WO1995031004A1 - Apparatus for encapsulating with plastic a lead frame with chips - Google Patents

Apparatus for encapsulating with plastic a lead frame with chips Download PDF

Info

Publication number
WO1995031004A1
WO1995031004A1 PCT/NL1995/000163 NL9500163W WO9531004A1 WO 1995031004 A1 WO1995031004 A1 WO 1995031004A1 NL 9500163 W NL9500163 W NL 9500163W WO 9531004 A1 WO9531004 A1 WO 9531004A1
Authority
WO
WIPO (PCT)
Prior art keywords
plunger
encapsulating material
encapsulating
head end
mould
Prior art date
Application number
PCT/NL1995/000163
Other languages
French (fr)
Inventor
Hendrikus Johannes Bernardus Peters
Original Assignee
Fico B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico B.V. filed Critical Fico B.V.
Priority to JP7528858A priority Critical patent/JP2938190B2/en
Priority to DE69531584T priority patent/DE69531584T2/en
Priority to EP95916859A priority patent/EP0708985B1/en
Publication of WO1995031004A1 publication Critical patent/WO1995031004A1/en
Priority to HK98115280A priority patent/HK1014079A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58—Details
    • B29C45/586—Injection or transfer plungers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to an apparatus for encapsulating with plastic lead frames carrying chips, comprising mutually movable mould halves which in the closed position bound a mould cavity for receiving a lead frame, a feed runner con- necting onto the mould cavity for supplying encapsulating material and a plunger-cylinder connected onto this feed runner for carrying up encapsulating material under pressure.
  • Such an apparatus is known from the European patent application 89.203003.2.
  • the problem with apparatus of this type is that despite a close fitting of the plunger in the cylinder there is the danger of liquid encapsulating material running along the wall of the plunger.
  • the cylinder wall is hereby fouled, which results in interruptions in the encapsulating process.
  • the invention has the object of providing a solution to this problem.
  • a peripheral groove is arranged which is connected to the head end by means of at least one flow channel.
  • the flow channel is preferably of swallowtail shape in order to ensure securing of the cured quantity of encapsu ⁇ lating material into the groove.
  • Fig. 1 shows a perspective view with broken away parts of the apparatus according to the invention
  • Fig. 2 shows on large scale a detail of the lowermost part of the apparatus of fig. 1, 15 Fig. 3 and 4 are cross sectional views of the plungei? and the plunger driving drive rod,
  • Fig. 5 shows a view of the head end of the plunger according to the invention.
  • Fig. 6 is a cross sectional view of an alternative 20 embodiment of the invention.
  • the table 101 bears a fixed lower 25 mould half 102.
  • the upper mould half 103 is movable relative to the lower half 102 using pull rods 104, 105 which are connected to the upper half 103 by the respective nut connections, 106, 107.
  • the pull rods 104, 105 are movable relative to the fixed table 101 via bearings, for example 30 108.
  • the driving of the upper half of the mould 103 takes place from an electric motor 109.
  • the angle lever systems 111, 112 are driven by means of the worm box 110.
  • the angle lever systems are coupled on the one side to a movable 35 underplate 113 and on the other side to a plate 116 fixedly connected to the table 101 by means of columns 114, 115.
  • the electric motor rotates the underplate 113 is moved vertically, for example in the direction of the arrow PI, which movement is transmitted via the pull rods 104, 105 onto the upper mould half 103.
  • the arms of the angle lever system 111, 112 lie practically in one line so that a very great closing force is achieved.
  • the input carriage 117 is movable over the guide rails 118, 119.
  • the driving of the input carriage 117 takes place from the electric motor 120.
  • Lead frames are supplied from a supply cassette and are carried up over belts 122, 123 as far as a stop 124.
  • the input carriage is filled from a so-called pellet-filling carriage 125 with pellet-shaped encapsulating material which is taken from a supply reservoir 126.
  • pellet-filling carriage 125 With pellet-shaped encapsulating material which is taken from a supply reservoir 126.
  • the cleaning-discharge unit 129 is likewise movable over the rails 118, 119 between the position outside the mould die and the position inside the mould die.
  • the unit 129 consists of a cleaning-brushing apparatus 130 and a discharge member 131.
  • the cleaning apparatus 130 brushes both mould halves after use and simultaneously sucks up brushed-off remnants.
  • Co-acting with the unit is a break-off plate 132 which subjects the finished product to an after- processing.
  • the cavities 133 in the lower half 102 of the mould are each provided with a plunger 134 which is biased by a spring 135 such that the position of the plunger is adapted to the quantity of encapsulating material in the relevant cavities 133.
  • the plungers are driven from an electric motor which drives a screwed rod 137 via the speed control 136.
  • a nut 138 is placed on the screwed rod so that the rotating movement is converted into a vertically directed movement of the frame 139.
  • Fixedly coupled to the frame are the drive rods 140, 141 for the plunger bracket 142 which in turn drives the plungers.
  • Pellet-shaped encapsulating material is compressed during the ascending movement of the plunger 175 and trans ⁇ ported via a runner to the cavity 145 in the lower half of the mould where the chip is arranged.
  • the plunger 175 is provided at a relatively short distance from the head end with a groove 170 which is connected to the head end by means of flow channels, for instance 171, 172.
  • the flow channels 171, 172 preferably take a swallowtail form, thus preventing breaking away and fouling due to the breaking away of the encapsulating material.
  • the plunger 175 is provided with helical grooves, the depth of which increases as seen from the drive side of the plunger 175.
  • the drive rod 174 of plunger 175 is connected to plunger 175 by means of welds 176.
  • the apparatus operates as follows. When a production stroke is performed a pellet- shaped piece of encapsulating material is placed on the head end of the plunger 175. When the stroke is performed the encapsulating material becomes plastic and moves through the flow channels 171, 172 to the groove 170 in the plunger 175. The groove 170 is wholly filled. When the product is ejected the groove 170 of plunger 175 rises above the cylinder such that during the return stroke the material in the groove 170 is scraped off on the sharp cylinder edge.
  • a number of cleaning strokes can be carried out as desired, wherein the plunger 175 rises each time above the cylinder wall and a scraping action is there- fore performed on the material in the groove 170 of plunger 175.
  • the number of non-operational strokes is chosen between one and six.
  • the encapsulating material will be able to flow down ⁇ ward along the plunger wall as far as the groove 170 due to the clearance between cylinder wall and plunger 175 and thereby once again replenish the scraped-off, cured layer in the groove 170.
  • the replenished layer in groove 170 thus forms a sealant between the plunger 175 and the inner wall of the cylinder.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

