WO2000047361A1 - Laser processing power output stabilization - Google Patents
Laser processing power output stabilization Download PDFInfo
- Publication number
- WO2000047361A1 WO2000047361A1 PCT/US2000/003484 US0003484W WO0047361A1 WO 2000047361 A1 WO2000047361 A1 WO 2000047361A1 US 0003484 W US0003484 W US 0003484W WO 0047361 A1 WO0047361 A1 WO 0047361A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pulse
- workpiece
- laser
- processing
- mode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70041—Production of exposure light, i.e. light sources by pulsed sources, e.g. multiplexing, pulse duration, interval control or intensity control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
- Laser Surgery Devices (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002362173A CA2362173C (en) | 1999-02-10 | 2000-02-10 | Laser processing power output stabilization |
JP2000598307A JP5033281B2 (en) | 1999-02-10 | 2000-02-10 | Laser processing power output stabilization |
DE60023112T DE60023112T2 (en) | 1999-02-10 | 2000-02-10 | STABILIZATION OF A LASER PROCESSING POWER END |
AU39990/00A AU3999000A (en) | 1999-02-10 | 2000-02-10 | Laser processing power output stabilization |
AT00919278T ATE306352T1 (en) | 1999-02-10 | 2000-02-10 | STABILIZATION OF A LASER PROCESSING POWER FINAL STAGE |
EP00919278A EP1150797B1 (en) | 1999-02-10 | 2000-02-10 | Laser processing power output stabilization |
HK02103189.3A HK1043557B (en) | 1999-02-10 | 2002-04-29 | Laser processing power output stabilization |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/248,071 US6172325B1 (en) | 1999-02-10 | 1999-02-10 | Laser processing power output stabilization apparatus and method employing processing position feedback |
US09/248,071 | 1999-02-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000047361A1 true WO2000047361A1 (en) | 2000-08-17 |
Family
ID=22937553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/003484 WO2000047361A1 (en) | 1999-02-10 | 2000-02-10 | Laser processing power output stabilization |
Country Status (11)
Country | Link |
---|---|
US (1) | US6172325B1 (en) |
EP (1) | EP1150797B1 (en) |
JP (1) | JP5033281B2 (en) |
KR (1) | KR100589496B1 (en) |
CN (1) | CN1158161C (en) |
AT (1) | ATE306352T1 (en) |
AU (1) | AU3999000A (en) |
CA (1) | CA2362173C (en) |
DE (1) | DE60023112T2 (en) |
HK (1) | HK1043557B (en) |
WO (1) | WO2000047361A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007124828A1 (en) * | 2006-04-27 | 2007-11-08 | Carl Zeiss Industrielle Messtechnik Gmbh | Method and device for the positionally accurate triggering of an optionally activated machine part |
WO2010138897A2 (en) * | 2009-05-28 | 2010-12-02 | Electro Scientific Industries, Inc. | Acousto-optic deflector applications in laser processing of dielectric or other materials |
US7846847B2 (en) | 2004-03-29 | 2010-12-07 | J.P. Sercel Associates Inc. | Method of separating layers of material |
WO2014145305A1 (en) * | 2013-03-15 | 2014-09-18 | Electro Scientific Industries, Inc. | Laser emission-based control of beam positioner |
US8847113B2 (en) | 2010-10-22 | 2014-09-30 | Electro Scientific Industries, Inc. | Laser processing systems and methods for beam dithering and skiving |
US8986497B2 (en) | 2009-12-07 | 2015-03-24 | Ipg Photonics Corporation | Laser lift off systems and methods |
US9669613B2 (en) | 2010-12-07 | 2017-06-06 | Ipg Photonics Corporation | Laser lift off systems and methods that overlap irradiation zones to provide multiple pulses of laser irradiation per location at an interface between layers to be separated |
Families Citing this family (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5998759A (en) | 1996-12-24 | 1999-12-07 | General Scanning, Inc. | Laser processing |
US6339604B1 (en) | 1998-06-12 | 2002-01-15 | General Scanning, Inc. | Pulse control in laser systems |
US6144118A (en) | 1998-09-18 | 2000-11-07 | General Scanning, Inc. | High-speed precision positioning apparatus |
US6300590B1 (en) * | 1998-12-16 | 2001-10-09 | General Scanning, Inc. | Laser processing |
JP2000263840A (en) * | 1999-03-11 | 2000-09-26 | Hitachi Ltd | Laser printing method and laser printing apparatus |
