WO1997023893A1 - Process for aligning and sealing field emission displays - Google Patents
Process for aligning and sealing field emission displays Download PDFInfo
- Publication number
- WO1997023893A1 WO1997023893A1 PCT/US1996/016653 US9616653W WO9723893A1 WO 1997023893 A1 WO1997023893 A1 WO 1997023893A1 US 9616653 W US9616653 W US 9616653W WO 9723893 A1 WO9723893 A1 WO 9723893A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive
- faceplate
- fed
- cathode member
- pressing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
- H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/304—Field emission cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2329/00—Electron emission display panels, e.g. field emission display panels
Definitions
- This invention relates generally to flat panel emission displays and more particularly to methods of manufacturing field emission displays.
- Field emission displays are flat panel displays comprising faceplates on which phosphor pixels reside and cathode members have micro-tip cathodes which emit electrons to activate the phosphors .
- the cathode member is attached to or integrally formed with a backplate, and in other embodiments, the cathode member is attached to the faceplate and surrounded by a separate backplate. In either case, the cathode member must be aligned with the faceplate so that the cathode tips are in opposed relation to the specific pixels which they are intended to activate.
- a seal must be made between the backplate and the faceplate. Maintaining alignment while making the seal in high resolution displays and in large area displays is a very serious problem.
- a FED comprising a faceplate and a cathode member, made according to a process comprising: aligning the faceplate and the cathode member; disposing an adhesive between the faceplate and the cathode member; pressing the faceplate and the cathode member together; disposing a frit seal between the faceplate and a backplate assembly; and heating the frit seal to a temperature sufficient to cause the frit to seal.
- Fig. 1 is a side view of an embodiment of the present invention.
- Fig. 2 is a side view of an embodiment of the present invention.
- Fig. 3 is a top view of an embodiment of the present invention.
- a FED comprising a faceplate 10 and a cathode member 12.
- the cathode member 12 is formed integrally with the backplate, as in, for example, U.S. Patent No. 5,391,259, incorporated herein by reference.
- the cathode member is separate from and surrounded by the backplate.
- either type of FED is made according to a process comprising: aligning the faceplate 10 and the cathode member 12; disposing an adhesive 16 between the faceplate 10 and the cathode member 12; pressing the faceplate 10 and the backplate together; disposing a frit seal 18 between the faceplate 10 and the backplate; and heating the frit seal 18 to a temperature sufficient to cause the frit to seal.
- said pressing occurs during said aligning.
- said heating causes the adhesive 16 to be removed, and in one specific embodiment, the adhesive 16 is melted from between the faceplate 10 and the cathode member 12, at least to a level that allows frit 18 to contact both the cathode member assembly 12, 14a-14b and the faceplate 10. See Fig. 2.
- cathode member 12 is separated from faceplate 10 by spacers 14a and 14b, which are made of a glass similar to the glass forming the backplate.
- faceplate 10 is made of glass according to some embodiments .
- Acceptable glasses for faceplate 10 and cathode member assembly 12, 14a-14b include: Corning 7059, 1737, and soda-lime-silica.
- the cathode member assembly comprises no spacers 14a and 14b, and comprises simply a backplate with a cathode assembly formed thereon, as seen in, for example, U.S. Patent No. 5,329,207, incorporated herein by reference.
- Fig. 3 is a top view of an example embodiment of the present invention
- the adhesive 16 is isolated from the cathode 30 which is surrounded by frit seal 18. Also, according to the illustrated embodiment, the adhesive 16 is placed in discrete locations around the frit seal 18, although according to an alternative embodiment, the adhesive 16 is placed in a continuous strip (not shown) around the frit seal 18.
- said pressing causes a cold solder joint to form between the faceplate 10 and the cathode member assembly 12, 14a-14b, wherein the cold solder joint effectuates a seal due to the composition of adhesive 16.
- acceptable adhesives which form a cold solder joint include indium, lead, tin, silver, cadmium, and compounds and allows thereof. Some such materials require heating in order to become wet to glass .
- removal of the adhesive 16 from between the faceplate 10 and the cathode member assembly 12, 14a-14b comprises reduction.
- the removal of adhesive 16 is conducted in an oxygen-containing atmosphere, and the adhesive 16 comprises an organic material, and the removal comprises oxidation of the organic material.
- acceptable organic adhesives include: corn protein (for example Zein), polyvinyl alcohol, acryloid material (for example Rolm 7 Haas B66 and B72) .
- said disposing an adhesive 16 comprises placement of the adhesive 16 on the faceplate 10 before said pressing, while in other embodiments, said disposing an adhesive 16 comprises placement of the adhesive 16 on the cathode member assembly 12, 14a-14b before said pressing.
