WO2001016973A1 - Anode für elektrolytkondensatoren, elektrolyt-kondensator und verfahren zur herstellung der anode - Google Patents

Anode für elektrolytkondensatoren, elektrolyt-kondensator und verfahren zur herstellung der anode Download PDF

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Publication number
WO2001016973A1
WO2001016973A1 PCT/DE2000/002845 DE0002845W WO0116973A1 WO 2001016973 A1 WO2001016973 A1 WO 2001016973A1 DE 0002845 W DE0002845 W DE 0002845W WO 0116973 A1 WO0116973 A1 WO 0116973A1
Authority
WO
WIPO (PCT)
Prior art keywords
anode
anode conductor
conductor
tantalum
paste
Prior art date
Application number
PCT/DE2000/002845
Other languages
German (de)
English (en)
French (fr)
Inventor
Helge Clasen
Willy Knabe
Klaus Gnann
Josef Gerblinger
Dieter Hahn
Original Assignee
Epcos Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP00960356A priority Critical patent/EP1208573B1/de
Application filed by Epcos Ag filed Critical Epcos Ag
Priority to DE50008616T priority patent/DE50008616D1/de
Priority to JP2001520427A priority patent/JP2003508907A/ja
Priority to AU72693/00A priority patent/AU7269300A/en
Priority to MXPA02002153A priority patent/MXPA02002153A/es
Priority to CA002379305A priority patent/CA2379305A1/en
Priority to BR0013708-1A priority patent/BR0013708A/pt
Priority to AT00960356T priority patent/ATE282244T1/de
Priority to DE10082598T priority patent/DE10082598D2/de
Priority to IL14735200A priority patent/IL147352A0/xx
Publication of WO2001016973A1 publication Critical patent/WO2001016973A1/de
Priority to IL147352A priority patent/IL147352A/en
Priority to NO20021016A priority patent/NO20021016D0/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G9/052—Sintered electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors

Definitions

  • Anode for electrolytic capacitors electrolytic capacitors, electrolytic capacitor and method for manufacturing the anode
  • the present invention relates to an anode for electrolytic capacitors with an anode body and an anode conductor. Furthermore, the invention relates to an electrolytic capacitor with the anode, a dielectric surrounding the anode, a layer cathode provided on the dielectric, a first connection lug formed from the anode conductor and a second connection lug connected to the layer cathode. The present invention further relates to methods for producing the anode.
  • the capacitor is preferably a chip capacitor.
  • the present invention is readily applicable to other capacitors, such as caseless capacitors.
  • a housing-free capacitor has a low overall height and is integrated, for example, in a hybrid circuit. In the following, however, it should be assumed that the capacitor according to the invention is a chip capacitor.
  • Chip capacitors in particular tantalum chip capacitors, are distinguished by a high volume-specific capacitance-voltage product, also called "CV product". This means that with these capacitors the value of the product based on the volume of the capacitance and the voltage that can be applied to the capacitor is particularly large. Further advantageous properties of chip capacitors are stable temperature and frequency behavior, a low residual current and a small loss factor.
  • tantalum chip capacitors are used for a large number of applications in a wide variety of fields.
  • New applications Tough operating conditions and increasing miniaturization in electronics mean that the requirements for chip capacitors are constantly increasing.
  • FIG. 24 shows the construction of a conventional tantalum chip capacitor in a schematic section, while in FIG. 25 the anode body of this chip capacitor is shown in a side view and in FIG. 26 the anode body in plan view.
  • This conventional chip capacitor consists of the anode body 1, a dielectric 2 and a layer cathode 3, which form an actual capacitor element.
  • a housing 4 which takes over important protective functions for the capacitor element.
  • a tantalum wire 5 leads to the capacitor element comprising the anode body 1, the dielectric 2 and the layer cathode 3 and is connected to a first metal ash 6 in the interior of the housing 4.
  • the layer cathode 3 is connected by means of a conductive adhesive 8 to a second metal ash 7 which, like the metal ash 6, is led out of the housing 4.
  • Such chip capacitors are manufactured in different sizes of the housing 4 with mostly standardized base dimensions and heights. Consequently, the volume fraction of the capacitor element or of the anode body 1 contained therein must be increased in order to achieve a higher CV product.
  • the housing utilization can hardly be increased.
  • the free end of the tantalum wire 5 is in fact welded to the metal ash 6 which is produced
  • Chip capacitor the electrical connection to an electronic circuit on a circuit board together with the other should take over their metal ash.
  • the distance between the capacitor element and the housing wall is particularly large on the plus side.
  • the distance formed by the tantalum wire 5 between the metal pocket 6 on the plus side and the capacitor element or the anode body 1 can scarcely be reduced further due to production.
  • the housing volume is only used insufficiently.
  • a tantalum chip capacitor is known from the publication DD-PS 215 420, in which an anode conductor is embedded in a two-part anode body which is prefabricated by extrusion. The anode body is then sintered with the anode conductor.
  • the use of two pre-pressed partial anode bodies has the disadvantage that, due to manufacturing-related tolerances, an exact positive fit of the anode body with the anode conductor cannot be achieved. As a result, the electrical contact between the anode body and the anode conductor deteriorates.
  • a tantalum capacitor is also known in which a wire-shaped anode conductor is encapsulated by a tantalum powder.
  • This capacitor has the disadvantage of a small contact area between the wire-shaped anode conductor and the anode body. This results in an increased ohmic resistance of the capacitor, which can have a negative influence on the electrical values of the capacitor. This effect is undesirable.
  • a tantalum capacitor is also known from US Pat. No. 3,903,589, the anode of which is produced by immersing the anode conductor in a dispersion containing metal powder. When the anode conductor is pulled out of the dispersion, a drop remains on the anode conductor, which is then dried and sintered.
  • This tantalum capacitor has the disadvantage that the anode body cannot be produced with a defined geometry. The well-known Due to the lack of optimized anode geometry and wide tolerances, capacitor has poor volume utilization.
  • the aim of the present invention is therefore to provide an anode which has a large contact area between the anode conductor and the anode body, the anode body of which has a fixed predetermined shape and in which there is good electrical contact between the anode body and the anode conductor.
  • the invention provides an anode for an electrolytic capacitor with an anode body of a predetermined shape and with a flat anode conductor, in which the anode body is molded onto the anode conductor from a continuously deformable material that can be solidified.
  • the invention provides a capacitor in which the anode body is surrounded by a dielectric, in which a layer cathode is provided on the dielectric, in which a further end section of the anode conductor is shaped into a first connection tab and in which the layer cathode is provided with a second connection tab connected is.
