WO1998029262A1 - Carte a puce et module de puce - Google Patents
Carte a puce et module de puce Download PDFInfo
- Publication number
- WO1998029262A1 WO1998029262A1 PCT/JP1997/004771 JP9704771W WO9829262A1 WO 1998029262 A1 WO1998029262 A1 WO 1998029262A1 JP 9704771 W JP9704771 W JP 9704771W WO 9829262 A1 WO9829262 A1 WO 9829262A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit chip
- card
- reinforcing member
- disposed
- antenna
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Definitions
- the present invention relates to a card and a circuit chip module on which a circuit chip is mounted, and more particularly to a circuit chip-mounted card and a circuit chip module that realize improved reliability, reduced manufacturing cost, and the like.
- Non-contact IC cards are used for ski lifts, automatic ticket gates for railways, and automatic sorting of luggage.
- Fig. 7 shows an example of a conventional contactless IC card.
- the IC card 2 shown in FIG. 7 is a one-coil type IC card, and includes a coil 4 used as an antenna, capacitors C1, C2, and an IC chip 8.
- the capacitors C1, C2 and the IC chip 8 are mounted on a film-shaped synthetic resin substrate.
- tab tape automated bonding
- FIG. 8A shows a cross-sectional view of the IC card 2.
- a synthetic resin core member 12 is sandwiched between a pair of surface materials 14 and 16.
- a tab 10 on which capacitors C1, C2, and an IC chip 8 are mounted is fixed to a surface layer material 14 exposed in a hollow portion 18 provided in the core member 12.
- the joint between the tab 10 and the IC chip 8 is covered with a sealing material 9 such as epoxy resin.
- the coil 4 is disposed between the surface material 14 and the core member 12. Coil 4 and tab 10 are connected by wire 20.
- FIG. 8B shows a circuit diagram of the IC card 2.
- IC card 2 is a reader / writer
- information transmitted by being superimposed on this electromagnetic wave is transmitted to a control unit provided in the IC chip 8. (Not shown) decrypts and replies.
- the response is made by changing the impedance of the resonance circuit 22.
- the reader / writer knows the response content by detecting a change in impedance (impedance reflection) of its own resonance circuit (not shown) accompanying a change in impedance of the resonance circuit 22 on the IC card 2 side.
- the conventional IC card as described above has the following problems.
- the IC card 2 is often placed in a wallet or pants pocket, and may be subjected to a fairly strong bending, twisting, or pressing force.
- the thickness t of the IC card 2 shown in FIG. 8A is a standard dimension and is not so thick. Therefore, the rigidity against bending, twisting, pushing, etc. is not so large. Therefore, when the IC card 2 is subjected to a strong bending force or the like, the deflection is considerably large.
- the IC chip 8 is also greatly deformed. Due to such deformation, the IC chip 8 is cracked, and the function as the IC card is impaired.
- the conventional IC card has a problem that it is difficult to use and lacks reliability.
- An object of the present invention is to provide a circuit chip mounted card having high reliability and low manufacturing cost by solving the above conventional problems.
- a card mounted with a circuit chip of the present invention that achieves the above object is characterized in that a reinforcing member for increasing the rigidity of the card near the circuit chip is provided on the card.
- the card is not greatly deformed in the vicinity of the circuit chip.
- the circuit chip itself is not significantly deformed. That Therefore, even if a bending force, a torsion force, a pressing force, or the like is applied, it is possible to prevent the occurrence of a situation in which the circuit chip is damaged and the function is impaired. In other words, the reliability of the circuit chip mounted card can be improved.
- the reinforcing member includes a frame body arranged so as to surround the circuit chip in a plane direction which is a direction orthogonal to a thickness direction of the card. Have.
- the rigidity of the card in the vicinity of the circuit chip can be effectively increased while securing a space for accommodating the circuit chip.
- the reinforcing body includes a plate-shaped body that covers at least one of the spaces surrounded by the frame in the thickness direction, and the circuit chip is disposed in a substantially concave space formed by the plate-shaped body and the frame. Is done.
- the rigidity of the card near the circuit chip can be further increased. Therefore, the desired rigidity can be ensured even if the dimension of the reinforcing member in the surface direction is increased to some extent. Therefore, for example, when the antenna is provided on the reinforcing member, a larger antenna can be provided.
- the circuit chip is supported in the card via a cushioning member for reducing impact.
