WO1999044172A1 - Electronic device with contactless electronic memory, and method for making same - Google Patents

Electronic device with contactless electronic memory, and method for making same Download PDF

Info

Publication number
WO1999044172A1
WO1999044172A1 PCT/FR1999/000291 FR9900291W WO9944172A1 WO 1999044172 A1 WO1999044172 A1 WO 1999044172A1 FR 9900291 W FR9900291 W FR 9900291W WO 9944172 A1 WO9944172 A1 WO 9944172A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
sheet
rieure
caract
ris
inf
Prior art date
Application number
PCT/FR1999/000291
Other languages
French (fr)
Inventor
Laurent Oddou
Ray Freeman
Stéphane AYALA
Michael Zafrany
Philippe Patrice
Gérard BOURNEIX
David Martin
Original Assignee
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01087Francium [Fr]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]

Abstract

The invention concerns a contactless electronic device (10) such as a card, a label, a ticket or a token, comprising at least an electronic microcircuit (20) arranged in the thickness of a rigid or semirigid support and comprising pads (26) connected to an interface antenna (24) arranged in the thickness of the support, the latter comprising at least two opposite, lower (12) and upper (14), protective sheets. The invention is characterised in that it comprises a stack: of a lower protective sheet (12) whereof the inner face (22) bears at least one electronic microcircuit and at least one interface antenna (24); of an intermediate bonding sheet (14) whereof the two opposite faces lower and upper are provided with adhesive; and of an upper protective sheet (16).

Description

electronic memory contactless electronic device, and method of fabricating such a device

The present invention relates to a method of manufacturing an electronic device without contact flexible and pliable thin thickness (10), such as a card, a label, a ticket or token, comprising at least one electronic microcircuit (20) is arranged in the thickness of a support and which comprises contact pieces connected to an antenna (24) arranged in the interface thickness of the support, the latter comprising at least two opposed sheets, bottom (12) and upper (16 ), protection, said method comprising the following consecutive steps are many known examples of such electronic devices, commonly smart cards known, which are either rigid cards whose support is made of plastic or labels, called "tags e "for labeling of consumer products which are disposable, that is to say, which are intended to be stuck once on a product and its t essentially constituted by a sheet of paper.

There is thus a need for an electronic device of the type mentioned above, for example a smart card contact thin thickness (thickness of less than for example about 400 .mu.m or 280 .mu.m) and flexible or foldable in two, which can be used several times, the cost is reduced particularly as its thickness to be used in many applications using an electronic memory chip for which it is now impossible for cost reasons and / or thickness support, to use maps, 2 labels, tickets or electronic memory chips without contact.

There is also a need for stronger devices allowing mishandling even a few folds in half without affecting operation. This is the case for example of metro tickets.

Alternatively, there is a need for devices without very fine touch and excellent surface may provide support for high quality printing. This is particularly true of playing card or identity card.

For this purpose, the invention proposes a method of manufacturing an electronic device of the type mentioned above, comprising the following consecutive steps: a) providing a bottom sheet of protection: ai) putting at least one electronic microcircuit on the inner face of the lower sheet; a2) providing at least one interface antenna on the inner face of the bottom sheet, in particular by screen printing; a3) electrically connecting pads of the electronic microcircuit in the antenna interface; b) providing a stack by stacking the lower protective sheet, an intermediate sheet bonding the two opposed lower and upper faces are provided with glue, and an upper protective sheet; c) assembling the three superimposed sheets by compressing them.

According to other features of the method according to the invention: - step c) assembly consists of a hot rolling operation; 3

- the intermediate sheet bonding has a recess in line with the electronic microcircuit;

- the intermediate sheet bonding is a hot melt adhesive sheet; - the intermediate sheet bonding is a sheet of paper, the two opposed lower and upper faces are provided with a hot-melt adhesive layer;

- during step a) embodiment of the lower protective sheet, operations ai), a2) and a3) are carried out successively;

- at least one protective sheet is made of paper.

- the method comprises an additional step of printing on one and / or the other of the external faces of the two sheets of upper and lower protection of the support. Preferably the printing is carried out before the transfer of the antenna and / or the chip.