  • the anode according to the invention has the advantage that by shaping the entire anode body in the form of a continuously deformable material on the anode conductor, a homogeneous anode body can be designed with a good form fit to the anode conductor and with good electrical contact to the anode conductor.
  • the anode according to the invention has the advantage that the shape of the anode body with the aid of a continuously deformable material allows it to have any shape
  • H- tr o rt 01 LQ ⁇ 01 r JO ti ⁇ ti rt ti ⁇ rt Pi H- i ⁇ tr ⁇ H- nn ⁇ tr ⁇ H- ts J ⁇ 3 ⁇ ⁇ ⁇ ⁇ ti H- Pi H- H - H- Hl ti ts ⁇ tr 01 J tr 0 NH H- ti ti rt rt 3 ⁇ ti H- tr ⁇ ⁇ ts ⁇ ?
  • H- ⁇ tr 1 1 ⁇ ⁇ ti rt ⁇ ti 01 ti PJ rt ⁇ ⁇ ⁇ P- ⁇ c-- rt tr 9 ) ⁇ TJ H- Hi M- ti 01 P-. ⁇ ⁇ ti ⁇ ti ⁇ H- ti ti H- 01 ⁇ ti P>
  • An anode in which the anode body completely encloses an end section of the anode conductor is also advantageous. In this way, an optimal utilization of the surface of the anode conductor for contacting the anode body can be achieved. This also ensures a high mechanical stability of the anode.
  • the invention specifies a method for producing the anode according to the invention, wherein a continuously deformable material that can be solidified is molded onto a flat anode conductor with simultaneous external shaping and then solidified to form an anode body.
  • a continuously deformable material that can be solidified is molded onto a flat anode conductor with simultaneous external shaping and then solidified to form an anode body.
  • a method is particularly advantageous in which a paste which contains a binder system and a powder is applied to the anode conductor and then dried and sintered.
  • the paste can be shaped into an anode using the anode arrester using different methods.
  • a paste known from DE 199 27 909 A1 consisting of a discrete phase with a metal powder and a continuous phase with organic compounds, can be used.
  • the invention specifies a method for producing the anode according to the invention, a flat anode conductor being encapsulated with a powder from which the anode conductor protrudes on one side. Then the compact sintered.
  • the method according to the invention can advantageously be carried out in such a way that an anode conductor in the form of a strip-shaped sheet is inserted into a bed of powder contained in a press die and the pressing process then takes place.
  • the material tantalum which is preferably used for the anode conductor is very expensive, so that the strip used for the method should be as thin as possible.
  • the tantalum sheet used must have sufficient mechanical stability so that it can be pushed into the powder bed and later bent into a mechanically stable tab. Under these boundary conditions, strip-shaped anode conductors with a width between 0.3 and 5 mm and a thickness between 50 and 150 ⁇ m have proven to be suitable. These anode arresters have a width / thickness ratio between 2 and 100.
  • the powder can be pressed in a particularly advantageous manner by transverse pressing, i. H. by pressing transverse to the direction in which the strip-shaped anode conductor extends.
  • the further production steps correspond to the conventional tantalum chip capacitor production.
  • the dielectric of tantalum pentoxide is formed on the inner and outer surface of the sintered anode body.
  • the cathode connection and housing are produced.
  • the anode tab made of tantalum which serves for the electrical connection on the plus side can be post-treated in the embodiment according to the invention for the purpose of being able to be soldered or glued, which also applies to the other exemplary embodiments.
  • Tantalum chip capacitor is added to the tantalum powder with an additive that due to its lubricating effect Pressing process made easier and protects the pressing tool.
  • the free-flowing properties of the powder and the mechanical stability of the compact are also improved by the binding effect of the additive.
  • a common additive is camphor. If possible, it should be removed without residue before sintering the compact.
  • tantalum instead of tantalum, other suitable metals, such as niobium, or alloys of suitable metals or other materials that have the ability to form a dielectric can also be used.
  • suitable metals such as niobium, or alloys of suitable metals or other materials that have the ability to form a dielectric can also be used.
  • 1 to 3 are schematic representations for explaining a first embodiment of the invention
  • 7 to 13 are schematic representations for explaining a first method for producing a
  • 16 to 23 are schematic representations for explaining a second method for producing an anode body
  • 24 to 26 are schematic diagrams for explaining a conventional chip capacitor. 24 to 26 have already been described at the beginning. In the figures, corresponding components are given the same reference numerals.
  • the anode body 1 shows a chip capacitor according to the invention with an actual capacitor element comprising an anode body 1, a dielectric 2, a layer cathode 3 and a flat anode conductor 9 which extends into the anode body 1.
  • the anode body 1 consists of a porous metal sintered body which, as will be explained in more detail below, is built up from a paste containing metal powder, which is dried and sintered, and thereby establishes a solid and large-area connection to the anode conductor 9.
  • the anode conductor 9 is preferably made of tantalum, which is advantageously also used as metal for the metal powder of the paste.
  • the layer cathode 3 is connected to the metal ash 7 via a conductive adhesive 8.
