WO2002054448A3 - Low cost mmw transceiver packaging - Google Patents

Low cost mmw transceiver packaging Download PDF

Info

Publication number
WO2002054448A3
WO2002054448A3 PCT/US2001/050504 US0150504W WO02054448A3 WO 2002054448 A3 WO2002054448 A3 WO 2002054448A3 US 0150504 W US0150504 W US 0150504W WO 02054448 A3 WO02054448 A3 WO 02054448A3
Authority
WO
WIPO (PCT)
Prior art keywords
housing
design
low cost
millimeter wave
costs
Prior art date
Application number
PCT/US2001/050504
Other languages
French (fr)
Other versions
WO2002054448A2 (en
WO2002054448A9 (en
Inventor
Danny F Ammar
Gavin James Clark
Eugene Fischer
John F Hubert
Original Assignee
Lockheed Corp
Danny F Ammar
Gavin James Clark
Eugene Fischer
John F Hubert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lockheed Corp, Danny F Ammar, Gavin James Clark, Eugene Fischer, John F Hubert filed Critical Lockheed Corp
Priority to EP01994469A priority Critical patent/EP1346485B1/en
Priority to AU2002246860A priority patent/AU2002246860A1/en
Priority to DE60137793T priority patent/DE60137793D1/en
Priority to KR1020037007505A priority patent/KR100875043B1/en
Publication of WO2002054448A2 publication Critical patent/WO2002054448A2/en
Publication of WO2002054448A3 publication Critical patent/WO2002054448A3/en
Publication of WO2002054448A9 publication Critical patent/WO2002054448A9/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Receivers (AREA)

Abstract

A millimeter wave transceiver package is provided. Housings for electronic, RF, and support components of the transceiver with an RF transparent cover are stacked vertically in a multilayer structure. The channelized RF housing affects a reduction of 5:1 by minimizing the components placed on the housing. The design and position of the regulator/controller allows the use of surface mount parts and simplified DC and RF interfaces further contributing to design efficiency and reduced costs. Additionally, costs are reduced through the appropriate selection and application of materials. The generic housing for the millimeter wave module assembly accommodates frequencies from 20 to 40 GHz without design change, thus improving the modular character.
PCT/US2001/050504 2000-12-28 2001-12-28 Low cost mmw transceiver packaging WO2002054448A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP01994469A EP1346485B1 (en) 2000-12-28 2001-12-28 Low cost mmw transceiver packaging
AU2002246860A AU2002246860A1 (en) 2000-12-28 2001-12-28 Low cost mmw transceiver packaging
DE60137793T DE60137793D1 (en) 2000-12-28 2001-12-28 COST-EFFECTIVE MMW TRANSMITTER / RECEIVER HOUSING
KR1020037007505A KR100875043B1 (en) 2000-12-28 2001-12-28 How to manufacture a millimeter wave transceiver package and a millimeter wave transceiver assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/749,425 US6594479B2 (en) 2000-12-28 2000-12-28 Low cost MMW transceiver packaging
US09/749,425 2000-12-28

Publications (3)

Publication Number Publication Date
WO2002054448A2 WO2002054448A2 (en) 2002-07-11
WO2002054448A3 true WO2002054448A3 (en) 2002-08-08
WO2002054448A9 WO2002054448A9 (en) 2002-12-12

Family

ID=25013710

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/050504 WO2002054448A2 (en) 2000-12-28 2001-12-28 Low cost mmw transceiver packaging

Country Status (6)

