WO2001015076A1 - Method for making a mini-smart card - Google Patents

Method for making a mini-smart card Download PDF

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Publication number
WO2001015076A1
WO2001015076A1 PCT/FR2000/002262 FR0002262W WO0115076A1 WO 2001015076 A1 WO2001015076 A1 WO 2001015076A1 FR 0002262 W FR0002262 W FR 0002262W WO 0115076 A1 WO0115076 A1 WO 0115076A1
Authority
WO
WIPO (PCT)
Prior art keywords
overmolding
support strip
manufacturing
dielectric film
portable electronic
Prior art date
Application number
PCT/FR2000/002262
Other languages
French (fr)
Inventor
Henri Boccia
Philippe Patrice
Olivier Brunet
Isabelle Limousin
Original Assignee
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus filed Critical Gemplus
Priority to AU70101/00A priority Critical patent/AU7010100A/en
Publication of WO2001015076A1 publication Critical patent/WO2001015076A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
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Definitions

  • the invention relates to a method of manufacturing a portable electronic device comprising at least one integrated circuit chip.
  • a portable electronic device comprising at least one integrated circuit chip.
  • Such a device comprises two parallel flat faces, one of which has contact pads.
  • the invention also relates to the device obtained by such a method.
  • the invention applies very particularly to the manufacture of smart card type devices in mini-card format, and preferably to smart cards of a reduced format compared to the standard format of mini-cards.
  • smart cards with flush contacts make it possible, for example, to carry out secure transactions of electronic payment, identification or telecommunications type.
  • the dimensions of the cards and the positioning of the contacts are defined by a standard corresponding to international standards ISO 7810, 7816-1 and 7816-2.
  • This first standard defines a card with or without contact as a portable element of small thickness and dimensions: 85 mm in length, 54 mm in width and 0.76 mm in thickness.
  • a second standard made it possible to define the format of smart cards dedicated to the mobile telephony market.
  • These smart cards dedicated to mobile telephony have a reduced format compared to the ISO format which has just been mentioned.
  • These are 25 mm long and 15 mm wide mini-cards with a 3mm by 3mm keying on the lower right corner, the thickness being identical to the thickness of the cards meeting the first standard.
  • a contact smart card comprises a plastic support in the form of a plate according to the ISO standard format.
  • This support carries at least one electronic microcircuit (also called electronic module or electronic micromodule in the literature) and a series of contact pads for the electrical connection of the microcircuit to an operating circuit.
  • a mini-card is generally obtained by the same manufacturing process as a card in ISO standard format, with an additional step of pre-cutting the card support around a region carrying the contacts, this region being in mini-card format.
  • the mobile telephony market is constantly changing and is tending towards greater miniaturization of mobile terminals. Therefore, the miniaturization of the mini-card format seems a necessity in order not to penalize the miniaturization of terminals. We are therefore moving towards a reduction in the format of the cards intended to equip new generations of mobile phones while seeking to maintain the size of integrated circuits and even to increase it.
  • Such a device comprises a card body of rectangular shape 15 mm in length and 10 mm in width with a thickness less than or equal to 0.76 mm and a polarization of 1mm by 1mm on the lower right corner of the card.
  • Such a device makes it possible to meet a need for a reduced card format by optimizing the place of the integrated circuit in this new format and by being compatible with new generations of mobile telephones.
  • the support of the chip card in ISO standard format (and mini-card) is produced by plastic molding or by lammation, then the microcircuit is incorporated into the card support during of an operation called "inserting".
  • the microcircuit is bonded into a cavity provided for this purpose in the support.
  • This method of molding and inserting the microcircuit is not profitable in the case of a device with a reduced format compared to the standard format of mini-cards as mentioned above. According to another known method, it is possible to obtain the card support by overmolding of the electronic microcircuit.
  • the overmolding technique essentially consists in placing a microcircuit 10 in a mold 200 in the format of the card support that one wishes to make, then in injecting plastic material 50 into this mold to fix the microcircuit 10.
  • the microcircuit 10 consisting of a chip 1 electrically connected to a contact grid 18, is held against one of the walls of the mold 200 by rods 210 so as to properly press the contact grid 18 which must be flush with the card holder after demolding.
  • the contact grid 18 is arched so as to constitute claws 19 which allow the microcircuit 10 to be anchored in the injected plastic 50.
  • the object of the present invention is to propose another molding technique which is simple and which makes it possible to minimize the number of steps in the manufacture of a portable electronic device.
  • the manufacturing method according to the present invention consists in carrying out the overmolding of microcircuits directly on a continuous support film and not on an individual support film.
  • the method according to the invention therefore makes it possible to carry out all the stages of manufacturing the device. continuously until the final stage of individualization by cutting.
  • the adhesion of the microcircuit to the injected plastic is advantageously obtained by the presence of a thermoactivable dielectric on the support film of the microcircuit, the bonding properties of which are implemented by the heated plastic material injected during overmolding.
  • the support film is constituted by a dielectric film laminated on a contact grid, the dielectric film having properties such that it allows the adhesion of the support film to the plastic material injected during overmolding.
  • PET Polyethylene Terephthalate
  • the additional step of making the claws is thus eliminated.
  • the method according to the invention makes it possible to overmold a plurality of microcircuits and then to cut the various devices to the desired format, which simplifies the industrial process.
  • the method according to the invention preferably applies to devices of small dimensions such as mini-cards or 3G PLUGs for which the microcircuit covers the entire surface of the device.
  • the process of the invention could possibly be applied to cards of ISO format, but the size of the support of these cards is such that it would be necessary to space the chips a lot on the support film which would cause a loss of space. and therefore greater productivity than the time saved.
  • the present invention more particularly relates to a method of manufacturing a portable electronic device comprising at least one integrated circuit chip transferred onto a support strip formed by a dielectric film laminated on a contact grid, the integrated circuit chip being electrically connected to the contact grid, characterized in that it comprises the following stages: producing an overmolding of the chips and their connections to the contact grid directly on the support strip by an overmolding material; cutting around the chips and its connections so as to obtain the devices.
  • the materials constituting the dielectric film and the overmolding material are identical or compatible for adhesion.
  • the materials constituting the dielectric film and the material of overmolding have a continuity not visible to the naked eye on the edge of the device.
  • the dielectric film consists of a hot-melt dielectric capable of sticking to the molding material.