  • the anode conductor 9 fulfills the functions of the tantalum wire 5 and the metal ash 6 of the conventional chip capacitor from FIG. 24: it is bent or formed into a contact tab for this purpose (cf. in particular FIGS. 2 and 3), so that the distance between the capacitor element and the edge of the housing 4 can be reduced.
  • the volume of the housing 4 of the component is thus better utilized in order to advantageously achieve a higher CV product.
  • a smaller size for the housing 4 can also be selected with the volume of the anode body 1 remaining the same. With the same size of the housing 4, the capacitor element or the anode body 1 can be made larger than in the prior art according to FIGS. 24 to 26 by the invention.
  • the chip capacitor according to the invention with the flat anode conductor 9 in the anode body 1 allows the production of extremely flat capacitor elements, as can be seen schematically from FIGS. 4 to 6.
  • 5 shows, like FIG. 2, a side view of the anode body 1 with the anode conductor 9, while in FIG. 6, similar to FIG. 3, a top view of the anode body 1 with the anode conductor 9 is shown.
  • the anode conductor 9 is shown in its entire extent in FIGS. 3 and 6, although it is in part partially covered by the anode body 1.
  • the flat design according to the exemplary embodiment in FIGS. 4 to 6 gives a particularly large lateral surface, which enables short current paths and improves the electrical properties.
  • the extremely flat capacitor elements can optionally be integrated in hybrid circuits without a housing.
  • a paste of a binder system and a tantalum powder is printed on a tantalum foil or a tantalum sheet 10 with a thickness of 50 to 150 ⁇ m using a stencil 11.
  • FIG. 7 shows a top view of this template 11, while in FIG. 8 a side view of the tantalum sheet 10 is shown together with the template 11 and in FIG. 9 the template 11 is filled with tantalum paste 12.
  • the tantalum sheet 10 together with the doctored or printed tantalum paste 12 is dried and sintered after the stencil 11 has been removed, so that the arrangement shown in side view in FIG. 10 is obtained.
  • FIG. 10 is finally cut along the dotted lines (cf. FIG. 11), so that anode bodies which are connected to the tantalum sheet 10 are obtained in this way.
  • 12 shows a side view of such an body with a tantalum sheet 10, while in Fig. 13 a plan view thereof is shown.
  • cutting into the individual anode bodies can also take place before sintering if the drying is sufficient.
  • the subsequent process steps correspond to conventional tantalum chip capacitor production.
  • the dielectric 2 is formed from tantalum pentoxide on the inner and outer surface of the sintered anode body 1.
  • the cathode connection or metal ash 7 and the housing 4 are produced.
  • the anode tab from the anode conductor 9 made of tantalum, which serves as the electrical connection on the positive side, can be post-treated for the purpose of improving the solderability or bondability.
  • FIGS. 14 and 15 show a side view, while in FIG. 15 a plan view the tantalum sheet 10 is shown with the anode body consisting of two parts.
  • the production of the anode body for the chip capacitor is also possible by screen printing, for which purpose a paste from a binder system and tantalum powder is screen printed on a tantalum foil or a tantalum sheet 10 with a thickness of 50 to 150 ⁇ m.
  • the tantalum sheet 10 with the screen-printed tantalum paste 12 is dried and sintered as in the previous examples. After sintering, the tantalum sheet 10 is cut. In this way, individual anode bodies with an anode conductor made of tantalum sheet 10 or tantalum foil are obtained in accordance with FIGS. 12 and 13. Here, too, the cutting can take place with sufficient drying before the actual sintering.
  • an anode conductor is completely enclosed by a metal powder paste, so that the anode conductor can only protrude on one side from an anode body 20 produced from the metal powder paste by drying and sintering, as is initially the case in FIGS 22 and 23 is shown in side view and plan view.
  • a multi-stage stencil process can be used to produce such an arrangement, in which strips 15 made of tantalum foil or tantalum sheet with a thickness of 50 to 150 ⁇ m are first placed between two shadow masks 13, 14.
  • FIG. 16 shows a top view of the shadow mask 13 with the strips 15, while in FIG. 17 a side view of the shadow masks 13, 14 with the strips 15 is shown on a first base plate 16.
  • the portion of the strip 15 which projects into the hole in the shadow masks 13, 14 can be supported by a spacer 17 (cf. FIG. 17). This spacer 17 can optionally also be part of the base plate 16 or be fixed on it.
  • Binder system and a tantalum powder to overmold, to overmold or to cast After shaping, the anode body thus obtained is dried and sintered.
  • individual anode bodies with an anode conductor made of tantalum foil or tantalum sheet according to FIGS. 22 (side view) and 23 (top view) are obtained, which are treated further in the manner explained above.
  • an elastic, foil-like mass (green foil) can also be prefabricated from a paste consisting of a binder system and tantalum powder, which is cut and glued to the tantalum foil or tantalum sheet with a thickness of 50 to 150 ⁇ m. After drying and sintering, individual anode bodies with an anode conductor made of tantalum foil or
  • Tantalum sheet obtained as shown in Figs. 22 and 23.
  • the anode bodies produced by the powder pressing process described above look exactly like those shown in FIGS. 22 and 23.
PCT/DE2000/002845 1999-08-30 2000-08-21 Anode für elektrolytkondensatoren, elektrolyt-kondensator und verfahren zur herstellung der anode WO2001016973A1 (de)

