691,740 priority
Application filed by Honeywell International Inc. filed Critical Honeywell International Inc.
Publication of WO2002087024A1 publication Critical patent/WO2002087024A1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/10757Bent leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178Means for venting or for letting gases escape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/167Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • Y02P70/60Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control
    • Y02P70/613Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control involving the assembly of several electronic elements

Abstract

An electronic device package is attached to a printed wiring board with an interposer formed from a sheet of material to contain a lower surface and an elevated upper surface that surrounds the lower surface and a plurality legs along the edge of the upper surface. The electronic device package is attached to the upper surface. The lower surface is attached to the printed wiring board. The legs are attached to the printed wiring board. The transition between the lower surface and the upper surface are in staircase pattern, as are the legs. Vent slots are included in the transition between the lower and upper surfaces.

Description

TITLE

COMPLIANT INTERPOSER FOR SINGLE-SIDED

ELECTRONIC PACKAGE ATTACHMENT

BACKGROUND

This invention relates to techniques for attaching electronic components to a printed wiring board (PWB).

Electronic devices in "space" applications (spacecraft, satellites and launch vehicles) use surface mounted ceramic quad flat pack (CQFP) packages due to hermeticity and reliability requirements and the need to populate both sides of the printed wiring board. Peripheral-leaded single chip module (SCM) or multichip module (MCM) devices with high input/output (I/O) counts typically require small lead pitches to minimize size and weight. Even at a small 20 - mil. lead pitch, however, I/O counts of 184-532 can lead to.large

packages that are 1-3 inches on a side.

Surface mounting large, heavy ceramic packages like that to a PWB present challenges in terms of electrical and thermal performance, mechanical integrity, reliability, assembly and rework (removal of the electronic component from the PWB). Distortions and high stress levels in the attachment interface arise form differences in

the temperature coefficient of expansion (TCE) between the ceramic package and the glass-expoxy or glass-polymide PWB materials and PWB deflections under worst case shock, vibration, acceleration and temperature cycling environments Mechanically, the attachment interface (between package and the PWB) must be stiff enough to prevent net deflections of the package relative to the PWB and yet be compliant enough to absorb those distortions. For good electrical and thermal performance, the attachment interface must also have low electrical and thermal impedances. In severe space environments, larger packages require a longer lead form to accommodate the larger distortions in the package to PWB interface. The combination of small lead pitch and longer lead form leads to high lead aspect ratios (ratio of length to cross-sectional area). When multiple outputs of one or more packaged digital integrated circuit (IC) die, such an application specific integrated circuit (ASIC) switch simultaneously in the same direction, their combined switching currents flow through and develop a voltage along the power and ground paths of the packaging. The voltage v(t), developed along a power or ground path is a function of both the path current magnitude, I(t), and path current rate of change, di/dt, described b y v(t)=R*I(t)+Ldi/dt, where R and L are the series resistance and inductance of the path, respectively. "Rail bounce" is the transient voltage differences between the power and ground paths of the die and the power and ground paths of the host PWB. Too much rail bounce can lead to false triggering, errors and possible system failure. Because of rapid changes in current (high di/dt levels) in high speed digital systems, inductance tends to have a significant effect in the series impedance of the power and ground paths and the resulting rail bounce. The high series resistance and inductance of fine pitched peripheral leads makes them ineffective for controlling rail bounce. To control rail bounce in a high I/O single-sided digital SCM or

MCM device, the entire bottom side of the single chip package (SCP) or multichip package (MCP) is metalized and contains multiple via connections to its internal ground planes and ground pads for die and bypass capacitor attachment and wire bonding. The host PWB footprint for the SCM or MCM has large ground attachment pad(s) with multiple via connections to its internal ground planes.

The bottom of the package is interfacially bonded to the large ground attach pad(s) of its host PWB footprint with solder or conductive epoxy. An interfacial solder bond is typically vapor phased at the same time as the package leads. An interfacial conductive epoxy is bond is typically formed after the leads are vapor phased by squirting the epoxy through a hole from the back side of the PWB. The corners of the package are typically bonded to the PWB with nonconductive structural epoxy for additional mechanical strength and to minimize corner lead deflections.

The resulting ground paths extend directly from the die and bypass capacitor attach pads and wire bond pads through multiple package vias, conductive interfacial bond(s) and multiple PWB vias to the ground planes of the PWB and have a very low impedance and are almost purely resistive. These paths also provide a very low thermal impedance. However, this multi-point direct interfacial attach (one or more conductive paths and four nonconductive corner path(s) between the package and the PWB offers little or no Z-axis compliance for PWB , deflections. As a result, the interfacial conductive ground bond receives high stress levels and is prone to failure. Conceptually, a conductive epoxy bond may be more compliant than a solder bond. But an interfacial solder or conductive epoxy ground path can go from nearly full conduction to full or intermittent failure. Degradation in the conductive interfacial epoxy ground path degradation and/or total failure can be a problem as well. Once the interfacial ground path degrades or fails, the increased rail bounce levels become high enough to cause errors and system failures. SUMMARY OF THE INVENTION An object of the present invention is provide a better way of attaching electronic packages to a PWB that eliminates the aforementioned problems, especially in space environments.