US7838794B2 (en) | 1999-12-28 | 2010-11-23 | Gsi Group Corporation | Laser-based method and system for removing one or more target link structures |
US7723642B2 (en) | 1999-12-28 | 2010-05-25 | Gsi Group Corporation | Laser-based system for memory link processing with picosecond lasers |
US20060141681A1 (en) * | 2000-01-10 | 2006-06-29 | Yunlong Sun | Processing a memory link with a set of at least two laser pulses |
US20030222324A1 (en) * | 2000-01-10 | 2003-12-04 | Yunlong Sun | Laser systems for passivation or link processing with a set of laser pulses |
US7671295B2 (en) * | 2000-01-10 | 2010-03-02 | Electro Scientific Industries, Inc. | Processing a memory link with a set of at least two laser pulses |
US6483071B1 (en) * | 2000-05-16 | 2002-11-19 | General Scanning Inc. | Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
KR100773070B1 (en) * | 2000-07-12 | 2007-11-02 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Laser system and method for single pulse severing of ?? fuses |
US8497450B2 (en) * | 2001-02-16 | 2013-07-30 | Electro Scientific Industries, Inc. | On-the fly laser beam path dithering for enhancing throughput |
US20070173075A1 (en) * | 2001-03-29 | 2007-07-26 | Joohan Lee | Laser-based method and system for processing a multi-material device having conductive link structures |
US6639177B2 (en) | 2001-03-29 | 2003-10-28 | Gsi Lumonics Corporation | Method and system for processing one or more microstructures of a multi-material device |
EP1374139B1 (en) * | 2001-03-29 | 2011-05-04 | LASX Industries, Inc. | Controller for a laser using predictive models ofa laser beam motion system |
US6973355B2 (en) * | 2001-04-25 | 2005-12-06 | Tisue J Gilbert | Accurate positioner suitable for sequential agile tuning of pulse burst and CW lasers |
US6753947B2 (en) | 2001-05-10 | 2004-06-22 | Ultratech Stepper, Inc. | Lithography system and method for device manufacture |
US6951995B2 (en) | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
US7099073B2 (en) * | 2002-09-27 | 2006-08-29 | Lucent Technologies Inc. | Optical frequency-converters based on group III-nitrides |
US6986693B2 (en) | 2003-03-26 | 2006-01-17 | Lucent Technologies Inc. | Group III-nitride layers with patterned surfaces |
US6947454B2 (en) * | 2003-06-30 | 2005-09-20 | Electro Scientific Industries, Inc. | Laser pulse picking employing controlled AOM loading |
US7616669B2 (en) | 2003-06-30 | 2009-11-10 | Electro Scientific Industries, Inc. | High energy pulse suppression method |
JP4231349B2 (en) * | 2003-07-02 | 2009-02-25 | 株式会社ディスコ | Laser processing method and laser processing apparatus |
US7027199B2 (en) * | 2004-06-07 | 2006-04-11 | Electro Scientific Industries, Inc. | AOM modulation techniques for facilitating pulse-to-pulse energy stability in laser systems |
US8148211B2 (en) * | 2004-06-18 | 2012-04-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously |
US7923306B2 (en) * | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
US8383982B2 (en) * | 2004-06-18 | 2013-02-26 | Electro Scientific Industries, Inc. | Methods and systems for semiconductor structure processing using multiple laser beam spots |
US7935941B2 (en) * | 2004-06-18 | 2011-05-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures |
US20060000814A1 (en) * | 2004-06-30 | 2006-01-05 | Bo Gu | Laser-based method and system for processing targeted surface material and article produced thereby |
US7372878B2 (en) * | 2004-08-06 | 2008-05-13 | Electro Scientific Industries, Inc. | Method and system for preventing excessive energy build-up in a laser cavity |
US7227098B2 (en) * | 2004-08-06 | 2007-06-05 | Electro Scientific Industries, Inc. | Method and system for decreasing the effective pulse repetition frequency of a laser |
US20060114948A1 (en) * | 2004-11-29 | 2006-06-01 | Lo Ho W | Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams |
US20060151704A1 (en) * | 2004-12-30 | 2006-07-13 | Cordingley James J | Laser-based material processing methods, system and subsystem for use therein for precision energy control |