- the disposing of adhesive 16 comprises, in one example embodiment, pressing adhesive material (for example, indium, having a thickness of about 0.03 inches) onto either cathode member assembly 12, 14a-14b or faceplate 10.
- said disposing an adhesive 16 comprises extrusion of an adhesive 16 on either the faceplate 10 or the cathode member assembly 12, 14a-14b.
- said pressing the faceplate 10 and the cathode member assembly 12, 14a-14b together occurs before said disposing a frit seal 18 between the faceplate 10 and the cathode member assembly 12, 14a-14b or after said disposing a frit seal 18 between the faceplate 10 and the cathode member assembly 12, 14a-14b.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69614670T DE69614670T2 (en) | 1995-12-21 | 1996-10-17 | METHOD FOR ALIGNING AND LOCKING FIELD EMISSION DISPLAY DEVICES |
AU74508/96A AU7450896A (en) | 1995-12-21 | 1996-10-17 | Process for aligning and sealing field emission displays |
EP96936635A EP0811235B1 (en) | 1995-12-21 | 1996-10-17 | Process for aligning and sealing field emission displays |
JP52361397A JP4188415B2 (en) | 1995-12-21 | 1996-10-17 | FED array and sealing method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/576,672 US5807154A (en) | 1995-12-21 | 1995-12-21 | Process for aligning and sealing field emission displays |
US08/576,672 | 1995-12-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997023893A1 true WO1997023893A1 (en) | 1997-07-03 |
Family
ID=24305466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1996/016653 WO1997023893A1 (en) | 1995-12-21 | 1996-10-17 | Process for aligning and sealing field emission displays |
Country Status (8)
Country | Link |
---|---|
US (2) | US5807154A (en) |
EP (1) | EP0811235B1 (en) |
JP (1) | JP4188415B2 (en) |
KR (1) | KR100443629B1 (en) |
AU (1) | AU7450896A (en) |
DE (1) | DE69614670T2 (en) |
TW (1) | TW316320B (en) |
WO (1) | WO1997023893A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999039363A1 (en) * | 1998-02-02 | 1999-08-05 | Motorola, Inc. | Method for fabricating a flat panel device |
WO2000051155A1 (en) * | 1999-02-25 | 2000-08-31 | Canon Kabushiki Kaisha | Enclosure and image forming device comprising the same |
WO2002021560A1 (en) * | 2000-09-05 | 2002-03-14 | Motorola, Inc. | Method of sealing field emission devices |
WO2005086197A1 (en) * | 2004-03-10 | 2005-09-15 | Seoul National University Industry Foundation | Method of vacuum-sealing flat panel display using o-ring and flat panel display manufactured by the method |
US7559819B2 (en) | 2001-08-31 | 2009-07-14 | Canon Kabushiki Kaisha | Image display apparatus and production method thereof |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5807154A (en) * | 1995-12-21 | 1998-09-15 | Micron Display Technology, Inc. | Process for aligning and sealing field emission displays |
US6109994A (en) * | 1996-12-12 | 2000-08-29 | Candescent Technologies Corporation | Gap jumping to seal structure, typically using combination of vacuum and non-vacuum environments |
US6129259A (en) * | 1997-03-31 | 2000-10-10 | Micron Technology, Inc. | Bonding and inspection system |
JPH11135018A (en) * | 1997-08-29 | 1999-05-21 | Canon Inc | Manufacture of image formation device, its manufacturing equipment, and image formation device |
US6021648A (en) * | 1997-09-29 | 2000-02-08 | U. S. Philips Corporation | Method of manufacturing a flat glass panel for a picture display device |
KR100273139B1 (en) | 1997-11-25 | 2000-12-01 | 정선종 | A packing method of FED |
DE19817478B4 (en) * | 1998-04-20 | 2004-03-18 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Flat discharge lamp and process for its manufacture |
US6392334B1 (en) | 1998-10-13 | 2002-05-21 | Micron Technology, Inc. | Flat panel display including capacitor for alignment of baseplate and faceplate |
US6328620B1 (en) | 1998-12-04 | 2001-12-11 | Micron Technology, Inc. | Apparatus and method for forming cold-cathode field emission displays |
US6840833B1 (en) * | 1999-01-29 | 2005-01-11 | Hitachi, Ltd. | Gas discharge type display panel and production method therefor |
US6030267A (en) * | 1999-02-19 | 2000-02-29 | Micron Technology, Inc. | Alignment method for field emission and plasma displays |
JP2001210258A (en) * | 2000-01-24 | 2001-08-03 | Toshiba Corp | Picture display device and its manufacturing method |