- it comprises an additional step of cutting the electronic device, according to a predetermined contour map, label, ticket or token; are produced simultaneously more electronic devices from cover sheets and a bonding sheet in rolls, and the electronic devices are separated in the further step of cutting. The invention also relates to a contactless electronic device of the type mentioned above, characterized in that it comprises a stack:

- a lower cover sheet which ia inner side carries at least one electronic microcircuit and at least one antenna interface;

- an intermediate sheet bonding the two opposed lower and upper faces are provided with glue; 4

- and an upper protective sheet.

According to other characteristics of the device according to the invention:

- the intermediate sheet bonding has a recess in line with the electronic microcircuit;

- the intermediate sheet bonding is a hot melt adhesive sheet;

- the intermediate sheet bonding is a sheet of paper, the two opposed lower and upper faces are provided with a hot-melt adhesive layer;

- at least one protective sheet is made of paper.

- The device has a thickness less than 400 .mu.m or 280 .mu.m. - the sheet supporting the antenna and the chip (the chip) has a thickness less than or equal to 75 .mu.m.

Other features and advantages of the invention will emerge on reading the detailed description which follows for the understanding of which reference is made to the accompanying drawings in which:

- Figure 1 is a longitudinal sectional schematic view of a first embodiment of an IC card performed in accordance with teachings of the invention and on which the stack of three sheets which constitute it is illustrated preoperatively hot rolling;

- Figure 2 is a similar view to that of Figure 1 which illustrates a second embodiment of a smart card in compliance with the teachings of the invention;

- Figures 3A to 3C schematically illustrate the three operations for achieving a lower cover sheet of paper for an electronic device according to the teachings of the invention; and 5

- Figure 4 is a schematic view illustrating the production of the stack by superimposition of the three constituent sheets of the support of a smart card in compliance with the teachings of the invention. In the following description, elements identical, similar or analogous will be designated by the same reference numbers, and in the description and claims, the terms lower, upper, vertical, etc. will be used without limitation with reference to figures for ease of explanation.

By definition, a flexible means, the same mechanical property to that of playing cards.

Where appropriate, the product of the invention is designed so as to be handled as a subway ticket, wound or bent by hand without altering its transceiver operation.

There is shown in Figure 1 a smart card 10 which is constituted by a vertical stack of three sheets 12, 14 and 16. The lower sheet 1 2 is a first sheet of paper whose thickness is for example equal to 75 microns made of paper "Maine" sold by Arjo Wiggins-society.

The lower paper sheet 12 constitutes a lower cover sheet of the card 10 while the top sheet 16, of the same constitution and the same thickness as the lower sheet 12 constitutes an upper cover sheet of paper of the card 10.

The intermediate sheet 14 is a mutual bonding sheet of the two sheets 12 and less than 16, which in this first embodiment, is a sheet or hot-melt adhesive film, also called "hot melt" sheet with a 6-thickness of 100 Polyconcept microns marketed by the company. This hot melt sheet has the advantage of being soft at room temperature and does not damage the chip during stacking. According to a feature of the invention, when the intermediate sheet bonding 14 is hard as paper, it may optionally have a recess or window 18 which is arranged vertically in an electronic microcircuit 20, or chip, placed on the internal upper face 22 of the backsheet 12.

The electronic microcircuit 20 is connected to an interface 24 antenna which, according to a known technique, is for example produced by screen printing on the upper face 22 by means of a conductive ink based on silver which is for example the ink E520 sold by Dupont de Nemours.

The electronic microcircuit 20 is for example a "Chip Mifare Amtel AT 8100" whose thickness is reduced to for example 70 microns. It can be fixed on the face 22, for example by gluing.

The electrical connection pad of the electronic chip or electronic module 20 to interface 24 antenna is carried out, according to known technique, preferably by cords 26 of conductive adhesive which is for example glue sold under the name "Ablestick Silver Glue ".

The second embodiment illustrated in Figure 2 differs from the first embodiment which has just been described by the intermediate sheet of the structure of bonding 14. Indeed, the bonding sheet 14 is constituted by an intermediate sheet of paper 14A the two opposite external faces are coated with a layer of glue 7

melt 14B, the composite which thus constitutes the bonding intermediate sheet 14 being interposed between the sheets of less than 12 and greater than 1 6 paper protection in the same manner as the bonding sheet 14 of Figure 1 which consists solely of a film of hot melt glue. We will now describe an example of a method of manufacturing cards 1 0 illustrated in Figure 1 or Figure 2.

