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Appareil et procede de regulation thermique d'une plaquette et dispositif en essai utilisant une diode integree sensible a la temperature

Info

Publication number
WO2002005051A3
WO2002005051A3 PCT/US2001/021317 US0121317W WO2002005051A3 WO 2002005051 A3 WO2002005051 A3 WO 2002005051A3 US 0121317 W US0121317 W US 0121317W WO 2002005051 A3 WO2002005051 A3 WO 2002005051A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
temperature
integrated
method
controlling
diode
Prior art date
Application number
PCT/US2001/021317
Other languages
English (en)
French (fr)
Other versions
WO2002005051A2 (en )
Inventor
Douglas S Olsen
David Stura
Original Assignee
Temptronic Corp
Douglas S Olsen
David Stura
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/20Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/1927Control of temperature characterised by the use of electric means using a plurality of sensors
    • G05D23/193Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
    • G05D23/1932Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces
    • G05D23/1934Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces each space being provided with one sensor acting on one or more control means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
PCT/US2001/021317 2000-07-10 2001-07-06 Appareil et procede de regulation thermique d'une plaquette et dispositif en essai utilisant une diode integree sensible a la temperature WO2002005051A3 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US09/612,667 2000-07-10
US09612667 US6545494B1 (en) 2000-07-10 2000-07-10 Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diode
US09839274 US6552561B2 (en) 2000-07-10 2001-04-20 Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode
US09/839,274 2001-04-20

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002509847A JP2004503924A (ja) 2000-07-10 2001-07-06 集積化された温度センシングダイオードを用いて試験中のウェハおよびデバイスの温度を制御する装置およびその方法
EP20010950901 EP1301838A2 (en) 2000-07-10 2001-07-06 Apparatus and method for controlling temperature in a wafer and a device under test using integrated temperature sensitive diode

Publications (2)

Publication Number Publication Date
WO2002005051A2 true WO2002005051A2 (en) 2002-01-17
WO2002005051A3 true true WO2002005051A3 (fr) 2002-04-25

Family

ID=27086824

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/021317 WO2002005051A3 (fr) 2000-07-10 2001-07-06 Appareil et procede de regulation thermique d'une plaquette et dispositif en essai utilisant une diode integree sensible a la temperature

Country Status (4)

Country Link
US (1) US6552561B2 (xx)
JP (1) JP2004503924A (xx)
EP (1) EP1301838A2 (xx)
WO (1) WO2002005051A3 (xx)

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EP1312106A1 (en) * 2000-07-21 2003-05-21 Temptronic Corporation Temperature-controlled thermal platform for automated testing
US6636062B2 (en) * 2001-04-10 2003-10-21 Delta Design, Inc. Temperature control device for an electronic component
KR100479988B1 (ko) * 2002-07-24 2005-03-30 미래산업 주식회사 반도체 소자 테스트 핸들러의 발열 보상방법
JP4659328B2 (ja) * 2002-10-21 2011-03-30 東京エレクトロン株式会社 被検査体を温度制御するプローブ装置
JP2004354341A (ja) * 2003-05-30 2004-12-16 Denso Corp 環境試験装置及び環境試験方法
US6844752B1 (en) * 2003-09-19 2005-01-18 Xilinx, Inc. Thermal conditioning for integrated circuit testing
EP1692714A1 (en) * 2003-11-26 2006-08-23 Temptronic Corporation Apparatus and method for reducing electrical noise in a thermally controlled chuck
US8749762B2 (en) 2004-05-11 2014-06-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7235992B2 (en) * 2004-06-08 2007-06-26 Powerchip Semiconductor Corp. Semiconductor facility
DE102004057215B4 (de) * 2004-11-26 2008-12-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer Sondenkarte unter Verwendung eines temperierten Fluidstrahls
DE102005001163B3 (de) * 2005-01-10 2006-05-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung
DE102005054552B4 (de) * 2005-11-14 2017-06-08 Infineon Technologies Austria Ag Vorrichtung und Verfahren zur Prüfung von Halbleitersubstraten auf Risse
JP2007165390A (ja) * 2005-12-09 2007-06-28 Fujitsu Ltd 検査装置及び方法
US7590473B2 (en) * 2006-02-16 2009-09-15 Intel Corporation Thermal management using an on-die thermal sensor
US7457117B2 (en) * 2006-08-16 2008-11-25 Rambus Inc. System for controlling the temperature of electronic devices
US7663388B2 (en) * 2007-03-30 2010-02-16 Essai, Inc. Active thermal control unit for maintaining the set point temperature of a DUT
US8087823B2 (en) * 2008-08-18 2012-01-03 International Business Machines Corporation Method for monitoring thermal control
US8540422B2 (en) * 2010-10-04 2013-09-24 Cameron Health, Inc. Electrical component behavior analysis tools
US8547122B2 (en) * 2011-07-11 2013-10-01 Microchip Technology Incorporated Temperature measurement of active device under test on strip tester
CN102608509B (zh) * 2011-12-22 2015-06-03 中国科学院半导体研究所 对发光二极管进行光电热老化综合检测的方法
US9063171B2 (en) * 2012-03-23 2015-06-23 Mpi Corporation Probing apparatus equipped with heating device
US9244107B2 (en) * 2012-11-12 2016-01-26 Marvell World Trade Ltd. Heat sink blade pack for device under test testing
US9562943B2 (en) * 2012-11-19 2017-02-07 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer temperature sensing methods and related semiconductor wafer
CN103176489B (zh) * 2013-02-06 2015-09-30 南京千韵电子科技有限公司 芯片内部温度控制方法和装置以及基于本方法的实验仪
CN103364032B (zh) * 2013-07-15 2015-09-16 中国科学院半导体研究所 半导体发光器件或模组在线多功能测试系统及方法
US20160054377A1 (en) * 2014-08-20 2016-02-25 Darryl G. Walker Testing and setting performance parameters in a semiconductor device and method therefor
CN104679059A (zh) * 2014-12-26 2015-06-03 北京兆易创新科技股份有限公司 一种集成电路的温度控制系统
US20170261547A1 (en) * 2016-03-08 2017-09-14 Temptronic Corporation Temperature Forcing System and Method with Conductive Thermal Probes

