WO1996016767A1 - Appareil de marquage au laser - Google Patents
Appareil de marquage au laser Download PDFInfo
- Publication number
- WO1996016767A1 WO1996016767A1 PCT/JP1995/002422 JP9502422W WO9616767A1 WO 1996016767 A1 WO1996016767 A1 WO 1996016767A1 JP 9502422 W JP9502422 W JP 9502422W WO 9616767 A1 WO9616767 A1 WO 9616767A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laser
- deflecting
- laser beam
- marking
- branching
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
Definitions
- a required engraving pattern is displayed on a liquid crystal mask, and a laser beam is applied to the workpiece through the liquid crystal mask to mark the engraving pattern on the workpiece.
- one laser oscillator and one marking device constitute one set of laser marking devices, but due to process problems, the waiting time due to inspection or the like is longer than the time required for marking. In this case, there is a problem that the output of the laser oscillator cannot be used efficiently.
- a system is considered in which laser light from one laser oscillator is branched and each of the branched lights is supplied to a plurality of marking devices via a plurality of optical fibers.
- the laser light from the laser oscillator 90 is an optical fiber in which three units are juxtaposed by a deflection mirror 91 that can slide freely in the direction of arrow A.
- the incident light is input to the input lens unit 92.
- the optical fiber-input lens unit 92 has a built-in condenser lens 93 and is connected to the optical fiber 94.
- the laser light can be branched into three optical paths by sliding the deflection mirror 91.
- An object of the present invention is to provide a laser marking device provided with a laser branching device capable of performing a laser marking.
- FIG. 1 is a diagram showing an embodiment of the present invention.
- FIG. 5 is a diagram showing a configuration of a control system of the laser marking device.
- FIG. 8 is a diagram showing a laser branching mode by the laser branching device of FIG. 7;
- FIG. 9 shows a conventional example of a laser branching device.
- FIG. 10 is a diagram showing a conventional technique related to laser branching.
- FIG. 1 shows an embodiment of the present invention.
- a laser beam oscillated from a laser oscillator 1 is time-divided into three laser beams by a laser branching device 2, and then three laser beams are emitted.
- the laser branching device 2 includes an alignment mirror 10, a condenser lens 11, a deflection mirror (or prism) 12, a servo motor 13, a slide mechanism 14 such as a ball screw 14, a guide rail 15, an optical fiber connection unit 16 Etc.
- the condenser lens 11 and the deflecting mirror 12 are fixed to the moving body 17 of the slide mechanism 14, and the condenser lens 11 and the deflecting mirror 12 slide integrally.
- the optical fiber connection unit 16 has connectors 17a to 17c for connecting the optical fibers 3a, 3b, and 3c, and each connection section has a disconnection for detecting the drop of the optical fiber.
- the drop detection sensors 18a to 18c are equipped with the drop detection sensors 18a to 18c, for example, as shown in Fig. 2 (a). The detection output may be turned on), or as shown in FIG.
- a reflective photoelectric sensor PS which receives reflected light when a fiber is connected, and
- the laser beam from the laser oscillator 1 is deflected by an alignment mirror 10 and then a condensing lens 11 1 After being condensed by the mirror, the laser beam is incident on the deflection mirror 12: The laser beam is deflected by the deflection mirror 12 and is incident on the optical fibers 3a to 3c.
- the condenser lens 11 is made to enter the entrance of the optical fiber 1
- the condenser lens is provided at the entrance of the optical fiber 1.
- the branch destination can be changed with a shorter slide movement amount, and the pitch between the optical fibers can be reduced.This makes it possible to switch the branch destination at high speed, In addition, the density of the spatial arrangement of a bundle of fibers can be improved.
- Optical fiber - laser light guided by 3 a the laser beam focused by the beam expander 2 0 which is incident on the beam expander 2 0 and via a laser emission Yuni' sheet 1 9, Y-direction deflection Scanner mirror 2 1 as lens, lens 2 2, polygon mirror 2 as X-direction deflector 2 3, liquid crystal mask 2 5 through lens 24
- the laser beam is raster-scanned on the liquid crystal mask 25 by the sub scanning (Y direction) by the scanner mirror 21 and the main scanning (X direction) by the polygon mirror 23:
- Each of these marking devices 4a to 4c is provided with a light receiving confirmation sensor 40a to 4Oc for confirming that the laser beam has reliably reached each marking device. Detects fiber dropout or wire breakage accident by using 40a to 4Oc
- light reception confirmation sensors 40a to 40c include those shown in FIGS. 4 (a) and 4 (b):
- the laser emitting unit 19 contains a partial mirror 41 that allows approximately 99% of the light to pass, a scattering plate 42, and an optical sensor 43. Then, a part of the laser beam extracted by the partial mirror 41 is detected by the optical sensor 43.That is, when the optical sensor 43 detects light of a predetermined amount or more, it is determined that the laser beam is normal. If not, determine that an accident has occurred, such as dropping or disconnection of the optical fiber:
- an optical sensor 44 is disposed near the liquid crystal mask 25, and the light sensor 44 detects light scattered by the liquid crystal mask.