US6722937B1 (en) | 2000-07-31 | 2004-04-20 | Candescent Technologies Corporation | Sealing of flat-panel device |
JP2002245941A (en) * | 2001-02-13 | 2002-08-30 | Nec Corp | Manufacturing method of plasma display panel |
US6554672B2 (en) | 2001-03-12 | 2003-04-29 | Micron Technology, Inc. | Flat panel display, method of high vacuum sealing |
DE10147728A1 (en) * | 2001-09-27 | 2003-04-10 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Discharge lamp, e.g. dielectric barrier discharge type, with discharge chamber between two discharge vessel plates and electrode set has first discharge vessel plate supported by stabilizing plate on side facing electrode set |
US6988921B2 (en) * | 2002-07-23 | 2006-01-24 | Canon Kabushiki Kaisha | Recycling method and manufacturing method for an image display apparatus |
KR100529071B1 (en) * | 2002-11-26 | 2005-11-15 | 삼성에스디아이 주식회사 | Plasma display panel having sealing structure for reducing noise |
US7285900B2 (en) * | 2003-10-22 | 2007-10-23 | Teco Nanotech Co., Ltd. | Field emission display having self-adhesive frame |
KR20050104550A (en) * | 2004-04-29 | 2005-11-03 | 삼성에스디아이 주식회사 | Electron emission display device |
US7972461B2 (en) * | 2007-06-27 | 2011-07-05 | Canon Kabushiki Kaisha | Hermetically sealed container and manufacturing method of image forming apparatus using the same |
CN105652522B (en) | 2016-04-12 | 2018-12-21 | 京东方科技集团股份有限公司 | Backlight module and preparation method thereof, backboard and display device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1037609A (en) * | 1964-12-03 | 1966-07-27 | Tokyo Shibaura Electric Co | Air tight vessel |
FR2076479A5 (en) * | 1970-01-16 | 1971-10-15 | Elimelekh Jury | |
US4031597A (en) * | 1976-09-22 | 1977-06-28 | Rca Corporation | Method of assembling a mount assembly in the neck of a cathode-ray tube |
GB1482696A (en) * | 1974-10-01 | 1977-08-10 | Mullard Ltd | Pressure bonding method of sealing a glass faceplate to a metal cone of an electron display tube |
US4407658A (en) * | 1981-03-02 | 1983-10-04 | Beckman Instruments, Inc. | Gas discharge display device sealing method for reducing gas contamination |
JPS61250922A (en) * | 1985-04-30 | 1986-11-08 | Sony Corp | Manufacture of cathode-ray tube |
US5157304A (en) * | 1990-12-17 | 1992-10-20 | Motorola, Inc. | Field emission device display with vacuum seal |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5177169A (en) * | 1974-12-27 | 1976-07-03 | Nippon Electric Kagoshima Ltd | TAKETAKEIKOHYOJIKANNOSEIZOHOHO |
US4005920A (en) * | 1975-07-09 | 1977-02-01 | International Telephone And Telegraph Corporation | Vacuum-tight metal-to-metal seal |
JPS53141572A (en) * | 1977-05-17 | 1978-12-09 | Fujitsu Ltd | Manufacture of gas discharge panel |
JPS5536828A (en) * | 1978-09-08 | 1980-03-14 | Hitachi Ltd | Production of liquid crystal display element |
US4245273A (en) * | 1979-06-29 | 1981-01-13 | International Business Machines Corporation | Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices |
US4417296A (en) * | 1979-07-23 | 1983-11-22 | Rca Corp | Method of connecting surface mounted packages to a circuit board and the resulting connector |
US5302328A (en) * | 1983-07-19 | 1994-04-12 | Ceradyne, Inc. | Making hot pressed silicon nitride by use of low density reaction bonded body |
EP0160222B1 (en) * | 1984-04-30 | 1993-01-20 | AlliedSignal Inc. | Novel nickel/indium alloy for use in the manufacture of a hermetically sealed container for semiconductor and other electronic devices |
FR2567684B1 (en) * | 1984-07-10 | 1988-11-04 | Nec Corp | MODULE HAVING A MULTILAYER CERAMIC SUBSTRATE AND A MULTILAYER CIRCUIT ON THE SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF |
JPS62265796A (en) * | 1986-05-14 | 1987-11-18 | 株式会社住友金属セラミックス | Ceramic multilayer interconnection board and manufacture of the same |
JPH02129828A (en) * | 1988-11-10 | 1990-05-17 | Matsushita Electric Ind Co Ltd | Manufacture of image display |
US5519332A (en) * | 1991-06-04 | 1996-05-21 | Micron Technology, Inc. | Carrier for testing an unpackaged semiconductor die |
US5229331A (en) * | 1992-02-14 | 1993-07-20 | Micron Technology, Inc. | Method to form self-aligned gate structures around cold cathode emitter tips using chemical mechanical polishing technology |