  • the dielectric film consists of a thermoplastic dielectric capable of melting on contact with the overmolding material.
  • the overmolding material is chosen from Polystyrene, Polyethylene Terephthalate (PET), and Acrylonitrile Butadiene Styrene (ABS).
  • the overmolding produced on the support strip includes a plurality of chips with their connections, each device being individualized by simultaneous cutting of the support strip and the overmolding.
  • the overmolding is carried out on the support strip in the format of the devices, each device being individualized by cutting the support strip flush with the overmolding.
  • the present invention also relates to a portable electronic device comprising at least one integrated circuit chip transferred onto a support strip, the chip and its connections to a contact grid being embedded in a plastic material constituting the body of the device, characterized in that the support strip consists of a dielectric film laminated on the contact grid and ensuring the adhesion of the chip support strip with the plastic material of the device body.
  • the support strip extends to the edge of the body of the device.
  • the device consists of a smart card in the standard format of mini-cards.
  • the device consists of a smart card of a reduced format compared to the standard format of mini-cards.
  • the support strip covers the entire surface of the device.
  • FIG. 1 illustrates a molding technique of the prior art
  • FIG. 2 illustrates the support strip for the microcircuits to be overmolded according to the method of the invention
  • - Figure 3 illustrates a first embodiment of the manufacturing method according to the invention
  • FIG. 4 illustrates the step of overmolding the method according to the first embodiment of the invention
  • FIG. 5a illustrates a first application of the first embodiment of the invention
  • FIG. 5b illustrates a second application of the first embodiment of the invention
  • - Figure 6 illustrates a second embodiment of the manufacturing method according to the invention
  • FIG. 7 illustrates the step of overmolding the method according to the second embodiment of the invention
  • FIG. 8a illustrates a first application of the second embodiment of the invention
  • FIG. 8b illustrates a second application of the second embodiment of the invention
  • the manufacturing method according to the invention consists in producing microcircuits on a support film according to standard techniques.
  • a conventional technique for manufacturing microcircuits 10, illustrated in FIG. 2, consists in bonding an integrated circuit chip 1 by placing its active face with its contact pads 11 upwards, and by bonding the opposite face to a support film 14 .
  • the support film 14 consists of a dielectric film 15 disposed on a contact grid 18, for example of nickel-plated and gilded copper, on which the contact pads of the microcircuit 10 are defined.
  • the dielectric film 15 can for example be laminated on the contact grid 18.
  • the metal grid 18 can also constitute an antenna for application to contactless devices.
  • the chip 1 can be bonded to the dielectric film 15 or directly to the contact grid 18.
  • the chip 1 is preferably bonded to the metal grid 18 by means of an insulating adhesive. insensitive to heat.
  • connection is generally made by wire wiring.
  • Other connection means can be envisaged, such as, for example, a connection by a “flip chip” process which consists in turning the chip 1 over to connect it directly to the contact grid 18 by means of bosses made on the pads. contact 11 and an anisotropic conduction adhesive for example.
  • connection wells 16 are formed in the dielectric film 15 and connection wires 17 connect the contact pads 11 of the chip 1 to the contact pads of the grid 18 by the through the connection wells 16.
  • the electrical connection can be established by heat sealing, for example.
  • encapsulation is carried out so as to protect the chip 1 and its welded connection wires 17. It may be the deposition of a resin 20, based on epoxy for example, according to a process called “glob top” which consists in coating the chip 1 and its connections 17 from above.
  • the micromodule 10 was then generally cut out then inserted in the cavity of a card body previously decorated, or deposited in a mold to be overmolded in the format of the card body.
  • the method according to the invention proposes to overmold the microcircuits 10 directly on the support film 14 and then to individualize the devices by subsequent cutting.
  • the dielectric film 15 of the support strip 14 is constituted by a thermoactivable dielectric capable of ensuring the adhesion of the support strip 14 with the heated plastic material injected during overmolding. It may, for example, be a hot-melt dielectric capable of sticking to the hot plastic material, or a thermoplastic dielectric capable of melting with the hot plastic material.
  • FIG. 3 illustrates a first embodiment of the manufacturing method according to the invention.
  • a plurality of microcircuits 10 are overmolded in the same mold, each device 100 then being individualized by simultaneous cutting of the support strip 14 and the overmolding 50.
  • FIG. 4 illustrates the overmolding step according to this first embodiment.
  • the support film 14 is placed on the mold 200, the format of which is adapted to the number of devices 100 which it is desired to overmold in one step.
  • the contact grid 18 being pressed against the wall of the mold 200, the contact pads will necessarily be flush with the device 100.
  • the overmolding being carried out directly on the support film 14, the contacts are perfectly protected from the plastics material.
  • the plastic 50 is then injected according to conventional techniques, using a nozzle 220 for example.
  • This material 50 covers the dielectric 15 of the support film 14 as well as the coating drop 20 or the chip 1 and its connections 17 if the coating was optional.
  • the plastic 50 can be composed, for example, of polystyrene, of polyethylene terephthalate
  • PET Polyethylene
  • ABS Acrylonitrile Butadiene Styrene
  • FIGS. 5a and 5b are top views of the overmoldings obtained according to this first embodiment of the invention, for applications to mini-cards (FIG. 5a) and to 3G PLUG (FIG. 5b).
  • the devices 100 are obtained by cutting using a suitable cutting tool.
  • the mold and / or the cutting tool has a broken edge to form the key in the case of an application to cards intended for mobile telephony.
  • FIG. 6 illustrates a second embodiment of the manufacturing method according to the invention.
  • a plurality of microcircuits 10 are molded directly in the format of the devices 100, each device 100 then being individualized by cutting the support strip.
  • FIG. 7 illustrates the overmolding step according to this second embodiment of the invention.
  • This overmolding step is the same as that previously described with reference to the first embodiment, only the shape of the mold 200 being different, as well as the cutting tool which must allow cutting to the level of the overmolding 50.
  • FIGS. 8a and 8b are top views of the overmoldings obtained according to this second embodiment of the invention, for applications to mini-cards (FIG. 8a) and to 3G PLUG (FIG. 8b). It should be noted that the method described in the present application applies whatever the size and the number of integrated circuit chips used, and this within the limits imposed by known technologies.

