WO2002067647A2 - Soudeuse - Google Patents

Soudeuse Download PDF

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Publication number
WO2002067647A2
WO2002067647A2 PCT/DE2002/000570 DE0200570W WO02067647A2 WO 2002067647 A2 WO2002067647 A2 WO 2002067647A2 DE 0200570 W DE0200570 W DE 0200570W WO 02067647 A2 WO02067647 A2 WO 02067647A2
Authority
WO
WIPO (PCT)
Prior art keywords
component
pick
axis
components
bonder according
Prior art date
Application number
PCT/DE2002/000570
Other languages
German (de)
English (en)
Other versions
WO2002067647A3 (fr
Inventor
Michael Geringer
Original Assignee
Michael Geringer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Michael Geringer filed Critical Michael Geringer
Priority to AU2002247599A priority Critical patent/AU2002247599A1/en
Publication of WO2002067647A2 publication Critical patent/WO2002067647A2/fr
Publication of WO2002067647A3 publication Critical patent/WO2002067647A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/047—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Definitions

  • the invention relates to a bonder according to the preamble of claim 1.
  • Transfer devices or bonders are known in particular as so-called chip or die bonders (DE 195 10 230 C2), with which first components, for example semiconductor chips, are picked up by a pick-up element at a pick-up position and from this pick-up element a bonding position on a component available there, for example on a second component, a substrate or an assembly or, for example, in a lead frame by bonding.
  • first components for example semiconductor chips
  • this transfer and bonding requires a high level of accuracy, in particular with regard to the location and orientation of the first components, depositing and bonding.
  • the transfer device has a double arm, which is pivotally mounted in the center about a vertical axis and has a pick-up element at both ends, so that each time the arm is pivoted through 180 °, a pick-up element Element received at the receiving position first component reaches the bonding position.
  • the object of the invention is to show a bonder that ensures high accuracy with regard to the positioning and orientation of components during bonding at high performance.
  • the special feature of the bonder according to the invention is that the pick-up elements only have to perform extremely small movement strokes at the receiving position and at the bonding position, that is to say they transfer first components in a very short time at the receiving position to the component receptacles of the transport element and at the bonding position can be removed from the component receptacles for bonding, long distances for the pick-up elements which impair the performance of the bonder are thus avoided.
  • At least one pick-up element for example the pick-up element provided at the receiving position, can only be moved in one axial direction perpendicular to the direction of movement of the transport element, in such a way that with this pick-up element the recess or opening provided between two component receptacles in the transport element is grasped and received through the respective first component and this component is then placed on the next component receptacle adjacent to the recess.
  • FIG. 1 shows a simplified perspective partial representation of an embodiment of the device according to the invention as a bonder for the highly precise mounting of the smallest components on assemblies
  • Figure 2 shows the device of Figure 1 in a schematic representation and in plan view. 3 shows an enlarged illustration of the assembly or bonding position together with an assembly arranged at this position and a component placed on the assembly
  • Fig. 4 in a schematic, perspective view, the recording position of the
  • Fig. 5 shows the bonding position of the in a schematic, perspective representation
  • FIG. 6 is a representation similar to Figure 2 in another possible
  • FIG. 7 shows a simplified representation and a top view of a component placed in an assembly or on a substrate; 8 shows a further possible embodiment in a representation similar to FIG. 6; 9 - 11 in illustrations similar to FIG. 2 further embodiments of the device according to the invention.
  • the device generally designated 1 in FIGS. 1-5 is used for high-precision positioning and bonding, ie for the high-precision placement and connection of “first” components 2 with extremely small dimensions on already partially manufactured modules 3.
  • the components 2 in the embodiment shown are optical Components that have several functional elements, for example prisms for deflecting a laser beam and lenses for beam collimation or focusing.
  • the assemblies 3 consist of a substrate 4 with conductor tracks, contact areas, etc., on which, in addition to optical components, for example prism-like components acting as mirrors, a laser diode 6 is also preassembled.
  • optical components for example prism-like components acting as mirrors
  • a laser diode 6 is also preassembled.
  • the placement of the components 2 and the bonding of these components on the respective assembly 3 must be carried out with high precision in order to achieve the desired profile for the laser beam 6 '.
  • the device 1 has a turntable 7 which is driven by means of a high-precision servo motor 8 (FIG. 1) about a vertical device axis.
  • a high-precision servo motor 8 (FIG. 1) about a vertical device axis.
  • radially projecting web-like holding arms 9 are provided, which are spaced apart from one another on the circumference of the plate by the angular amount, which corresponds to two rotation steps or an integer multiple thereof.
