WO2000058053A1 - Apparatus and process for reconditioning polishing pads - Google Patents
Apparatus and process for reconditioning polishing pads Download PDFInfo
- Publication number
- WO2000058053A1 WO2000058053A1 PCT/US2000/005709 US0005709W WO0058053A1 WO 2000058053 A1 WO2000058053 A1 WO 2000058053A1 US 0005709 W US0005709 W US 0005709W WO 0058053 A1 WO0058053 A1 WO 0058053A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pad
- polishing
- tool
- shaping
- polishing surface
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
- B24B53/14—Dressing tools equipped with rotary rollers or cutters; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
Definitions
- This invention relates generally to maintenance of polishing pads for semiconductor wafers and more particularly to an apparatus and process for reconditioning polishing pads to maintain flatness.
- Semiconductor wafers are generally prepared from a single crystal ingot, such as a silicon ingot, which is sliced into individual wafers. Each wafer is subjected to a number of processing operations to facilitate the installation of integrated circuit devices and to improve their yield, performance, and reliability. Typically, these operations reduce the thickness of the wafer, remove damage caused by the slicing operation, and create a flat and reflective surface. Chemical-mechanical polishing of semiconductor wafers is one of these operations. It generally involves rubbing a wafer with a polishing pad while dispensing a slurry containing an abrasive and chemicals, such as a colloidal silica and an alkaline etchant, to produce a surface that is extremely flat, highly reflective, and damage-free.
- an abrasive and chemicals such as a colloidal silica and an alkaline etchant
- the polishing pad is circular or annular in shape and has a polishing surface (i.e., that portion of the surface area of the pad which contacts and polishes the wafer) which must be extremely flat to produce wafers that are likewise flat.
- polishing surfaces can acquire an uneven shape after use.
- the wafer is held with force by a polishing arm against the rotating polishing pad.
- the polishing arm may also move the wafer across the polishing pad in an oscillatory fashion as the pad rotates. After a number of polishing cycles, pressure and heat on the polishing pad cause variations of pad shape in a central annular region of the pad that contacts the wafer. Further, the polishing surface becomes worn in the central annular region.
- the cross sectional profile of the polishing surface of the pad becomes nonplanar.
- Slurry particles typically become deposited on polishing pads and further degrade polishing effectiveness.
- a typical polishing pad is made of a polyester felt impregnated with polyurethane resin.
- particles from the slurry and reaction products become adhered to fibers in the pad.
- the pad becomes soaked with slurry particles, its polishing ability is reduced.
- the particles can be unevenly distributed across the polishing surface, making the surface irregular.
- the combination of pad wear and slurry deposition can make the pad either concave or convex. Accordingly, polishing pads must be periodically reconditioned, or dressed, to restore a flat cross sectional profile and scrape away deposited slurry particles.
- One way reconditioning is accomplished is by using a dressing wheel which carries abrasive material on a pad shaping surface of the wheel.
- the wheel is held in position over the polishing surface with its pad shaping surface engaging the pad.
- the wheel is restricted from rotating about the axis of rotation of the pad as it turns, but may be permitted to freely rotate about its own center.
- the pad shaping surface rubs against the pad, abrading away the thicker portions so the profile is made more flat.
- the inner and outer edge margins of the polishing surface are lowered to the level of the central region by abrading away the inner and outer edge margins.
- the tool also removes deposited particles of slurry.
- the abrasive material on the tool such as diamond, is disposed in a continuous ring located at the periphery of the tool.
- the pad shaping tool can become slightly misaligned with the polishing pad resulting in uneven shaping.
- the tool is typically held by a connector at its center to a fixture generally above the pad shaping surface.
- the fixture holds the pad shaping surface generally parallel the pad, and has a bearing that engages the connector and permits the tool to rotate about its center.
- frictional force from the pad drives the tool to move along with the pad.
- the fixture opposes the force and holds the tool from translating with the pad.
- the force creates a moment about the bearing and the fixture, since they are spaced above the point of force application. The moment urges the tool to pivot about a point at the connector between the tool and the fixture.
- Mechanisms for attaching tools such as the bearing and the fixture, often have some degree of flexibility and looseness that allows a finite movement when opposing forces or moments.
- the moment from the frictional force induces a deflection in the fixture so that the tool pivots a small angle and is no longer in horizontal alignment with the pad.