In order to provide an industrial method for manufacture in large series of electronic devices, such as cards 10, a plurality of devices are produced simultaneously and / or file taking advantage particularly for the three sheets 12, 14 and 16 to strips or continuous rolls. It should firstly realize the lower sheets 12 of paper protection.

For this purpose, as illustrated in Figure 3A, one starts with a sheet of paper 12 on the upper face 22 of which is bonded, for each electronic device to be produced, an electronic microcircuit or module 20.

Then, as illustrated in FIG 3B, the antenna 24 is carried out, preferably by screen printing on the upper surface 22. Alternatively, one can achieve the previously antenna fixing and module connection. Finally, as shown in FIG 3C, there is provided electrical connections or connections of electronic microcircuits 20 to the antennas 24 by cords deposit 26 of conductive adhesive.

Thus, at the end of the operation illustrated in FIG 3C, there is provided a strip or a roll of a lower paper sheet 12 which must then be combined by stacking to the other sheets 14 and 16. 8

This next step is illustrated in Figure 4 in which schematically is shown in exploded perspective stacking of the backsheet 12 previously produced, an intermediate sheet bonding 14 into which has been, where appropriate, carried out prior windows or cut-outs 1 8, and a top sheet 16 of paper backing.

The stack or sandwich thus formed is then, in a subsequent step, not shown in the figures, assembled by hot pressing the superposed three sheets 12, 14 to 1 6, for example in a rolling operation to hot, that is to say at a temperature to cause melting of the hot melt glue constituting itself the intermediate sheet 14 (Figure 1) or component 14B layers of glue of the intermediate sheet bonding 14 (Figure

2).

This rolling operation, also called lamifiage, allows to permanently associate the three sheets of the stack and to reduce the total thickness of the electronic device thus produced to a value below or equal to 260 microns.

During the rolling operation, the presence of a window 18 to the right of each electronic microcircuit 20 avoids damaging them.

In order to ensure the matching of the windows 18 with electronic microcircuits 20, it is of course necessary to provide indexing means of rollers or bands of the sheets 12 and 14.

After the step of assembling by hot rolling, there is a band or a roller in which the electronic devices, whether cards, labels, tickets or chips, must then be cut 9 by known means, for example using a technique to cookie cutter.

In an additional step, prior to or after the cutting of electronic devices, it is of course possible to print and / or the other of the outer faces of the sheets 12 and less than 16 paper protection.

The invention thus provides electronic devices to electronic memory contactless reduced cost and reduced thickness to replace other products with identification means such as for example flexible tickets with a magnetic stripe or code bar, these new electronic devices being more biodegradable. The invention is not limited to the embodiments and to the method just described.

The different operations possible in particular to achieve the realization of the bottom sheet of protective paper 12 provided with the electronic chip 20 and antenna 24 may be made using other known technologies, the antenna can for example be carried out in first and connecting the electronic microcircuit being performed automatically during the installation of the latter with its contact conductive pads turned towards the upper face 22 and placed directly on the conductive sections of the antenna 24 (the "Flip Chip").

Connecting an electronic microcircuit 20 to the antenna 24 could be produced using a technique of wire bonding or wire bonding ( "Wire Bonding") but would be more fragile and bulky in thickness. 10

The presence of the hot melt adhesive, regardless of the structure of the intermediate sheet bonding 14, avoids to use a coating enclosure ( "potting") of protecting the electronic microcircuit and its connections 20 using a resin .

The nature of the hot melt adhesive used can also be such that it is slightly tacky to the cold-contact so as to provide a preassembly of the stack of three sheets prior to the hot rolling operation. The protective sheet of paper (12, 16) and the sheet 14 may be also made of a polymer, especially among those commonly used in the field of smart cards (PVC, PE, PP).

These sheets can also be made based on cellulose charged polymer to improve some of its properties (seal holding mechanical ...).

The invention need to bring several parameters. Beyond the use of small chips (less than 70 .mu.m) and fine protection sheets, it was necessary to use preferably a hot melt or heat fusible intermediate layer called "hot melt" for the assembly of the together. This layer due to its ductility cold has the advantage of not damaging the silicon chip coming directly in contact during rolling. Incidentally, a course in the intermediate layer is not essential.