  • receptacles or nests 10 are formed, the shape of which is adapted to the components 2, in such a way that in each nest 1 there is space for a component 2 in a precisely predetermined orientation and position.
  • the components 2 are fed in a belted form at a receiving position 11, ie they are located there in a precisely defined position and orientation in recordings of a belt 12.
  • the belt 12 becomes radial to vertical in synchronism with the movement of the turntable 7 Axis (Z axis) fed this turntable, in such a way that at the beginning of each work cycle there is a component 2 for reception by a reception or pick-up element 13 there.
  • the latter is formed by a vacuum holder or a vacuum pipette which can only be moved up and down between three stroke positions in the vertical direction, ie in the axial direction parallel to the vertical axis of rotation of the turntable 7 (Z axis) by a drive 14 (FIG. 1) is, namely between
  • the arrangement is also such that the receiving position 1 1 is below the path of movement of the holder 9.
  • the pick-up element is arranged with its vertical central axis on an imaginary circular arc around the axis of rotation of the turntable 7, which passes through the center of the nests 10.
  • the pick-up element 13 is located in the receiving position 11 directly above the belt 12 and is moved synchronously with the rotary movement of the turntable. In each work cycle starting with a position of the turntable 7, in which there is no nest 10 above the receiving position 11, the pick-up element 13 is first moved into the lowest position for receiving the component 2 provided in the belt 12 and then back to the uppermost position, so that after the rotary step of the turntable 7 has been completed, the component 2 in question is introduced into the ready nest 10 by lowering the pick-up element 13 can.
  • the pick-up element 13 is moved again into the uppermost position, from which it is again in a new work cycle after a further turning step of the turntable 7 between two successive holders 9 on the periphery of the turntable 7 until a new, at the receiving position 1 1 available component 2 can be lowered.
  • the components 2 reach the bonding position 15, at each of which an assembly 3 is available in a precisely predetermined position and orientation .
  • the assemblies 3 are arranged in the embodiment shown in receptacles 16 of a conveyor belt 17, which is clocked and moved with high accuracy in the direction of arrow B, in such a way that this conveyor belt or its horizontal conveying direction B at the bond position 15 tangential to circular movement path of the holder 9 or nests 10 runs.
  • the bond position 15 is also in a plane below the plane of the orbit of the holders 9 and nests 10.
  • a pick-up element 18 is provided, which in the embodiment shown is designed as pliers and with which each component 2 at the bond position 15 in a nest 10 is removed from this nest and placed with high precision on the module 3 at the bond position 15 at a predetermined position and in a predetermined orientation and held until the connection (Bonding) the component 2 with the assembly 3 in the chosen manner, for example by gluing, soldering or welding using a laser beam, etc.
  • the pick-up element 18 is provided on a pick-up head 19, which controls a controlled movement of the pick-up element 18 not only in the vertical Z-axis, but also in the X-axis and the Y- Axis and possibly also a rotation around the Z axis.
  • the pick-up element 18 can in turn be moved essentially between three positions, namely between
  • the method of operation is such that when a nest 10 is at the bond position 15 and below the pick-up element 18 which has been raised to the starting position, the latter is lowered, namely to grasp the component 2. Subsequently, it becomes the pick-up element 18 is raised again and, after the turntable 7 has been rotated, lowered onto the assembly 3, so that the component 2 is then placed there in the required positioning and orientation.
  • the control here is carried out by a vision system 20, which essentially consists of at least one video camera and an image processing system which cooperates with it. As also indicated in FIG.
  • this vision system 20 is designed in such a way that the component 2 held by the pick-up element 18, but also the assembly 3, are detected with the system during bonding, so that then by appropriate Activation of the pick-up head 19 and thus the pick-up element 18 can align the component 2 to predetermined markings, edges, etc. on the assembly 3 (for example edge 21 of FIG. 3).
  • the vision system with its optical axis (Z-axis) is located exactly above the bond position 15 and covers the working area (bond position 15) when it is deposited and bonded through the space between two carriers 9.
  • the pick is -Up element 18 designed so that it is led out obliquely from the field of vision of the vision system 20 and the pick-up head 19 is outside the image area of this system.
  • the pick-up elements 13 and 18 each move from their upper position into one of the lower positions and back again into the upper position.
  • the vertical movement (Z axis) of the pick-up element 18 is also effected by the drive 14.
  • a vision system 22 for example for monitoring the proper functioning, also in the area of the receiving position 11 and a further vision system 23 in the direction of rotation A of the turntable 7 after the bonding position 15, for example to monitor the nests 10 and to detect a component 2 possibly remaining in a nest 10, specifically to generate an error message.
  • the vision system 22 can also take over the function of the vision system 20 if a bond position is formed in the area of the vision system 23, specifically in another application of the device 1.
