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WO2001062517A1 - Carte d'identification sans contact ou analogue et procede de fabrication correspondant - Google Patents

Carte d'identification sans contact ou analogue et procede de fabrication correspondant

Info

Publication number
WO2001062517A1
WO2001062517A1 PCT/JP2001/001253 JP0101253W WO2001062517A1 WO 2001062517 A1 WO2001062517 A1 WO 2001062517A1 JP 0101253 W JP0101253 W JP 0101253W WO 2001062517 A1 WO2001062517 A1 WO 2001062517A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
electrodes
antenna
substrate
id
card
Prior art date
Application number
PCT/JP2001/001253
Other languages
English (en)
French (fr)
Inventor
Masanori Akita
Koji Ito
Toshihiro Mori
Yoshio Nogami
Yoshio Kuramoto
Original Assignee
Toray Engineering Company,Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07722Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001Internal layers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001Internal layers
    • H01L2224/0502Disposition
    • H01L2224/05022Disposition the internal layer being at least partially embedded in the surface
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001Internal layers
    • H01L2224/0502Disposition
    • H01L2224/05026Disposition the internal layer being disposed in a recess of the surface
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0556Disposition
    • H01L2224/05571Disposition the external layer being disposed in a recess of the surface
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
PCT/JP2001/001253 2000-02-22 2001-02-21 Carte d'identification sans contact ou analogue et procede de fabrication correspondant WO2001062517A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000/44006 2000-02-22
JP2000044006 2000-02-22

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP20010906168 EP1258370B1 (en) 2000-02-22 2001-02-21 Noncontact id card and method of manufacturing the same
US10204090 US6779733B2 (en) 2000-02-22 2001-02-21 Noncontact id card or the like and method of manufacturing the same
JP2001561547A JP3729491B2 (ja) 2000-02-22 2001-02-21 非接触idカード類及びその製造方法
DE2001637117 DE60137117D1 (de) 2000-02-22 2001-02-21 Kontaktlose ic-karte und verfahren zu ihrer herstellung

Publications (1)

Publication Number Publication Date
WO2001062517A1 true true WO2001062517A1 (fr) 2001-08-30

Family

ID=18566838

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/001253 WO2001062517A1 (fr) 2000-02-22 2001-02-21 Carte d'identification sans contact ou analogue et procede de fabrication correspondant

Country Status (6)

Country Link
US (1) US6779733B2 (ja)
EP (2) EP1258370B1 (ja)
JP (1) JP3729491B2 (ja)
CN (1) CN1200822C (ja)
DE (2) DE60144452D1 (ja)
WO (1) WO2001062517A1 (ja)

Cited By (11)

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WO2004038793A1 (ja) * 2002-10-24 2004-05-06 Toray Engineering Company,Limited 非接触idカード類及びその製造方法
JP2004527864A (ja) * 2001-05-31 2004-09-09 ラフセック オサケ ユキチュアRafsec Oy スマートラベルおよびスマートラベルウェブ
US6882545B2 (en) 2002-03-18 2005-04-19 Toray Engineering Company, Limited Noncontact ID card and method of manufacturing the same
WO2005045919A1 (ja) * 2003-11-11 2005-05-19 Toray Engineering Co.,Ltd. 非接触idカード及びその製造方法
JP2005520266A (ja) * 2002-01-18 2005-07-07 エーブリー デニソン コーポレイションAvery Dennison Corporation Rfidラベルを製造するための方法
JP2005309953A (ja) * 2004-04-23 2005-11-04 Dainippon Printing Co Ltd インターポーザ付シートの巻体およびicタグ
JP2006004053A (ja) * 2004-06-16 2006-01-05 Dainippon Printing Co Ltd 非接触データキャリア部材取付方法及び装置
JP2008204346A (ja) * 2007-02-22 2008-09-04 Fujitsu Ltd Rfidタグおよびrfidタグの製造方法
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7838892B2 (en) 2004-04-29 2010-11-23 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip and method for forming a contact structure for making electrical contact with an optoelectronic semiconductor chip
US8912907B2 (en) 2003-03-24 2014-12-16 Alien Technology, Llc RFID tags and processes for producing RFID tags