US20060191884A1 (en) * | 2005-01-21 | 2006-08-31 | Johnson Shepard D | High-speed, precise, laser-based material processing method and system |
US7363180B2 (en) * | 2005-02-15 | 2008-04-22 | Electro Scientific Industries, Inc. | Method for correcting systematic errors in a laser processing system |
US7315038B2 (en) | 2005-08-26 | 2008-01-01 | Electro Scientific Industries, Inc. | Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target |
US7297972B2 (en) | 2005-08-26 | 2007-11-20 | Electro Scientific Industries, Inc. | Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target |
DE102006006582B4 (en) * | 2006-02-13 | 2009-06-10 | Jenoptik Laser, Optik, Systeme Gmbh | Laser and method for generating pulsed laser radiation |
US7952109B2 (en) * | 2006-07-10 | 2011-05-31 | Alcatel-Lucent Usa Inc. | Light-emitting crystal structures |
US7266257B1 (en) | 2006-07-12 | 2007-09-04 | Lucent Technologies Inc. | Reducing crosstalk in free-space optical communications |
US8084706B2 (en) * | 2006-07-20 | 2011-12-27 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
CN101511524A (en) * | 2006-07-20 | 2009-08-19 | 杰斯集团公司 | Systems and methods for laser processing during periods having non-constant velocities |
JP4917382B2 (en) * | 2006-08-09 | 2012-04-18 | 株式会社ディスコ | Laser beam irradiation device and laser processing machine |
US7732731B2 (en) * | 2006-09-15 | 2010-06-08 | Gsi Group Corporation | Method and system for laser processing targets of different types on a workpiece |
WO2008091898A1 (en) | 2007-01-23 | 2008-07-31 | Imra America, Inc. | Ultrashort laser micro-texture printing |
EP2252426A4 (en) | 2008-03-21 | 2014-08-06 | Imra America Inc | Laser-based material processing methods and systems |
US8178818B2 (en) * | 2008-03-31 | 2012-05-15 | Electro Scientific Industries, Inc. | Photonic milling using dynamic beam arrays |
US7982160B2 (en) * | 2008-03-31 | 2011-07-19 | Electro Scientific Industries, Inc. | Photonic clock stabilized laser comb processing |
CA2727985C (en) * | 2008-06-27 | 2015-02-10 | Institut National D'optique | Digital laser pulse shaping module and system |
US8238390B2 (en) * | 2008-06-27 | 2012-08-07 | Institut National D'optique | Methods for stabilizing the output of a pulsed laser system having pulse shaping capabilities |
JP4612733B2 (en) * | 2008-12-24 | 2011-01-12 | 東芝機械株式会社 | Pulse laser processing equipment |
JP5148717B2 (en) * | 2009-08-03 | 2013-02-20 | 東芝機械株式会社 | Pulse laser processing apparatus and pulse laser processing method |
JP5620669B2 (en) * | 2009-10-26 | 2014-11-05 | 東芝機械株式会社 | Laser dicing method and laser dicing apparatus |
US20110210105A1 (en) * | 2009-12-30 | 2011-09-01 | Gsi Group Corporation | Link processing with high speed beam deflection |
JP5452247B2 (en) * | 2010-01-21 | 2014-03-26 | 東芝機械株式会社 | Laser dicing equipment |
CN102905839B (en) | 2010-03-30 | 2016-03-09 | Imra美国公司 | Based on the materials processing apparatus and method of laser |
US8263903B2 (en) | 2010-05-18 | 2012-09-11 | Institut National D'optique | Method for stablizing an output of a pulsed laser system using pulse shaping |
DE112012002844T5 (en) | 2011-07-05 | 2014-04-24 | Electronic Scientific Industries, Inc. | Method for laser processing with a thermally stabilized acousto-optical beam deflector and thermally stabilized high-speed laser processing system |
JP5140198B1 (en) | 2011-07-27 | 2013-02-06 | 東芝機械株式会社 | Laser dicing method |
JP2014011358A (en) | 2012-06-29 | 2014-01-20 | Toshiba Mach Co Ltd | Laser dicing method |
US20180207748A1 (en) * | 2017-01-23 | 2018-07-26 | Lumentum Operations Llc | Machining processes using a random trigger feature for an ultrashort pulse laser |
CN111266741A (en) * | 2018-11-19 | 2020-06-12 | 深圳市圭华智能科技有限公司 | Laser processing system and laser processing method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5041716A (en) * | 1989-09-29 | 1991-08-20 | Nec Corporation | Laser machining device comprising an acousto-optic modulator unit |
US5453594A (en) * | 1993-10-06 | 1995-09-26 | Electro Scientific Industries, Inc. | Radiation beam position and emission coordination system |