- the light sensor 44 detects light of a predetermined amount or more, it is determined to be normal; otherwise, it is determined that some kind of accident has occurred.
- Each of the marking devices 4a to 4c is installed together with a work transfer device 53 and a sub operation panel 52 for transferring a work.
- the engraving data creation and storage computer 60 stores the engraving data of each of the marking devices 4a to 4c.
- the engraved data is transferred to the controller 51 at a required point in time.-
- the controller 51 of the main body 50 controls the drive of the slide mechanism 14 of the laser branching device 2 to switch the branch destination and
- the control of transfer of the engraved data to each of the marking devices 4a to 4c, the operation control of each of the marking devices 4a to 4c, and the like are performed.
- the switching control of the branch destination by the controller 51 will be described with reference to FIG.
- a predetermined priority is assigned to each of the marking devices 4a to 4c, and the branch destination is switched according to this priority (in this case, the order of 4a ⁇ 4b-4c). It is carried out
- the controller 51 has a multitasking function, and performs engraving work, transfers engraved data from the engraved data creation / storing computer 60 to the main unit 50, and transmits engraved data from the main unit 50 to each marking device.
- the transfer operation can be performed in parallel, so that the marking data can be transferred to the marking device at any appropriate time, such as when the marking device is in a standby state.
- laser light from a laser oscillator is focused. After that, the laser beam is branched, and the branched laser light is made to enter a plurality of marking devices via the optical fiber, so that the branch destination can be changed with a short moving amount and the optical fiber can be changed.
- the spacing between the branches can be reduced, which allows faster switching of the branching destinations and increases the density of the spatial arrangement of the bundle of fibers:
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP95937203A EP0798067A4 (en) | 1994-11-28 | 1995-11-28 | LASER MARKING DEVICE |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6293337A JPH08150485A (ja) | 1994-11-28 | 1994-11-28 | レーザマーキング装置 |
JP6/293337 | 1994-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996016767A1 true WO1996016767A1 (fr) | 1996-06-06 |
Family
ID=17793511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1995/002422 WO1996016767A1 (fr) | 1994-11-28 | 1995-11-28 | Appareil de marquage au laser |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0798067A4 (ja) |
JP (1) | JPH08150485A (ja) |
KR (1) | KR960017039A (ja) |
WO (1) | WO1996016767A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998053949A1 (en) * | 1997-05-27 | 1998-12-03 | Sdl, Inc. | Laser marking system and method of energy control |
US6275250B1 (en) | 1998-05-26 | 2001-08-14 | Sdl, Inc. | Fiber gain medium marking system pumped or seeded by a modulated laser diode source and method of energy control |
US7015418B2 (en) | 2002-05-17 | 2006-03-21 | Gsi Group Corporation | Method and system for calibrating a laser processing system and laser marking system utilizing same |
US7705268B2 (en) | 2004-11-11 | 2010-04-27 | Gsi Group Corporation | Method and system for laser soft marking |
US8319147B2 (en) * | 2005-09-30 | 2012-11-27 | Hitachi Via Mechanics, Ltd. | Laser machining method and laser machining apparatus |
CN109954982A (zh) * | 2017-12-19 | 2019-07-02 | 东京毅力科创株式会社 | 激光加工装置和激光加工方法 |