  • the advantage of the device 1 consists essentially in the fact that with this device 1 the components 2 are positioned and bonded to the assemblies 3 with high precision.
  • the high output results in particular from the fact that essentially only short strokes in the vertical direction (Z axis) are necessary for the pick-up elements 13 and 18 and for the pick-up element 18 additionally only for adjustment in ⁇ m.
  • Range is also movable in the direction of the X-axis and Y-axis and, if necessary, rotatable about the Z-axis, in each case by a small amount.
  • FIG. 6 shows the bond position 15a again in a simplified representation in a further possible embodiment of the device according to the invention.
  • This device generally designated 1 a in FIG. 6, corresponds in its design to device 1, but with a somewhat different design to bond position 15 a.
  • components in the form of laser diodes 6 are placed on the substrate 4 in a precisely predetermined position, specifically monitored by the vision system 20 and oriented to predetermined reference points or edges 21 the substrate 4 ( Figure 7).
  • the tool or pick-up element 18 is provided on a tool carrier 25 which is fastened to an arm 27 by means of a rotary bearing 26 so that it can rotate about the Z axis.
  • the arm 27, on which a sensor 28 for measuring the bond force is also provided, is connected to an X / Y drive of the otherwise not shown pick-up head for movement in the X-axis and Y-axis.
  • the carrier 25 can be rotated about the Z axis with an actuator (not shown).
  • the sensor 28 is, for example, one with a strain gauge.
  • a central opening 29 is provided in the carrier 25, through which the vision system 20 detects both the substrate 4 and the component, namely the laser diode 6, in particular also during adjustment and bonding.
  • the bonding itself i.e. the bond connection between the laser diode 6 and the substrate 4 takes place by eutectic bonding or soldering, using a laser beam 30 with which the substrate 4 is partially heated for this purpose.
  • Other connections for example adhesive connections, are of course also possible here.
  • FIG. 8 shows, as a further possible embodiment, the bond position 15b of an otherwise not shown device 1b, with the components in shape special optical elements 31 are mounted on assemblies 3b, each with a laser diode 6 and a spacer 32, the spacer 32 being formed on an area 33 as an optical mirror.
  • the bonding position 15b also has, among other things, electrical contacts 35 , via which the laser diode 6 can be connected to a voltage source.
  • the component 31 is positioned in such a way that the desired optimal focusing or collimation of this laser beam is achieved.
  • a pick-up element 18b is used, which is designed as a vacuum holder and consists of a translucent material, for example glass, so that in any case the laser beam 6 'passing through the lens 34 from the Vision system 20 can be captured.
  • a semitransparent mirror 36 is also provided in the illustrated embodiment, via which an outer laser beam 36 of a laterally arranged laser can be directed onto the spacer 32 in order to produce a eutectic bond connection by heating this spacer 32 or else one cure the adhesive used for this bond, etc.
  • Figures 9 and 10 show very schematically a device 1 c, which differs from the device 1 essentially in that the receiving position 1 1 c and the bond position 15c with respect to the vertical axis of rotation of the turntable 7 are provided diametrically opposite each other that instead of the Components 2 supplied in a belted form are processed from a wafer 38 by separating chips 38 or are bonded to the substrates 4 moved past the bonding position 15, and that instead of the vision system 20, the vision system 23 is deposited at the bonding position 15c the chips 38 on the substrates 4 and the like there Bonding monitors and controls the intended pick-up element in the required manner.
  • the wafer 37 is arranged at the receiving position 11 c on an XY table, which is controlled by the vision system 22 there in the required manner such that exactly one chip 38 is always present in the middle of the pick-up element.
  • FIG. 9 shows the phase for picking up a chip 38 at the pick-up position 11 c and placing a chip 38 on a substrate 4 at the bond position 15 c
  • FIG. 10 shows the placing of a chip 38 at the pick-up position 11 c in a nest 10 a holder 9 or the removal of a chip 38 from a nest 10 at the bond position 15c.
  • FIG. 1 1 shows, as a further possible embodiment, a device 1 d which is designed similarly to device 1 c, but as a wafer / wafer bonder in which the chips 38 of the wafer 37 at the receiving position 11d are each placed on chips 38 of a wafer 40 at the bonding position 15d and bonded in an exact position.
  • the wafer 40 is also located on an XY table, which is precisely controlled by the vision system 23, the pick-up element present at the bond position 15d preferably also making an adjustment movement in the X-axis and Y- Axis executes, if necessary also an adjustment rotary movement about the Z axis.
  • the adjustment movements and also the movements of the X-Y table for the wafer 40 are controlled by the vision system 22 or 23.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne une soudeuse pour composants de faibles dimensions, présentant une unité de transfert qui sert, d'une part, à transférer les composants d'une position de préhension ou de réception vers un composant disponible au niveau de la position de soudage et, d'autre part, à effectuer un positionnement et un soudage précis sur ledit composant.
PCT/DE2002/000570 2001-02-23 2002-02-19 Soudeuse WO2002067647A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002247599A AU2002247599A1 (en) 2001-02-23 2002-02-19 Bonder