According the invention, a compliant interfacial interposer replaces direct interfacial solder or conducive epoxy attachment of single-sided surface mount SCM or MCM devices. The entire top surface of the interposer (peripheral ring shape with four optional tab extensions) is conductively bonded (e.g. solder or conductive polymer) to the metalized bottom side of the package. The bottom side of the interposer (center circle and four optional corner tab feet) is conductively bonded (e.g. solder or conductive polymer) to mating center and four corner attach pads of the host PWB footprint. The package leads, interposer and PWB can be vapor phase soldered together in a single operation. A Z-axis offset between the top and bottom bonded surfaces of the interposer provides the vertical gap necessary to absorb Z-axis PWB deflections. The Z-axis transition paths around the center and at corners of the interposer that connect the top and bottom bonded portions are multiple stepped (i.e. corrugated) so that they can stretch and compress along their length to provide X, Y and Z compliance. The circular Z-axis transition path provides the majority of mechanical support and electrical and thermal conduction between the package and the PWB. The diameter of the circular Z-axis transition path is as large as possible to provide mechanical support as close a possible to the lead attach points and thereby minimize lead deflection.

According to one aspect of the invention, narrow radial slots vent and promote cleaning of the center cavity without compromising the radial electrical and thermal conduction paths between the package and the PWB. According to one aspect of the invention, the transition between the top and bottom surfaces of the interposer have a staircase pattern, as do the peripheral tabs on the top surface.

According to another aspect, an optional center dimple (or pin) of the interposer fits a center alignment hole of the host footprint. It provides placement alignment of the interposer to the PWB and adds X-Y shear strength to the interface. The center/ pin length is less than half the PWB thickness to facilitate mounting SCM or MCM devices on both sides of the PWB at the same location.

A feature of the invention, the interposer can be inexpensively fabricated from sheet copper with a simple punching and stamping operation. A copper interposer improves the lateral electrical and thermal conduction from the package to the PWB. The large compliant corrugated (due the staircase shape in the taps and transition between the top and bottom surfaces) copper interface between the package and the PWB absorbs the mechanical distortions of the interface and reduces stress on the solder joints. The compliant copper interface improves ground path reliability in severe environments. An all solder attachment eliminates the need for conductive and nonconductive epoxy. During rework, the package is removed with a hot air reflow station and the interposer may remain on the PWB as a compliant mounting platform for the replacement SCM or MCM device or be replaced along with the SCM or MCM device.

Other objects, benefits and features of the invention will apparent to one of ordinary skill in the art from the drawing and following description.

BRIEF DESCRIPTION OF THE DRAWING Fig. 1 is a diagonal cross-section view of a square CQFP device

(the device leads are not shown) attached to a PWB with an interposer that embodies the present invention.

Fig. 2, a section taken in the direction 2-2 in Fig. 1, shows a bottom view of the interposer attached to the bottom of the CQFP device. DESCRIPTION Referring to Fig. 1, a SCM or MCM device 10 is attached to an interposer 12 which is attached to a PWB 13. In particular, the SCM

or MCM device is attached (e.g. soldered) to the interposer on surface 12a and the interposer is attached (e.g. soldered) to the PWB 13 at tabs 12b and a circular surface 12c. The interposer 12 is initially a flat sheet of copper or similar thermal and /or electrically conductive material. The corner tabsl2b, ring portion 12a and center portion 12c are homogeneously formed (e.g. with a die) from the sheet so that the connection between the corner tabs 12b and the ring portion 12a and between the ring portion 12a and the center portion 12c are staircase Z-axis transitions 14. The SCM or MCM device is therefore

slightly elevated and supported above its host PWB 13 by the compliant staircase Z-axis transitions 14 between the ring portion 12a bonded to the SCM or MCM device and the corner tabs 12b and center portion 12c bonded to the PWB 13. An alignment tab 15 in the bottom surface of center portion 12c meets with a hole 17 in the

PWB 13.