Priority Applications (12)

Application Number Priority Date Filing Date Title
CA002379305A CA2379305A1 (en) 1999-08-30 2000-08-21 Anode for electrolytic capacitors, electrolytic capacitor and method of producing said anode
DE50008616T DE50008616D1 (de) 1999-08-30 2000-08-21 Anode für elektrolytkondensatoren, elektrolyt-kondensator und verfahren zur herstellung der anode
JP2001520427A JP2003508907A (ja) 1999-08-30 2000-08-21 電解質コンデンサ用アノード、電解質コンデンサ、およびアノードの製造方法
AU72693/00A AU7269300A (en) 1999-08-30 2000-08-21 Anode for electrolytic capacitors, electrolytic capacitor and method of producing said anode
MXPA02002153A MXPA02002153A (es) 1999-08-30 2000-08-21 Anodo para condensadores electroliticos, condensador electrolitico y procedimiento para la fabricacion del anodo.
EP00960356A EP1208573B1 (de) 1999-08-30 2000-08-21 Anode für elektrolytkondensatoren, elektrolyt-kondensator und verfahren zur herstellung der anode
BR0013708-1A BR0013708A (pt) 1999-08-30 2000-08-21 ânodo para condensadores de eletrólito, condensador de eletrólito e processo para a fabricação do ânodo
IL14735200A IL147352A0 (en) 1999-08-30 2000-08-21 Anode for electrolytic capacitors, electrolytic capacitor and method of producing said anode
DE10082598T DE10082598D2 (de) 1999-08-30 2000-08-21 Anode für Elektrolytkondensatoren, Elektrolyt-Kondensator und Verfahren zur Herstellung der Anode
AT00960356T ATE282244T1 (de) 1999-08-30 2000-08-21 Anode für elektrolytkondensatoren, elektrolyt- kondensator und verfahren zur herstellung der anode
IL147352A IL147352A (en) 1999-08-30 2001-12-27 Anode for electrolytic capacitors, electrolytic capacitor and method of producing said anode
NO20021016A NO20021016D0 (no) 1999-08-30 2002-02-28 Anode for elektrolyttkondensatorer, elektorlyttkondensator og fremgangsmåte for fremstilling av anoden

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19941094A DE19941094A1 (de) 1999-08-30 1999-08-30 Kondensator und Verfahren zum Herstellen eines Anodenkörpers und eines Anodenableiters hierfür
DE19941094.1 1999-08-30

Publications (1)

Publication Number Publication Date
WO2001016973A1 true WO2001016973A1 (de) 2001-03-08

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PCT/DE2000/002845 WO2001016973A1 (de) 1999-08-30 2000-08-21 Anode für elektrolytkondensatoren, elektrolyt-kondensator und verfahren zur herstellung der anode

Country Status (18)

Country Link
US (3) US6493213B1 (zh)
EP (2) EP1208573B1 (zh)
JP (1) JP2003508907A (zh)
KR (1) KR100730916B1 (zh)
CN (1) CN1258786C (zh)
AT (1) ATE282244T1 (zh)
AU (1) AU7269300A (zh)
BR (1) BR0013708A (zh)
CA (1) CA2379305A1 (zh)
CZ (1) CZ2002701A3 (zh)
DE (4) DE19941094A1 (zh)
HU (1) HUP0202307A2 (zh)
IL (2) IL147352A0 (zh)
MX (1) MXPA02002153A (zh)
NO (1) NO20021016D0 (zh)
PT (1) PT1208573E (zh)
TW (1) TW455894B (zh)
WO (1) WO2001016973A1 (zh)

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DE10131236A1 (de) * 2001-06-28 2003-01-23 Epcos Ag Kondensator
DE10244713A1 (de) * 2002-07-18 2004-02-05 Epcos Ag Oberflächenmontierbares Bauelement und Verfahren zu dessen Herstellung
US7161796B2 (en) 2002-07-18 2007-01-09 Kemet Electronics Corporation Surface-mountable component and method for the production thereof

