WO2002015654A1 - Mounting method and mounting device - Google Patents

Mounting method and mounting device Download PDF

Info

Publication number
WO2002015654A1
WO2002015654A1 PCT/JP2001/006551 JP0106551W WO0215654A1 WO 2002015654 A1 WO2002015654 A1 WO 2002015654A1 JP 0106551 W JP0106551 W JP 0106551W WO 0215654 A1 WO0215654 A1 WO 0215654A1
Authority
WO
WIPO (PCT)
Prior art keywords
bonded
means
non
cleaning
energy
Prior art date
Application number
PCT/JP2001/006551
Other languages
French (fr)
Japanese (ja)
Inventor
Akira Yamauchi
Original Assignee
Toray Engineering Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2000237486A priority Critical patent/JP2002050860A/en
Priority to JP2000-237486 priority
Application filed by Toray Engineering Co., Ltd. filed Critical Toray Engineering Co., Ltd.
Publication of WO2002015654A1 publication Critical patent/WO2002015654A1/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27Manufacturing methods
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/731Location prior to the connecting process
    • H01L2224/73101Location prior to the connecting process on the same surface
    • H01L2224/73103Bump and layer connectors
    • H01L2224/73104Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7501Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7515Means for applying permanent coating, e.g. in-situ coating
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83191Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]

Abstract

A mounting method and a mounting device in which articles having an electrode are bonded by coating the electrode (3) of at least one article (2) to be bonded with nonconductive paste (20) immediately after that electrode (3) is irradiated with energy wave or energy particles (4) for cleaning. Since the electrode of the article to be bonded is prevented effectively against primary oxidation and secondary oxidation and fluxless bonding is realized, the process is simplified and the quality of a bonded article can be enhanced.

Description

Akira Itoda

Mounting method and mounting apparatus

Technical field .

The present invention is a object to be bonded to each other with an electrode (an example chip and the substrate) on how to implement our Yopi mounting device you joined.

Background technology

Bonding objects to be bonded to each other with electrodes, for example, the chip and the substrate on which the bumps are formed as an electrode together, for example mounting method for heat-bonding is well known. Typical method, washed electrodes prior to bonding, after the washing, while securing the sealing performance of the joint portion after bonding by applying a non-conductive paste, the reliability and bonding the electrode during the bonding method of applying a flux before the bonding to the oxide removal is known.

However, in the conventional method as described above, after preventing electrode cleaning to primary oxidation of the objects to be bonded, the time until the application of the non-conductive paste or flux is long, the object to be bonded electrodes, for example, solder bumps there is a possibility that the oxidized.

Further, although it is possible to prevent some secondary oxidation by applying flux before heat-bonding, the flux is applied, removing removed by the flux residue is required after bonding, the problem of much process becomes complicated You are invited.

Inventions of disclosure

An object of the present invention can effectively prevent the primary oxidation and secondary oxidation of the electrodes of the object to be bonded and to allow bonding at fluxless, good implementations of which can be simplified process efficiency It is to provide a method and mounting apparatus.

To achieve the above object, a mounting method according to the present invention, when bonding the objects to be bonded to each other with electrodes, least properly both electrodes to energy waves of one object to be bonded is being irradiated with energetic particles immediately after washing, the non-conductive paste was applied cloth, made of a method which is characterized in that bonding the two objects to be bonded thereafter.

In this technique, least properly both electrodes to energy waves of one object to be bonded may be applied immediately after washing by irradiating energy particles, the same position Similar nonconductive paste and cleaning. Alternatively, when the electrodes of at least one of the junction is washed by irradiating the energy wave or energy particles, washed while relatively moving the means for irradiating 該被 conjugate and energy wave or energy particles, for example, it is also possible to wash while relatively moving in a horizontal direction. In this case, immediately after washing, it may be applied to non-conductive paste at the position after the relative movement.

