WO2002055762A2 - Electrochemical co-deposition of metals for electronic device manufacture - Google Patents
Electrochemical co-deposition of metals for electronic device manufacture Download PDFInfo
- Publication number
- WO2002055762A2 WO2002055762A2 PCT/US2001/047369 US0147369W WO02055762A2 WO 2002055762 A2 WO2002055762 A2 WO 2002055762A2 US 0147369 W US0147369 W US 0147369W WO 02055762 A2 WO02055762 A2 WO 02055762A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal layer
- metal
- copper
- substrate
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-7006092A KR20030048110A (en) | 2000-11-03 | 2001-11-03 | Electrochemical co-deposition of metals for electronic device manufacture |
EP01993230A EP1346083A2 (en) | 2000-11-03 | 2001-11-03 | Electrochemical co-deposition of metals for electronic device manufacture |
JP2002556406A JP2004518022A (en) | 2000-11-03 | 2001-11-03 | Electrochemical co-deposition of metals for electronic device fabrication |
AU2002245083A AU2002245083A1 (en) | 2000-11-03 | 2001-11-03 | Electrochemical co-deposition of metals for electronic device manufacture |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24593700P | 2000-11-03 | 2000-11-03 | |
US60/245,937 | 2000-11-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002055762A2 true WO2002055762A2 (en) | 2002-07-18 |
WO2002055762A3 WO2002055762A3 (en) | 2003-07-17 |
Family
ID=22928699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/047369 WO2002055762A2 (en) | 2000-11-03 | 2001-11-03 | Electrochemical co-deposition of metals for electronic device manufacture |
Country Status (7)
Country | Link |
---|---|
US (1) | US20020127847A1 (en) |
EP (1) | EP1346083A2 (en) |
JP (1) | JP2004518022A (en) |
KR (1) | KR20030048110A (en) |
CN (1) | CN1529772A (en) |
AU (1) | AU2002245083A1 (en) |
WO (1) | WO2002055762A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005014748A1 (en) * | 2005-03-31 | 2006-10-05 | Advanced Micro Devices, Inc., Sunnyvale | Technique for electrochemical depositing of an alloy e.g., for microstructures, involves generating current between consumer electrode and surface |
EA034557B1 (en) * | 2018-05-21 | 2020-02-20 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Саратовский государственный технический университет имени Гагарина Ю.А." | Method of manufacturing chemoresistor based on nanostructures of zinc oxide by electrochemical method |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030159941A1 (en) * | 2002-02-11 | 2003-08-28 | Applied Materials, Inc. | Additives for electroplating solution |
US6974767B1 (en) * | 2002-02-21 | 2005-12-13 | Advanced Micro Devices, Inc. | Chemical solution for electroplating a copper-zinc alloy thin film |
US8002962B2 (en) | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
US7316772B2 (en) * | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
JP4758614B2 (en) * | 2003-04-07 | 2011-08-31 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | Electroplating composition and method |
US20050045485A1 (en) * | 2003-09-03 | 2005-03-03 | Taiwan Semiconductor Manufacturing Co. Ltd. | Method to improve copper electrochemical deposition |
TW200632147A (en) | 2004-11-12 | 2006-09-16 | ||
US7771579B2 (en) * | 2004-12-03 | 2010-08-10 | Taiwan Semiconductor Manufacturing Co. | Electro chemical plating additives for improving stress and leveling effect |
US7271482B2 (en) * | 2004-12-30 | 2007-09-18 | Micron Technology, Inc. | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
US7905994B2 (en) | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
JP2010045140A (en) * | 2008-08-11 | 2010-02-25 | Nec Electronics Corp | Lead frame, method of manufacturing the same, and method of manufacturing semiconductor device |
US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
WO2015065150A1 (en) * | 2013-11-04 | 2015-05-07 | 서울시립대학교 산학협력단 | Method for forming multilayer-plated thin film using alloy plating liquid and pulse current |
US9496145B2 (en) * | 2014-03-19 | 2016-11-15 | Applied Materials, Inc. | Electrochemical plating methods |
US9758896B2 (en) | 2015-02-12 | 2017-09-12 | Applied Materials, Inc. | Forming cobalt interconnections on a substrate |
WO2016171526A1 (en) * | 2015-04-22 | 2016-10-27 | 덕산하이메탈(주) | Low-temperature sintering bonding material using exothermic reaction caused by nano-grain size, and method for manufacturing same |