The use of hot rolling with smooth slabs can improve the state of initial surface protection films. It is possible to use sheets of paper more economical than some sheets aforementioned polymer. 11

For the production of the antenna, it has been preferred to use screen printing. Indeed, many tests with engraving (aluminum, copper ...) on paper sheets of the paper show chemical alterations that result in corrugations and yellowing thereof.

On the other hand, it is impossible to pre-print the protective sheet prior to completion of the printing by antenna (the benefit of being able to control the printing and to avoid waste after assembly of the chip). Another problem may arise in the use of screen printing on thin protective sheets including paper or polymer in the absence of special precautions. This is the occurrence of surface undulations resulting from the drying of the ink. This problem and the solution are described in the patent application FR 3734 of 97/1 0/97 03/1. They are included by reference in the method of the invention to produce devices having excellent surface quality (no corrugation).

Screen printing as requested above has the advantage of producing the antenna tracks the precise outline, good conductivity (silver particles). The ink being polymer base and partially dried according to the method described in the above, the device may be repeatedly bent by hand 5 times for example, without damage to the antenna.

In addition, the use of a screen-printed antenna loaded money facilitates cost the antenna connection to the chip by a connecting element below compared to the use of an antenna made by etching.

The connection member is preferably either a conductive adhesive bead charged money chip 12 being attached to the area is a conductive adhesive point, the chip being attached upside down (flip-chip).

These connections have compared to welded connections son type (wire bonding), the advantage of being thin and more resistant to mechanical stress.

Claims

1. Procédé of manufacturing a device without électronique flexible and pliable thin épaisseur contact (10), such as a card, a étiquette, a ticket or token, comprising at électronique least one microcircuit (20) which is agencé in épaisseur a support and which comprises reliés pads à an antenna (24) agencée interface in the épaisseur the support, the latter comprising at least two sheets opposées, inférieure (12) and supérieure (16), protection, said procédé comprising the étapes rec écutives following: a) a réaliser inférieure sheet (12) of protection by: ai) putting at least one électronique microcircuit (20) on the inner face (22) of the sheet infé higher; a2) réalisant at least one (24) interface antenna on the inner face (22) of the inférieure sheet (12), particularly by sérigraphie; a3) connecting électriquement (26) pads of the microcircuit électronique (20) à the interface antenna (24); b) a stack réaliser by superimposing the inférieure sheet (12) for protection, a intermédiaire sheet (14, 14A, 14B) bonding the two faces opposées inférieure and supérieure are provided with glue, and a supérieure sheet (16) of protection; c) assembling the three superposées sheets (12, 14, 16) by compressing them.
2. Procédé according to claim 1, caractérisé in that the étape c) assembly consists of a hot rolling à opération.
3. Procédé according to any one of claims précédentes, caractérisé in that the bonding intermédiaire sheet (14) comprises a évidement (18 ) to the right of électronique microcircuit (20). 14
4. Procédé according to any one of claims 1 à 3 caractérisé in that the bonding intermédiaire sheet (14) is a hot melt adhesive sheet.
5. Procédé according to any one of claims 1 à 3 caractérisé in that the sheet bonding intermédiaire
(14) is a sheet of paper (14A) having both inférieure and supérieure opposées faces are provided with a hot melt adhesive layer (14B).
6. Procédé according to any one of claims précédentes, caractérisé in that, when a étape) of the sheet réalisation inférieure (12), the opérations ai), a2) and a3) are réalisées successively.
7. Procédé according to any one of claims précédentes, caractérisé in that it comprises a étape printing on one supplémentaire and / or the other of the external faces of the two inférieure sheets (12) and supérieure (16) for protecting the support.
8. Procédé according to any one of claims précédentes, caractérisé in that it comprises a supplémentaire étape découpe of the device électronique (10) in a contour map déterminé, of étiquette, ticket or token.
9. Procédé claim précédente, caractérisé in that one réalise simultanément électroniques several devices (10) from à protection sheets and a bonding sheet in rolls, and in that one sépare the électroniques devices in said étape supplémentaire of découpe.
10. Procédé claim précédente, caractérisé in that at least one protective sheet is paper. 15
January 1. électronique device without contact (10), such as a card, a étiquette, a ticket or token, having at least one électronique microcircuit (20) which is agencé in épaisseur d a flexible support and which comprises reliés pads (26) à an interface antenna (24) in the agencée épaisseur the support, the latter comprising at least two sheets opposées , inférieure (12) and supérieure (14), protection, caractérisé in that it comprises a collapsible stack inférieur à 400 μm of: - inférieure protective sheet (12) whose inner face (22) carries at least one électronique microcircuit and at least one interface antenna (24);
- a intermédiaire sheet (14) bonding with both opposées inférieure and supérieure faces are provided with glue;
- and a supérieure protective sheet (16).
12. Device according to claim ├⌐lectronique pr├⌐c├⌐dente, caract├⌐ris├⌐ in that the bonding interm├⌐diaire sheet (14) comprises a ├⌐videment (18) to the microcircuit of the right ├ ⌐lectronique (20).
13. Device électronique according to one of claims 1 1 or 12, caractérisé in that the bonding intermédiaire sheet (14) is a hot melt adhesive sheet.
14. Device électronique according to one of claims 1 1 or 12, caractérisé in that the bonding intermédiaire sheet (14) is a sheet of paper (14A) whose two opposite faces ées inférieure supérieure and are provided with a hot melt adhesive layer (14B).
15. Device électronique according to one of claims 1 1 or 12, caractérisé in that the said at least one protection sheet is paper.
PCT/FR1999/000291 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same WO1999044172A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR98/02727 1998-02-27
FR9802727A FR2775533B1 (en) 1998-02-27 1998-02-27 Electronic device electronic memory without contact, and method of manufacturing such a device