Abstract

The invention concerns a method for making a portable electronic device comprising at least an integrated circuit chip (1) transferred onto a support strip (14) consisting of a dielectric film (15) laminated on a contact gate (18), the integrated circuit chip (1) being electrically connected to the contact gate (18). The invention is characterised in that it comprises the following steps: overmoulding chips (1) and their connections (17) to the contact gate (18) directly on the support strip (14) with an overmoulding material (50); cutting around the chips (1) and its connections (17) so as to obtain the devices (100).

Description

PROCEDE DE FABRICATION D'UNE MINI-CARTE A PUCE METHOD FOR MANUFACTURING A MINI-CHIP CARD
L'invention concerne un procédé de fabrication d'un dispositif électronique portable comportant au moins une puce de circuit intégré. Un tel dispositif comprend deux faces planes parallèles dont l'une comporte des plages de contact. L'invention concerne également le dispositif obtenu par un tel procédé.The invention relates to a method of manufacturing a portable electronic device comprising at least one integrated circuit chip. Such a device comprises two parallel flat faces, one of which has contact pads. The invention also relates to the device obtained by such a method.
L'invention s'applique tout particulièrement à la fabrication de dispositifs de type cartes à puce au format mini-carte, et préférentiellement aux cartes à puce d'un format réduit par rapport au format standard des mini-cartes.The invention applies very particularly to the manufacture of smart card type devices in mini-card format, and preferably to smart cards of a reduced format compared to the standard format of mini-cards.
On rappelle que les cartes à puce à contacts affleurants permettent d'effectuer par exemple des transactions sécurisées de type monétique, d'identification ou de télécommunications. Les dimensions des cartes ainsi que le positionnement des contacts sont définis par un standard correspondant aux normes internationales ISO 7810, 7816-1 et 7816-2.It will be recalled that smart cards with flush contacts make it possible, for example, to carry out secure transactions of electronic payment, identification or telecommunications type. The dimensions of the cards and the positioning of the contacts are defined by a standard corresponding to international standards ISO 7810, 7816-1 and 7816-2.
Ce premier standard définit une carte avec ou sans contact comme un élément portable de faible épaisseur et de dimensions : 85 mm de longueur, 54 mm de largeur et 0.76 mm d'épaisseur.This first standard defines a card with or without contact as a portable element of small thickness and dimensions: 85 mm in length, 54 mm in width and 0.76 mm in thickness.
Un deuxième standard a permis de définir le format des cartes à puce dédiées au marché de la téléphonie mobile. Ces cartes à puce dédiées à la téléphonie mobile présentent un format réduit par rapport au format ISO qui vient d'être rappelé. Il s'agit de mini -cartes de 25 mm de longueur et de 15 mm de largeur avec un détrompeur de 3mm par 3mm sur le coin inférieur droit, l'épaisseur étant identique à l'épaisseur des cartes répondant au premier standard.A second standard made it possible to define the format of smart cards dedicated to the mobile telephony market. These smart cards dedicated to mobile telephony have a reduced format compared to the ISO format which has just been mentioned. These are 25 mm long and 15 mm wide mini-cards with a 3mm by 3mm keying on the lower right corner, the thickness being identical to the thickness of the cards meeting the first standard.
On rappelle qu'une carte à puce à contact comporte un support plastique en forme de plaque selon le format standard ISO. Ce support porte au moins un microcircuit électronique (appelé également module électronique ou micromodule électronique dans la littérature) et une série de plages de contact pour le raccordement électrique du microcircuit à un circuit d'exploitation. Une mini-carte est généralement obtenue par le même procédé de fabrication qu'une carte au format standard ISO, avec une étape supplémentaire de prédécoupe du support de carte autour d'une région portant les contacts, cette région étant au format mini-carte. Le marché de la téléphonie mobile est en constante mutation et tend vers une miniaturisation plus grande des terminaux mobiles. De ce fait, la miniaturisation du format mini -carte semble une nécessité afin de ne pas pénaliser la miniaturisation des terminaux. On s'oriente donc vers une réduction du format des, cartes destinées à équiper les nouvelles générations de téléphones mobiles tout en cherchant à conserver la taille des circuits intégrés et même à l'augmenter.It will be recalled that a contact smart card comprises a plastic support in the form of a plate according to the ISO standard format. This support carries at least one electronic microcircuit (also called electronic module or electronic micromodule in the literature) and a series of contact pads for the electrical connection of the microcircuit to an operating circuit. A mini-card is generally obtained by the same manufacturing process as a card in ISO standard format, with an additional step of pre-cutting the card support around a region carrying the contacts, this region being in mini-card format. The mobile telephony market is constantly changing and is tending towards greater miniaturization of mobile terminals. Therefore, the miniaturization of the mini-card format seems a necessity in order not to penalize the miniaturization of terminals. We are therefore moving towards a reduction in the format of the cards intended to equip new generations of mobile phones while seeking to maintain the size of integrated circuits and even to increase it.
Ainsi, un nouveau format de carte à puce à contact a été proposé dans lequel le microcircuit couvre la quasi totalité de la surface de la carte. Une telle carte d'un format réduit par rapport au format standard des mini-cartes a été baptisé « PLUG 3G ».Thus, a new format of contact smart card has been proposed in which the microcircuit covers almost the entire surface of the card. Such a card of a reduced format compared to the standard format of mini-cards has been baptized "PLUG 3G".
Un tel dispositif comprend un corps de carte de forme rectangulaire de 15 mm de longueur et de 10 mm de largeur avec une épaisseur inférieure ou égale à 0.76 mm et un détrompeur de 1mm par 1mm sur le coin inférieur droit de la carte.Such a device comprises a card body of rectangular shape 15 mm in length and 10 mm in width with a thickness less than or equal to 0.76 mm and a polarization of 1mm by 1mm on the lower right corner of the card.
Un tel dispositif permet de répondre à un besoin de format de carte réduit en optimisant la place du circuit intégré dans ce nouveau format et en étant compatible aux nouvelles générations de téléphones mobiles .Such a device makes it possible to meet a need for a reduced card format by optimizing the place of the integrated circuit in this new format and by being compatible with new generations of mobile telephones.