US5205770A (en) * | 1992-03-12 | 1993-04-27 | Micron Technology, Inc. | Method to form high aspect ratio supports (spacers) for field emission display using micro-saw technology |
US5210472A (en) * | 1992-04-07 | 1993-05-11 | Micron Technology, Inc. | Flat panel display in which low-voltage row and column address signals control a much pixel activation voltage |
US5329207A (en) * | 1992-05-13 | 1994-07-12 | Micron Technology, Inc. | Field emission structures produced on macro-grain polysilicon substrates |
US5391259A (en) * | 1992-05-15 | 1995-02-21 | Micron Technology, Inc. | Method for forming a substantially uniform array of sharp tips |
US5302238A (en) * | 1992-05-15 | 1994-04-12 | Micron Technology, Inc. | Plasma dry etch to produce atomically sharp asperities useful as cold cathodes |
US5689151A (en) * | 1995-08-11 | 1997-11-18 | Texas Instruments Incorporated | Anode plate for flat panel display having integrated getter |
US5697825A (en) * | 1995-09-29 | 1997-12-16 | Micron Display Technology, Inc. | Method for evacuating and sealing field emission displays |
US5807154A (en) * | 1995-12-21 | 1998-09-15 | Micron Display Technology, Inc. | Process for aligning and sealing field emission displays |
-
1995
- 1995-12-21 US US08/576,672 patent/US5807154A/en not_active Expired - Lifetime
-
1996
- 1996-10-09 TW TW085112375A patent/TW316320B/zh not_active IP Right Cessation
- 1996-10-17 EP EP96936635A patent/EP0811235B1/en not_active Expired - Lifetime
- 1996-10-17 WO PCT/US1996/016653 patent/WO1997023893A1/en active IP Right Grant
- 1996-10-17 DE DE69614670T patent/DE69614670T2/en not_active Expired - Lifetime
- 1996-10-17 JP JP52361397A patent/JP4188415B2/en not_active Expired - Fee Related
- 1996-10-17 AU AU74508/96A patent/AU7450896A/en not_active Abandoned
- 1996-10-17 KR KR1019970705749A patent/KR100443629B1/en not_active IP Right Cessation
-
1998
- 1998-03-02 US US09/033,256 patent/US6036567A/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1037609A (en) * | 1964-12-03 | 1966-07-27 | Tokyo Shibaura Electric Co | Air tight vessel |
FR2076479A5 (en) * | 1970-01-16 | 1971-10-15 | Elimelekh Jury | |
GB1482696A (en) * | 1974-10-01 | 1977-08-10 | Mullard Ltd | Pressure bonding method of sealing a glass faceplate to a metal cone of an electron display tube |
US4031597A (en) * | 1976-09-22 | 1977-06-28 | Rca Corporation | Method of assembling a mount assembly in the neck of a cathode-ray tube |
US4407658A (en) * | 1981-03-02 | 1983-10-04 | Beckman Instruments, Inc. | Gas discharge display device sealing method for reducing gas contamination |
JPS61250922A (en) * | 1985-04-30 | 1986-11-08 | Sony Corp | Manufacture of cathode-ray tube |
US5157304A (en) * | 1990-12-17 | 1992-10-20 | Motorola, Inc. | Field emission device display with vacuum seal |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 011, no. 099 (E - 493) 27 March 1987 (1987-03-27) * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999039363A1 (en) * | 1998-02-02 | 1999-08-05 | Motorola, Inc. | Method for fabricating a flat panel device |
WO2000051155A1 (en) * | 1999-02-25 | 2000-08-31 | Canon Kabushiki Kaisha | Enclosure and image forming device comprising the same |
WO2002021560A1 (en) * | 2000-09-05 | 2002-03-14 | Motorola, Inc. | Method of sealing field emission devices |
US6547618B1 (en) | 2000-09-05 | 2003-04-15 | Motorola, Inc. | Seal and method of sealing field emission devices |
US7559819B2 (en) | 2001-08-31 | 2009-07-14 | Canon Kabushiki Kaisha | Image display apparatus and production method thereof |
WO2005086197A1 (en) * | 2004-03-10 | 2005-09-15 | Seoul National University Industry Foundation | Method of vacuum-sealing flat panel display using o-ring and flat panel display manufactured by the method |
Also Published As
Publication number | Publication date |
---|---|
AU7450896A (en) | 1997-07-17 |
KR19980702352A (en) | 1998-07-15 |
DE69614670D1 (en) | 2001-09-27 |
EP0811235B1 (en) | 2001-08-22 |
US6036567A (en) | 2000-03-14 |
KR100443629B1 (en) | 2004-09-18 |
EP0811235A1 (en) | 1997-12-10 |
TW316320B (en) | 1997-09-21 |
JPH11508397A (en) | 1999-07-21 |
US5807154A (en) | 1998-09-15 |
DE69614670T2 (en) | 2002-06-27 |
JP4188415B2 (en) | 2008-11-26 |
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