More specific embodiments of the method according to the present invention, for example, one of the objects to be bonded is a substrate or chip solder bumps are formed as an electrode, it was washed by irradiating an energy wave or energy particles solder bumps immediately after, at the same location, or at a position after the relative movement, the non-conductive paste was applied on 該被 conjugate, contacting the electrodes of the solder bumps and the other object to be bonded of 該被 conjugate thereafter it is a method of engagement. The other object to be bonded, the electrode chip or the substrate is formed by a gold bump or the like the one object to be bonded, have either the electrode Ha Ndabanpu is formed substrate or chip it may be. In the latter case, at even for the solder bumps of the other object to be bonded, immediately after cleaning by irradiating an energy wave or Eneru formic single particle at the same location, or position after the relative moving, the non-conductive paste was applied on 該被 conjugate may be bonded to the solder bumps of both the object junction object thereafter. '

For the bonding between the electrode made of the electrode and the gold bumps formed of solder bumps, the chip substrate and the gold bumps Han Dabanpu thereon was formed a combination, of the substrate chip and the gold bumps solder bumps are formed is formed combination, and further, it is possible to joint the combination of chip chip and the gold bumps solder bumps are formed is formed. As the bonding method is typically applicable to pressurized heat bonding by the heater first class, not limited to this, also applicable Mel ultrasonic bonding using ultrasonic waves.

Also, the referred to in the present invention "electrode", electrodes formed in a flat shape slightly higher position at the same level or even more even and the surface of the object to be bonded, and, on the flat electrode, Oh Rui be joined on the surface of the object, which is formed so as to swell in a convex shape is a concept including a form of so-called van-flop. Therefore, the bonding between the electrodes also bumps the mechanic junction, is a concept including bonding the bumps and flat electrodes. - The energy wave or energy particles in the present invention, plasma, Onbimu, atomic beam, radical beam, it is possible to use a laser or the like, from the viewpoint of simplification of the cleaning effect and device configurations, especially, use of atmospheric pressure plasma it is good Masui. Atmospheric pressure plasma, so as not to charge the object to be bonded, a method of applying to a voltage tract is desirable.

Mounting device according to the present invention, a mounting apparatus der connexion for joining objects to be bonded to each other with electrodes, and means for cleaning by irradiating an energy wave or energy particles electrodes of at least one of the objects to be bonded, the washing means substantially consisting of those and having a coating means movable non-conductive paste Bok integrally. It said cleaning means is preferably configured to the relative movable means to be cleaned object to be bonded, it is possible to do this Yotsute, desired cleaning while relatively moving. The application means of the non-conductive paste can also be configured to the relative movable means relative to the objects to be bonded. For example, the coating means of the non-conductive paste, if previously placed with a certain distance between the cleaning means, the cleaning means substantially moved integrally, and, by relatively moving with respect to the object to be bonded , it is possible to apply non-conductive base an strike immediately after making the necessary cleaning. Further, the coating fabric means the non-conductive base Ichisu DOO, after washing with the washing means, independently of the cleaning means, can be configured to be moved relative the object to be bonded. However, in this case, cleaning means the completion of the cleaning, may be moved non-conductive paste applying means and integrally. Thus, cleaning means and a non-conductive base - so be sampled coating means is substantially located is moved integrally adjusted, can nonconductive paste Bok coating at the same location immediately after washing become. Alternatively, leave movable integrally formed coating means of the cleaning unit and a non-conductive paste and having a predetermined positional relationship, is washed while relatively moving the cleaning means and the objects to be bonded during cleaning, immediately after the washing, it is also possible to apply the non-conductive pane one strike at a position after the relative movement.

In the present invention, cleaning by irradiating an energy wave or energy particles, and the purpose of removal of contaminants present on the surface (-contamination Chillon), but, and this Kontamine one to down, attached to the substrate electrode or the like organic you are, is that an oxide or other impurities. Further, the joint according to the present invention, in addition to the portions bonded by the solder of the conventional lead / tin, tin / silver, etc. B i / I n junction by a so-called alternate solder, gold / tin, gold Z is a concept including portions bonded by gold. Also, the electrode and the in the present invention, not only the electrode accompanied by electrical wiring, including the dummy electrode is not the One Do therefore electrical wiring. Further, the chip and the in the present invention, example, IC chips, semiconductor chips, optical elements, surface mount components, wafer, etc., regardless of the type or size, refers to all the sides to be joined to the substrate. Further, the substrate, for example, a resin substrate, a glass substrate, a film substrate, a chip, such as a wafer one, regardless of the type or size, refers to all the sides to be joined to the chip.