On rappelle que selon un procédé connu de fabrication, le support de la carte à puce au format standard ISO (et mini-carte) est réalisé par moulage en matière plastique ou par lammation, puis le microcircuit est incorporé dans le support de carte au cours d'une opération dite "encartage" . En pratique, on vient coller le microcircuit dans une cavité prévue à cet effet dans le support.Recall that according to a known manufacturing process, the support of the chip card in ISO standard format (and mini-card) is produced by plastic molding or by lammation, then the microcircuit is incorporated into the card support during of an operation called "inserting". In practice, the microcircuit is bonded into a cavity provided for this purpose in the support.
Ce procédé de moulage et encartage du microcircuit n'est pas rentable dans le cas d'un dispositif de format réduit par rapport au format standard des mini- cartes tel qu'il a été mentionné plus haut. Selon un autre procédé connu, il est possible d'obtenir le support de carte par surmoulage du microcircuit électronique.This method of molding and inserting the microcircuit is not profitable in the case of a device with a reduced format compared to the standard format of mini-cards as mentioned above. According to another known method, it is possible to obtain the card support by overmolding of the electronic microcircuit.
Une telle technique est décrite, par exemple, dans la demande de brevet internationale WO 97/23843, illustrée sur la figure 1. La technique du surmoulage consiste essentiellement à placer un microcircuit 10 dans un moule 200 au format du support de carte que l'on souhaite réaliser, puis à injecter de la matière plastique 50 dans ce moule pour fixer le microcircuit 10.Such a technique is described, for example, in international patent application WO 97/23843, illustrated in FIG. 1. The overmolding technique essentially consists in placing a microcircuit 10 in a mold 200 in the format of the card support that one wishes to make, then in injecting plastic material 50 into this mold to fix the microcircuit 10.
Selon une particularité de cette demande, le microcircuit 10, constitué d'une puce 1 électriquement reliée à une grille de contact 18, est maintenu contre une des parois du moule 200 par des tiges 210 de manière à bien plaquer la grille de contact 18 qui doit se situer à fleur du support de la carte après démoulage .According to a feature of this application, the microcircuit 10, consisting of a chip 1 electrically connected to a contact grid 18, is held against one of the walls of the mold 200 by rods 210 so as to properly press the contact grid 18 which must be flush with the card holder after demolding.
Avantageusement, la grille de contact 18 est cambrée de manière à constituer des griffes 19 qui permettent d'ancrer le microcircuit 10 dans la matière plastique 50 injectée.Advantageously, the contact grid 18 is arched so as to constitute claws 19 which allow the microcircuit 10 to be anchored in the injected plastic 50.
Toutes les techniques connues de surmoulage effectuent cette opération sur un microcircuit individualisé et constituent généralement, comme 1' encartage, la dernière étape de fabrication d'une carte à puce.All known overmolding techniques perform this operation on an individual microcircuit and generally constitute, like one insert, the last step of manufacturing a smart card.
Le but de la présente invention est de proposer une autre technique de surmoulage qui soit simple et qui permette de minimiser le nombre d'étapes de fabrication d'un dispositif électronique portable.The object of the present invention is to propose another molding technique which is simple and which makes it possible to minimize the number of steps in the manufacture of a portable electronic device.
Ainsi, le procédé de fabrication selon la présente invention consiste à réaliser le surmoulage de microcircuits directement sur un film support continu et non pas sur un film support pris individuellement. Le procédé selon l'invention permet donc de réaliser toutes les étapes de fabrication du dispositif en continu jusqu'à l'étape finale d'individualisation par découpe .Thus, the manufacturing method according to the present invention consists in carrying out the overmolding of microcircuits directly on a continuous support film and not on an individual support film. The method according to the invention therefore makes it possible to carry out all the stages of manufacturing the device. continuously until the final stage of individualization by cutting.
En particulier, une seule étape est nécessaire pour créer le support du microcircuit et le maintenir dans ce support .In particular, a single step is necessary to create the support for the microcircuit and to maintain it in this support.
Ainsi, un net gain de productivité est possible. L'adhésion du microcircuit dans la matière plastique injectée est avantageusement obtenue par la présence d'un diélectrique thermoactivable sur le film support du microcircuit dont les propriétés de collage sont mises en œuvre par la matière plastique chauffée injectée lors du surmoulage.Thus, a net gain in productivity is possible. The adhesion of the microcircuit to the injected plastic is advantageously obtained by the presence of a thermoactivable dielectric on the support film of the microcircuit, the bonding properties of which are implemented by the heated plastic material injected during overmolding.
A cet effet, le film support est constitué par un film diélectrique laminé sur une grille de contact, le film diélectrique présentant des propriétés telles qu'il permet l'adhésion du film support à la matière plastique injectée lors du surmoulage.To this end, the support film is constituted by a dielectric film laminated on a contact grid, the dielectric film having properties such that it allows the adhesion of the support film to the plastic material injected during overmolding.
Ainsi, par rapport à l'art antérieur, on évite le recours à un film diélectrique de type kapton, qui est très onéreux, ainsi qu'à un film thermoplastique compatible avec la matière surmoulée tel que duThus, compared to the prior art, the use of a dielectric film of the kapton type, which is very expensive, is avoided, as well as a thermoplastic film compatible with the overmolded material such as
Polyéthylène Téréphtalate (PET) .Polyethylene Terephthalate (PET).
L'étape supplémentaire de réalisation des griffes est ainsi supprimée. En outre, le procédé selon l'invention permet de surmouler une pluralité de microcircuits puis de découper les différents dispositifs au format souhaité, ce qui simplifie le procédé industriel.The additional step of making the claws is thus eliminated. In addition, the method according to the invention makes it possible to overmold a plurality of microcircuits and then to cut the various devices to the desired format, which simplifies the industrial process.
Le procédé selon l'invention s'applique préférentiellement à des dispositifs de petites dimensions tels que les mini-cartes ou les PLUG 3G pour lesquels le microcircuit couvre toute la surface du dispositif .The method according to the invention preferably applies to devices of small dimensions such as mini-cards or 3G PLUGs for which the microcircuit covers the entire surface of the device.
Le procédé de l'invention pourrait éventuellement s'appliquer à des cartes de format ISO, mais la taille du support de ces cartes est telle qu'il serait nécessaire d'espacer grandement les puces sur le film support ce qui engendrerait une perte de place et donc de productivité plus importante que le gain de temps obtenu.The process of the invention could possibly be applied to cards of ISO format, but the size of the support of these cards is such that it would be necessary to space the chips a lot on the support film which would cause a loss of space. and therefore greater productivity than the time saved.