- the circuit chip mounted card having such a structure even if an impact is applied to the card, the transmission of the impact to the circuit chip is reduced. Therefore, damage to the circuit chip due to the impact can be prevented to some extent.
- an antenna for performing communication using electromagnetic waves is provided on a reinforcing member or a cushioning member.
- the wire connecting the circuit chip and the antenna falls within the range of the highly rigid reinforcing body, the wire is hardly cut or disconnected due to the bending of the card. As a result, the reliability of non-contact type circuit chip cards with antennas is improved. Can be up.
- the antenna in this circuit chip-mounted card is preferably such that the antenna is formed of a loop-shaped metal wire fixed to a reinforcing member or a buffer member.
- the antenna can be formed more easily by printing or etching. Therefore, the manufacturing cost can be further reduced.
- the reinforcing body is formed of ceramic.
- the rigidity of the reinforcing member can be further increased, and the rigidity of the card near the circuit chip can be further increased.
- the antenna can be directly provided on the reinforcing member by printing or the like, and the manufacturing cost can be reduced.
- the circuit chip mounted card of the present invention includes a first base material, a reinforcing member disposed on the first base material, and having a through hole in a thickness direction of the card; A second substrate disposed on the body, a buffer member disposed on the first substrate in the through hole, and a circuit chip disposed on the buffer member in the through hole; A core member is provided outside the reinforcing member and between the first base material and the second base material.
- the card is not greatly deformed in the vicinity of the circuit chip.
- the circuit chip itself is not significantly deformed. Therefore, even if a bending force, a torsional force, a pressing force, or the like is applied, it is possible to prevent the circuit chip itself from being damaged and its function being impaired to some extent. That is, the reliability of the circuit chip mounted card can be improved.
- the circuit chip module of the present invention provides a circuit for forming a card on which a circuit chip is mounted.
- a circuit chip module wherein a circuit chip mounted on a card and a reinforcing member for increasing rigidity of the card at a position where the circuit chip is mounted are integrally connected.
- the circuit chip module of the present invention having such a structure, even if a strong bending force, torsion force, pressing force, or the like is applied to the card on which the circuit chip module is mounted, the card can be mounted near the circuit chip.
- the circuit chip itself does not deform significantly because it does not deform significantly. For this reason, even if a bending force, a torsional force, a pressing force, or the like is applied, it is possible to prevent the occurrence of a situation in which a circuit chip is damaged and its function is impaired. That is, the reliability of the circuit chip mounted card can be improved.
- FIG. 1 is a diagram showing an external configuration of a non-contact type IC card 30 according to an embodiment of the present invention
- FIG. 2 is a cross-sectional view showing a cross section II_II in FIG.
- Fig. 3 is a plan view of the IC card 30 from the direction V1 in Fig. 2 with the surface material 36 removed.
- FIG. 4 is a cross-sectional view showing a cross-sectional configuration of a non-contact type IC card 50 according to another embodiment of the present invention
- FIG. 5 shows a non-contact type IC card 17 according to still another embodiment of the present invention.
- FIG. 6 is a diagram showing an external configuration of a non-contact type IC card 60 according to still another embodiment of the present invention.
- FIG. 7 is a diagram showing an example of a conventional non-contact type IC card
- FIG. 8A is a cross-sectional view showing a cross section taken along the line VIIA-VIIA in FIG. 7, and FIG. 8B is a circuit diagram of the IC arm 2 in FIG. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 shows a circuit chip mounted card according to an embodiment of the present invention.
- the external configuration of a contact type IC card 30 is shown.
- the IC card 30 is a one-coil type IC card, and can be used for ski lifts, automatic ticket gates for railways, automatic sorting of luggage, and the like.
- FIG. 2 shows a cross section taken along the line II-II in FIG.
- the 10 card 30 has a structure in which a surface material 32 as a first base material, a core member 34, and a surface material 36 as a second base material are laminated in this order. Synthetic resins such as vinyl chloride and PET (polyethylene terephthalate) are used as the surface material 32, 36.
- the core member 34 is made of a synthetic resin.
- a ceramic frame 38 is embedded in a layer formed by the core member 34.
- the ceramic frame 38 is made of ceramic and formed in a cylindrical shape.
- the ceramic frame 38 corresponds to the frame of the reinforcing member. That is, in this embodiment, the reinforcing member is constituted only by the frame.
- the inside 38 a of the ceramic frame 38 is hollow. At the lower end of the inside 38 a of the ceramic frame 38, an elastic material 40 as a cushioning member is laid in contact with the surface material 32. Adhesive silicone rubber is used as the elastic material 40. An IC chip 42 as a circuit chip is held on the elastic material 40. In this embodiment, the configuration is such that a capacitor for a resonance circuit and a capacitor for power supply smoothing are built in the IC chip 42.
- the bending stiffness, the torsional stiffness, and the pressing stiffness of the IC force 30 near the ceramic frame 38 are obtained. Can be significantly increased.
- the IC chip 42 disposed inside 38 a of the ceramic frame 38 does not significantly deform. Therefore, even if a bending force, a torsional force, a pressing force, or the like is applied, the IC chip 42 is hardly damaged. That is, the reliability of the IC card 30 can be improved.
- the thickness of each of the surface materials 32 and 36 is 0.1 mm, and the thickness of the entire IC card 30 is 0.768 mm.
- the IC chip 42 is a square having a side of 3 mm and a thickness of 0.25 mm.
- the thickness of the elastic member 40 is 0.118 mm.
- the height of the ceramic frame 38 is 568 mm including the coil 44 described later, which is adjacent to the upper end surface 38b.
- the inner diameter of the ceramic frame 38 is set so that the clearance with the built-in IC chip 42 is about 0.2 to 0.3 mm.
- the outer diameter of the ceramic frame 38 is about 23 mm.
- the present invention is not limited to these dimensions and materials.
- FIG. 3 is a view of the IC card 30 from the VI direction in FIG. 2 with the surface material 36 removed.
- the coil 44 is formed of a loop-shaped metal wire formed on the upper end surface 38 b of the cylindrical ceramic frame 38 by printing or etching.
- the terminal of the coil 44 is connected to the IC chip 42 by a wire 46.
- the IC chip 42, ceramic frame 38 and coil 44 connected together must be prepared in advance. Becomes possible. Therefore, manufacturing cost can be reduced by improving workability during manufacturing.
- the tail 46 is cut by bending the IC card 30. However, it is hard to be detached. Therefore, it is possible to improve the reliability of the non-contact type IC card 3 ⁇ including the coil 44.
- the operation of the IC card 30 is the same as that of the conventional IC card 2. That is, an electromagnetic wave transmitted from a reader / writer (write / read device, not shown) is transmitted to a resonance circuit (not shown) constituted by a capacitor (not shown) built in the coil 44 and the IC chip 42. Zu), and use this as the power source.
- the IC chip 42 also has a built-in power smoothing capacitor (not shown).
- a control unit (not shown) provided in the IC chip 42 decodes information obtained by being superimposed on the electromagnetic wave, and responds. The response is made by changing the impedance of the resonant circuit.
- the reader / writer knows the contents of the response by detecting the change in the impedance of its own resonance circuit (not shown) due to the change in the impedance of the resonance circuit on the IC card 3 side.
- the IC chip 42 is fixed to the surface material 32 via the elastic material 40, but without the elastic material 40.
- the IC chip 42 may be directly fixed to the surface material 32.
- FIG. 4 shows a cross-sectional configuration of a non-contact type IC card 50 as a circuit chip mounted card according to another embodiment of the present invention.
- the external configuration of the IC card 50 is the same as that of the IC card 30 (see FIG. 1).
- the view from VI in FIG. 4 is almost the same as that of the IC card 32 (see FIG. 3).
- the shape of the ceramic frame 52 is different from the shape of the ceramic frame 38 in the IC card 32 (see FIG. 2). That is, the ceramic frame 52 includes a cylindrical portion 52 a that is a frame, and a bottom portion 52 b that is a plate-shaped body continuously and integrally provided at the lower end of the cylindrical portion 52 a. This is different from the ceramic frame 38 composed of only the cylindrical frame.
- the IC chip 42 is directly fixed to the bottom 52b of the concave space 52c formed by the cylindrical portion 52a and the bottom 52b of the ceramic frame 52. It is configured as follows. Thus, by providing the bottom portion 52b continuously and integrally at the lower end of the cylindrical portion 52a, the rigidity of the ceramic frame 52 can be further increased. Therefore, even if the dimension of the ceramic frame 52 in the plane direction (the X direction and the Y direction in FIG. 1) is increased to some extent, the desired rigidity can be secured. Therefore, the diameter of the coil 44 can be further increased.