- a leading edge of the abrasive surface of the tool i.e., the side of the wheel that first contacts the central annular region of the rotating pad
- the trailing edge of the tool i.e., the side of the wheel that last contacts the rotating pad
- the pad shape should conform with the shape of the abrasive material at the tool peripheral.
- the cross sectional profile of the polishing surface becomes concave.
- the frictional force creates a moment that pivots the tool and tends to make the pad profile concave.
- the tendency yields uncertain results, and operators have devised various cumbersome procedures for reconditioning pads that vary depending on the initial profile (i.e., whether convex or concave). For instance, when a pad is convex the wheel may be allowed to rotate but when a pad is concave the rotation of the wheel is restricted. These procedures often yield non-repeatable results and may require trial and error to obtain polishing pads that are flat.
- a pad shaping tool of the present invention shapes a polishing pad having a polishing surface defined by a radially inner and a radially outer boundary and a cross sectional profile between its radially inner and outer boundaries which changes as the polishing pad is used to polish objects.
- the tool comprises a disk having a first side and a second side, the disk being adapted for mounting in position on the polishing surface, and at least two discontinuous pad shaping surfaces located in spaced apart positions relative to each other on the first side of the disk.
- the pad shaping surfaces are simultaneously engageable with the polishing surface of the polishing pad for shaping the polishing surface as the pad rotates relative to the pad shaping tool to change the cross sectional profile of the polishing surface from a curved shape to a flatter shape.
- a process of the present invention for reconditioning a polishing pad on a rotatable platform of a wafer polishing machine comprises the steps of engaging a pad shaping tool with a polishing surface of the pad such that at least two discontinuous pad shaping surfaces of the tool simultaneously engage the polishing surface, with the pad shaping surfaces being located in spaced apart positions relative to each other on the tool.
- the polishing pad is rotated while translational movement of the pad shaping tool relative to the pad is prevented so that the pad shaping tool shapes the polishing surface of the pad to be more nearly flat.
- a process of the present invention for polishing semiconductor wafers using a wafer polishing machine having a rotating polishing pad including a polishing surface defined by a radially inner boundary and a radially outer boundary, the polishing surface having a cross sectional profile between its radially inner and outer boundaries comprises the steps of polishing at least one face of each of a first plurality of semiconductor wafers.
- the cross sectional profile is monitored to determine whether the profile of the polishing surface becomes more curved in shape than permitted by a process tolerance amount. If the determined shape of the profile of the polishing surface is more curved than the process tolerance amount, the polishing pad is shaped.
- the step of shaping the polishing pad is substantially as set forth in the preceding paragraph.
- FIG. 1 is a bottom plan view of a pad shaping tool of the present invention illustrating a slotted wheel arrangement of abrasive pad shaping surfaces on the tool;
- FIG. 2 is a fragmentary top plan schematic view of a polishing machine showing a fixture for holding the pad shaping tool against a polishing pad;
- FIG. 3 is an elevational view of the pad shaping tool;
- FIG. 4 is an elevational view of the pad shaping tool illustrating pivoting motion of the tool resulting from engagement with a moving polishing pad.
- a pad shaping tool of the present invention for reconditioning semiconductor wafer polishing pads on a wafer polishing machine and having a slotted wheel arrangement is indicated generally at 10.
- the tool 10 comprises a flat disk 12 having a first side 14 and a second side 16, and three discontinuous pad shaping surfaces 18 located in spaced apart positions relative to each other on the first side of the disk.
- the pad shaping surfaces 18 are located generally at the periphery of the first side 14 of the disk 12.
- the pad shaping 0 surfaces 18 are fixedly attached to the disk 12.
- the disk 12 is made of stainless steel and the pad shaping surfaces 18 are made of a suitable abrasive material such as electrolytically plated diamond. It is envisioned that the tool 10 may be made of other materials, a non-circular shaped disk 12, or may have any number of discontinuous pad shaping surfaces 18 located 5 anywhere on the disk without departing from the scope of the present invention.
- Each pad shaping surface 18 has the shape of a segment of an arc, and is generally rectangular in cross section.
- the pad shaping surfaces 18 lie between two circles 20, 22 of different diameters having centers coincided with a center 24 of the first side of the disk 12.
- the two circles 20, 22 define between o them an annular or wheel shape.
- a size of each pad shaping surface 18 may be defined by an angular extent 26 on the first side 14 of the wheel, measured with respect to the center 24 of the disk 12, and a corresponding arc segment length 28. In the preferred embodiment, the angular extent 26 and arc segment length 28 of each pad shaping surface 18 are approximately equal to the those of the other pad shaping surfaces.