La présente invention a plus particulièrement pour objet un procédé de fabrication d'un dispositif électronique portable comprenant au moins une puce de circuit intégré reportée sur une bande support constituée par un film diélectrique laminé sur une grille de contact, la puce de circuit intégré étant électriquement reliée à la grille de contact, caractérisé en ce qu'il comprend les étapes suivantes : réalisation d'un surmoulage des puces et de leurs connexions à la grille de contact directement sur la bande support par une matière de surmoulage ; découpe autour des puces et de ses connexions de manière à obtenir les dispositifs. Selon une caractéristique, les matériaux constitutifs du film diélectrique et de la matière de surmoulage sont identiques ou compatibles pour une adhésion.The present invention more particularly relates to a method of manufacturing a portable electronic device comprising at least one integrated circuit chip transferred onto a support strip formed by a dielectric film laminated on a contact grid, the integrated circuit chip being electrically connected to the contact grid, characterized in that it comprises the following stages: producing an overmolding of the chips and their connections to the contact grid directly on the support strip by an overmolding material; cutting around the chips and its connections so as to obtain the devices. According to one characteristic, the materials constituting the dielectric film and the overmolding material are identical or compatible for adhesion.
Selon une autre caractéristique, les matériaux constitutifs du film diélectrique et de la matière de surmoulage présentent une continuité non visible à l'œil nu sur la tranche du dispositif.According to another characteristic, the materials constituting the dielectric film and the material of overmolding have a continuity not visible to the naked eye on the edge of the device.
Selon une première variante, film diélectrique est constitué par un diélectrique thermofusible apte à coller à la matière de surmoulage.According to a first variant, the dielectric film consists of a hot-melt dielectric capable of sticking to the molding material.
Selon une deuxième variante, le film diélectrique est constitué par un diélectrique thermoplastique apte à entrer en fusion au contact de la matière de surmoulage . Selon des variantes de réalisation, la matière de surmoulage est choisie parmi du Polystyrène, du Polyéthylène Téréphtalate (PET), et de 1 'Acrylonitπle Butadiène Styrène (ABS) .According to a second variant, the dielectric film consists of a thermoplastic dielectric capable of melting on contact with the overmolding material. According to variant embodiments, the overmolding material is chosen from Polystyrene, Polyethylene Terephthalate (PET), and Acrylonitrile Butadiene Styrene (ABS).
Selon un premier mode de réalisation, le surmoulage réalisé sur la bande support englobe une pluralité de puces avec leurs connexions, chaque dispositif étant individualisé par découpe simultanée de la bande support et du surmoulage.According to a first embodiment, the overmolding produced on the support strip includes a plurality of chips with their connections, each device being individualized by simultaneous cutting of the support strip and the overmolding.
Selon un deuxième mode de réalisation, le surmoulage est réalisé sur la bande support au format des dispositifs, chaque dispositif étant individualisé par découpe de la bande support au ras du surmoulage.According to a second embodiment, the overmolding is carried out on the support strip in the format of the devices, each device being individualized by cutting the support strip flush with the overmolding.
La présente invention concerne également un dispositif électronique portable comprenant au moins une puce de circuit intégré reportée sur une bande support, la puce et ses connexions à une grille de contact étant noyées dans une matière plastique constituant le corps du dispositif, caractérisé en ce que la bande support est constituée par un film diélectrique laminé sur la grille de contact et assurant l'adhésion de la bande support de la puce avec la matière plastique du corps du dispositif.The present invention also relates to a portable electronic device comprising at least one integrated circuit chip transferred onto a support strip, the chip and its connections to a contact grid being embedded in a plastic material constituting the body of the device, characterized in that the support strip consists of a dielectric film laminated on the contact grid and ensuring the adhesion of the chip support strip with the plastic material of the device body.
Selon une caractéristique, la bande support s'étend jusqu'au bord du corps du dispositif. Selon une première application, le dispositif consiste en une carte à puce au format standard des mini-cartes .According to one characteristic, the support strip extends to the edge of the body of the device. According to a first application, the device consists of a smart card in the standard format of mini-cards.
Selon une deuxième application, le dispositif consiste en une carte à puce d'un format réduit par rapport au format standard des mini-cartes.According to a second application, the device consists of a smart card of a reduced format compared to the standard format of mini-cards.
Selon une particularité de cette deuxième application, la bande support couvre toute la surface du dispositif.According to a feature of this second application, the support strip covers the entire surface of the device.
Les particularités et avantages de l'invention apparaîtront clairement à la lecture de la description qui est faite ci -après et qui est donnée à titre d'exemple îllustratif et non limitatif et en regard des dessins sur lesquels : - la figure 1, déjà décrite, illustre une technique de surmoulage de l'art antérieur ; la figure 2 illustre la bande support des microcircuits à surmouler selon le procédé de 1 ' invention ; - la figure 3 illustre un premier mode de réalisation du procédé de fabrication selon l'invention ; la figure 4 illustre l'étape de surmoulage du procédé selon le premier mode de réalisation de l'invention ; la figure 5a illustre une première application du premier mode de réalisation de l'invention ; la figure 5b illustre une deuxième application du premier mode de réalisation de l'invention ; - la figure 6 illustre un deuxième mode de réalisation du procédé de fabrication selon 1 ' invention ; la figure 7 illustre l'étape de surmoulage du procédé selon le deuxième mode de réalisation de 1 ' invention ; la figure 8a illustre une première application du deuxième mode de réalisation de l'invention ; la figure 8b illustre une deuxième application du deuxième mode de réalisation de l'invention ;The features and advantages of the invention will become apparent on reading the description which is given below and which is given by way of illustrative and nonlimiting example and with reference to the drawings in which: - Figure 1, already described , illustrates a molding technique of the prior art; FIG. 2 illustrates the support strip for the microcircuits to be overmolded according to the method of the invention; - Figure 3 illustrates a first embodiment of the manufacturing method according to the invention; FIG. 4 illustrates the step of overmolding the method according to the first embodiment of the invention; FIG. 5a illustrates a first application of the first embodiment of the invention; FIG. 5b illustrates a second application of the first embodiment of the invention; - Figure 6 illustrates a second embodiment of the manufacturing method according to the invention; FIG. 7 illustrates the step of overmolding the method according to the second embodiment of the invention; FIG. 8a illustrates a first application of the second embodiment of the invention; FIG. 8b illustrates a second application of the second embodiment of the invention;
Dans un premier temps, le procédé de fabrication selon l'invention consiste à réaliser des microcircuits sur un film support selon des techniques standards.Firstly, the manufacturing method according to the invention consists in producing microcircuits on a support film according to standard techniques.