IT201800005899A1 (it) * | 2018-05-31 | 2019-12-01 | Apparecchiatura per saldatura laser di materiali plastici e relativo procedimento. | |
CN110722270A (zh) * | 2018-06-29 | 2020-01-24 | 上海微电子装备(集团)股份有限公司 | 激光传输系统、激光切割装置和激光切割方法 |
IT202000003970A1 (it) * | 2020-02-26 | 2021-08-26 | Cemas Elettra S R L | Apparecchiatura per saldatura laser di materiali plastici e relativo procedimento |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3468660B2 (ja) * | 1997-03-27 | 2003-11-17 | 三菱電機株式会社 | レーザビーム分岐装置 |
JP2001105164A (ja) | 1999-10-07 | 2001-04-17 | Sumitomo Heavy Ind Ltd | レーザ穴あけ加工方法及び加工装置 |
KR100350997B1 (ko) * | 1999-12-24 | 2002-08-30 | 금호산업 주식회사 | 레이저빔을 이용한 타이어 마킹장치 |
DE10105878A1 (de) * | 2001-02-09 | 2002-09-12 | Mlt Micro Laser Technology Gmb | Vorrichtung zur Substratbehandlung mittels Laserstrahlung |
JP4664102B2 (ja) * | 2005-03-18 | 2011-04-06 | 東レエンジニアリング株式会社 | 露光装置及び露光方法 |
KR100598521B1 (ko) * | 2005-04-07 | 2006-07-10 | 현대자동차주식회사 | 레이저빔을 이용한 용접장치 |
JP2007167936A (ja) * | 2005-12-26 | 2007-07-05 | Miyachi Technos Corp | 金メッキ剥離方法及び金メッキ剥離装置 |
JP5051686B2 (ja) * | 2006-09-29 | 2012-10-17 | パナソニック デバイスSunx株式会社 | レーザ加工装置及び記憶媒体 |
KR101135537B1 (ko) * | 2010-07-16 | 2012-04-13 | 삼성모바일디스플레이주식회사 | 레이저 조사 장치 |
JP2011034123A (ja) * | 2010-11-19 | 2011-02-17 | Toray Eng Co Ltd | 露光装置及び露光方法 |
DE102011003686A1 (de) | 2011-02-07 | 2012-08-09 | Trumpf Laser- Und Systemtechnik Gmbh | Laserbearbeitungsvorrichtung |
WO2015145609A1 (ja) * | 2014-03-26 | 2015-10-01 | 株式会社島津製作所 | レーザ装置 |
US10423015B2 (en) | 2016-09-29 | 2019-09-24 | Nlight, Inc. | Adjustable beam characteristics |
US10730785B2 (en) | 2016-09-29 | 2020-08-04 | Nlight, Inc. | Optical fiber bending mechanisms |
JP6306659B1 (ja) | 2016-10-19 | 2018-04-04 | ファナック株式会社 | ビーム分配器 |
WO2018102094A1 (en) * | 2016-12-02 | 2018-06-07 | TeraDiode, Inc. | Laser systems utilizing fiber bundles for power delivery and beam switching |
US10916462B2 (en) * | 2017-10-25 | 2021-02-09 | Kla-Tencor Corporation | Laser marking focus feedback system having an intensity indication of reflected radiation passed through an objective lens, a beam splitter and a pinhole |
WO2020241136A1 (ja) * | 2019-05-29 | 2020-12-03 | パナソニックIpマネジメント株式会社 | レーザ加工装置及びそれを用いたレーザ加工方法 |
WO2020241137A1 (ja) * | 2019-05-29 | 2020-12-03 | パナソニックIpマネジメント株式会社 | レーザ加工装置及びそれを用いたレーザ加工方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62292288A (ja) * | 1986-06-11 | 1987-12-18 | Sanoyasu:Kk | Yagレ−ザ−を用いた高速多点スポツト溶接法及びその装置 |
JPH0489193A (ja) * | 1990-07-31 | 1992-03-23 | Toshiba Corp | レーザ加工装置 |
JPH0542379A (ja) * | 1991-08-09 | 1993-02-23 | Komatsu Ltd | Yagレーザマスクマーカ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4838631A (en) * | 1986-12-22 | 1989-06-13 | General Electric Company | Laser beam directing system |
-
1994
- 1994-11-28 JP JP6293337A patent/JPH08150485A/ja active Pending
-
1995
- 1995-11-28 EP EP95937203A patent/EP0798067A4/en not_active Withdrawn
- 1995-11-28 WO PCT/JP1995/002422 patent/WO1996016767A1/ja not_active Application Discontinuation
- 1995-11-28 KR KR1019950044198A patent/KR960017039A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62292288A (ja) * | 1986-06-11 | 1987-12-18 | Sanoyasu:Kk | Yagレ−ザ−を用いた高速多点スポツト溶接法及びその装置 |
JPH0489193A (ja) * | 1990-07-31 | 1992-03-23 | Toshiba Corp | レーザ加工装置 |
JPH0542379A (ja) * | 1991-08-09 | 1993-02-23 | Komatsu Ltd | Yagレーザマスクマーカ |
Non-Patent Citations (1)
Title |
---|
See also references of EP0798067A4 * |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998053949A1 (en) * | 1997-05-27 | 1998-12-03 | Sdl, Inc. | Laser marking system and method of energy control |