- Spaces between the pad shaping surfaces 18, which lie generally between the two circles 20, 22 and outside of the angular extent of any pad shaping surface 18, comprise slots 30 in the wheel.
- the angular extent 26 of any pad shaping surface 18 generally ranges between 40° and 90°. Other angles and pad shaping surfaces having substantially different sizes do not depart from the scope of this invention.
- a connector 32 is on the second side 16 of the disk 12 and is constructed for rotatably attaching the tool 10 to a fixture 34 (Fig 2) for holding the tool in a position in which the pad shaping surfaces 18 engage a polishing pad 36 on the wafer polishing machine.
- the fixture 34 comprises an arm 38 for holding the tool 10 as the pad 36 rotates on the machine generally beneath the tool.
- the fixture 34 has a bearing 40 that permits the tool 10 to rotate about a central axis 42 at the center of the tool.
- the fixture 34 and connector 32 hold the tool 10 in general horizontal alignment with the pad 36.
- the construction and arrangement of the fixture 34 and the attachment of the tool 10 to the fixture is conventional and will not be further described herein.
- the tool 10 is used to recondition polishing pads 36 on the wafer polishing machine in a manner similar to that in the prior art for wheel- shaped pad dressing tools.
- the polishing pad 36 has a polishing surface 44 defined by a radially inner boundary 46 and a radially outer boundary 48, and a cross sectional profile between its radially inner and outer boundaries, the profile being ideally flat. After a number of polishing cycles where the pad 36 rotates relative to wafers (not shown) to polish the wafers, the profile of the pad becomes curved. The shape of the profile of the pad is monitored by periodically measuring the flatness of a wafer polished by the pad 36, since after polishing, wafer shape generally corresponds to pad shape.
- one sample wafer after every 50 polished wafers may be measured for surface flatness. If the wafer deviates from being flat by more than a process tolerance amount, it is an indication that the profile of the pad 36 is unacceptably curved or soaked with slurry particles and requires reconditioning.
- Wafer polishing is ceased while a pad reconditioning and shaping process is conducted.
- the fixture 34 is put in position where the pad shaping tool 10 engages the polishing surface 44 of the pad 36.
- the disk 12 is oriented generally parallel to the pad 36 so that all pad shaping surfaces 18 simultaneously engage the polishing surface 44.
- the polishing pad 36 is rotated while the fixture 34 holds the pad shaping tool 10.
- the tool 10 shapes the polishing surface 44 by abrading pad material as the pad 36 rotates relative to the tool, thereby changing the cross sectional profile of the polishing surface from a curved shape to a flatter shape.
- the fixture 34 prevents translational movement of the tool 10, but allows rotational movement of the tool about the central axis 42.
- the process is conducted for a suitable duration, as for example one minute, until the pad 36 is sufficiently flat and most of the deposited slurry particles are scraped from the pad.
- the tool 10 is removed from engagement with the pad 36, and additional wafers may be polished and their profiles periodically measured to assure the polishing pad is acceptably flat.
- a significant feature of the present invention is that the pad shaping surfaces 18 are discontinuous, having the form of a wheel with slots 30.
- the slotted wheel has less contact surface area of abrasive material than a continuous ring of the same width. Therefore, as the pad 36 moves relative to the abrasive material of the pad shaping tool 10, frictional force from the pad, which is proportional to contact surface area, is relatively less than that on a full wheel.
- a moment about the connector 32 is realized as a result of the frictional force that urges the tool 10 to a pivoted orientation, as seen in Fig. 4. When the tool 10 pivots, a leading edge 50 of the tool is pressed relatively harder into the pad 36 so that it more readily abrades pad material in a central annular region of the pad that passes underneath.
- the slotted wheel has less tendency than a full wheel to make the cross sectional profile of the polishing surface 44 concave. Because frictional force from the pad 36 is less than that for a full dressing wheel, it is believed that the magnitude of the moment is likewise reduced and the tool 10 is less strongly urged to pivot. The tool 10 stays more closely aligned with the pad 36 than full wheel tools, and there is less tendency to press and abrade the central annular region at a leading edge 50 of the tool.
- the slotted wheel configuration also is believed to have a different removal distribution pattern of pad material than a full wheel, which with the reduced moment tends to make the pad 36 more flat.