Country Link
US (1) US6594479B2 (en)
EP (1) EP1346485B1 (en)
KR (1) KR100875043B1 (en)
AU (1) AU2002246860A1 (en)
DE (1) DE60137793D1 (en)
WO (1) WO2002054448A2 (en)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6627992B2 (en) * 2001-05-21 2003-09-30 Xytrans, Inc. Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set
US7024165B2 (en) * 2001-06-14 2006-04-04 Honeywell Federal Manufacturing & Technologies, Llc ISM band to U-NII band frequency transverter and method of frequency transversion
US7000691B1 (en) * 2002-07-11 2006-02-21 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US7139531B2 (en) * 2002-09-27 2006-11-21 Fujitsu Limited Outdoor radio equipment
US7050765B2 (en) * 2003-01-08 2006-05-23 Xytrans, Inc. Highly integrated microwave outdoor unit (ODU)
US6952345B2 (en) * 2003-10-31 2005-10-04 Raytheon Company Method and apparatus for cooling heat-generating structure
US20050124307A1 (en) * 2003-12-08 2005-06-09 Xytrans, Inc. Low cost broadband wireless communication system
US20050262861A1 (en) * 2004-05-25 2005-12-01 Weber Richard M Method and apparatus for controlling cooling with coolant at a subambient pressure
US20050274139A1 (en) * 2004-06-14 2005-12-15 Wyatt William G Sub-ambient refrigerating cycle
US7254957B2 (en) * 2005-02-15 2007-08-14 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US20070119568A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and method of enhanced boiling heat transfer using pin fins
US20070119572A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
KR100790760B1 (en) * 2005-12-08 2008-01-03 한국전자통신연구원 Band signalling transmitter using multiplex waveguide structures
US20070209782A1 (en) * 2006-03-08 2007-09-13 Raytheon Company System and method for cooling a server-based data center with sub-ambient cooling
US7908874B2 (en) 2006-05-02 2011-03-22 Raytheon Company Method and apparatus for cooling electronics with a coolant at a subambient pressure
US7860473B2 (en) * 2006-07-17 2010-12-28 Sony Corporation Systems and methods for providing millimeter wave signal improvements
US8395256B2 (en) * 2007-02-02 2013-03-12 Harris Stratex Networks Operating Corporation Packaging for low-cost, high-performance microwave and millimeter wave modules
US7782765B2 (en) * 2007-01-22 2010-08-24 Harris Stratex Networks Operating Corporation Distributed protection switching architecture for point-to-point microwave radio systems
US8275071B2 (en) 2007-05-17 2012-09-25 Harris Stratex Networks Operating Corporation Compact dual receiver architecture for point to point radio
US8095088B2 (en) 2007-05-17 2012-01-10 Harris Stratex Networks Operating Corporation Compact wide dynamic range transmitter for point to point radio
US8651172B2 (en) * 2007-03-22 2014-02-18 Raytheon Company System and method for separating components of a fluid coolant for cooling a structure
US7921655B2 (en) 2007-09-21 2011-04-12 Raytheon Company Topping cycle for a sub-ambient cooling system
JP5383512B2 (en) * 2008-01-30 2014-01-08 京セラ株式会社 Connection terminal, package using the same, and electronic device
US8072065B2 (en) * 2008-02-14 2011-12-06 Viasat, Inc. System and method for integrated waveguide packaging
US8872333B2 (en) 2008-02-14 2014-10-28 Viasat, Inc. System and method for integrated waveguide packaging
US7934386B2 (en) * 2008-02-25 2011-05-03 Raytheon Company System and method for cooling a heat generating structure
US7907409B2 (en) * 2008-03-25 2011-03-15 Raytheon Company Systems and methods for cooling a computing component in a computing rack
KR101108330B1 (en) * 2008-12-24 2012-01-25 권석웅 cake fixing device
US8592960B2 (en) 2010-08-31 2013-11-26 Viasat, Inc. Leadframe package with integrated partial waveguide interface
JP2015149649A (en) * 2014-02-07 2015-08-20 株式会社東芝 Millimeter waveband semiconductor package and millimeter waveband semiconductor device
JP2015149650A (en) * 2014-02-07 2015-08-20 株式会社東芝 Millimeter waveband semiconductor package and millimeter waveband semiconductor device
US11032919B2 (en) * 2018-01-19 2021-06-08 Ge Aviation Systems Llc Control boxes and system-on-module circuit boards for unmanned vehicles
US10942509B2 (en) 2018-01-19 2021-03-09 Ge Aviation Systems Llc Heterogeneous processing in unmanned vehicles
US11029985B2 (en) 2018-01-19 2021-06-08 Ge Aviation Systems Llc Processor virtualization in unmanned vehicles
CN112104383A (en) * 2020-08-31 2020-12-18 济南金宇公路产业发展有限公司 Wisdom traffic data transmission terminal

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490684A (en) * 1983-01-03 1984-12-25 Motorola, Inc. Adaptive quadrature combining apparatus
US5512901A (en) * 1991-09-30 1996-04-30 Trw Inc. Built-in radiation structure for a millimeter wave radar sensor
US5680139A (en) * 1994-01-07 1997-10-21 Millitech Corporation Compact microwave and millimeter wave radar
US5914684A (en) * 1997-04-18 1999-06-22 Honeywell Inc. Electromagnetic transducer system with integrated circuit card adapter