In mounting method and a mounting apparatus according to the present invention as described above, since the non-conductive paste immediately after washing the electrode is applied, to or is left an extended period before pasting after cleaning is no longer , by coating with a non-conductive paste, the primary oxidation of washing the electrodes is reliably prevented. Moreover, at the same position as the cleaning, with some stomach immediately after the relative movement position, because non-conductive base one strike is applied immediately after washing, the positional accuracy of the coated fabric is also easily secured with respect to the washed electrode exactly non-conductive base one strike is applied so as to cover it securely.

In this state, since the object to be bonded to each other are bonded (e.g. heat-bonding), electrodes immediately after cleaning is covered with Bok nonconductive pace eliminates the chance Touching the atmosphere around up to the junction, the secondary oxidized would be prevented. Further, by covering such an electrode surface after cleaning straight with nonconductive Bae one strike in is not limited to antioxidants, which hinders junction step after, not reaction or undesired with the metal surface of the non-oxide adhesion of foreign matters and reaction products (for example, adsorption, such as CO) can be prevented. Therefore, it is possible to bond with fluxes less, by a fluxless, a series of steps up to the junction completed is greatly simplified. The bonding process has already been applied is non-conductive paste is, and the flux process, since the residue removing step is unnecessary, the time required for the series of processes is greatly reduced, Taku part-time is shortened that. Also, can both effectively prevent primary oxidation and secondary oxidation of the electrodes of the object to be bonded, and, since-contamination Chillon foreign matter or the like can be effectively prevented, it is possible to ensure excellent quality bonded article .

Furthermore, cleaning and substantially simultaneously non-conductive paste Bok are applied. Since primary oxidation of the electrodes is prevented, required it is not to consider the time until the bonding process. As a result, for example, stock in a state coated with non-conductive paste also becomes possible, it becomes possible to have a buffer if necessary to a series of production processes.

Figure surface easy single a description of the

Figure 1 is a schematic configuration diagram of a mounting apparatus according to an embodiment of the present invention.

Figure 2 is an enlarged schematic side view showing washing 净 in the apparatus of FIG. 1, the state of the non-conductive paste coating.

Figure 3 is a schematic sectional view showing the substrate after the non-conductive paste coated state. Figure 4 is a schematic cross-sectional view showing the state of bonding between the objects to be bonded.

BEST MODE order to you the Invention

Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. Figure 1 shows a mounting apparatus according to an embodiment of the present invention. In Figure 1, the implementation device 1, means for cleaning at least one of the electrode substrate 2 as objects to be bonded, the solder bumps 3 formed on the substrate 2 in the present embodiment, by irradiation of an energy wave or energy particles 4 5 If, on the substrate 2, and a joining means 7 for joining the tip 6 as the other of the objects to be bonded. In the present embodiment, the chip 6 and the gold bumps 8 are formed, with respect to the gold bumps 8, contamination removing surface, for example, it is desirable to perform the contamination removal by A r flop plasma, essentially oxide since there is no problem, paste application is not performed. Gold bumps 8 can be formed, for example, as a main Tsukibanpu.

Cleaning means 5, in this embodiment, is provided in the cleaning chamber 9, plasma is used as Eneru formic one wave or energetic particles 4. If the atmospheric pressure bra Zuma used, it is possible to omit the cleaning tea Nba 9. In the vicinity of the cleaning unit 5, the cleaning means and integrally movable non-conductive paste Bok coating means (dispenser) 1 0 is provided. Coating means 1 0, immediately after by that cleaning in the cleaning unit 5, and summer to be applied to non-conductive paste at the same position. The cleaning, as described above, the substrate 2 to be cleaned and cleaning means 5 are relatively moved, for example, are relatively moved in the horizontal direction, washed in relative movement, after washing straight, that is, washing the at completion position after the relative movement may be coated with a non-conductive paste by a coating means 1 0.

Washed, the substrate 2 where a nonconductive paste is applied, in this embodiment, the transfer port pots 1 1, and is conveyed to the bonding unit 7 provided on the junction Chiya Nba 1 2. Bonding Chiyanba 1 2 may be omitted in particular, the provision of the bonding Chiyanba 1 2, if necessary, certain bonding Chiya Nba 1 2, for example, can be an inert gas atmosphere or reduced pressure atmosphere . For sealing the wash tea Nba 9, or to the cleaning Chiya Nba 9 and joined Chiyanba 1 in 2 different atmosphere, it is preferable to provide a shutter motor unit 1 3 between.

Joining means 7, the non-conductive paste Bok is cleaned with solder bumps 3 of the substrate 2 coated, heat bonding the gold bumps 8 of the chip 6. Joining means 7, for example a stage 1 4 for holding a substrate 2, and a tool 1 5 for holding the chip 6. In this real embodiments with stage 1 4 X, positioning in the Y direction (horizontal direction), or X, Ru Tei summer to allow positional adjustment in the Y direction (horizontal direction) and the direction of rotation (direction). Tool 1 5 is summer so adjustable in the Z direction position adjustment (vertical direction), or Z direction (vertical direction) and rotational direction (0 direction). In the present invention, a method of position adjustment is not particularly limited. Further, to detect the positional deviation amount between the upper and lower article to be welded, in order to be able to adjust within the desired positional accuracy range based on it, between the stearyl over di 1 4 and tools 1 5, upper and lower of the recognizing means 1 6 to read the recognition mark provided on the bonded object side is provided to be retractable. As a recognition unit 1 6, for example, CCD camera, infrared camera, X-rays camera, sensor-like, if means for recognizing a recognition mark regardless of the type or size, may be any means. The recognition means 1 6 is also the X, Y directions (in some cases, and Z direction (vertical direction)) are summer to allow position location adjustment. Moreover, this recognition means, and below the recognition mark is attached to the article side respectively read separately, may be configured to recognize means other configurations. For Araimento, the tool side, may be carried out in either of the stage side, it may be carried out in both.

Thus using the configured mounting apparatus 1, the mounting method according to the present invention is carried out as follows.

'In this embodiment, as shown in FIG. 2, Ri by the atmospheric pressure plasma 4 from the cleaning unit 5 is cleaned solder bumps 3 of the substrate 2, and immediately thereafter, the coating means being aligned with the cleaning means 5 1 0 force, et al, a nonconductive paste 2 0 toward the cleaned solder bumps 3 are applied. be. Depending on the formation region of several Ya Ha Ndabanpu 3 of solder bumps 3 formed on the substrate 2 is carried out returns Ri this operation calyx. Because it is washed by the atmospheric-pressure plasma, the special atmosphere forming means is not required, as the configuration of the cleaning means portion requires only one simple. Cleaning, after the non-conductive base Ichisu preparative coating, as shown in FIG. 3, is cleaned solder bumps 3 on purpose made like covered by a non-conductive paste 2 0. The coverage of the non-conductive base Ichisu DOO 2 0 is only to be adjusted by appropriately adjusting the coating means 1 0, it is preferable to prevent too much. Against solder bumps 3 of the substrate 2, after washing, or washing substantially base nonconductive simultaneously Ichisu Doo 2 0 is applied, it washed solder bumps 3 are substantially completely non-conductive paste 2 0 since it is a state of being covered by the primary oxidation of the cleaned Handaba pump 3 is effectively prevented. Since the cleaned solder bumps 3 does not touch the atmosphere after this, it is also possible stocking left alone, for example as a buffer for production. .

Coated substrate 2 of a non-conductive paste 2 0 is conveyed to the bonding unit 7 by the conveying robot 1 1, it is held in position on the stage 1 4. After alignment of the substrate 2 held by the tool 1 chip 6 held on 5 and stage 1 4 has been performed, both objects to be bonded are joined heated. The heat-bonding, as shown in FIG. 4, in a non-conductive paste 2 0, and the gold bumps 8 of the chip 6 without risk of oxidation, the substrate oxidation by a non-conductive paste 2 0 has been prevented 2 will be the solder bumps 3 are bonded, in particular solder bumps 3 are so will be heated in a non-conductive paste 2 0, secondary oxidation by heating is also effectively prevented.

Primary oxidation, since heat-bonding in a state of being prevented both secondary oxidation takes place, when the junction is the flux which has been used basically conventional is unnecessary. That allows bonding at 'fluxes less. Since fluxless, and flux coating fabric process, flux residue removal step is not required, a series of process is greatly simplified, Taku part-time is shortened.

Primary oxidation, while secondary oxidation is prevented, since the predetermined bonding between the substrate 2 and the chip 6 is carried out, yet simple series of steps, the quality after the bonding is extremely excellent. As the non-conductive base one strike, it is also possible to use those obtained by containing the conductive particles, it'll shall be applied to any on if the non-conductive base one strike remains between the bumps to be joined, it is possible to enhance the reliability of the joint. Further, the form of the object to be bonded, as long as the purpose of the present invention is not particularly limited.

Further, the present invention is a solder bump as well, it is effective in primary oxidation and / or secondary oxidation reaction any electrodes.

Interest for Allowed potential on the industrial

Mounting method and mounting apparatus of the present invention can be applied to objects to be bonded to each other with electrodes on bonding Surua Rayuru implementation, by applying the present invention, as well as simplifying the sequence of steps, the quality of the conjugate it is possible to improve.

Claims

Gen'ao required of range
1. Upon joining the objects to be bonded to each other with an electrode, immediately after cleaning by irradiating an energy wave or energy particles electrodes least also one of objects to be bonded is coated with a non-conductive paste, accordingly mounting method characterized in that bonding the two objects to be bonded later.
2. Least also the electrodes of one object to be bonded immediately after washing by irradiating an energy wave or energy particles, coating the non-conductive paste at the same position, mounting method of claim 1.
3. Upon the electrode of at least one object to be bonded is washed by irradiating the energy wave or energy particles, washed while relatively moving the means for irradiating 該被 conjugate and energy wave or energy conservation one grain implementation how the claim 1.
4. Least also one substrate object to be bonded is solder bumps as an electrode is formed is a chip, immediately after washing by Rukoto be irradiated energy wave or energy particles in the solder bumps, the non-conductive base Ichisu DOO was coated on 該被 conjugates, bonded electrodes solder bumps and the other object to be bonded of 該被 conjugate after that deer, mounting method of claim 1.
5. Using atmospheric pressure plasma as an energy wave or energetic particles, mounting method of claim 1.
6. The mounting apparatus for joining objects to be bonded to each other with electrodes, and means for washing by irradiation with even the electrodes to energy waves or energy particles of one object to be bonded less, the cleaning means and substantially to mounting apparatus characterized by having a coating fabric means movable non-conductive paste Bok integrally.
7. The cleaning means comprises a relatively movable unit with respect to objects to be bonded, of claim 6
8. The application means of the non-conductive paste, an object to be bonded to the relatively movable means or Ranaru, mounting apparatus of claim 6.
9. The non-conductive base one strike of the coating means, with a constant interval between the cleaning measures are Installation, mounting apparatus of claim 7.
1 0. The coating means of the non-conductive paste, the after cleaning by the cleaning unit is configured to relatively movable unit with respect to the junction thereof, the mounting apparatus of claim 6.
PCT/JP2001/006551 2000-08-04 2001-07-30 Mounting method and mounting device WO2002015654A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000237486A JP2002050860A (en) 2000-08-04 2000-08-04 Method and device for mounting
JP2000-237486 2000-08-04

Publications (1)

Publication Number Publication Date
WO2002015654A1 true WO2002015654A1 (en) 2002-02-21

Family

ID=18729337

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/006551 WO2002015654A1 (en) 2000-08-04 2001-07-30 Mounting method and mounting device

Country Status (3)

Country Link
JP (1) JP2002050860A (en)
TW (1) TW529061B (en)
WO (1) WO2002015654A1 (en)

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9548462B2 (en) 2006-02-10 2017-01-17 Universal Display Corporation Organic electroluminescent materials and devices
US9590194B2 (en) 2014-02-14 2017-03-07 Universal Display Corporation Organic electroluminescent materials and devices
US9647217B2 (en) 2014-02-24 2017-05-09 Universal Display Corporation Organic electroluminescent materials and devices
US9680113B2 (en) 2014-12-17 2017-06-13 Universal Display Corporation Organic electroluminescent materials and devices
US9761807B2 (en) 2013-07-15 2017-09-12 Universal Display Corporation Organic light emitting diode materials
US9799838B2 (en) 2014-10-08 2017-10-24 Universal Display Corporation Fluorinated organic electroluminescent materials and devices
US9812656B2 (en) 2011-06-08 2017-11-07 Universal Display Corporation Organic electroluminescent materials and devices
US9825260B2 (en) 2014-11-26 2017-11-21 Universal Display Corporation Emissive display with photo-switchable polarization
US9831442B2 (en) 2009-01-16 2017-11-28 Universal Display Corporation Organic electroluminescent materials and devices
US9859510B2 (en) 2015-05-15 2018-01-02 Universal Display Corporation Organic electroluminescent materials and devices
US9871219B2 (en) 2005-04-13 2018-01-16 Universal Display Corporation Organic light emitting devices
US9905784B2 (en) 2013-11-15 2018-02-27 Universal Display Corporation Organic electroluminescent materials and devices
US9911930B2 (en) 2007-03-08 2018-03-06 Universal Display Corporation Organic electroluminescent materials and devices
US9929360B2 (en) 2016-07-08 2018-03-27 Universal Display Corporation Organic electroluminescent materials and devices
US9929361B2 (en) 2015-02-16 2018-03-27 Universal Display Corporation Organic electroluminescent materials and devices
US9978956B2 (en) 2015-07-15 2018-05-22 Universal Display Corporation Organic electroluminescent materials and devices
US9997727B2 (en) 2007-08-08 2018-06-12 Universal Display Corporation Organic electroluminescent materials and devices
US10033004B2 (en) 2015-06-01 2018-07-24 Universal Display Corporation Organic electroluminescent materials and devices
US10128450B2 (en) 2013-10-23 2018-11-13 University Of Southern California Organic electroluminescent materials and devices
US10135006B2 (en) 2016-01-04 2018-11-20 Universal Display Corporation Organic electroluminescent materials and devices
US10144867B2 (en) 2015-02-13 2018-12-04 Universal Display Corporation Organic electroluminescent materials and devices
US10177316B2 (en) 2015-02-09 2019-01-08 Universal Display Corporation Organic electroluminescent materials and devices
US10181564B2 (en) 2015-08-26 2019-01-15 Universal Display Corporation Organic electroluminescent materials and devices
US10236456B2 (en) 2016-04-11 2019-03-19 Universal Display Corporation Organic electroluminescent materials and devices
US10256427B2 (en) 2014-04-15 2019-04-09 Universal Display Corporation Efficient organic electroluminescent devices
US10263198B2 (en) 2014-05-08 2019-04-16 Universal Display Corporation Organic electroluminescent materials and devices
US10270046B2 (en) 2015-03-06 2019-04-23 Universal Display Corporation Organic electroluminescent materials and devices
US10297770B2 (en) 2015-03-27 2019-05-21 Universal Display Corporation Organic electroluminescent materials and devices
US10301338B2 (en) 2014-05-08 2019-05-28 Universal Display Corporation Organic electroluminescent materials and devices
US10312450B2 (en) 2007-08-08 2019-06-04 Universal Display Corporation Organic electroluminescent materials and devices

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235520A (en) * 1992-02-20 1993-09-10 Masuhiro Kokoma Treatment of circuit board by use of plasma
JPH0799382A (en) * 1993-09-27 1995-04-11 Shibuya Kogyo Co Ltd Non-cleaning soldering and device thereof
JPH0796260A (en) * 1993-09-24 1995-04-11 Omron Corp Washing method and apparatus and processing method and apparatus
EP0884936A1 (en) * 1996-02-28 1998-12-16 Hitachi, Ltd. Method for manufacturing electronic circuit device
JPH1126511A (en) * 1997-07-08 1999-01-29 Matsushita Electric Ind Co Ltd Mounting method for work with bumps

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235520A (en) * 1992-02-20 1993-09-10 Masuhiro Kokoma Treatment of circuit board by use of plasma
JPH0796260A (en) * 1993-09-24 1995-04-11 Omron Corp Washing method and apparatus and processing method and apparatus
JPH0799382A (en) * 1993-09-27 1995-04-11 Shibuya Kogyo Co Ltd Non-cleaning soldering and device thereof
EP0884936A1 (en) * 1996-02-28 1998-12-16 Hitachi, Ltd. Method for manufacturing electronic circuit device
JPH1126511A (en) * 1997-07-08 1999-01-29 Matsushita Electric Ind Co Ltd Mounting method for work with bumps

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9871219B2 (en) 2005-04-13 2018-01-16 Universal Display Corporation Organic light emitting devices
US10158090B2 (en) 2006-02-10 2018-12-18 Universal Display Corporation Organic electroluminescent materials and devices
US9548462B2 (en) 2006-02-10 2017-01-17 Universal Display Corporation Organic electroluminescent materials and devices
US9893306B2 (en) 2006-02-10 2018-02-13 Universal Display Corporation Organic electroluminescent materials and devices
US10230060B2 (en) 2007-03-08 2019-03-12 Universal Display Corporation Organic electroluminescent materials and devices
US9911930B2 (en) 2007-03-08 2018-03-06 Universal Display Corporation Organic electroluminescent materials and devices
US9997727B2 (en) 2007-08-08 2018-06-12 Universal Display Corporation Organic electroluminescent materials and devices
US10312450B2 (en) 2007-08-08 2019-06-04 Universal Display Corporation Organic electroluminescent materials and devices
US9831442B2 (en) 2009-01-16 2017-11-28 Universal Display Corporation Organic electroluminescent materials and devices
US9847495B2 (en) 2011-06-08 2017-12-19 Universal Display Corporation Organic electroluminescent materials and devices
US10297769B2 (en) 2011-06-08 2019-05-21 Universal Display Corporation Organic electroluminescent materials and devices
US9812656B2 (en) 2011-06-08 2017-11-07 Universal Display Corporation Organic electroluminescent materials and devices
US9761807B2 (en) 2013-07-15 2017-09-12 Universal Display Corporation Organic light emitting diode materials
US10128450B2 (en) 2013-10-23 2018-11-13 University Of Southern California Organic electroluminescent materials and devices
US9905784B2 (en) 2013-11-15 2018-02-27 Universal Display Corporation Organic electroluminescent materials and devices
US9590194B2 (en) 2014-02-14 2017-03-07 Universal Display Corporation Organic electroluminescent materials and devices
US9647217B2 (en) 2014-02-24 2017-05-09 Universal Display Corporation Organic electroluminescent materials and devices
US10256427B2 (en) 2014-04-15 2019-04-09 Universal Display Corporation Efficient organic electroluminescent devices
US10276805B2 (en) 2014-05-08 2019-04-30 Universal Display Corporation Organic electroluminescent materials and devices
US10263198B2 (en) 2014-05-08 2019-04-16 Universal Display Corporation Organic electroluminescent materials and devices
US10301338B2 (en) 2014-05-08 2019-05-28 Universal Display Corporation Organic electroluminescent materials and devices
US9799838B2 (en) 2014-10-08 2017-10-24 Universal Display Corporation Fluorinated organic electroluminescent materials and devices
US9825260B2 (en) 2014-11-26 2017-11-21 Universal Display Corporation Emissive display with photo-switchable polarization
US9680113B2 (en) 2014-12-17 2017-06-13 Universal Display Corporation Organic electroluminescent materials and devices
US10000517B2 (en) 2014-12-17 2018-06-19 Universal Display Corporation Organic electroluminescent materials and devices
US10177316B2 (en) 2015-02-09 2019-01-08 Universal Display Corporation Organic electroluminescent materials and devices
US10144867B2 (en) 2015-02-13 2018-12-04 Universal Display Corporation Organic electroluminescent materials and devices
US9929361B2 (en) 2015-02-16 2018-03-27 Universal Display Corporation Organic electroluminescent materials and devices
US10270046B2 (en) 2015-03-06 2019-04-23 Universal Display Corporation Organic electroluminescent materials and devices
US10297770B2 (en) 2015-03-27 2019-05-21 Universal Display Corporation Organic electroluminescent materials and devices
US9859510B2 (en) 2015-05-15 2018-01-02 Universal Display Corporation Organic electroluminescent materials and devices
US10033004B2 (en) 2015-06-01 2018-07-24 Universal Display Corporation Organic electroluminescent materials and devices
US9978956B2 (en) 2015-07-15 2018-05-22 Universal Display Corporation Organic electroluminescent materials and devices
US10181564B2 (en) 2015-08-26 2019-01-15 Universal Display Corporation Organic electroluminescent materials and devices
US10135006B2 (en) 2016-01-04 2018-11-20 Universal Display Corporation Organic electroluminescent materials and devices
US10236456B2 (en) 2016-04-11 2019-03-19 Universal Display Corporation Organic electroluminescent materials and devices
US9929360B2 (en) 2016-07-08 2018-03-27 Universal Display Corporation Organic electroluminescent materials and devices

Also Published As

Publication number Publication date
JP2002050860A (en) 2002-02-15
TW529061B (en) 2003-04-21

Similar Documents

Publication Publication Date Title
US3628717A (en) Apparatus for positioning and bonding
US6179196B1 (en) Apparatus for manufacturing circuit boards
US5626277A (en) Mounting apparatus of solder-balls
EP0392539A2 (en) Semiconductor device package and sealing method therefore
US4285002A (en) Integrated circuit package
US4817849A (en) Method for bonding semiconductor laser element and apparatus therefor
EP0680803B1 (en) Bonding flip chips to a substrate
US5188280A (en) Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
JP3181600B2 (en) Method and apparatus for soldering without flux substrate or chip
US6503130B2 (en) Protective film separator in semiconductor wafer grinding process
JP3790995B2 (en) Bonding method and device and the welding device created by this method
JP3885747B2 (en) Wire bonding method
US5415331A (en) Method of placing a semiconductor with die collet having cavity wall recess
JP2007516602A (en) Production structures and methods capped chip containing the flowable conductive medium
JP2000068327A (en) Component mounting method and apparatus
US7975901B2 (en) Bonding apparatus and wire bonding method
GB881832A (en) Improvements in or relating to the bonding of metals to bodies comprising semiconductive or brittle materials
GB1536872A (en) Electrical inter-connection method and apparatus
KR100495024B1 (en) A method for forming the bump
JP4275806B2 (en) Implementation method of the semiconductor element
JPH05226407A (en) Manufacture of semiconductor device and device therefor
KR20100128275A (en) Thermal mechanical flip chip die bonding
JP4279786B2 (en) Method of forming a bump, a method of manufacturing a semiconductor device, and a substrate processing apparatus
US6386432B1 (en) Semiconductor die pickup method that prevents electrostatic discharge
US4587395A (en) Bonding leads to semiconductor devices

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CA KR US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
122 Ep: pct application non-entry in european phase