The invention relates to an apparatus for encapsulating with plastic lead frames carrying chips, comprising mutually movable mould halves (102, 103) which in the closed position bound a mould cavity for receiving a lead frame, a feed runner connecting onto the mould cavity for supplying encapsulating material and a plunger-cylinder (175) connected onto this feed runner for carrying up encapsulating material under pressure, characterized in that at a distance from the head end of the plunger (175) a peripheral groove (170) is arranged which is connected to the head end by means of at least one flow channel (171).

Description

APPARATUS FOR ENCAPSULATING WITH PLASTIC A LEAD FRAME WITH CHIPS
The invention relates to an apparatus for encapsulating with plastic lead frames carrying chips, comprising mutually movable mould halves which in the closed position bound a mould cavity for receiving a lead frame, a feed runner con- necting onto the mould cavity for supplying encapsulating material and a plunger-cylinder connected onto this feed runner for carrying up encapsulating material under pressure. Such an apparatus is known from the European patent application 89.203003.2. The problem with apparatus of this type is that despite a close fitting of the plunger in the cylinder there is the danger of liquid encapsulating material running along the wall of the plunger. The cylinder wall is hereby fouled, which results in interruptions in the encapsulating process. The invention has the object of providing a solution to this problem. This is achieved according to the invention in that at a distance from the head end of the plunger a peripheral groove is arranged which is connected to the head end by means of at least one flow channel. With the steps according to the invention the following is achieved. When a production stroke is performed and a pellet-shaped piece of encapsulating material is placed on the plunger head, which material becomes fluid through exerting of pressure and under the influence of heat, the encapsulating material will reach and fill the peripheral groove through the flow channels. The filled groove then serves as sealant of the plunger relative to the inner wall of the cylinder. At the end of the production stroke the plunger moves outside the upper edge of the cylinder. During the return movement the outer layer of the groove will be scraped off by the scraping edge of the cylinder. During a subsequent production stroke encapsulating material will be able to move through the clearance between the plunger and the inner wall of the cylinder and once again replenish the scraped-off outer layer of the encapsulating material in the groove.
A self-regulating sealing system is thus obtained. 5 The flow channel is preferably of swallowtail shape in order to ensure securing of the cured quantity of encapsu¬ lating material into the groove.
Further advantages and special features will become apparent from the description following hereinbelow of the 10 drawings, in which:
Fig. 1 shows a perspective view with broken away parts of the apparatus according to the invention,
Fig. 2 shows on large scale a detail of the lowermost part of the apparatus of fig. 1, 15 Fig. 3 and 4 are cross sectional views of the plungei? and the plunger driving drive rod,
Fig. 5 shows a view of the head end of the plunger according to the invention, and
Fig. 6 is a cross sectional view of an alternative 20 embodiment of the invention.
A description of the moulding apparatus according to the invention will be given with reference to fig. 1 and 2.
Mounted on the frame 100 of the machine is a fixedly positioned table 101. The table 101 bears a fixed lower 25 mould half 102. The upper mould half 103 is movable relative to the lower half 102 using pull rods 104, 105 which are connected to the upper half 103 by the respective nut connections, 106, 107. The pull rods 104, 105 are movable relative to the fixed table 101 via bearings, for example 30 108.
The driving of the upper half of the mould 103 takes place from an electric motor 109. The angle lever systems 111, 112 are driven by means of the worm box 110. The angle lever systems are coupled on the one side to a movable 35 underplate 113 and on the other side to a plate 116 fixedly connected to the table 101 by means of columns 114, 115. When the electric motor rotates the underplate 113 is moved vertically, for example in the direction of the arrow PI, which movement is transmitted via the pull rods 104, 105 onto the upper mould half 103. At the end of the stroke the arms of the angle lever system 111, 112 lie practically in one line so that a very great closing force is achieved. The input carriage 117 is movable over the guide rails 118, 119. The driving of the input carriage 117 takes place from the electric motor 120.
Lead frames are supplied from a supply cassette and are carried up over belts 122, 123 as far as a stop 124. During the position of the input carriage outside the mould the input carriage is filled from a so-called pellet-filling carriage 125 with pellet-shaped encapsulating material which is taken from a supply reservoir 126. For a reliable take¬ over of pellet-shaped encapsulating material by the input carriage 117 from the pellet transporting carriage 125 use is made in both carriages of pin-shaped guiding means 127. The mutual movements are controlled using a sensor 128.
The cleaning-discharge unit 129 is likewise movable over the rails 118, 119 between the position outside the mould die and the position inside the mould die. The unit 129 consists of a cleaning-brushing apparatus 130 and a discharge member 131. The cleaning apparatus 130 brushes both mould halves after use and simultaneously sucks up brushed-off remnants. Co-acting with the unit is a break-off plate 132 which subjects the finished product to an after- processing.
As can be seen in fig. 2, the cavities 133 in the lower half 102 of the mould are each provided with a plunger 134 which is biased by a spring 135 such that the position of the plunger is adapted to the quantity of encapsulating material in the relevant cavities 133. The plungers are driven from an electric motor which drives a screwed rod 137 via the speed control 136. A nut 138 is placed on the screwed rod so that the rotating movement is converted into a vertically directed movement of the frame 139. Fixedly coupled to the frame are the drive rods 140, 141 for the plunger bracket 142 which in turn drives the plungers. Pellet-shaped encapsulating material is compressed during the ascending movement of the plunger 175 and trans¬ ported via a runner to the cavity 145 in the lower half of the mould where the chip is arranged. According to the invention the plunger 175 is provided at a relatively short distance from the head end with a groove 170 which is connected to the head end by means of flow channels, for instance 171, 172. The flow channels 171, 172 preferably take a swallowtail form, thus preventing breaking away and fouling due to the breaking away of the encapsulating material. According to an alternative embodi¬ ment the plunger 175 is provided with helical grooves, the depth of which increases as seen from the drive side of the plunger 175. The drive rod 174 of plunger 175 is connected to plunger 175 by means of welds 176.
The apparatus according to the invention operates as follows. When a production stroke is performed a pellet- shaped piece of encapsulating material is placed on the head end of the plunger 175. When the stroke is performed the encapsulating material becomes plastic and moves through the flow channels 171, 172 to the groove 170 in the plunger 175. The groove 170 is wholly filled. When the product is ejected the groove 170 of plunger 175 rises above the cylinder such that during the return stroke the material in the groove 170 is scraped off on the sharp cylinder edge. After performing of the production stroke a number of cleaning strokes can be carried out as desired, wherein the plunger 175 rises each time above the cylinder wall and a scraping action is there- fore performed on the material in the groove 170 of plunger 175. In practice the number of non-operational strokes is chosen between one and six. During a subsequent production stroke the encapsulating material will be able to flow down¬ ward along the plunger wall as far as the groove 170 due to the clearance between cylinder wall and plunger 175 and thereby once again replenish the scraped-off, cured layer in the groove 170. The replenished layer in groove 170 thus forms a sealant between the plunger 175 and the inner wall of the cylinder.
*****

Claims

1. Apparatus for encapsulating with plastic lead frames carrying chips, comprising mutually movable mould halves which in the closed position bound a mould cavity for receiving a lead frame, a feed runner connecting onto the mould cavity for supplying encapsulating material and a plunger-cylinder connected onto this feed runner for carrying up encapsulating material under pressure, charac¬ terized in that at a distance from the head end of the plunger a peripheral groove is arranged which is connected to the head end by means of at least one flow channel.
2. Apparatus as claimed in claim 1, characterized in that the flow channel is of swallowtail shape in cross section.
3. Apparatus as claimed in claims 1-2, characterized in that the outer wall of the plunger is provided with helically running grooves and that the depth of the grooves increases as seen from the drive side of the plunger.
4. Apparatus as claimed in claims 1-3, characterized in that the plunger is connected to a drive by means of welds.
*****
PCT/NL1995/000163 1994-05-09 1995-05-04 Apparatus for encapsulating with plastic a lead frame with chips WO1995031004A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP7528858A JP2938190B2 (en) 1994-05-09 1995-05-04 Apparatus for plastically encapsulating lead frames with chips
DE69531584T DE69531584T2 (en) 1994-05-09 1995-05-04 ARRANGEMENT FOR ENCLOSURE A FRAME FOR PLASTIC CHIPS
EP95916859A EP0708985B1 (en) 1994-05-09 1995-05-04 Apparatus for encapsulating with plastic a lead frame with chips
HK98115280A HK1014079A1 (en) 1994-05-09 1998-12-23 Apparatus for encapsulating with plastic a lead frame with chips

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9400768 1994-05-09
NL9400768A NL9400768A (en) 1994-05-09 1994-05-09 Device for enclosing a lead frame with chips in plastic.

Publications (1)

Publication Number Publication Date
WO1995031004A1 true WO1995031004A1 (en) 1995-11-16

Family

ID=19864176

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL1995/000163 WO1995031004A1 (en) 1994-05-09 1995-05-04 Apparatus for encapsulating with plastic a lead frame with chips

Country Status (8)

Country Link
EP (1) EP0708985B1 (en)
JP (1) JP2938190B2 (en)
KR (1) KR100426198B1 (en)
DE (1) DE69531584T2 (en)
HK (1) HK1014079A1 (en)
NL (1) NL9400768A (en)
TW (1) TW261570B (en)
WO (1) WO1995031004A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1004460C2 (en) * 1996-11-06 1998-05-08 Fico Bv Ejector pin, molded part and mold for encapsulating electronic components as well as a method for sealing an interspace.
EP1030349B2 (en) † 1999-01-07 2013-12-11 Kulicke & Soffa Die Bonding GmbH Method and apparatus for treating electronic components mounted on a substrate, in particular semiconductor chips
CN116631927A (en) * 2023-07-19 2023-08-22 广州丰江微电子有限公司 Lead frame conveying system with cleaning function

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1026000C2 (en) * 2004-04-22 2005-10-25 Fico Bv Plunger, encapsulating device and method for sealing a connection of a plunger to a plunger housing.
JP5484209B2 (en) * 2010-06-15 2014-05-07 パナソニック株式会社 Transfer molding method and transfer molding apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6341035A (en) * 1986-08-06 1988-02-22 Mitsubishi Electric Corp Resin-seal molding equipment for semiconductor device
WO1993011925A1 (en) * 1991-12-17 1993-06-24 Asm-Fico Tooling B.V. Scraping plunger

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6341035A (en) * 1986-08-06 1988-02-22 Mitsubishi Electric Corp Resin-seal molding equipment for semiconductor device
WO1993011925A1 (en) * 1991-12-17 1993-06-24 Asm-Fico Tooling B.V. Scraping plunger

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 254 (E - 634) 16 July 1988 (1988-07-16) *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1004460C2 (en) * 1996-11-06 1998-05-08 Fico Bv Ejector pin, molded part and mold for encapsulating electronic components as well as a method for sealing an interspace.
WO1998019845A2 (en) * 1996-11-06 1998-05-14 Fico B.V. Sealing ejectorpin
US6179599B1 (en) 1996-11-06 2001-01-30 Fico B.V. Sealing ejector pin
WO1998019845A3 (en) * 1996-11-06 2002-10-03 Fico Bv Sealing ejectorpin
EP1030349B2 (en) † 1999-01-07 2013-12-11 Kulicke & Soffa Die Bonding GmbH Method and apparatus for treating electronic components mounted on a substrate, in particular semiconductor chips
CN116631927A (en) * 2023-07-19 2023-08-22 广州丰江微电子有限公司 Lead frame conveying system with cleaning function
CN116631927B (en) * 2023-07-19 2024-02-02 广州丰江微电子有限公司 Lead frame conveying system with cleaning function

Also Published As

Publication number Publication date
TW261570B (en) 1995-11-01
EP0708985A1 (en) 1996-05-01
HK1014079A1 (en) 1999-09-17
EP0708985B1 (en) 2003-08-27
DE69531584D1 (en) 2003-10-02
KR100426198B1 (en) 2004-06-11
NL9400768A (en) 1995-12-01
JPH09500496A (en) 1997-01-14
JP2938190B2 (en) 1999-08-23
DE69531584T2 (en) 2004-06-24
KR960704355A (en) 1996-08-31

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