WO2017039402A1 (en) * | 2015-09-02 | 2017-03-09 | 단국대학교 천안캠퍼스 산학협력단 | Method for producing alloy thin films of various compositions by means of electroforming |
US9809892B1 (en) * | 2016-07-18 | 2017-11-07 | Rohm And Haas Electronic Materials Llc | Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium |
WO2018073011A1 (en) | 2016-10-20 | 2018-04-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
JP2020502370A (en) | 2016-12-20 | 2020-01-23 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | Compositions for metal plating including inhibitors for void-free embedding |
JP7087759B2 (en) * | 2018-07-18 | 2022-06-21 | 住友金属鉱山株式会社 | Copper-clad laminate |
US11901225B2 (en) * | 2021-09-14 | 2024-02-13 | Applied Materials, Inc. | Diffusion layers in metal interconnects |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1433850A (en) * | 1973-09-04 | 1976-04-28 | Fuji M | Packaging material |
US4108739A (en) * | 1973-09-04 | 1978-08-22 | Fuji Photo Film Co., Ltd. | Plating method for memory elements |
US5156729A (en) * | 1988-11-01 | 1992-10-20 | Metal Leve, S.A. | Method of making a plain bearing sliding layer |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6444110B2 (en) * | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
JP4394234B2 (en) * | 2000-01-20 | 2010-01-06 | 日鉱金属株式会社 | Copper electroplating solution and copper electroplating method |
US6679983B2 (en) * | 2000-10-13 | 2004-01-20 | Shipley Company, L.L.C. | Method of electrodepositing copper |
-
2001
- 2001-11-03 WO PCT/US2001/047369 patent/WO2002055762A2/en not_active Application Discontinuation
- 2001-11-03 US US10/008,665 patent/US20020127847A1/en not_active Abandoned
- 2001-11-03 AU AU2002245083A patent/AU2002245083A1/en not_active Abandoned
- 2001-11-03 KR KR10-2003-7006092A patent/KR20030048110A/en not_active Application Discontinuation
- 2001-11-03 CN CNA018209033A patent/CN1529772A/en active Pending
- 2001-11-03 JP JP2002556406A patent/JP2004518022A/en active Pending
- 2001-11-03 EP EP01993230A patent/EP1346083A2/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1433850A (en) * | 1973-09-04 | 1976-04-28 | Fuji M | Packaging material |
US4108739A (en) * | 1973-09-04 | 1978-08-22 | Fuji Photo Film Co., Ltd. | Plating method for memory elements |
US5156729A (en) * | 1988-11-01 | 1992-10-20 | Metal Leve, S.A. | Method of making a plain bearing sliding layer |
Non-Patent Citations (3)
Title |
---|
COHEN ET AL.: "Electroplating of Cyclic Multilayered Alloy Coatings" J. ELECTROCHEM. SOC., vol. 130, no. 10, October 1983 (1983-10), pages 1987-1995, XP001105967 * |
CORREIA A N ET AL: "Electrodeposition and characterisation of thin layers of NiÐ?Co alloys obtained from dilute chloride baths" ELECTROCHIMICA ACTA, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB, vol. 45, no. 11, February 2000 (2000-02), pages 1733-1740, XP004186236 ISSN: 0013-4686 * |
XUE Q ET AL: "THE ELECTRODEPOSITION OF A COPPER/NICKEL MULTILAYER ALLOY ON BERYLLIUM BRONZE SUBSTRATE" JOURNAL OF PHYSICS D. APPLIED PHYSICS, IOP PUBLISHING, BRISTOL, GB, vol. 30, no. 24, 21 December 1997 (1997-12-21), pages 3301-3306, XP000767125 ISSN: 0022-3727 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005014748A1 (en) * | 2005-03-31 | 2006-10-05 | Advanced Micro Devices, Inc., Sunnyvale | Technique for electrochemical depositing of an alloy e.g., for microstructures, involves generating current between consumer electrode and surface |
DE102005014748B4 (en) * | 2005-03-31 | 2007-02-08 | Advanced Micro Devices, Inc., Sunnyvale | Technique for electrochemical deposition of a chemical order alloy |
US7985329B2 (en) | 2005-03-31 | 2011-07-26 | Advanced Micro Devices, Inc. | Technique for electrochemically depositing an alloy having a chemical order |
EA034557B1 (en) * | 2018-05-21 | 2020-02-20 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Саратовский государственный технический университет имени Гагарина Ю.А." | Method of manufacturing chemoresistor based on nanostructures of zinc oxide by electrochemical method |
Also Published As
Publication number | Publication date |
---|---|
KR20030048110A (en) | 2003-06-18 |
WO2002055762A3 (en) | 2003-07-17 |
AU2002245083A1 (en) | 2002-07-24 |
CN1529772A (en) | 2004-09-15 |
JP2004518022A (en) | 2004-06-17 |
US20020127847A1 (en) | 2002-09-12 |
EP1346083A2 (en) | 2003-09-24 |
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