- the sizes of the pad shaping surfaces 18 of the slotted wheel tool 10 may be optimized to improve wafer flatness. After reconditioning, if the shape of the cross sectional profile of the polishing surface 44 of the pad 36 is concave, then too much tool pivoting is indicated.
- the pad shaping surface 18 should be reduced in size to reduce the contact surface area, frictional force, and moment. Accordingly, a portion of at least one of the pad shaping surfaces 18 of the tool is removed, thereby decreasing a size of said at least one pad shaping surface. The portion removed would preferably be located at an end of one or more pad shaping surfaces 18 to reduce the angular extent 26 and the arc segment length 28. The step can be repeated until the tool 10 produces pads 36 with flat profile.
- the pad shaping surface 18 should be increased in size to increase contact surface area, frictional force, and moment. Accordingly, the pad shaping surfaces 18 should be enlarged, by affixing additional portions or by starting with a new, full wheel tool and removing appropriately sized portions.
- the tool 10 may be used for many pads, both concave and convex. Its pad shaping surfaces 18 are properly sized to create a moment that pivots the tool 10 and favors concavity which balances any tendency to favor convexity so that the polishing pad 36 is made flat.
- the shape of the pad cross section to be obtained need not be flat. For instance, if an operator desires a concave or convex shape, the operator may select a tool 10 having a relatively larger or relatively smaller pad shaping surfaces 18 to control the resulting profile.
- the apparatus and process of the present invention reconditions a polishing surface 44 of a polishing pad 36, restoring a flat cross sectional profile and removing deposited slurry particles.
- the tool 10 evenly abrades the pad 36 across the polishing surface 44 and permits the same tool operating in the same way to be used for pads regardless of initial profile.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000607790A JP2002539962A (en) | 1999-03-31 | 2000-03-03 | Apparatus and method for reconditioning polishing pad |
EP00913735A EP1165287A1 (en) | 1999-03-31 | 2000-03-03 | Apparatus and process for reconditioning polishing pads |
KR1020017012385A KR20010108423A (en) | 1999-03-31 | 2000-03-03 | Apparatus and process for reconditioning polishing pads |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/282,391 US6120350A (en) | 1999-03-31 | 1999-03-31 | Process for reconditioning polishing pads |
US09/282,391 | 1999-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000058053A1 true WO2000058053A1 (en) | 2000-10-05 |
Family
ID=23081310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/005709 WO2000058053A1 (en) | 1999-03-31 | 2000-03-03 | Apparatus and process for reconditioning polishing pads |
Country Status (7)
Country | Link |
---|---|
US (1) | US6120350A (en) |
EP (1) | EP1165287A1 (en) |
JP (1) | JP2002539962A (en) |
KR (1) | KR20010108423A (en) |
CN (1) | CN1352587A (en) |
TW (1) | TW480208B (en) |
WO (1) | WO2000058053A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011056509A3 (en) * | 2009-10-26 | 2011-10-27 | Illinois Tool Works Inc. | Fusion bonded epoxy removal tool |
US8961077B2 (en) | 2009-10-26 | 2015-02-24 | Illlinois Tool Works Inc. | Severing and beveling tool |
US9636836B2 (en) | 2013-10-03 | 2017-05-02 | Illinois Tool Works Inc. | Pivotal tool support for a pipe machining apparatus |
JP2018067524A (en) * | 2016-10-14 | 2018-04-26 | Basf戸田バッテリーマテリアルズ合同会社 | Method for reducing amount of lithium remaining in positive electrode active material particles |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000024548A1 (en) * | 1998-10-28 | 2000-05-04 | Hitachi, Ltd. | Polishing apparatus and a semiconductor manufacturing method using the same |
US6302772B1 (en) * | 1999-04-01 | 2001-10-16 | Mitsubishi Materials Corporation | Apparatus and method for dressing a wafer polishing pad |
US6517419B1 (en) * | 1999-10-27 | 2003-02-11 | Strasbaugh | Shaping polishing pad for small head chemical mechanical planarization |