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734872A (en) * 1985-04-30 1988-03-29 Temptronic Corporation Temperature control for device under test
US5154514A (en) * 1991-08-29 1992-10-13 International Business Machines Corporation On-chip temperature sensor utilizing a Schottky barrier diode structure
US5281026A (en) * 1992-03-20 1994-01-25 Cray Research, Inc. Printed circuit board with cooling monitoring system
US5498971A (en) * 1994-02-07 1996-03-12 Zenith Data Systems Corporation Method and control circuit for measuring the temperature of an integrated circuit
DE19652046A1 (de) * 1996-12-13 1998-06-18 Siemens Ag Verfahren zur Ermittlung der Temperatur eines Halbleiter-Chips
US5875142A (en) * 1997-06-17 1999-02-23 Micron Technology, Inc. Integrated circuit with temperature detector
WO1999034159A1 (en) * 1997-12-31 1999-07-08 Temptronic Corporation Temperature control system for a workpiece chuck

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JPS58124949A (en) * 1982-01-20 1983-07-25 Sumitomo Metal Ind Ltd Estimating method of manganese content in molten steel
US4848090A (en) * 1988-01-27 1989-07-18 Texas Instruments Incorporated Apparatus for controlling the temperature of an integrated circuit package
JPH0252263A (en) * 1988-08-17 1990-02-21 Seiko Instr Inc Semiconductor testing device
US4955380A (en) * 1988-12-15 1990-09-11 Massachusetts Institute Of Technology Flexible measurement probes
US5123850A (en) * 1990-04-06 1992-06-23 Texas Instruments Incorporated Non-destructive burn-in test socket for integrated circuit die
US5205132A (en) * 1992-06-12 1993-04-27 Thermonics Incorporated Computer-implemented method and system for precise temperature control of a device under test
JP2970628B2 (ja) * 1997-11-07 1999-11-02 日本電気株式会社 高低温プローバおよびウエハ測定方法
US6279832B1 (en) * 1999-03-31 2001-08-28 Melexis Nv Temperature control system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734872A (en) * 1985-04-30 1988-03-29 Temptronic Corporation Temperature control for device under test
US5154514A (en) * 1991-08-29 1992-10-13 International Business Machines Corporation On-chip temperature sensor utilizing a Schottky barrier diode structure
US5281026A (en) * 1992-03-20 1994-01-25 Cray Research, Inc. Printed circuit board with cooling monitoring system
US5498971A (en) * 1994-02-07 1996-03-12 Zenith Data Systems Corporation Method and control circuit for measuring the temperature of an integrated circuit
DE19652046A1 (de) * 1996-12-13 1998-06-18 Siemens Ag Verfahren zur Ermittlung der Temperatur eines Halbleiter-Chips
US5875142A (en) * 1997-06-17 1999-02-23 Micron Technology, Inc. Integrated circuit with temperature detector
WO1999034159A1 (en) * 1997-12-31 1999-07-08 Temptronic Corporation Temperature control system for a workpiece chuck

Also Published As

Publication number Publication date Type
EP1301838A2 (en) 2003-04-16 application
WO2002005051A2 (en) 2002-01-17 application
JP2004503924A (ja) 2004-02-05 application
US20020050834A1 (en) 2002-05-02 application
US6552561B2 (en) 2003-04-22 grant

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