WO2002017381A3 - Method for preventing damage to wafers in a sequential multiple steps polishing process - Google Patents

Method for preventing damage to wafers in a sequential multiple steps polishing process

Info

Publication number
WO2002017381A3
WO2002017381A3 PCT/EP2001/009648 EP0109648W WO2002017381A3 WO 2002017381 A3 WO2002017381 A3 WO 2002017381A3 EP 0109648 W EP0109648 W EP 0109648W WO 2002017381 A3 WO2002017381 A3 WO 2002017381A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
polishing
operation
wafer
wafers
method
Prior art date
Application number
PCT/EP2001/009648
Other languages
French (fr)
Other versions
WO2002017381A2 (en )
Inventor
Samuel Dunton
Victor Liang
Liming Zhang
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/03Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers
    • H01L21/3105After-treatment
    • H01L21/31051Planarisation of the insulating layers
    • H01L21/31053Planarisation of the insulating layers involving a dielectric removal step

Abstract

A method for preventing the drying of a residue on a wafer surface in a multiple stage polishing operation increases wafer processing throughput and extends the useful life of polishing pads used in a CMP operation. The method includes detecting a polishing endpoint for a wafer polished in a second polishing step following a first polishing operation for the wafer. Endpoint detection terminates polishing of another wafer in the first polishing operation and triggers overpolishing of the prior wafer in the second polishing operation. After a set period, overpolishing of the prior wafer in the second polishing operation ends. Finally each of the wafers moves to a subsequent processing operation, which may include a polishing operation or a buffing operation. One of the advantages of the invention is the maximization of total platen pad usage between platen pad changes since total processing time has been increased for the same polishing pads, thus permitting polishing of greater numbers of wafers between platen pad changes.
PCT/EP2001/009648 2000-08-24 2001-08-20 Method for preventing damage to wafers in a sequential multiple steps polishing process WO2002017381A3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US64573500 true 2000-08-24 2000-08-24
US09/645,735 2000-08-24

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20010978288 EP1312112A2 (en) 2000-08-24 2001-08-20 Method for preventing damage to wafers in a sequential multiple steps polishing process
KR20027005224A KR20020040913A (en) 2000-08-24 2001-08-20 Method for preventing damage to wafers in a sequential multiple steps polishing process
JP2002521350A JP2004507109A (en) 2000-08-24 2001-08-20 Wafer method of preventing damage in a multi polishing process for continuous

Publications (2)

Publication Number Publication Date
WO2002017381A2 true WO2002017381A2 (en) 2002-02-28
WO2002017381A3 true true WO2002017381A3 (en) 2002-11-07

Family

ID=24590257

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/009648 WO2002017381A3 (en) 2000-08-24 2001-08-20 Method for preventing damage to wafers in a sequential multiple steps polishing process

Country Status (5)

Country Link
EP (1) EP1312112A2 (en)
JP (1) JP2004507109A (en)
KR (1) KR20020040913A (en)
CN (1) CN1636272A (en)
WO (1) WO2002017381A3 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7363569B2 (en) 2001-06-29 2008-04-22 Intel Corporation Correcting for data losses with feedback and response
CN1302522C (en) * 2002-05-15 2007-02-28 旺宏电子股份有限公司 Terminal detection system for chemical and mechanical polisher
CN100473501C (en) 2005-12-08 2009-04-01 上海华虹Nec电子有限公司 Method for prolonging service-life of grinding pad in chemical-mechanical polishing
CN102922415B (en) * 2011-08-10 2015-05-13 无锡华润上华科技有限公司 Chemical mechanical polishing method capable of prolonging service life of polishing pad

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2324750A (en) * 1997-04-28 1998-11-04 Nec Corp Automatic wafer polishing apparatus
WO1999043465A1 (en) * 1998-02-24 1999-09-02 Speedfam Corporation Apparatus and method for the face-up surface treatment of wafers
US5951373A (en) * 1995-10-27 1999-09-14 Applied Materials, Inc. Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning
WO2000025984A1 (en) * 1998-11-02 2000-05-11 Applied Materials, Inc. Chemical mechanical polishing a substrate having a filler layer and a stop layer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5951373A (en) * 1995-10-27 1999-09-14 Applied Materials, Inc. Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning
GB2324750A (en) * 1997-04-28 1998-11-04 Nec Corp Automatic wafer polishing apparatus
WO1999043465A1 (en) * 1998-02-24 1999-09-02 Speedfam Corporation Apparatus and method for the face-up surface treatment of wafers
WO2000025984A1 (en) * 1998-11-02 2000-05-11 Applied Materials, Inc. Chemical mechanical polishing a substrate having a filler layer and a stop layer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SZARKA F ET AL: "THE CHARACTERIZATION, DEVELOPMENT AND IMPLEMENTATION OF MULTI-PLATEN IN-SITU RATE MONITOR (ISRM) CONTROL FOR CHEMICAL MECHANICAL PLANARIZATION IN ASIC MANUFACTURING", PROCEEDINGS OF THE SPIE, SPIE, BELLINGHAM, VA, US, no. 3742, 19 May 1999 (1999-05-19), pages 28 - 42, XP008005628 *

Also Published As

Publication number Publication date Type
WO2002017381A2 (en) 2002-02-28 application
CN1636272A (en) 2005-07-06 application
JP2004507109A (en) 2004-03-04 application
EP1312112A2 (en) 2003-05-21 application
KR20020040913A (en) 2002-05-30 application

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