Une technique classique de fabrication de microcircuits 10, illustrée sur la figure 2, consiste à coller une puce de circuit intégré 1 en disposant sa face active avec ses plots de contact 11 vers le haut, et en collant la face opposée sur un film support 14.A conventional technique for manufacturing microcircuits 10, illustrated in FIG. 2, consists in bonding an integrated circuit chip 1 by placing its active face with its contact pads 11 upwards, and by bonding the opposite face to a support film 14 .
Le film support 14 est constitué d'un film diélectrique 15 disposé sur une grille de contacts 18, par exemple en cuivre nickelé et doré, sur laquelle sont définies les plages de contact du microcircuit 10. Le film diélectrique 15 peut par exemple être laminé sur la grille de contacts 18. Sans sortir du cadre de l'invention, la grille métallique 18 peut également constituer une antenne pour une application à des dispositifs sans contact.The support film 14 consists of a dielectric film 15 disposed on a contact grid 18, for example of nickel-plated and gilded copper, on which the contact pads of the microcircuit 10 are defined. The dielectric film 15 can for example be laminated on the contact grid 18. Without departing from the scope of the invention, the metal grid 18 can also constitute an antenna for application to contactless devices.
Néanmoins, la description qui suit se réfère à une grille métallique 18 dans laquelle sont définies des plages de contact pour une application à des dispositifs à contact.However, the following description refers to a metal grid 18 in which contact pads are defined for application to contact devices.
Selon les applications, la puce 1 peut être collée sur le film diélectrique 15 ou directement sur la grille de contact 18. Dans l'application qui nous intéresse, la puce 1 est préférentiellement collée sur la grille métallique 18 au moyen d'une colle isolante insensible à la chaleur.Depending on the applications, the chip 1 can be bonded to the dielectric film 15 or directly to the contact grid 18. In the application which interests us, the chip 1 is preferably bonded to the metal grid 18 by means of an insulating adhesive. insensitive to heat.
Chaque puce 1 doit alors être respectivement connectée aux plages de contact 18 de chaque microcircuit 10. Cette connexion est généralement réalisée par câblage filaire. D'autres moyens de connexion peuvent être envisagés, comme par exemple, une connexion par un procédé de « flip chip » qui consiste à retourner la puce 1 pour la connecter directement sur la grille de contact 18 au moyen de bossages réalisés sur les plots de contact 11 et d'une colle à conduction anisotropique par exemple.Each chip 1 must then be respectively connected to the contact pads 18 of each microcircuit 10. This connection is generally made by wire wiring. Other connection means can be envisaged, such as, for example, a connection by a “flip chip” process which consists in turning the chip 1 over to connect it directly to the contact grid 18 by means of bosses made on the pads. contact 11 and an anisotropic conduction adhesive for example.
Dans le cas d'une connexion par câblage filaire, des puits de connexion 16 sont pratiqués dans le film diélectrique 15 et des fils de connexion 17 relient les plots de contact 11 de la puce 1 aux plages de contacts de la grille 18 par l'intermédiaire des puits de connexion 16. La connexion électrique peut être établie par thermosoudure par exemple. Enfin, une étape dite « d' encapsulation » est réalisée de manière à protéger la puce 1 et ses fils de connexions 17 soudés. Il peut s'agir du dépôt d'une résine 20, à base d'époxy par exemple, selon un procédé dit de « glob top » qui consiste à enrober la puce 1 et ses connexion 17 par le dessus.In the case of a connection by wire wiring, connection wells 16 are formed in the dielectric film 15 and connection wires 17 connect the contact pads 11 of the chip 1 to the contact pads of the grid 18 by the through the connection wells 16. The electrical connection can be established by heat sealing, for example. Finally, a so-called "encapsulation" step is carried out so as to protect the chip 1 and its welded connection wires 17. It may be the deposition of a resin 20, based on epoxy for example, according to a process called "glob top" which consists in coating the chip 1 and its connections 17 from above.
Cette étape de protection de la puce et de ses connexions n'est pas indispensable dans le cas d'une connexion par le procédé de flip chip par exemple. Dans les procédés de l'art antérieur, le micromodule 10 était alors généralement découpé puis encarté dans la cavité d'un corps de carte préalablement décoré, ou déposé dans un moule pour être surmoulé au format du corps de carte. Le procédé selon l'invention propose de surmouler les microcircuits 10 directement sur le film support 14 puis d' individualiser les dispositifs par découpe ultérieure .This step of protecting the chip and its connections is not essential in the case of a connection by the flip chip method for example. In the methods of the prior art, the micromodule 10 was then generally cut out then inserted in the cavity of a card body previously decorated, or deposited in a mold to be overmolded in the format of the card body. The method according to the invention proposes to overmold the microcircuits 10 directly on the support film 14 and then to individualize the devices by subsequent cutting.
Selon une caractéristique essentielle de l'invention, le film diélectrique 15 de la bande support 14 est constitué par un diélectrique thermoactivable apte à assurer l'adhésion de la bande support 14 avec la matière plastique chauffée injectée lors du surmoulage. II peut s'agir par exemple, d'un diélectrique thermofusible apte à coller à la matière plastique chaude, ou d'un diélectrique thermoplastique apte à entrer en fusion avec la matière plastique chaude.According to an essential characteristic of the invention, the dielectric film 15 of the support strip 14 is constituted by a thermoactivable dielectric capable of ensuring the adhesion of the support strip 14 with the heated plastic material injected during overmolding. It may, for example, be a hot-melt dielectric capable of sticking to the hot plastic material, or a thermoplastic dielectric capable of melting with the hot plastic material.