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490721A (en) 1980-11-17 1984-12-25 Ball Corporation Monolithic microwave integrated circuit with integral array antenna
JPS6238035A (en) * 1985-08-12 1987-02-19 Nissan Motor Co Ltd Thin plate type portable device
US4967201A (en) 1987-10-22 1990-10-30 Westinghouse Electric Corp. Multi-layer single substrate microwave transmit/receive module
US4870421A (en) 1987-12-28 1989-09-26 General Electric Company Regulating switch for transmitting modules in a phased array radar
US5315303A (en) 1991-09-30 1994-05-24 Trw Inc. Compact, flexible and integrated millimeter wave radar sensor
US5247309A (en) 1991-10-01 1993-09-21 Grumman Aerospace Corporation Opto-electrical transmitter/receiver module
US5422783A (en) * 1992-07-06 1995-06-06 Universal Electronics Inc. Modular casing for a remote control having upper housing member slidingly received in a panel section
US5493305A (en) 1993-04-15 1996-02-20 Hughes Aircraft Company Small manufacturable array lattice layers
US5588041A (en) * 1995-01-05 1996-12-24 Motorola, Inc. Cellular speakerphone and method of operation thereof
JP3163981B2 (en) 1996-07-01 2001-05-08 株式会社村田製作所 Transceiver
US5945941A (en) 1998-03-12 1999-08-31 Northrop Grumman Corporation Pulsed radar apparatus and method employing power distribution system having reduced cost and weight and enhanced efficiency and reliability
US6157545A (en) * 1998-05-14 2000-12-05 Motorola, Inc. Battery connection apparatus with end projections
US6064341A (en) * 1998-05-14 2000-05-16 Motorola, Inc. Antenna assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490684A (en) * 1983-01-03 1984-12-25 Motorola, Inc. Adaptive quadrature combining apparatus
US5512901A (en) * 1991-09-30 1996-04-30 Trw Inc. Built-in radiation structure for a millimeter wave radar sensor
US5680139A (en) * 1994-01-07 1997-10-21 Millitech Corporation Compact microwave and millimeter wave radar
US5914684A (en) * 1997-04-18 1999-06-22 Honeywell Inc. Electromagnetic transducer system with integrated circuit card adapter

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1346485A4 *

Also Published As

Publication number Publication date
EP1346485A4 (en) 2008-02-20
KR100875043B1 (en) 2008-12-19
US6594479B2 (en) 2003-07-15
WO2002054448A2 (en) 2002-07-11
AU2002246860A1 (en) 2002-07-16
US20020086655A1 (en) 2002-07-04
EP1346485B1 (en) 2009-02-25
KR20040010573A (en) 2004-01-31
EP1346485A2 (en) 2003-09-24
DE60137793D1 (en) 2009-04-09
WO2002054448A9 (en) 2002-12-12

Similar Documents

Publication Publication Date Title
WO2002054448A3 (en) Low cost mmw transceiver packaging
USD367649S (en) Housing for a portable radio/phone
CA2362976A1 (en) Modular power running board
WO2001076030A8 (en) Power distribution panel with modular elements
RU94045896A (en) CARRYING CASE OF PORTABLE COMPUTER WORKPLACE
GB2387743A (en) Radiating enclosure
AU9323001A (en) Self-tuned millimeter wave rf transceiver module
CA2128553A1 (en) Wireless Base Station
US7084814B2 (en) Planar inverted F antenna
USD467041S1 (en) Enclosure for cats
AU2002316615A1 (en) Millimeter wave module (mmw) for microwave monolithic integrated circuit (mmic)
CN111478017A (en) Electronic device
EP1510965A4 (en) Card adapter
RU2001114573A (en) The external housing of the electronic device in which the electronic components are located, and the electronic device with such an external housing
DE602004011621T2 (en) Microphone coupler for a communication device
USD419154S (en) Housing for a portable communications device
USD354056S (en) Housing for a portable radio/phone
CA2291318A1 (en) Shielded modular housing for a substrate
EP1033821A3 (en) DECT transceiver module
CA2017340A1 (en) Hybrid module electronics package
CN201119131Y (en) Modular shell assembly structure
USD430866S (en) Environmental enclosure for housing cellular power equipment
KR20190102867A (en) Electronic device
JP2002271130A (en) Planar antenna
CN214851324U (en) Earphone fixing structure and mobile terminal

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: C2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: C2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 2001994469

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020037007505

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2001994469

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWP Wipo information: published in national office

Ref document number: 1020037007505

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP