WO1997012399A1 - Metal stack for integrated circuit having two thin layers of titanium with dedicated chamber depositions - Google Patents
Metal stack for integrated circuit having two thin layers of titanium with dedicated chamber depositions Download PDFInfo
- Publication number
- WO1997012399A1 WO1997012399A1 PCT/US1996/015351 US9615351W WO9712399A1 WO 1997012399 A1 WO1997012399 A1 WO 1997012399A1 US 9615351 W US9615351 W US 9615351W WO 9712399 A1 WO9712399 A1 WO 9712399A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- titanium
- metal stack
- approximately
- stack
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 45
- 239000002184 metal Substances 0.000 title claims abstract description 45
- 239000010936 titanium Substances 0.000 title claims abstract description 39
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229910052719 titanium Inorganic materials 0.000 title claims abstract description 38
- 238000000151 deposition Methods 0.000 title description 2
- 230000008021 deposition Effects 0.000 title description 2
- 239000004020 conductor Substances 0.000 claims abstract description 26
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 11
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 claims abstract description 11
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 239000006117 anti-reflective coating Substances 0.000 abstract description 11
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 86
- 235000012431 wafers Nutrition 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- OQPDWFJSZHWILH-UHFFFAOYSA-N [Al].[Al].[Al].[Ti] Chemical compound [Al].[Al].[Al].[Ti] OQPDWFJSZHWILH-UHFFFAOYSA-N 0.000 description 4
- 229910021324 titanium aluminide Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 101100107923 Vitis labrusca AMAT gene Proteins 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- WYEMLYFITZORAB-UHFFFAOYSA-N boscalid Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1NC(=O)C1=CC=CN=C1Cl WYEMLYFITZORAB-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- RTAQQCXQSZGOHL-AHCXROLUSA-N titanium-44 Chemical compound [44Ti] RTAQQCXQSZGOHL-AHCXROLUSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
- H01L23/53223—Additional layers associated with aluminium layers, e.g. adhesion, barrier, cladding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to metal stacks used for interconnecting structures in integrated circuits.
- Modem integrated circuits often include millions of active and passive devices such as transistors, capacitors and resistors formed on a semiconductor substrate such as silicon. These devices, when initially fabricated, are isolated from one another on the substrate and are later interconnected to form functional circuits. The quality of these interconnecting structure drastically effects the performance and the reliability of the completed integrated circuit. Interconnections are increasingly determining the limits of performance and densities in modern ultra large scale integrated (ULSI) circuits.
- ULSI ultra large scale integrated
- the interconnecting structure is fabricated from a metal stack which may include a base layer, bulk conductor layer and/or capping layer.
- the stack is formed on a dielectric layer generally by sputtering and then through use of photolithographic techniques is etched to define the interconnecting structure.
- multiple levels of interconnecting structures are used, for example, four layers of metal stacks may be used, each insulated from one another by a interlayer dielectric (ILD). More often than not, aluminum and aluminum alloys are used as the bulk conductor in metal stacks.
- ILD interlayer dielectric
- Electromigration is a significant reliability problem for these thin- film conductors;.
- Aluminum due to its low melting point, is more susceptible to electromigration than are other metals.
- atoms are transported and vacancies are generated at grain boundaries which coalesce into a network of voids. Void nucleation often occurs at the intersection of grain boundaries and conductor sidewalls.
- aluminum-copper alloys selected boundaries remain intact, presumably where they are hardened by copper-rich planar precipitates, resulting in voids with several sharply defined edges. These variously shaped voids continue to enlarge until an open circuit terminates the process.
- Refractory metals are often used in conjunction with aluminum alloys to provide shunting layers, that is, an electrical path even in the presence of these voids.
- titanium and titanium nitride layers are sometimes used as shunting layers.
- Figure 1 shows one prior art metal stack used for an interconnecting structure.
- the metal stack is formed on an interlayer dielectric (ILD) 10.
- the bulk conductor 1 1 comprises an aluminum-copper alloy layer 1 1.
- the thickness of this layer varies depending upon the current that the layer is required to carry; a typical layer may be 350 ⁇ A thick.
- a layer of titanium nitride (TiN) is formed on the upper surface of the layer 1 1.
- This layer in the prior art stack described in Figure 1 is approximately 370A thick.
- a layer 13 of titanium approximately 100 ⁇ A thick is sputtered on to the upper surface of layer 12.
- an anti-reflective coating (ARC) 14 is formed on the upper surface of layer 13.
- This coating is 370A thick for the prior art example shown in Figure 1.
- Figure 2 shows another prior art metal stack used for an interconnecting structure which is formed on an ILD 20.
- a base layer 21 of titanium approximately 1000A thick is formed on the ILD 20.
- an aluminum-copper alloy layer 22 is formed on the upper surface of titanium layer 21.
- the thickness of this layer is, as before, determined by the amount of current that the layer is required to carry (e.g., 6000A to 12000A thick).
- An ARC 23 is formed on the upper surface of layer 22. Again layer 23 comprises a coating of TiN 370A thick
- the present invention provides a different stack than those shown in Figures 1 and 2.
- the newly disclosed metal stack has been found to have superior qualities and, in particular, improved electromigration performance over the metal stacks shown in Figures 1 and 2
- the stack includes a thin base layer of titanium which, is approximately between 125A and 200A thick
- a bulk conductor layer is formed on the upper surface of the base layer
- this layer comprises an aluminum-copper alloy
- a capping layer of titanium approximately between 125A to 200A thick is formed on the upper surface of the bulk conductor layer
- An anti-reflective coating of titanium nitride is formed on the upper surface of the capping layer
- Figure 1 is a cross sectional elevation view of a prior art metal stack used for an interconnecting structure in an integrated circuit
- Figure 2 is a cross sectional elevation view of another prior art metal stack used for an interconnecting structure in an integrated circuit
- Figure 3 is a cross sectional elevation view of a metal stack fabricated in accordance with the present invention
- Figure 4 is a cross sectional elevation view of two metal stacks formed in accordance with the present invention.
- Figure 5 is a plan view of a sputter system used to fabricate the metal stacks of Figures 2 and 3 showing the sequence of wafer movement.
- Figure 6 is a process flow diagram illustrating the steps used to fabricate the metal stack of the present invention
- the present invention describes a novel metal stack for use as an interconnecting structure in an integrated circuit
- numerous specific details are set forth, such as specific materials, processes and equipment in order to provide a thorough understanding of the present invention It will be apparent, however, to one skilled in the art that the present invention may be practiced without these specific details
- well-known manufacturing materials, processes and equipment are not set forth in detail in order not to unnecessarily obscure the present invention
- the metal stack 35 of the present invention is formed on an ILD layer such as ILD 30
- ILD 30 an ILD layer
- well-known photolithographic techniques are used to mask the stack and to etch away portions of the stack so as to form the interconnecting structures as will be discussed
- Vias are used to provide conductive paths between different levels of metal stacks and between the stacks and substrate regions
- One via for use with the metal stack of the present invention is described in a co- pending application entitled “A Novel Via Hole Profile and Method of Fabrication", serial no 327,763, filed October 17, 1994 assigned to the Assignee of the present invention
- the stack 35 illustrated in Figure 3 includes a base layer 31 of titanium which is sputtered in a dedicated chamber onto the ILD layer 30 While titanium is preferred, other refractory metals may be used for this thin layer This shunting layer may be approximately between 125A and 20 ⁇ thick, although 185A is preferred
- a bulk conductor layer 32 which, in one embodiment ,uses an aluminum-copper alloy having approximately 0 5% copper is in contact with the upper surface of the base layer 31
- an aluminum alloy layer is preferred because of its low resistivity and its well-known processes, it is to be appreciated that other low resistance materials may act as the bulk conductor.
- the thickness of the layer 32 is selected as a function of the amount of current that the layer 32 will carry. As will be described in conjunction with Figure 4, the thickness of this layer may be different in one level compared to another in a given integrated circuit. Typical values for the thickness of layer 32 range between approximately 5000A to 20,000A thick.
- a thin capping layer 33 of titanium is formed in contact with the upper surface of the layer 32.
- Layer 33 is sputtered titanium, in a dedicated chamber, preferably approximately 185A thick in the preferred embodiment. However, this layer may be approximately between 125A to 200A thick. Again, as in the case of layer 31 other refractory materials may be used for layer 33.
- ARC anti-reflective coating
- TiN titanium nitride
- TiAl3 titanium aluminide
- 185A of Ti will react with 525A of AICu alloy and result in the formation of approximately 67 ⁇ A of the TiAl3 layer.
- Performance measurements were compared for the metal stack shown in Figure 3 and the prior art stacks shown in Figures 1 and 2.
- the metal stacks of Figure 3 perform better in such areas as via resistance, metal undercutting, voiding, and sheet resistance.
- the stack of Figure 3 proved to be as manufacturable as the prior art stacks.
- the electromigration performance as measured by defect density for the stack of Figure 3 was found to be unexpectedly high when compared to the prior art stacks of Figures 1 and 2.
- the stack of Figure 3 is used at a plurality of different levels. This is partially shown in the cross section of Figure 4.
- a first metal stack 40 is formed on the ILD 43.
- the stack 40 is separated from a second metal stack 42 by an ILD 41 .
- Another ILD is formed on the stack 42 and may support an additional metal stack.
- the stack 40 is patterned into an interconnecting structure using well-known photolithography and etch processes. Any well-known etching techniques such as reactive ion etching (RIE) with a chemistry comprising BCI3 and CI2 can be used to pattern the stack 40 to form the interconnecting structure.
- RIE reactive ion etching
- an ILD 41 is formed over the pattern stack 40 using well-known chemical vapor deposition (CVD). For instance, a doped silicon dioxide layer is deposited to a thickness of approximately 10.000A. Also, as is well-known, the layer 41 is planarized using chemical etching or chemical-mechanical polishing to form a planar surface upon which the stack 42 may be formed.
- CVD chemical vapor deposition
- the stack 42 is then formed on the ILD 41 in the same manner as used to form the stack 35. Intermediate cleaning, via contact processing steps and other well-known steps have not been described.
- the stacks 40 and 42 each may be identical to the stack 35 of Figure 3 except that the thickness of the bulk conductor layer may vary.
- the stack 40 comprises a thin base layer of titanium 44 having a thickness in the preferred embodiment of approximately 185A.
- a bulk conductive layer 45 may have a thickness of, for example, 540 ⁇ A.
- the thin capping titanium layer 46 which, in the preferred embodiment, has a thickness of approximately 185A is formed over the layer 45.
- the ARC coating 47 is then formed on the layer 46.
- the stack 42 is formed beginning with the base layer 48 of approximately 185A of titanium.
- the bulk conductor layer 49 of aluminum-copper alloy which may be thicker for the stack 42 (e.g., 740 ⁇ A) is formed on layer 48.
- the second thin titanium capping layer 50 is formed on layer 49 (approximately 185A thick).
- another ARC coating 50 is formed on the layer 50 for the patterning of the stack 42.
- the metal stack of the present invention is formed using a commercially available cluster sputtering apparatus such as an AMAT 5500, Endura Sputter System.
- cluster sputtering apparatus such as an AMAT 5500, Endura Sputter System.
- Such systems include, as shown in Figure 5, a central region 60 equipped with a robotic arm allowing wafers to be moved from one chamber to another chamber, such as between chambers 61 , 62, 63 and 64.
- Each of the chambers are separately controllable to allow different processing to occur in each of the chambers.
- a wafer is first transported as shown at 66 to a chamber 61.
- the base layer of titanium is first sputtered onto an ILD.
- step 71 which follows the processing of the ILD 70.
- the wafer is next moved to the chamber 63.
- the bulk conductor such as aluminum-copper alloy is deposited on the base layer of titanium. This is shown in Figure 6 by the processing step 72.
- the wafer is moved to the chamber 64 where the capping layer of titanium is formed over the bulk conductor layer. Again as currently preferred, this capping layer is approximately 185A thick.
- the capping layer is shown in Figure 6 by the process step 73.
- step 74 the ARC (TiN coating) is formed over the capping layer of titanium.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980702234A KR19990063767A (en) | 1995-09-29 | 1996-09-25 | Metal lamination for integrated circuits with two chamber-deposited thin titanium layers |
JP9512195A JPH11511593A (en) | 1995-09-29 | 1996-09-25 | Metal stack for integrated circuits with two thin titanium layers in a dedicated chamber |
IL12375196A IL123751A0 (en) | 1995-09-29 | 1996-09-25 | Metal stack for integrated circuit having two thin layers of titanium with dedicated chamber depositions |
EP96933891A EP0852809A4 (en) | 1995-09-29 | 1996-09-25 | Metal stack for integrated circuit having two thin layers of titanium with dedicated chamber depositions |
AU72453/96A AU7245396A (en) | 1995-09-29 | 1996-09-25 | Metal stack for integrated circuit having two thin layers of titanium with dedicated chamber depositions |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53615595A | 1995-09-29 | 1995-09-29 | |
US08/536,155 | 1995-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997012399A1 true WO1997012399A1 (en) | 1997-04-03 |
Family
ID=24137384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1996/015351 WO1997012399A1 (en) | 1995-09-29 | 1996-09-25 | Metal stack for integrated circuit having two thin layers of titanium with dedicated chamber depositions |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0852809A4 (en) |
JP (1) | JPH11511593A (en) |
KR (1) | KR19990063767A (en) |
CN (1) | CN1198252A (en) |
AU (1) | AU7245396A (en) |
IL (1) | IL123751A0 (en) |
WO (1) | WO1997012399A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6337263B1 (en) | 1999-01-27 | 2002-01-08 | Infineon Technologies Ag | Method for improving the quality of metal conductor tracks on semiconductor structures |
DE10053915A1 (en) * | 2000-10-31 | 2002-05-16 | Infineon Technologies Ag | Production of integrated circuit comprises applying metallization layers to circuit substrate, and forming hard mask at predetermined temperature which effects phase conversion |
US6492281B1 (en) * | 2000-09-22 | 2002-12-10 | Advanced Micro Devices, Inc. | Method of fabricating conductor structures with metal comb bridging avoidance |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1324675C (en) * | 2003-04-02 | 2007-07-04 | 旺宏电子股份有限公司 | Structure and method for preventing micro image processing aligning mistake |
CN1316613C (en) * | 2003-06-19 | 2007-05-16 | 旺宏电子股份有限公司 | Sandwich antireflection structural metal layer of semiconductor and making process thereof |
KR100650904B1 (en) * | 2005-12-29 | 2006-11-28 | 동부일렉트로닉스 주식회사 | Method of forming aluminum line |
KR102036942B1 (en) | 2012-02-24 | 2019-10-25 | 스카이워크스 솔루션즈, 인코포레이티드 | Improved structures, devices and methods related to copper interconnects for compound semiconductors |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4673623A (en) * | 1985-05-06 | 1987-06-16 | The Board Of Trustees Of The Leland Stanford Junior University | Layered and homogeneous films of aluminum and aluminum/silicon with titanium and tungsten for multilevel interconnects |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5231053A (en) * | 1990-12-27 | 1993-07-27 | Intel Corporation | Process of forming a tri-layer titanium coating for an aluminum layer of a semiconductor device |
US5300813A (en) * | 1992-02-26 | 1994-04-05 | International Business Machines Corporation | Refractory metal capped low resistivity metal conductor lines and vias |
US5470790A (en) * | 1994-10-17 | 1995-11-28 | Intel Corporation | Via hole profile and method of fabrication |
US6285082B1 (en) * | 1995-01-03 | 2001-09-04 | International Business Machines Corporation | Soft metal conductor |
US5747879A (en) * | 1995-09-29 | 1998-05-05 | Intel Corporation | Interface between titanium and aluminum-alloy in metal stack for integrated circuit |
-
1996
- 1996-09-25 WO PCT/US1996/015351 patent/WO1997012399A1/en not_active Application Discontinuation
- 1996-09-25 JP JP9512195A patent/JPH11511593A/en active Pending
- 1996-09-25 IL IL12375196A patent/IL123751A0/en unknown
- 1996-09-25 EP EP96933891A patent/EP0852809A4/en not_active Withdrawn
- 1996-09-25 CN CN96197259A patent/CN1198252A/en active Pending
- 1996-09-25 KR KR1019980702234A patent/KR19990063767A/en not_active Application Discontinuation
- 1996-09-25 AU AU72453/96A patent/AU7245396A/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4673623A (en) * | 1985-05-06 | 1987-06-16 | The Board Of Trustees Of The Leland Stanford Junior University | Layered and homogeneous films of aluminum and aluminum/silicon with titanium and tungsten for multilevel interconnects |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6337263B1 (en) | 1999-01-27 | 2002-01-08 | Infineon Technologies Ag | Method for improving the quality of metal conductor tracks on semiconductor structures |
US6492281B1 (en) * | 2000-09-22 | 2002-12-10 | Advanced Micro Devices, Inc. | Method of fabricating conductor structures with metal comb bridging avoidance |
DE10053915A1 (en) * | 2000-10-31 | 2002-05-16 | Infineon Technologies Ag | Production of integrated circuit comprises applying metallization layers to circuit substrate, and forming hard mask at predetermined temperature which effects phase conversion |
DE10053915C2 (en) * | 2000-10-31 | 2002-11-14 | Infineon Technologies Ag | Manufacturing process for an integrated circuit |
Also Published As
Publication number | Publication date |
---|---|
AU7245396A (en) | 1997-04-17 |
KR19990063767A (en) | 1999-07-26 |
CN1198252A (en) | 1998-11-04 |
JPH11511593A (en) | 1999-10-05 |
EP0852809A1 (en) | 1998-07-15 |
EP0852809A4 (en) | 1999-09-15 |
IL123751A0 (en) | 1998-10-30 |
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