La figure 3 illustre un premier mode de réalisation du procédé de fabrication selon l'invention. Selon ce mode de réalisation, une pluralité de microcircuits 10 sont surmoulés dans un même moule, chaque dispositif 100 étant ensuite individualisé par découpe simultanée de la bande support 14 et du surmoulage 50.FIG. 3 illustrates a first embodiment of the manufacturing method according to the invention. According to this embodiment, a plurality of microcircuits 10 are overmolded in the same mold, each device 100 then being individualized by simultaneous cutting of the support strip 14 and the overmolding 50.
La figure 4 illustre l'étape de surmoulage selon ce premier mode de réalisation.FIG. 4 illustrates the overmolding step according to this first embodiment.
Le film support 14 est disposé le moule 200 dont le format est adapté au nombre de dispositifs 100 que l'on souhaite surmouler en une seule étape.The support film 14 is placed on the mold 200, the format of which is adapted to the number of devices 100 which it is desired to overmold in one step.
La grille de contact 18 étant plaquée à la paroi du moule 200, les plages de contacts seront nécessairement à fleur du dispositif 100. Le surmoulage étant réalisé directement sur le film support 14, les contacts sont parfaitement protégés des coulés de matière plastique.The contact grid 18 being pressed against the wall of the mold 200, the contact pads will necessarily be flush with the device 100. The overmolding being carried out directly on the support film 14, the contacts are perfectly protected from the plastics material.
La matière plastique 50 est alors injectée selon des techniques classiques, à l'aide d'une busette 220 par exemple. Cette matière 50 vient recouvrir le diélectrique 15 du film support 14 ainsi que la goutte d'enrobage 20 ou la puce 1 et ses connexions 17 si l'enrobage était facultatif.The plastic 50 is then injected according to conventional techniques, using a nozzle 220 for example. This material 50 covers the dielectric 15 of the support film 14 as well as the coating drop 20 or the chip 1 and its connections 17 if the coating was optional.
La matière plastique 50 peut être composée, par exemple, de polystyrène, de polyéthylène téréphtalateThe plastic 50 can be composed, for example, of polystyrene, of polyethylene terephthalate
(PET) , ou d'Acrylonitπle Butadiène Styrène (ABS) . Elle présente des caractéristiques qui lui permettent d'activer le diélectrique 15 afin d'ancrer le microcircuit 10 dans le surmoulage 50.(PET), or Acrylonitrile Butadiene Styrene (ABS). It has characteristics which allow it to activate the dielectric 15 in order to anchor the microcircuit 10 in the overmolding 50.
Le moule 200 est alors ouvert et les dispositifs 100 peuvent être individualisés par découpe dans la matière 50 et dans le film support 14. Les figures 5a et 5b sont des vues de dessus des surmoulages obtenus selon ce premier mode de réalisation de l'invention, pour des applications aux mini -cartes (figure 5a) et aux PLUG 3G (figure 5b) . Les dispositifs 100 sont obtenus par découpe au moyen d'un outil de découpe adapté.The mold 200 is then opened and the devices 100 can be individualized by cutting from the material 50 and from the support film 14. FIGS. 5a and 5b are top views of the overmoldings obtained according to this first embodiment of the invention, for applications to mini-cards (FIG. 5a) and to 3G PLUG (FIG. 5b). The devices 100 are obtained by cutting using a suitable cutting tool.
Le moule et/ou l'outil de découpe, présente (nt) une arête brisée pour former le détrompeur dans le cas d'une application aux cartes destinées à la téléphonie mobile.The mold and / or the cutting tool has a broken edge to form the key in the case of an application to cards intended for mobile telephony.
La figure 6 illustre un deuxième mode de réalisation du procédé de fabrication selon 1 ' invention.FIG. 6 illustrates a second embodiment of the manufacturing method according to the invention.
Selon ce mode de réalisation, une pluralité de microcircuits 10 sont surmoulés directement au format des dispositifs 100, chaque dispositif 100 étant ensuite individualisé par découpe de la bande supportAccording to this embodiment, a plurality of microcircuits 10 are molded directly in the format of the devices 100, each device 100 then being individualized by cutting the support strip.
14 au ras de chaque surmoulage 50.14 flush with each overmold 50.
La figure 7 illustre l'étape de surmoulage selon ce deuxième mode de réalisation de l'invention.FIG. 7 illustrates the overmolding step according to this second embodiment of the invention.
Cette étape de surmoulage est la même que celle précédemment décrite en référence au premier mode de réalisation, seule la forme du moule 200 étant différente, ainsi que l'outil de découpe qui doit permettre un découpage au ras des surmoulages 50.This overmolding step is the same as that previously described with reference to the first embodiment, only the shape of the mold 200 being different, as well as the cutting tool which must allow cutting to the level of the overmolding 50.
Les figures 8a et 8b sont des vues de dessus des surmoulages obtenus selon ce deuxième mode de réalisation de l'invention, pour des applications aux mini-cartes (figure 8a) et aux PLUG 3G (figure 8b) . Il est à noter que le procédé décrit dans la présente demande s'applique quelque soit la taille et le nombre de puces de circuit intégré utilisées, et cela dans les limites imposées par le technologies connues. FIGS. 8a and 8b are top views of the overmoldings obtained according to this second embodiment of the invention, for applications to mini-cards (FIG. 8a) and to 3G PLUG (FIG. 8b). It should be noted that the method described in the present application applies whatever the size and the number of integrated circuit chips used, and this within the limits imposed by known technologies.

Claims

REVENDICATIONS
1. Procédé de fabrication d'un dispositif électronique portable comprenant au moins une puce de circuit intégré (1) reportée sur une bande support (14) constituée par un film diélectrique (15) laminé sur une grille de contact (18), la puce de circuit intégré (1) étant électriquement reliée à la grille de contact (18), caractérisé en ce qu'il comprend les étapes suivantes : - réalisation d'un surmoulage des puces (1) et de leurs connexions (17) à la grille de contact (18) directement sur la bande support (14) par une matière de surmoulage (50) ; découpe autour des puces (1) et de ses connexions (17) de manière à obtenir les dispositifs (100) .1. Method for manufacturing a portable electronic device comprising at least one integrated circuit chip (1) transferred to a support strip (14) constituted by a dielectric film (15) laminated on a contact grid (18), the chip of an integrated circuit (1) being electrically connected to the contact grid (18), characterized in that it comprises the following stages: - producing an overmolding of the chips (1) and their connections (17) to the grid contact (18) directly on the support strip (14) by an overmolding material (50); cutting around the chips (1) and its connections (17) so as to obtain the devices (100).