US5590141A (en) * | 1992-04-24 | 1996-12-31 | Electro Scientific Industries, Inc. | Method and apparatus for generating and employing a high density of excited ions in a lasant |
US5751585A (en) * | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61226198A (en) | 1985-03-29 | 1986-10-08 | Mitsubishi Electric Corp | Laser beam machining control device |
JPH03238184A (en) | 1990-02-15 | 1991-10-23 | Nec Corp | Laser beam machining method |
JPH04283977A (en) | 1991-03-12 | 1992-10-08 | Fuji Photo Film Co Ltd | Laser diode pumping solid laser |
US5260963A (en) | 1992-04-24 | 1993-11-09 | Electro Scientific Industries, Inc. | Method and apparatus for efficient operationof a solid-state laser optically pumped by an unstable resonator semiconductor laser |
US5317447A (en) | 1992-04-24 | 1994-05-31 | Electro Scientific Industries, Inc. | High-power, compact, diode-pumped, tunable laser |
US5323414A (en) | 1992-04-24 | 1994-06-21 | Electro Scientific Industries, Inc. | Laser system and method employing a nonimaging concentrator |
US5265114C1 (en) | 1992-09-10 | 2001-08-21 | Electro Scient Ind Inc | System and method for selectively laser processing a target structure of one or more materials of a multimaterial multilayer device |
JPH10305384A (en) * | 1997-05-02 | 1998-11-17 | Nec Corp | Laser processing apparatus |
-
1999
- 1999-02-10 US US09/248,071 patent/US6172325B1/en not_active Expired - Lifetime
-
2000
- 2000-02-10 AU AU39990/00A patent/AU3999000A/en not_active Abandoned
- 2000-02-10 KR KR1020017009935A patent/KR100589496B1/en active IP Right Grant
- 2000-02-10 EP EP00919278A patent/EP1150797B1/en not_active Expired - Lifetime
- 2000-02-10 JP JP2000598307A patent/JP5033281B2/en not_active Expired - Lifetime
- 2000-02-10 AT AT00919278T patent/ATE306352T1/en not_active IP Right Cessation
- 2000-02-10 CA CA002362173A patent/CA2362173C/en not_active Expired - Lifetime
- 2000-02-10 DE DE60023112T patent/DE60023112T2/en not_active Expired - Lifetime
- 2000-02-10 WO PCT/US2000/003484 patent/WO2000047361A1/en active IP Right Grant
- 2000-02-10 CN CNB008036381A patent/CN1158161C/en not_active Expired - Lifetime
-
2002
- 2002-04-29 HK HK02103189.3A patent/HK1043557B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5041716A (en) * | 1989-09-29 | 1991-08-20 | Nec Corporation | Laser machining device comprising an acousto-optic modulator unit |
US5590141A (en) * | 1992-04-24 | 1996-12-31 | Electro Scientific Industries, Inc. | Method and apparatus for generating and employing a high density of excited ions in a lasant |
US5453594A (en) * | 1993-10-06 | 1995-09-26 | Electro Scientific Industries, Inc. | Radiation beam position and emission coordination system |
US5751585A (en) * | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7846847B2 (en) | 2004-03-29 | 2010-12-07 | J.P. Sercel Associates Inc. | Method of separating layers of material |
WO2007124828A1 (en) * | 2006-04-27 | 2007-11-08 | Carl Zeiss Industrielle Messtechnik Gmbh | Method and device for the positionally accurate triggering of an optionally activated machine part |
US8115440B2 (en) | 2006-04-27 | 2012-02-14 | Carl Zeiss Industrielle Messtechnik Gmbh | Method and apparatus for position-accurate triggering of a machine part |
WO2010138897A2 (en) * | 2009-05-28 | 2010-12-02 | Electro Scientific Industries, Inc. | Acousto-optic deflector applications in laser processing of dielectric or other materials |
WO2010138897A3 (en) * | 2009-05-28 | 2011-03-24 | Electro Scientific Industries, Inc. | Acousto-optic deflector applications in laser processing of dielectric or other materials |
US8288679B2 (en) | 2009-05-28 | 2012-10-16 | Electro Scientific Industries, Inc. | Laser processing systems using through-the-lens alignment of a laser beam with a target feature |
US8404998B2 (en) | 2009-05-28 | 2013-03-26 | Electro Scientific Industries, Inc. | Acousto-optic deflector applications in laser processing of dielectric or other materials |
US11738405B2 (en) | 2009-05-28 | 2023-08-29 | Electro Scientific Industries, Inc. | Acousto-optic deflector applications in laser processing of dielectric or other materials |