US6160568A (en) * | 1997-05-27 | 2000-12-12 | Sdl, Inc. | Laser marking system and method of energy control |
US6489985B1 (en) | 1997-05-27 | 2002-12-03 | Jds Uniphase Corporation | Laser marking system and method of energy control |
US6275250B1 (en) | 1998-05-26 | 2001-08-14 | Sdl, Inc. | Fiber gain medium marking system pumped or seeded by a modulated laser diode source and method of energy control |
US7119351B2 (en) | 2002-05-17 | 2006-10-10 | Gsi Group Corporation | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
US7067763B2 (en) | 2002-05-17 | 2006-06-27 | Gsi Group Corporation | High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
US7015418B2 (en) | 2002-05-17 | 2006-03-21 | Gsi Group Corporation | Method and system for calibrating a laser processing system and laser marking system utilizing same |
USRE41924E1 (en) * | 2002-05-17 | 2010-11-16 | Gsi Group Corporation | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
US7705268B2 (en) | 2004-11-11 | 2010-04-27 | Gsi Group Corporation | Method and system for laser soft marking |
US8319147B2 (en) * | 2005-09-30 | 2012-11-27 | Hitachi Via Mechanics, Ltd. | Laser machining method and laser machining apparatus |
CN109954982A (zh) * | 2017-12-19 | 2019-07-02 | 东京毅力科创株式会社 | 激光加工装置和激光加工方法 |
IT201800005899A1 (it) * | 2018-05-31 | 2019-12-01 | Apparecchiatura per saldatura laser di materiali plastici e relativo procedimento. | |
CN110722270A (zh) * | 2018-06-29 | 2020-01-24 | 上海微电子装备(集团)股份有限公司 | 激光传输系统、激光切割装置和激光切割方法 |
CN110722270B (zh) * | 2018-06-29 | 2021-02-02 | 上海微电子装备(集团)股份有限公司 | 激光传输系统、激光切割装置和激光切割方法 |
IT202000003970A1 (it) * | 2020-02-26 | 2021-08-26 | Cemas Elettra S R L | Apparecchiatura per saldatura laser di materiali plastici e relativo procedimento |
Also Published As
Publication number | Publication date |
---|---|
KR960017039A (ko) | 1996-06-17 |
EP0798067A1 (en) | 1997-10-01 |
EP0798067A4 (en) | 1997-12-10 |
JPH08150485A (ja) | 1996-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO1996016767A1 (fr) | Appareil de marquage au laser | |
JP2910253B2 (ja) | レーザビーム走査装置 | |
US8314921B2 (en) | Exposure apparatus | |
US6580554B2 (en) | Method for beam control in a scanning microscope, arrangement for beam control in a scanning microscope, and scanning microscope | |
CN101971099A (zh) | 加工多器件板的激光器 | |
EP0462842B1 (en) | Laser machining device | |
CN1102796A (zh) | 二氧化碳激光加工装置 | |
CN101905382A (zh) | 激光加工方法、激光加工装置及太阳电池板制造方法 | |
JP3194248B2 (ja) | レーザドリル装置及びレーザ穴あけ加工方法 | |
JPH09159945A (ja) | ミラー角度検出装置及び検出方法 | |
JP4491446B2 (ja) | 周辺露光装置およびその方法 | |
JP2003290943A (ja) | レーザマーカを用いた被覆電線の被覆カット装置及び方法 | |
KR20180094481A (ko) | 레이저 가공 장치 | |
JP4533874B2 (ja) | レーザビーム露光装置 | |
KR101010770B1 (ko) | 패터닝 및 마킹 기능 복합 레이저 장치 및 이를 구비한 복합 레이저 장비 | |
US7521650B2 (en) | Laser machining apparatus | |
CN101859724B (zh) | 具穿透照明的工作台 | |
JP3213884B2 (ja) | レーザドリル装置 | |
JP2555468B2 (ja) | レーザマーキング装置 | |
US5018844A (en) | Passive beam derotator | |
JPH10148514A (ja) | 電子部品検査装置 | |
KR20210082486A (ko) | 레이저 가공 장치 | |
KR20210082485A (ko) | 레이저 가공 장치 | |
WO2020090906A1 (ja) | レーザ加工装置 | |
JPS5965706A (ja) | 位置合せ方法及びその装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CA SG US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
ENP | Entry into the national phase |
Ref country code: US Ref document number: 1997 849193 Date of ref document: 19970527 Kind code of ref document: A Format of ref document f/p: F |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1995937203 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1995937203 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 1995937203 Country of ref document: EP |