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
AU2428699A AU2428699A (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same
JP2000533853A JP2002505488A (en) 1998-02-27 1999-02-10 Contactless electronic memory electronic device, and a method of manufacturing such a device
BR9907751A BR9907751A (en) 1998-02-27 1999-02-10 electronic device with electronic memory without contact, and manufacturing this device process.
EP19990903730 EP1057139A1 (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same
CA 2321893 CA2321893A1 (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same

Publications (1)

Publication Number Publication Date
WO1999044172A1 true true WO1999044172A1 (en) 1999-09-02

Family

ID=9523715

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR1999/000291 WO1999044172A1 (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same

Country Status (6)

Country Link
EP (1) EP1057139A1 (en)
JP (1) JP2002505488A (en)
CN (1) CN1292129A (en)
CA (1) CA2321893A1 (en)
FR (1) FR2775533B1 (en)
WO (1) WO1999044172A1 (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003515850A (en) * 1999-11-29 2003-05-07 アエスカ エス.ア. Non-contact or non-contact hybrid smart card to limit the risk of fraud
JP2003515848A (en) * 1999-11-29 2003-05-07 アエスカ エス.ア. Method for manufacturing a contactless smart card with an antenna support made of fibrous material
JP2003515849A (en) * 1999-11-29 2003-05-07 アエスカ エス.ア. Method of manufacturing a non-contact hybrid smart card with an antenna support made of fibrous material
EP1768051A2 (en) * 2001-04-26 2007-03-28 Arjo Wiggins Security SAS Cover incorporating a radiofrequency identification device
US7653602B2 (en) 2003-11-06 2010-01-26 Visa U.S.A. Inc. Centralized electronic commerce card transactions
US7725369B2 (en) 2003-05-02 2010-05-25 Visa U.S.A. Inc. Method and server for management of electronic receipts
US7857215B2 (en) 2003-09-12 2010-12-28 Visa U.S.A. Inc. Method and system including phone with rewards image
US7872579B2 (en) 2004-04-14 2011-01-18 Arjowiggins Security Structure including an electronic device, in particular for fabricating a security document or a document of value
US8005763B2 (en) 2003-09-30 2011-08-23 Visa U.S.A. Inc. Method and system for providing a distributed adaptive rules based dynamic pricing system
US8010405B1 (en) 2002-07-26 2011-08-30 Visa Usa Inc. Multi-application smart card device software solution for smart cardholder reward selection and redemption
US8015060B2 (en) 2002-09-13 2011-09-06 Visa Usa, Inc. Method and system for managing limited use coupon and coupon prioritization
US8079519B2 (en) 2004-10-29 2011-12-20 Arjowiggins Security Structure including an electronic device for making a security document
US8119282B2 (en) 2005-06-16 2012-02-21 Exide Technologies Gmbh Pole bridge for a battery
US8407083B2 (en) 2003-09-30 2013-03-26 Visa U.S.A., Inc. Method and system for managing reward reversal after posting
US8429048B2 (en) 2009-12-28 2013-04-23 Visa International Service Association System and method for processing payment transaction receipts
US8554610B1 (en) 2003-08-29 2013-10-08 Visa U.S.A. Inc. Method and system for providing reward status
US8626577B2 (en) 2002-09-13 2014-01-07 Visa U.S.A Network centric loyalty system
US9852437B2 (en) 2002-09-13 2017-12-26 Visa U.S.A. Inc. Opt-in/opt-out in loyalty system