US6857942B1 (en) * | 2000-01-11 | 2005-02-22 | Taiwan Semiconductor Manufacturing Co., Ltd | Apparatus and method for pre-conditioning a conditioning disc |
US6343974B1 (en) * | 2000-06-26 | 2002-02-05 | International Business Machines Corporation | Real-time method for profiling and conditioning chemical-mechanical polishing pads |
US6692343B2 (en) * | 2000-09-13 | 2004-02-17 | A.L.M.T. Corp. | Superabrasive wheel for mirror finishing |
US6390902B1 (en) * | 2001-06-06 | 2002-05-21 | United Microelectronics Corp. | Multi-conditioner arrangement of a CMP system |
CN100439040C (en) * | 2004-09-02 | 2008-12-03 | 上海宏力半导体制造有限公司 | Polishing finishing device |
KR100822868B1 (en) * | 2007-04-04 | 2008-04-16 | 새솔다이아몬드공업 주식회사 | Diamond particles inspection method of a grinding tool using a pad smearing |
CN101459044B (en) * | 2007-12-13 | 2010-06-09 | 中芯国际集成电路制造(上海)有限公司 | Dishing phenomenon detection unit in chemical mechanical polishing, manufacturing method and detection method |
US8192248B2 (en) * | 2008-05-30 | 2012-06-05 | Memc Electronic Materials, Inc. | Semiconductor wafer polishing apparatus and method of polishing |
JP5504901B2 (en) * | 2010-01-13 | 2014-05-28 | 株式会社Sumco | Polishing pad shape correction method |
CN103659604B (en) * | 2012-09-20 | 2016-04-20 | 苏州赫瑞特电子专用设备科技有限公司 | A kind of abrasive disc degree correcting device |
JP6357260B2 (en) * | 2016-09-30 | 2018-07-11 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
CN109664179B (en) * | 2019-01-02 | 2021-05-04 | 中国科学院上海光学精密机械研究所 | Annular polishing machine |
CN110509132A (en) * | 2019-09-19 | 2019-11-29 | 福建北电新材料科技有限公司 | Crystal bar jig and crystal bar grinding method |
CN112975749A (en) * | 2019-12-17 | 2021-06-18 | 大量科技股份有限公司 | Method for instantly reconditioning polishing pad |
CN117718821A (en) * | 2024-02-07 | 2024-03-19 | 华海清科股份有限公司 | Wafer grinding post-processing system, device and method and wafer thinning equipment |
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JPS637270A (en) * | 1986-06-24 | 1988-01-13 | Brother Ind Ltd | Manufacture of connection parts of cast iron bond diamond grindstone |
WO1995018697A1 (en) * | 1994-01-04 | 1995-07-13 | Speedfam Corporation | Device for conditioning polishing pads |
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1999
- 1999-03-31 US US09/282,391 patent/US6120350A/en not_active Expired - Fee Related
-
2000
- 2000-03-03 KR KR1020017012385A patent/KR20010108423A/en not_active Application Discontinuation
- 2000-03-03 CN CN00805732A patent/CN1352587A/en active Pending
- 2000-03-03 JP JP2000607790A patent/JP2002539962A/en not_active Withdrawn
- 2000-03-03 WO PCT/US2000/005709 patent/WO2000058053A1/en not_active Application Discontinuation
- 2000-03-03 EP EP00913735A patent/EP1165287A1/en not_active Ceased
- 2000-04-12 TW TW089106092A patent/TW480208B/en not_active IP Right Cessation
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EP0803327A2 (en) * | 1996-04-26 | 1997-10-29 | MEMC Electronic Materials, Inc. | Apparatus and method for shaping polishing pads |
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PATENT ABSTRACTS OF JAPAN vol. 1998, no. 05 30 April 1998 (1998-04-30) * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011056509A3 (en) * | 2009-10-26 | 2011-10-27 | Illinois Tool Works Inc. | Fusion bonded epoxy removal tool |
US8961077B2 (en) | 2009-10-26 | 2015-02-24 | Illlinois Tool Works Inc. | Severing and beveling tool |
US9636836B2 (en) | 2013-10-03 | 2017-05-02 | Illinois Tool Works Inc. | Pivotal tool support for a pipe machining apparatus |
JP2018067524A (en) * | 2016-10-14 | 2018-04-26 | Basf戸田バッテリーマテリアルズ合同会社 | Method for reducing amount of lithium remaining in positive electrode active material particles |
Also Published As
Publication number | Publication date |
---|---|
KR20010108423A (en) | 2001-12-07 |
CN1352587A (en) | 2002-06-05 |
TW480208B (en) | 2002-03-21 |
JP2002539962A (en) | 2002-11-26 |
EP1165287A1 (en) | 2002-01-02 |
US6120350A (en) | 2000-09-19 |
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