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US6468638B2 (en) * 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US7218527B1 (en) * 2001-08-17 2007-05-15 Alien Technology Corporation Apparatuses and methods for forming smart labels
US6863219B1 (en) * 2001-08-17 2005-03-08 Alien Technology Corporation Apparatuses and methods for forming electronic assemblies
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US6867983B2 (en) * 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
JP3739752B2 (ja) * 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
US20040200061A1 (en) * 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
US7930815B2 (en) * 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
DE602004028692D1 (de) * 2003-07-14 2010-09-30 Nec Tokin Corp Kommunikationsmitel für berührungslose Kommunikation und dessen Herstellungsverfahren
DE10334578A1 (de) * 2003-07-28 2005-03-10 Infineon Technologies Ag Chipkarte, Chipkartenmodul sowie Verfahren zur Herstellung eines Chipkartenmoduls
DE602004019656D1 (de) 2003-08-05 2009-04-09 Nxp Bv Modul mit mindestens zwei paaren von modulverbindungsplatten
DE102004008840A1 (de) 2004-02-20 2005-09-01 Bundesdruckerei Gmbh Verfahren zur Herstellung eines buchartigen Wertdokuments sowie ein buchartiges Wertdokument
KR100602621B1 (ko) * 2004-06-16 2006-07-19 한국조폐공사 조립식 콤비카드 및 이의 제조방법
US7274297B2 (en) * 2004-07-01 2007-09-25 Intermec Ip Corp. RFID tag and method of manufacture
US8178958B2 (en) * 2004-10-19 2012-05-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having antenna and method for manufacturing thereof
US7615479B1 (en) 2004-11-08 2009-11-10 Alien Technology Corporation Assembly comprising functional block deposited therein
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
JP4091096B2 (ja) * 2004-12-03 2008-05-28 株式会社 ハリーズ インターポーザ接合装置
US20090217515A1 (en) * 2004-12-03 2009-09-03 Hallys Corporation Electronic component production method and electronic component production equipment
KR100674926B1 (ko) * 2004-12-08 2007-01-26 삼성전자주식회사 메모리 카드 및 그 제조 방법
US7912499B2 (en) * 2005-03-31 2011-03-22 Black Sand Technologies, Inc. Techniques for partitioning radios in wireless communication systems
WO2006109678A1 (ja) 2005-04-06 2006-10-19 Hallys Corporation 電子部品の製造装置
CN101160597A (zh) * 2005-04-18 2008-04-09 哈里斯股份有限公司 电子零件及该电子零件的制造方法
JP4171008B2 (ja) 2005-07-11 2008-10-22 株式会社東芝 アンテナ装置および携帯無線機
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition
EP1952312B1 (en) * 2005-10-14 2012-02-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and communication system using the semiconductor device
US20070240304A1 (en) * 2006-04-12 2007-10-18 Eisenhardt Randolph W RFID article with interleaf
CN101281992B (zh) * 2007-04-03 2015-08-26 联想(北京)有限公司 无线芯片及无线设备
JP2010160706A (ja) * 2009-01-08 2010-07-22 Hallys Corp 非接触icタグ類
US8387870B2 (en) * 2009-01-16 2013-03-05 Secure Exchange Solutions, Llc Methods and systems for fabricating a transaction card incorporating a memory
KR20120138517A (ko) * 2011-06-15 2012-12-26 삼성전자주식회사 칩 고정 장치 및 이를 이용한 칩의 테스트 방법
JP2014170811A (ja) * 2013-03-01 2014-09-18 Sony Corp CSP(ChipSizePackage)
KR101332184B1 (ko) * 2013-05-29 2013-11-22 유비벨록스(주) 콤비형 아이씨 카드 제조 시스템 및 제조방법
US9554469B2 (en) * 2014-12-05 2017-01-24 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Method of fabricating a polymer frame with a rectangular array of cavities

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JPH09186163A (ja) * 1995-12-26 1997-07-15 Motorola Inc 相互接続システムおよび製造方法
JPH09321391A (ja) * 1996-05-31 1997-12-12 Olympus Optical Co Ltd フレキシブル配線板
JPH1050709A (ja) * 1996-07-29 1998-02-20 Toshiba Corp 半導体装置の製造方法
JPH10203060A (ja) * 1997-01-20 1998-08-04 Toshiba Corp 無線カード
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See also references of EP1258370A4 *

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9495632B2 (en) 2001-02-02 2016-11-15 Avery Dennison Corporation RFID label technique
JP2004527864A (ja) * 2001-05-31 2004-09-09 ラフセック オサケ ユキチュアRafsec Oy スマートラベルおよびスマートラベルウェブ
JP2009048662A (ja) * 2002-01-18 2009-03-05 Avery Dennison Corp Rfidラベルを製造するための方法
JP2005520266A (ja) * 2002-01-18 2005-07-07 エーブリー デニソン コーポレイションAvery Dennison Corporation Rfidラベルを製造するための方法
US6882545B2 (en) 2002-03-18 2005-04-19 Toray Engineering Company, Limited Noncontact ID card and method of manufacturing the same
US7275696B2 (en) 2002-10-24 2007-10-02 Toray Engineering Company, Limited Non-contact ID card and the like and method for manufacturing same
WO2004038793A1 (ja) * 2002-10-24 2004-05-06 Toray Engineering Company,Limited 非接触idカード類及びその製造方法
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JP3729491B2 (ja) 2005-12-21 grant
EP1258370A4 (en) 2004-06-16 application
CN1404445A (zh) 2003-03-19 application
EP1843280A1 (en) 2007-10-10 application
DE60137117D1 (de) 2009-02-05 grant
EP1258370A1 (en) 2002-11-20 application
US20030029921A1 (en) 2003-02-13 application
CN1200822C (zh) 2005-05-11 grant
EP1843280B1 (en) 2011-04-13 grant
US6779733B2 (en) 2004-08-24 grant
DE60144452D1 (de) 2011-05-26 grant

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