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10109009A DE10109009C2 (de) 2001-02-23 2001-02-23 Bonder
DE10109009.9 2001-02-23

Publications (2)

Publication Number Publication Date
WO2002067647A2 true WO2002067647A2 (fr) 2002-08-29
WO2002067647A3 WO2002067647A3 (fr) 2002-12-27

Family

ID=7675402

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/000570 WO2002067647A2 (fr) 2001-02-23 2002-02-19 Soudeuse

Country Status (3)

Country Link
AU (1) AU2002247599A1 (fr)
DE (1) DE10109009C2 (fr)
WO (1) WO2002067647A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004112100A1 (fr) * 2003-06-02 2004-12-23 Amicra Microtechnologies Gmbh Dispositif de liaison et procede correspondant
EP2846992A1 (fr) * 2013-04-29 2015-03-18 KILIAN Tableting GmbH Appareil pour insérer des inserts dans des moules d'une presse à comprimer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0093015A1 (fr) * 1982-04-27 1983-11-02 Cleamax Limited Procédé et dispositif pour le guidage d'objets creux cylindriques tel que des boîtes métalliques
US5152390A (en) * 1990-12-04 1992-10-06 Nitto Kogyo Kabushiki Kaisha Automatic chip separating and feeding apparatus
DE19510230A1 (de) * 1995-03-24 1996-09-26 Michael Geringer Transfervorrichtung für elektrische Bauelemente, insbesondere Chips

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2670191B1 (fr) * 1990-12-05 1996-05-03 Nitto Kogyo Kk Appareil automatique de separation et d'amenee de puces.
DE19748442A1 (de) * 1997-11-03 1999-05-06 Georg Sillner Vorrichtung zum Fördern von kleinen Bauelementen, insbesondere von kleine elektrischen Bauelementen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0093015A1 (fr) * 1982-04-27 1983-11-02 Cleamax Limited Procédé et dispositif pour le guidage d'objets creux cylindriques tel que des boîtes métalliques
US5152390A (en) * 1990-12-04 1992-10-06 Nitto Kogyo Kabushiki Kaisha Automatic chip separating and feeding apparatus
DE19510230A1 (de) * 1995-03-24 1996-09-26 Michael Geringer Transfervorrichtung für elektrische Bauelemente, insbesondere Chips

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004112100A1 (fr) * 2003-06-02 2004-12-23 Amicra Microtechnologies Gmbh Dispositif de liaison et procede correspondant
DE10394243B4 (de) * 2003-06-02 2015-10-29 Amicra Microtechnologies Gmbh Bondvorrichtung und Bondverfahren
EP2846992A1 (fr) * 2013-04-29 2015-03-18 KILIAN Tableting GmbH Appareil pour insérer des inserts dans des moules d'une presse à comprimer
EP2846992B1 (fr) * 2013-04-29 2022-06-29 Romaco Kilian GmbH Appareil pour insérer des inserts dans des moules d'une presse à comprimer

Also Published As

Publication number Publication date
AU2002247599A1 (en) 2002-09-04
DE10109009C2 (de) 2003-12-18
WO2002067647A3 (fr) 2002-12-27
DE10109009A1 (de) 2002-10-17

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