- An IC chip module 54 which is a circuit chip module is constituted by the wire 46 connecting the device 2 and the wire 46.
- the IC chip 42 is configured to be directly fixed to the bottom 52b of the ceramic frame 52, but the IC chip 42 and the bottom 52b of the ceramic frame 52 are not fixed.
- An elastic material 40 as shown in FIG. 2 may be interposed between them. With this configuration, the impact applied to the card can be reduced.
- the coil 44 is formed on the upper end surface of the ceramic frame 38 or 52.
- the coil may be formed on the lower end surface of the ceramic frame 38 or 52, It may be configured to be provided on the side surface, both end surfaces, and the like.
- the ceramic frame 38 or 52 may be divided into two or more in the thickness direction, and the coil may be sandwiched between the divided ceramic frames.
- the coil 44 was directly formed on the ceramic frame 38 or 52 by printing or etching.However, a coil was formed on the synthetic resin film by etching or the like, and the coil-formed film was formed on the ceramic frame 38 or 52. It may be configured to connect. Further, the coil may be wound around the ceramic frame 38 or 52.
- FIG. 5 shows a cross-sectional configuration of a non-contact type IC card 170 which is a circuit chip mounted card according to another embodiment of the present invention.
- the external configuration of the IC card 170 Same as IC card 30.
- the shape of the ceramic frame 172 as a frame is different from the ceramic frame 38 in the IC card 30 (see FIG. 2).
- the ceramic frame 17 2 is formed in a single cylindrical shape like the ceramic frame 38 in accordance with the M rule, but the inside is formed in a stepped cylindrical shape. 3 different from 8.
- a coil 44 as an antenna is formed on the stepped portion 172a of the ceramic frame 172.
- a support film 174 constituting a buffer member is disposed on the coil 44.
- the support film 174 is a synthetic resin film formed in a hollow disk shape, and is provided with printed wiring (not shown).
- the printed wiring of the support film 174 and the terminal 44a provided at the end of the coil 44 are joined using soldering or bump technology (terminal joining technology). Therefore, the support film 17 4 is supported by the step 17 2 a of the ceramic frame 17 2 through the coil 44 in the internal space 17 2 b of the ceramic frame 17 Has become.
- the IC chip 42 is provided substantially at the center of the supporting film 17 4.
- the printed wiring of the support film 174 and the terminal 42 a of the IC chip 42 are joined using soldering, bump technology, or the like. Therefore, the IC chip 42 is supported by the support film 174 in the internal space 172 b of the ceramic frame 172 and is suspended.
- the terminal 44 a of the coil 44 and the terminal 42 a of the IC chip 42 are electrically connected to each other via the above-described printed wiring provided on the support film 174.
- an IC chip module 176 as a circuit chip module is constituted by the ceramic frame 17 2, the coil 44, the support film 174, and the IC chip 42.
- the terminal 42 a of the IC chip 42 of the printed wiring of the support film 174 is connected to the terminal 42 a by soldering or bump technology.
- the film 174 and the IC chip 42 may be configured to be joined via an anisotropic conductor (not shown).
- the anisotropic conductor is a conductor having conductivity only in one direction, and has an adhesive property.
- anisotropic conductor for example, anisolm (Hitachi Chemical) which is a thermosetting adhesive can be used.
- the printed wiring provided on the support film 174 and the terminal 42 a of the IC chip 42 can be electrically connected.
- the anisotropic conductor is filled so as to close the gap between the support film 174 and the IC chip 42, the bonding strength between the support film 174 and the IC chip 42 is extremely increased. be able to.
- the upper end surface 42b of the IC chip 42 entirely with an anisotropic conductor, it is possible to prevent moisture from entering the inside of the IC chip 42. Therefore, corrosion of aluminum wiring (not shown) inside the IC chip 42 can be prevented.
- the support film 17 4 is provided with a printed wiring, and the coil 44 and the IC chip 42 are electrically connected via the printed wiring. As in the embodiment shown in FIG. 4, the coil 44 and the IC chip 42 may be electrically connected via a wire.
- a hollow disk-shaped synthetic resin film is used as the cushioning member, the shape and material of the cushioning member are not limited thereto.
- the coil 44 is formed on the step 17 a of the ceramic frame 17 2.
- the coil 44 may be formed on the upper end face, the lower end face, the side face, and the side face of the ceramic frame 17 2. It may be configured to be provided on both end surfaces and the like.
- the ceramic frame 172 may be divided into two or more in the thickness direction, and a coil may be sandwiched between the divided ceramic frames.
- the coil 44 is formed on the ceramic frame 172 by printing or etching, the coil may be formed directly on the support film 174 by printed wiring or the like.
- a coil is wound around the ceramic frame 17 2 It can also be configured to attach.
- the coil 64 may be provided outside the ceramic frame 62. With such a configuration, the size of the coil 64 can be increased without increasing the size of the ceramic frame 62. Therefore, even if the distance from the reader / writer is long, information can be exchanged.
- a cylindrical body having a through cylindrical shape or a bottomed cylindrical shape is used as the reinforcing body.
- the outer shape and the inner shape of the cylinder are not limited to the cylindrical shape.
- a rectangular tube-shaped reinforcing member may be used as the reinforcing member.
- the reinforcing body is not limited to a tubular one, and for example, a flat one can be used.
- a plurality of reinforcing bodies can be provided.
- reinforcing members can be provided above and below the circuit chip so as to sandwich the circuit chip.
- the reinforcing member is made of ceramic. However, any material other than ceramic may be used as long as the material has high rigidity. For example, a metal material such as stainless steel or a hard synthetic resin can be used.
- the capacitor for the resonance circuit and the capacitor for power smoothing are configured to be built in the IC chip 42.
- these capacitors are configured not to be built in the IC chip 42. You can also.
- the IC chip 42 and the capacitor may be mounted on the tab (tab), and the tab may be placed in the ceramic frame 38 or 52. Further, in the embodiment shown in FIG. 5, a capacitor can be mounted on the support film 174.
- the present invention is applied to a one-coil type non-contact type IC card has been described as an example. Can also be applied.
- the present invention can be applied to a contact type IC card.
- the present invention can be applied to not only IC cards but also all modules and cards equipped with circuit chips.
- the card here refers to a substantially plate-shaped member, such as a credit card, Railway commuter pass, such as railway tickets are true (
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69732719T DE69732719T2 (de) | 1996-12-27 | 1997-12-22 | Chipkarte und chipkartenmodul |
AU78894/98A AU742524B2 (en) | 1996-12-27 | 1997-12-22 | Card mounted with circuit chip and circuit chip module |
CA002277181A CA2277181A1 (en) | 1996-12-27 | 1997-12-22 | Card mounted with circuit chip and circuit chip module |
US09/331,190 US6478228B1 (en) | 1996-12-27 | 1997-12-22 | Card mounted with circuit chip and circuit chip module |
EP97949217A EP1013472B1 (en) | 1996-12-27 | 1997-12-22 | Card mounted with circuit chip and circuit chip module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8/351359 | 1996-12-27 | ||
JP35135996A JP4108779B2 (ja) | 1996-12-27 | 1996-12-27 | 回路チップ搭載カードおよび回路チップモジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998029262A1 true WO1998029262A1 (fr) | 1998-07-09 |
Family
ID=18416769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1997/004771 WO1998029262A1 (fr) | 1996-12-27 | 1997-12-22 | Carte a puce et module de puce |
Country Status (8)
Country | Link |
---|---|
US (1) | US6478228B1 (ja) |
EP (2) | EP1013472B1 (ja) |
JP (1) | JP4108779B2 (ja) |
CN (1) | CN1086346C (ja) |
AU (1) | AU742524B2 (ja) |
CA (1) | CA2277181A1 (ja) |
DE (2) | DE69738891D1 (ja) |
WO (1) | WO1998029262A1 (ja) |
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JP2001084343A (ja) * | 1999-09-16 | 2001-03-30 | Toshiba Corp | 非接触icカード及びicカード通信システム |
EP1174821A1 (de) * | 2000-07-20 | 2002-01-23 | Sokymat S.A. | Transponder mit Versteifungselement |
JP2002074298A (ja) * | 2000-08-30 | 2002-03-15 | Fujitsu Ltd | 非接触型icカード |
US6923378B2 (en) * | 2000-12-22 | 2005-08-02 | Digimarc Id Systems | Identification card |
JP2002278451A (ja) * | 2001-03-16 | 2002-09-27 | Jr East Mechatronics Co Ltd | ラベル状鉄道用icカード |
KR100411811B1 (ko) * | 2001-04-02 | 2003-12-24 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 |
JP2002342731A (ja) * | 2001-05-16 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 複合icカード |
ATE509326T1 (de) | 2001-12-18 | 2011-05-15 | L 1 Secure Credentialing Inc | Mehrfachbildsicherheitsmerkmale zur identifikation von dokumenten und verfahren zu ihrer herstellung |
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US7694887B2 (en) | 2001-12-24 | 2010-04-13 | L-1 Secure Credentialing, Inc. | Optically variable personalized indicia for identification documents |
AU2002364746A1 (en) | 2001-12-24 | 2003-07-15 | Digimarc Id Systems, Llc | Systems, compositions, and methods for full color laser engraving of id documents |
WO2003056500A1 (en) | 2001-12-24 | 2003-07-10 | Digimarc Id Systems, Llc | Covert variable information on id documents and methods of making same |
EP1467834A4 (en) | 2001-12-24 | 2005-04-06 | Digimarc Id Systems Llc | LASER SEVERE SAFETY ELEMENTS FOR IDENTIFICATION DOCUMENTS AND METHODS OF MAKING THE SAME |
WO2003088144A2 (en) | 2002-04-09 | 2003-10-23 | Digimarc Id Systems, Llc | Image processing techniques for printing identification cards and documents |
US7824029B2 (en) | 2002-05-10 | 2010-11-02 | L-1 Secure Credentialing, Inc. | Identification card printer-assembler for over the counter card issuing |
KR100467634B1 (ko) * | 2002-07-16 | 2005-01-24 | 삼성에스디에스 주식회사 | 스마트 카드 및 그의 제조방법 |
DE10232569A1 (de) * | 2002-07-18 | 2004-02-05 | Agfa-Gevaert Ag | Identitätskarte |
AU2003298731A1 (en) | 2002-11-26 | 2004-06-18 | Digimarc Id Systems | Systems and methods for managing and detecting fraud in image databases used with identification documents |
US7712673B2 (en) | 2002-12-18 | 2010-05-11 | L-L Secure Credentialing, Inc. | Identification document with three dimensional image of bearer |
DE102004008841A1 (de) * | 2003-03-12 | 2004-09-23 | Bundesdruckerei Gmbh | Verfahren zur Herstellung einer Buchdeckeneinlage und eines buchartigen Wertdokuments sowie eine Buchdeckeneinlage und ein buchartiges Wertdokument |
EP1614064B1 (en) | 2003-04-16 | 2010-12-08 | L-1 Secure Credentialing, Inc. | Three dimensional data storage |
JP4567988B2 (ja) * | 2004-02-05 | 2010-10-27 | 株式会社日立製作所 | 紙状rfidタグおよびその製造方法 |
JP4077442B2 (ja) * | 2004-11-09 | 2008-04-16 | 東芝テック株式会社 | 無線タグの保持構造 |
EP1677232A1 (de) * | 2004-12-22 | 2006-07-05 | Trüb AG | Datenträger und Verfahren zur Herstellung eines Datenträgers |
JP4536552B2 (ja) * | 2005-02-28 | 2010-09-01 | ケイ・アール・ディコーポレーション株式会社 | Icタグ |
NL1029985C2 (nl) * | 2005-09-20 | 2007-03-21 | Sdu Identification Bv | Identiteitsdocument met chip. |
US8232621B2 (en) * | 2006-07-28 | 2012-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US7714535B2 (en) | 2006-07-28 | 2010-05-11 | Semiconductor Energy Laboratory Co., Ltd. | Power storage device |
US7838976B2 (en) * | 2006-07-28 | 2010-11-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a semiconductor chip enclosed by a body structure and a base |
DE202008010294U1 (de) | 2008-08-01 | 2008-10-16 | Flexo-Print Bedienfelder Gmbh | Transponder |
CN102332102A (zh) * | 2010-07-13 | 2012-01-25 | 凸版印刷(上海)有限公司 | 一种运用有金属薄板的非接触卡及其实现方法 |
CN203279336U (zh) * | 2013-04-27 | 2013-11-06 | 中兴通讯股份有限公司 | 一种内散热的终端 |
BR112016027213B1 (pt) | 2014-05-22 | 2022-11-01 | Composecure, Llc | Cartões de id e transação que têm textura e coloração selecionadas e método para produção do mesmo |
JP6367661B2 (ja) * | 2014-09-19 | 2018-08-01 | マクセルホールディングス株式会社 | Icモジュール |
CN112836778A (zh) * | 2014-11-03 | 2021-05-25 | 安全创造有限责任公司 | 含陶瓷的和陶瓷复合材料交易卡 |
US10783422B2 (en) | 2014-11-03 | 2020-09-22 | Composecure, Llc | Ceramic-containing and ceramic composite transaction cards |
DE102017122052A1 (de) * | 2017-09-22 | 2019-03-28 | Schreiner Group Gmbh & Co. Kg | RFID-Etikett mit Schutz der RFID-Funktion |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
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JPS62236793A (ja) * | 1986-04-07 | 1987-10-16 | 松下電子工業株式会社 | Icカ−ド |
JPH07200766A (ja) * | 1993-12-28 | 1995-08-04 | Omron Corp | 電子カード |
JPH08282167A (ja) * | 1995-04-13 | 1996-10-29 | Rohm Co Ltd | Icカード |
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JPS6440397A (en) * | 1987-08-07 | 1989-02-10 | Dainippon Printing Co Ltd | Portable electronic device |
US4921160A (en) * | 1988-02-29 | 1990-05-01 | American Telephone And Telegraph Company | Personal data card and method of constructing the same |
JP2709223B2 (ja) * | 1992-01-30 | 1998-02-04 | 三菱電機株式会社 | 非接触形携帯記憶装置 |
US5581445A (en) * | 1994-02-14 | 1996-12-03 | Us3, Inc. | Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module |
US5852289A (en) * | 1994-09-22 | 1998-12-22 | Rohm Co., Ltd. | Non-contact type IC card and method of producing the same |
DE4437844C2 (de) * | 1994-10-22 | 2001-03-08 | Cubit Electronics Gmbh | Kontaktloser Datenträger und Verfahren zu seiner Herstellung |
US5955723A (en) * | 1995-05-03 | 1999-09-21 | Siemens Aktiengesellschaft | Contactless chip card |
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1996
- 1996-12-27 JP JP35135996A patent/JP4108779B2/ja not_active Expired - Fee Related
-
1997
- 1997-12-22 CA CA002277181A patent/CA2277181A1/en not_active Abandoned
- 1997-12-22 WO PCT/JP1997/004771 patent/WO1998029262A1/ja active IP Right Grant
- 1997-12-22 DE DE69738891T patent/DE69738891D1/de not_active Expired - Lifetime
- 1997-12-22 AU AU78894/98A patent/AU742524B2/en not_active Ceased
- 1997-12-22 US US09/331,190 patent/US6478228B1/en not_active Expired - Fee Related
- 1997-12-22 CN CN97181047A patent/CN1086346C/zh not_active Expired - Fee Related
- 1997-12-22 EP EP97949217A patent/EP1013472B1/en not_active Expired - Lifetime
- 1997-12-22 DE DE69732719T patent/DE69732719T2/de not_active Expired - Fee Related
- 1997-12-22 EP EP04028035A patent/EP1514698B1/en not_active Expired - Lifetime
Patent Citations (3)
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JPS62236793A (ja) * | 1986-04-07 | 1987-10-16 | 松下電子工業株式会社 | Icカ−ド |
JPH07200766A (ja) * | 1993-12-28 | 1995-08-04 | Omron Corp | 電子カード |
JPH08282167A (ja) * | 1995-04-13 | 1996-10-29 | Rohm Co Ltd | Icカード |
Non-Patent Citations (1)
Title |
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See also references of EP1013472A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP1514698A3 (en) | 2005-03-30 |
DE69732719T2 (de) | 2006-04-13 |
JP4108779B2 (ja) | 2008-06-25 |
EP1514698A2 (en) | 2005-03-16 |
JPH10193847A (ja) | 1998-07-28 |
DE69732719D1 (de) | 2005-04-14 |
US6478228B1 (en) | 2002-11-12 |
AU742524B2 (en) | 2002-01-03 |
EP1013472A1 (en) | 2000-06-28 |
EP1013472A4 (en) | 2000-08-30 |
EP1514698B1 (en) | 2008-08-06 |
DE69738891D1 (de) | 2008-09-18 |
EP1013472B1 (en) | 2005-03-09 |
CN1241969A (zh) | 2000-01-19 |
CN1086346C (zh) | 2002-06-19 |
CA2277181A1 (en) | 1998-07-09 |
AU7889498A (en) | 1998-07-31 |
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