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DE19941094A1 (de) * 1999-08-30 2003-07-10 Epcos Ag Kondensator und Verfahren zum Herstellen eines Anodenkörpers und eines Anodenableiters hierfür
DE10057488B4 (de) * 2000-11-20 2006-05-24 Epcos Ag Kondensator
WO2004111288A2 (en) * 2003-06-12 2004-12-23 Sunel Technologies, Llc Fabrication of titanium and titanium alloy anode for dielectric and insulated films
US20040264704A1 (en) * 2003-06-13 2004-12-30 Camille Huin Graphical user interface for determining speaker spatialization parameters
WO2006035846A1 (ja) * 2004-09-30 2006-04-06 Dainippon Ink And Chemicals, Inc. 多孔質金属焼結体の製造方法
DE102005007583A1 (de) * 2005-02-18 2006-08-24 Epcos Ag Verfahren zur Herstellung eines Anodenkörpers und Anodenkörper
DE102005007582A1 (de) * 2005-02-18 2006-08-24 Epcos Ag Kondensator mit einem niedrigen Ersatzserienwiderstand und Kondensatoranordung
US7554792B2 (en) * 2007-03-20 2009-06-30 Avx Corporation Cathode coating for a wet electrolytic capacitor
US7460356B2 (en) * 2007-03-20 2008-12-02 Avx Corporation Neutral electrolyte for a wet electrolytic capacitor
US7649730B2 (en) * 2007-03-20 2010-01-19 Avx Corporation Wet electrolytic capacitor containing a plurality of thin powder-formed anodes
CN101345139B (zh) * 2007-07-12 2011-10-05 电子科技大学 一种固体钽电解电容器及其制造方法
JP4999673B2 (ja) * 2007-12-25 2012-08-15 ニチコン株式会社 固体電解コンデンサ素子およびその製造方法
DE102008063853B4 (de) * 2008-12-19 2012-08-30 H.C. Starck Gmbh Kondensatoranode
US8218292B2 (en) * 2009-07-31 2012-07-10 Avx Corporation Dry powder stencil printing of solid electrolytic capacitor components
US8139344B2 (en) * 2009-09-10 2012-03-20 Avx Corporation Electrolytic capacitor assembly and method with recessed leadframe channel
DE102011116939A1 (de) 2011-10-26 2013-05-02 H.C. Starck Gmbh Verzugsfreie schablonengedruckte Anoden auf Ta-/Nb-Blech
US8675349B2 (en) * 2011-12-14 2014-03-18 Kennet Electronics Corporation Stack capacitor having high volumetric efficiency
US10290429B2 (en) * 2017-01-17 2019-05-14 Kemet Electronics Corporation Wire to anode connection

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Publication number Priority date Publication date Assignee Title
DE10131236A1 (de) * 2001-06-28 2003-01-23 Epcos Ag Kondensator
DE10131236B4 (de) * 2001-06-28 2006-03-30 Epcos Ag Kondensator
US7330347B2 (en) 2001-06-28 2008-02-12 Kemet Electronics Corporation Capacitor
CN100437851C (zh) * 2001-06-28 2008-11-26 凯米特电子公司 电容器
DE10244713A1 (de) * 2002-07-18 2004-02-05 Epcos Ag Oberflächenmontierbares Bauelement und Verfahren zu dessen Herstellung
US7161796B2 (en) 2002-07-18 2007-01-09 Kemet Electronics Corporation Surface-mountable component and method for the production thereof

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KR20020027594A (ko) 2002-04-13
DE10040853A1 (de) 2001-04-26
US6493213B1 (en) 2002-12-10
NO20021016L (no) 2002-02-28
PT1208573E (pt) 2005-03-31
NO20021016D0 (no) 2002-02-28
BR0013708A (pt) 2002-05-07
CA2379305A1 (en) 2001-03-08
ATE282244T1 (de) 2004-11-15
DE10082598D2 (de) 2002-08-14
EP1477998A3 (de) 2007-09-05
US20020075628A1 (en) 2002-06-20
EP1208573B1 (de) 2004-11-10
EP1477998A2 (de) 2004-11-17
DE50008616D1 (de) 2004-12-16
CZ2002701A3 (cs) 2002-09-11
DE19941094A1 (de) 2003-07-10
TW455894B (en) 2001-09-21
CN1258786C (zh) 2006-06-07
CN1371522A (zh) 2002-09-25
EP1208573A1 (de) 2002-05-29
US20040136857A1 (en) 2004-07-15
HUP0202307A2 (en) 2002-10-28
IL147352A0 (en) 2002-08-14
MXPA02002153A (es) 2002-09-18
AU7269300A (en) 2001-03-26
KR100730916B1 (ko) 2007-06-22
US6699431B2 (en) 2004-03-02
JP2003508907A (ja) 2003-03-04
IL147352A (en) 2006-04-10

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