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US6851617B2 (en) * 2002-04-19 2005-02-08 Avery Dennison Corporation Laser imageable RFID label/tag
US7023347B2 (en) 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US6915551B2 (en) 2002-08-02 2005-07-12 Matrics, Inc. Multi-barrel die transfer apparatus and method for transferring dies therewith
US7233498B2 (en) * 2002-09-27 2007-06-19 Eastman Kodak Company Medium having data storage and communication capabilities and method for forming same
JP4103653B2 (en) * 2003-03-27 2008-06-18 株式会社デンソー Ic card
US20040250417A1 (en) 2003-06-12 2004-12-16 Arneson Michael R. Method, system, and apparatus for transfer of dies using a die plate
CN1322467C (en) * 2003-12-30 2007-06-20 上海东方磁卡工程有限公司 Manufacturing method of non contact type intelligent low frequency card
US7370808B2 (en) 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
US7479614B2 (en) 2004-01-12 2009-01-20 Symbol Technologies Radio frequency identification tag inlay sortation and assembly
CA2576772A1 (en) 2004-08-17 2006-03-02 Symbol Technologies, Inc. Singulation of radio frequency identification (rfid) tags for testing and/or programming
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
JP4091096B2 (en) 2004-12-03 2008-05-28 株式会社 ハリーズ Interposer bonding device
JP2006277178A (en) * 2005-03-29 2006-10-12 Aruze Corp Game card
WO2006109678A1 (en) 2005-04-06 2006-10-19 Hallys Corporation Electronic component manufacturing apparatus
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
DE102006026105B4 (en) * 2005-06-28 2011-07-07 Mühlbauer AG, 93426 Method and apparatus for producing self-adhesive RFID transponders
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0376062A1 (en) * 1988-12-27 1990-07-04 Eta SA Fabriques d'Ebauches Electronic module with an integrated circuit for a portable object of small dimensions, such as a card or a key, and process for manufacturing such a module
EP0640940A2 (en) * 1993-08-23 1995-03-01 N.V. Nederlandsche Apparatenfabriek NEDAP Contactless chip card
EP0698859A1 (en) * 1994-08-25 1996-02-28 Schlumberger Industries Method for manufacturing chip cards and card obtained thereby
EP0706152A2 (en) * 1994-11-03 1996-04-10 Fela Holding AG Chip card and method for fabricating it
WO1996010803A1 (en) * 1994-09-30 1996-04-11 Siemens Aktiengesellschaft Support arrangement to be embedded into a contactless chip card
EP0733994A2 (en) * 1995-03-19 1996-09-25 MELZER MASCHINENBAU GmbH Manufacturing method for chip cards

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0376062A1 (en) * 1988-12-27 1990-07-04 Eta SA Fabriques d'Ebauches Electronic module with an integrated circuit for a portable object of small dimensions, such as a card or a key, and process for manufacturing such a module
EP0640940A2 (en) * 1993-08-23 1995-03-01 N.V. Nederlandsche Apparatenfabriek NEDAP Contactless chip card
EP0698859A1 (en) * 1994-08-25 1996-02-28 Schlumberger Industries Method for manufacturing chip cards and card obtained thereby
WO1996010803A1 (en) * 1994-09-30 1996-04-11 Siemens Aktiengesellschaft Support arrangement to be embedded into a contactless chip card
EP0706152A2 (en) * 1994-11-03 1996-04-10 Fela Holding AG Chip card and method for fabricating it
EP0733994A2 (en) * 1995-03-19 1996-09-25 MELZER MASCHINENBAU GmbH Manufacturing method for chip cards

