WO2001059185A3 - Pre-plate treating system - Google Patents

Pre-plate treating system Download PDF

Info

Publication number
WO2001059185A3
WO2001059185A3 PCT/US2001/004076 US0104076W WO0159185A3 WO 2001059185 A3 WO2001059185 A3 WO 2001059185A3 US 0104076 W US0104076 W US 0104076W WO 0159185 A3 WO0159185 A3 WO 0159185A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
pre
treating system
surface
film forming
Prior art date
Application number
PCT/US2001/004076
Other languages
French (fr)
Other versions
WO2001059185A8 (en
WO2001059185A2 (en
Inventor
James M Taylor
Original Assignee
Duratech Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US18091700P priority Critical
Priority to US60/180,917 priority
Application filed by Duratech Ind Inc filed Critical Duratech Ind Inc
Publication of WO2001059185A2 publication Critical patent/WO2001059185A2/en
Publication of WO2001059185A8 publication Critical patent/WO2001059185A8/en
Publication of WO2001059185A3 publication Critical patent/WO2001059185A3/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Abstract

The invention relates in general to a method of electroplating substrates where at least a portion of the substrate is coated with a solution containing a film forming amine and sufficient acid to produce a pH of less than 6.5. The acid helps to clean the surface of the substrate, and the film forming amine forms a film on the surface of the substrate. Electroplating proceeds with greatly improved speed and efficiency, especially in low current areas.
PCT/US2001/004076 2000-02-08 2001-02-08 Pre-plate treating system WO2001059185A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US18091700P true 2000-02-08 2000-02-08
US60/180,917 2000-02-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AU3493501A AU3493501A (en) 2000-02-08 2001-02-08 Pre-plate treating system

Publications (3)

Publication Number Publication Date
WO2001059185A2 WO2001059185A2 (en) 2001-08-16
WO2001059185A8 WO2001059185A8 (en) 2001-11-22
WO2001059185A3 true WO2001059185A3 (en) 2002-03-07

Family

ID=22662189

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/004076 WO2001059185A2 (en) 2000-02-08 2001-02-08 Pre-plate treating system

Country Status (3)

Country Link
AU (1) AU3493501A (en)
TW (1) TW555892B (en)
WO (1) WO2001059185A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861293A (en) * 1982-08-25 1983-04-12 Masami Kobayashi Method for plating of stainless steel strip for electronic parts with gold
US4510018A (en) * 1984-02-21 1985-04-09 The Lea Manufacturing Company Solution and process for treating copper and copper alloys
US5543182A (en) * 1993-03-18 1996-08-06 Atotech Usa, Inc. Self-accelerating and replenishing non-formaldehyde immersion coating method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861293A (en) * 1982-08-25 1983-04-12 Masami Kobayashi Method for plating of stainless steel strip for electronic parts with gold
US4510018A (en) * 1984-02-21 1985-04-09 The Lea Manufacturing Company Solution and process for treating copper and copper alloys
US5543182A (en) * 1993-03-18 1996-08-06 Atotech Usa, Inc. Self-accelerating and replenishing non-formaldehyde immersion coating method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Derwent World Patents Index; AN 1983-48341K, XP002171646 *
PATENT ABSTRACTS OF JAPAN vol. 007, no. 151 (C - 174) 1 July 1983 (1983-07-01) *

Also Published As

Publication number Publication date
WO2001059185A8 (en) 2001-11-22
WO2001059185A2 (en) 2001-08-16
TW555892B (en) 2003-10-01
AU3493501A (en) 2001-08-20

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