US10391585B2 (en) | 2009-05-28 | 2019-08-27 | Electro Scientific Industries, Inc | Acousto-optic deflector applications in laser processing of dielectric or other materials |
US10297503B2 (en) | 2009-12-07 | 2019-05-21 | Ipg Photonics Corporation | Laser lift off systems and methods |
US8986497B2 (en) | 2009-12-07 | 2015-03-24 | Ipg Photonics Corporation | Laser lift off systems and methods |
US10974494B2 (en) | 2009-12-07 | 2021-04-13 | Ipg Photonics Corporation | Laser lift off systems and methods that overlap irradiation zones to provide multiple pulses of laser irradiation per location at an interface between layers to be separated |
US11239116B2 (en) | 2009-12-07 | 2022-02-01 | Ipg Photonics Corporation | Laser lift off systems and methods |
US8847113B2 (en) | 2010-10-22 | 2014-09-30 | Electro Scientific Industries, Inc. | Laser processing systems and methods for beam dithering and skiving |
US9669613B2 (en) | 2010-12-07 | 2017-06-06 | Ipg Photonics Corporation | Laser lift off systems and methods that overlap irradiation zones to provide multiple pulses of laser irradiation per location at an interface between layers to be separated |
US9527159B2 (en) | 2013-03-15 | 2016-12-27 | Electro Scientific Industries, Inc. | Laser emission-based control of beam positioner |
WO2014145305A1 (en) * | 2013-03-15 | 2014-09-18 | Electro Scientific Industries, Inc. | Laser emission-based control of beam positioner |
Also Published As
Publication number | Publication date |
---|---|
HK1043557A1 (en) | 2002-09-20 |
JP2002536188A (en) | 2002-10-29 |
DE60023112D1 (en) | 2006-02-23 |
CA2362173C (en) | 2007-03-27 |
KR20010101803A (en) | 2001-11-14 |
ATE306352T1 (en) | 2005-10-15 |
DE60023112T2 (en) | 2006-07-20 |
US6172325B1 (en) | 2001-01-09 |
CN1158161C (en) | 2004-07-21 |
CN1339995A (en) | 2002-03-13 |
EP1150797A1 (en) | 2001-11-07 |
EP1150797B1 (en) | 2005-10-12 |
AU3999000A (en) | 2000-08-29 |
KR100589496B1 (en) | 2006-06-14 |
JP5033281B2 (en) | 2012-09-26 |
CA2362173A1 (en) | 2000-08-17 |
HK1043557B (en) | 2006-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1150797B1 (en) | Laser processing power output stabilization | |
US6947454B2 (en) | Laser pulse picking employing controlled AOM loading | |
US7616669B2 (en) | High energy pulse suppression method | |
US7608800B2 (en) | Methods and systems for decreasing the effective pulse repetition of a laser | |
TWI583477B (en) | ;aser machining system and method employing laser emission-based control of beam positioner | |
JP5603324B2 (en) | Laser pulse equalization system and method | |
US6188704B1 (en) | Diode-pumped laser drive | |
US7372878B2 (en) | Method and system for preventing excessive energy build-up in a laser cavity | |
JP2002062512A (en) | Method and controller for controlling pulse width of laser pulse | |
JP2022174903A (en) | Laser machining device, laser machining method, program, and storage medium | |
JPH02101788A (en) | Excitation control equipment for laser amplifying equipment | |
JP2001259871A (en) | Laser beam machining device and method | |
JPH0628244B2 (en) | Excitation control device for laser amplifier device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 00803638.1 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CR CU CZ DE DK DM EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2000919278 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2362173 Country of ref document: CA Ref document number: 2362173 Country of ref document: CA Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020017009935 Country of ref document: KR |
|
ENP | Entry into the national phase |
Ref document number: 2000 598307 Country of ref document: JP Kind code of ref document: A |
|
WWP | Wipo information: published in national office |
Ref document number: 2000919278 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020017009935 Country of ref document: KR |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
WWG | Wipo information: grant in national office |
Ref document number: 2000919278 Country of ref document: EP |
|
WWG | Wipo information: grant in national office |
Ref document number: 1020017009935 Country of ref document: KR |