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003515850A (en) * 1999-11-29 2003-05-07 アエスカ エス.ア. Non-contact or non-contact hybrid smart card to limit the risk of fraud
JP2003515848A (en) * 1999-11-29 2003-05-07 アエスカ エス.ア. Method for manufacturing a contactless smart card with an antenna support made of fibrous material
JP2003515849A (en) * 1999-11-29 2003-05-07 アエスカ エス.ア. Method of manufacturing a non-contact hybrid smart card with an antenna support made of fibrous material
JP4731779B2 (en) * 1999-11-29 2011-07-27 アエスカ エス.ア.Ask S.A. Method for manufacturing a contactless smart card with an antenna support made of fibrous material
JP4875271B2 (en) * 1999-11-29 2012-02-15 アエスカ エス.ア.Ask S.A. Method of manufacturing a non-contact hybrid smart card with an antenna support made of fibrous material
JP4731780B2 (en) * 1999-11-29 2011-07-27 アエスカ エス.ア.Ask S.A. Non-contact or non-contact hybrid smart card to limit the risk of fraud
EP1768051A3 (en) * 2001-04-26 2010-01-20 Arjowiggins Security Cover incorporating a radiofrequency identification device
US7940185B2 (en) 2001-04-26 2011-05-10 Arjowiggins Security SAS Cover incorporating a radiofrequency identification device
US7847698B2 (en) 2001-04-26 2010-12-07 Arjowiggins Security SAS Cover incorporating a radio frequency identification device
EP1768051A2 (en) * 2001-04-26 2007-03-28 Arjo Wiggins Security SAS Cover incorporating a radiofrequency identification device
US8010405B1 (en) 2002-07-26 2011-08-30 Visa Usa Inc. Multi-application smart card device software solution for smart cardholder reward selection and redemption
US8015060B2 (en) 2002-09-13 2011-09-06 Visa Usa, Inc. Method and system for managing limited use coupon and coupon prioritization
US8626577B2 (en) 2002-09-13 2014-01-07 Visa U.S.A Network centric loyalty system
US8239261B2 (en) 2002-09-13 2012-08-07 Liane Redford Method and system for managing limited use coupon and coupon prioritization
US9852437B2 (en) 2002-09-13 2017-12-26 Visa U.S.A. Inc. Opt-in/opt-out in loyalty system
US7987120B2 (en) 2003-05-02 2011-07-26 Visa U.S.A. Inc. Method and portable device for management of electronic receipts
US9087426B2 (en) 2003-05-02 2015-07-21 Visa U.S.A. Inc. Method and administration system for management of electronic receipts
US7725369B2 (en) 2003-05-02 2010-05-25 Visa U.S.A. Inc. Method and server for management of electronic receipts
US8386343B2 (en) 2003-05-02 2013-02-26 Visa U.S.A. Inc. Method and user device for management of electronic receipts
US7827077B2 (en) 2003-05-02 2010-11-02 Visa U.S.A. Inc. Method and apparatus for management of electronic receipts on portable devices
US8793156B2 (en) 2003-08-29 2014-07-29 Visa U.S.A. Inc. Method and system for providing reward status
US8554610B1 (en) 2003-08-29 2013-10-08 Visa U.S.A. Inc. Method and system for providing reward status
US7857216B2 (en) 2003-09-12 2010-12-28 Visa U.S.A. Inc. Method and system for providing interactive cardholder rewards image replacement
US7857215B2 (en) 2003-09-12 2010-12-28 Visa U.S.A. Inc. Method and system including phone with rewards image
US9141967B2 (en) 2003-09-30 2015-09-22 Visa U.S.A. Inc. Method and system for managing reward reversal after posting
US8244648B2 (en) 2003-09-30 2012-08-14 Visa U.S.A. Inc. Method and system for providing a distributed adaptive rules based dynamic pricing system
US8407083B2 (en) 2003-09-30 2013-03-26 Visa U.S.A., Inc. Method and system for managing reward reversal after posting
US8005763B2 (en) 2003-09-30 2011-08-23 Visa U.S.A. Inc. Method and system for providing a distributed adaptive rules based dynamic pricing system
US7653602B2 (en) 2003-11-06 2010-01-26 Visa U.S.A. Inc. Centralized electronic commerce card transactions
US9710811B2 (en) 2003-11-06 2017-07-18 Visa U.S.A. Inc. Centralized electronic commerce card transactions
US7872579B2 (en) 2004-04-14 2011-01-18 Arjowiggins Security Structure including an electronic device, in particular for fabricating a security document or a document of value
US8079519B2 (en) 2004-10-29 2011-12-20 Arjowiggins Security Structure including an electronic device for making a security document
US8119282B2 (en) 2005-06-16 2012-02-21 Exide Technologies Gmbh Pole bridge for a battery
US8429048B2 (en) 2009-12-28 2013-04-23 Visa International Service Association System and method for processing payment transaction receipts