2. Procédé de fabrication selon la revendication 1, caractérisé en ce que les matériaux constitutifs du film diélectrique (15) et de la matière de surmoulage (50) sont identiques ou compatibles pour une adhésion.2. Manufacturing method according to claim 1, characterized in that the materials constituting the dielectric film (15) and the overmolding material (50) are identical or compatible for adhesion.
3. Procédé de fabrication selon l'une des revendications 1 à 2, caractérisé en ce que les matériaux constitutifs du film diélectrique (15) et de la matière de surmoulage (50) présentent une continuité non visible à l'œil nu sur la tranche du dispositif. 3. Manufacturing method according to one of claims 1 to 2, characterized in that the materials constituting the dielectric film (15) and the overmolding material (50) have a continuity not visible to the naked eye on the wafer of the device.
4. Procédé de fabrication selon l'une des revendications 1 à 3, caractérisé en ce que le film diélectrique (15) est constitué par un diélectrique thermofusible apte à coller à la matière de surmoulage (50) .4. Manufacturing method according to one of claims 1 to 3, characterized in that the dielectric film (15) consists of a hot-melt dielectric capable of sticking to the overmolding material (50).
5. Procédé de fabrication selon l'une des revendications 1 à 3, caractérisé en ce que le film diélectrique (15) est constitué par un diélectrique thermoplastique apte à entrer en fusion au contact de la matière de surmoulage (50) .5. Manufacturing process according to one of claims 1 to 3, characterized in that the dielectric film (15) consists of a thermoplastic dielectric capable of melting on contact with the overmolding material (50).
6. Procédé de fabrication selon l'une quelconque des revendications précédentes, caractérisé en ce que la matière de surmoulage (50) est choisie parmi du Polystyrène, du Polyéthylène Téréphtalate (PET) et de 1 ' Acrylonitrile Butadiène Styrène (ABS) .6. Manufacturing method according to any one of the preceding claims, characterized in that the overmolding material (50) is chosen from Polystyrene, Polyethylene Terephthalate (PET) and 1 Acrylonitrile Butadiene Styrene (ABS).
7. Procédé de fabrication selon l'une quelconque des revendications 1 à 6, caractérisé en ce que le surmoulage réalisé sur la bande support (14) englobe une pluralité de puces (1) avec leurs connexions (17), chaque dispositif (100) étant individualisé par découpe simultanée de la bande support (14) et du surmoulage (50) .7. Manufacturing method according to any one of claims 1 to 6, characterized in that the overmolding produced on the support strip (14) includes a plurality of chips (1) with their connections (17), each device (100) being individualized by simultaneous cutting of the support strip (14) and the overmolding (50).
8. Procédé de fabrication selon l'une quelconque des revendication 1 à 6, caractérisé en ce que le surmoulage est réalisé sur la bande support (14) au format des dispositifs (100) , chaque dispositif (100) étant individualisé par découpe de la bande support8. Manufacturing method according to any one of claims 1 to 6, characterized in that the overmolding is carried out on the support strip (14) in the format of the devices (100), each device (100) being individualized by cutting the support strip
(14) au ras du surmoulage (50) .(14) flush with the overmolding (50).
9. Dispositif électronique portable comprenant au moins une puce de circuit intégré (1) reportée sur une bande support (14), la puce (1) et ses connexions (17) à une grille de contact (18) étant noyées dans une matière plastique (50) constituant le corps du dispositif (100), caractérisé en ce que la bande support (14) est constituée par un film diélectrique9. Portable electronic device comprising at least one integrated circuit chip (1) transferred to a support strip (14), the chip (1) and its connections (17) to a contact grid (18) being embedded in a plastic material (50) constituting the body of the device (100), characterized in that the support strip (14) is constituted by a dielectric film
(15) laminé sur la grille de contact (18) et assurant l'adhésion de la bande support (14) de la puce (1) avec la matière plastique (50) du corps du dispositif (100) .(15) laminated on the contact grid (18) and ensuring the adhesion of the support strip (14) of the chip (1) with the plastic material (50) of the body of the device (100).
10. Dispositif électronique portable selon la revendication 9, caractérisé en ce que les matériaux constitutifs du film diélectrique (15) et de la matière plastique (50) sont identiques ou compatibles pour une adhésion.10. Portable electronic device according to claim 9, characterized in that the materials constituting the dielectric film (15) and the plastic material (50) are identical or compatible for adhesion.
11. Dispositif électronique portable selon la revendication 9, caractérisé en ce que la bande support (14) s'étend jusqu'au bord du corps du dispositif (100) .11. Portable electronic device according to claim 9, characterized in that the support strip (14) extends to the edge of the body of the device (100).
12. Dispositif électronique portable selon l'une des revendications 9 à 11, caractérisé en ce qu'il consiste en une carte à puce au format standard des mmi-cartes . 12. Portable electronic device according to one of claims 9 to 11, characterized in that it consists of a chip card in the standard format of mi-cards.
13. Dispositif électronique portable selon l'une des revendications 9 à 11, caractérisé en ce qu'il consiste en une carte à puce d'un format réduit par rapport au format standard des mini-cartes.13. Portable electronic device according to one of claims 9 to 11, characterized in that it consists of a smart card of a reduced format compared to the standard format of mini-cards.
14. Dispositif électronique portable selon la revendication 13, caractérisé en ce que la bande support (14) couvre toute la surface du dispositif (100) . 14. Portable electronic device according to claim 13, characterized in that the support strip (14) covers the entire surface of the device (100).
PCT/FR2000/002262 1999-08-25 2000-08-07 Method for making a mini-smart card WO2001015076A1 (en)

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FR9910786A FR2797977B1 (en) 1999-08-25 1999-08-25 MANUFACTURING PROCESS OF A PORTABLE ELECTRONIC DEVICE INCLUDING AN OVERMOLDING STEP DIRECTLY ON THE SUPPORT FILM

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JP2005085089A (en) * 2003-09-10 2005-03-31 Renesas Technology Corp Ic card and manufacturing method thereof
DE102004011702B4 (en) * 2004-03-10 2006-02-16 Circle Smart Card Ag Method for producing a card body for a contactless chip card
US8653673B2 (en) * 2011-12-20 2014-02-18 Raytheon Company Method for packaging semiconductors at a wafer level

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