As shown in Fig. 2, the SCM or MCM device has a plurality of edge-located wire leads; these connect with the PWB 13 (the connections are not shown) and are located between the tabs 12b. At least one radial slot is formed in the circular staircase Z-axis transition 14 and extending from the ring portion 12a to the center portion 12c, to vent the enclosed area 18 (see Fig. 1). The line 20 shows the air flow path. It will be appreciated that the large compliant corrugated copper interface between the package and the PWB absorbs the mechanical distortions of the interface and reduces stress on the solder joints. The compliant copper interface improves ground path reliability in severe environments. An all solder attach eliminates the need for conductive and nonconductive epoxy. During rework, the package is removed with a hot air reflow station and the interposer may remain on the PWB as a compliant mounting platform for the replacement SCM or MCM device or be replaced along with the SCM

or MCM device. One skilled in the art may make modifications, in whole or in part, to the described embodiment of the invention and its various , functions and components without departing from the true scope and spirit of the invention.

Claims

CLAIMS 1. A interposer for mounting an electrical device on a printed wiring board, comprising: a bottom surface for connection to the wiring board;
a top surface elevated above the bottom surface for connection to the device that encircles the bottom surface; and the top and bottom surfaces being formed from a sheet of material.
2. The interposer described in claim 1, wherein the top surface has a peripheral tab that extends downwardly for connection to the wiring board.
3. The interposer described in claim 1, wherein the top surface extends in a staircase pattern to the bottom surface.
4. The interposer described in claim 2, wherein the top surface extends in a first staircase pattern to the tabs and a second staircase pattern the bottom surface.
5. The interposer described in claim 3, wherein the sheet is made of an electrically conductive material.
6. The interposer described in claim 4, wherein the sheet is made of an electrically conductive material.
7. The interposer described in claim 3, wherein the sheet is made of a thermally conductive material.
8. The interposer described in claim 4, wherein the sheet is made of an thermally conductive material.
9. The interposer described in claim 3, further comprising vent slots in said first staircase pattern.
10. The interposer described in claim 4, further comprising vent slots in said first staircase pattern.
11. The interposer described in claim 3, further comprising: an alignment tab in the bottom surface for insertion in an alignment hole on the printed wiring board.
12. The interposer described in claim 4, further comprising:
an alignment tab for an alignment hole on the printed wiring board.
13. An assembly comprising: a printed wiring circuit board; ' , a electronic circuit package;
5 a interposer comprising: a lower surface and an upper surface formed from sheet material; the upper surface being attached to the electronic circuit package and being at a height above the lower surface to elevate the 0 electronic circuit package; and the lower surface being attached to the printed wiring board.
14. The assembly described in claim 13, wherein: a vent slot is located in position where the lower surface 5 extends upward to the upper surface.
15. The assembly described in claim 13, wherein: the lower surface extends upward to the upper surface in a staircase pattern that contains a vent slot. 0
16. The assembly described in claim 13, wherein: the lower surface extends upward to the upper surface in a staircase pattern.
17. The assembly described in claim 13, wherein: the upper surface contains peripheral tabs that are attached to the printed wiring board.
18. The assembly described in claim 17, wherein: the lower surface extends upward to the upper surface in a staircase pattern; and said peripheral tabs contain a staircase pattern.
19. The assembly described in claim 18, wherein the staircase pattern in the lower surface contains a vent slot.
20. The assembly described in claim 19, wherein the interposer comprises a conductive material.
21. The assembly described in claim 20, wherein the
interposer comprises a thermally conductive material.
22. The assembly described in claim 13, wherein the lower surface contains a printed wiring board alignment pin.
PCT/US2001/032305 2000-10-18 2001-10-18 Compliant interposer for single-sided electronic package attachment WO2002087024A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US69174000A true 2000-10-18 2000-10-18
US09/691,740 2000-10-18

Publications (1)

Publication Number Publication Date
WO2002087024A1 true WO2002087024A1 (en) 2002-10-31

Family

ID=24777757

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/032305 WO2002087024A1 (en) 2000-10-18 2001-10-18 Compliant interposer for single-sided electronic package attachment

Country Status (1)

Country Link
WO (1) WO2002087024A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19600966A1 (en) * 1996-01-12 1997-07-24 Siemens Ag Contact spring for electrical contacting of a component
US6264477B1 (en) * 1995-06-07 2001-07-24 Xerox Corporation Photolithographically patterned spring contact
US20010012723A1 (en) * 1999-05-07 2001-08-09 Kyoshin Kogyo Co., Ltd. Connecting terminal and a connecting terminal assembly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6264477B1 (en) * 1995-06-07 2001-07-24 Xerox Corporation Photolithographically patterned spring contact
DE19600966A1 (en) * 1996-01-12 1997-07-24 Siemens Ag Contact spring for electrical contacting of a component
US20010012723A1 (en) * 1999-05-07 2001-08-09 Kyoshin Kogyo Co., Ltd. Connecting terminal and a connecting terminal assembly

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