Also Published As

Publication number Publication date Type
EP1057139A1 (en) 2000-12-06 application
CN1292129A (en) 2001-04-18 application
FR2775533A1 (en) 1999-09-03 application
FR2775533B1 (en) 2003-02-14 grant
JP2002505488A (en) 2002-02-19 application
CA2321893A1 (en) 1999-09-02 application

Similar Documents

Publication Publication Date Title
US5972156A (en) Method of making a radio frequency identification tag
US5708419A (en) Method of wire bonding an integrated circuit to an ultraflexible substrate
US7259678B2 (en) Durable radio frequency identification label and methods of manufacturing the same
US7489248B2 (en) RFID tags and processes for producing RFID tags
US5969951A (en) Method for manufacturing a chip card and chip card manufactured in accordance with said method
US6786419B2 (en) Contactless smart card with an antenna support and a chip support made of fibrous material
EP1010543A1 (en) Card mounted with circuit chip and circuit chip module
US5851854A (en) Method for producing a data carrier
US4792843A (en) Data carrier having an integrated circuit and method for producing same
US6390375B2 (en) Contactless or hybrid contact-contactless smart card designed to limit the risks of fraud
US6794727B2 (en) Single receiving side contactless electronic module continuous manufacturing process
US5888624A (en) Data carrier with an electronic module and a method for producing the same
US20080277484A1 (en) Smart Card Producing Method and a Smart Card in Particular Provided with a Magnetic Antenna
US6437985B1 (en) Disposable electronic chip device and process of manufacture
JP2007150868A (en) Electronic equipment and method of manufacturing the same
US20110011939A1 (en) Contact-less and dual interface inlays and methods for producing the same
US7199456B2 (en) Injection moulded product and a method for its manufacture
JP2002175508A (en) Non-contact type data carrier device, and wiring member for booster antenna part
JP2004527864A (en) Smart labels and smart label web
US6406935B2 (en) Manufacturing process of a hybrid contact-contactless smart card with an antenna support made of fibrous material
WO1988008592A1 (en) Method for the manufacture of and structure of a laminated proximity card
JP2007279782A (en) Non-contact ic tag having ic chip breakdown prevention structure, connecting element of the non-contact ic tag, and manufacturing method of the non-contact ic tag connecting element
EP1120739A2 (en) Information recording tag
US20020070280A1 (en) Circuit chip mounted card and circuit chip module
US20050066513A1 (en) Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness

Legal Events

Date Code Title Description
AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

AK Designated states

Kind code of ref document: A1

Designated state(s): AU BR CA CN IN JP KR MX RU SG US VN

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1999903730

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 24286/99

Country of ref document: AU

WWE Wipo information: entry into national phase

Ref document number: PA/a/2000/007960

Country of ref document: MX

WWE Wipo information: entry into national phase

Ref document number: IN/PCT/2000/229/KOL

Country of ref document: IN

ENP Entry into the national phase in:

Ref document number: 2321893

Country of ref document: CA

Ref document number: 2321893

Country of ref document: CA

Kind code of ref document: A

NENP Non-entry into the national phase in:

Ref country code: KR

WWE Wipo information: entry into national phase

Ref document number: 09623168

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 1999903730

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 1999903730

Country of ref document: EP