WO1993017860A1 - Cyanate ester microwave circuit material - Google Patents
Cyanate ester microwave circuit materialInfo
- Publication number
- WO1993017860A1 WO1993017860A1 PCT/US1993/002277 US9302277W WO9317860A1 WO 1993017860 A1 WO1993017860 A1 WO 1993017860A1 US 9302277 W US9302277 W US 9302277W WO 9317860 A1 WO9317860 A1 WO 9317860A1
- Authority
- WO
- Grant status
- Application
- Patent type
- Prior art keywords
- material
- substrate
- circuit
- cyanate
- ester
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers, i.e. products comprising layers having different physical properties and products characterised by the interconnection of layers
- B32B7/04—Layered products characterised by the relation between layers, i.e. products comprising layers having different physical properties and products characterised by the interconnection of layers characterised by the connection of layers
- B32B7/12—Layered products characterised by the relation between layers, i.e. products comprising layers having different physical properties and products characterised by the interconnection of layers characterised by the connection of layers using an adhesive, i.e. any interposed material having adhesive or bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Impregnation or embedding of a layer; Bonding a fibrous, filamentary or particulate layer by using a binder
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Impregnation or embedding of a layer; Bonding a fibrous, filamentary or particulate layer by using a binder
- B32B2260/04—Impregnation material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
Abstract
Description
CYANATE ESTER MICROWAVE CIRCUIT MATERIAL
Background of the Invention:
This invention relates generally to microwave circuit materials. More particularly, this invention relates to a new and improved microwave circuit
material comprising a non-woven fiberglass web
impregnated with a cyanate ester matrix and filled with a particulate filler material. This cyanate ester based microwave circuit material exhibits a low
dissipation factor of less than 0.008, has a dielectric constant (K') which can be manipulated and tailored in the range between 3 and at least 10, and has a
relatively low cost. Preferably, this circuit material is also formulated to be flame retardant.
Microwave circuit materials are well known and are used in a large number of applications. Certain military and other demanding commercial applications require the use of relatively expensive fluoropolymer based microwave circuit materials. However, there is a developing need for lower cost microwave materials for less demanding commercial and consumer uses such as, for example, antennas for wireless communication in the home or office; or in connection with cellular
communications.
Presently available lower cost microwave materials include epoxy based FR-4 materials, polyimide based materials, cyanate ester/woven glass materials and bismaleimide triazine based materials. In microwave applications, the electrical property known as
dissipation factor (Df) is important, with lower values of Df providing improved performance. Unfortunately, epoxy, polyimide and cyanate ester/woven glass
microwave circuit materials exhibit less than desirable Df values .of generally 0.024, 0.021 and 0.009,
respectively. While bismaleimide triazine based materials (BT resins from Mitsubishi Gas Chemical
Company) exhibit Df values in the range of
0.0015-0.0140, the material versions which have a low Df are problematic from the standpoint of having a glass transition temperature under 200°C. Another drawback of all the above woven glass reinforced circuit materials, is the fact that their Z-axis coefficient of thermal expansion is much higher (50-70 ppm/°C) than the desirable 16 ppm/°C value of
copper.
Summary of the Invention:
The above-discussed and other drawbacks and deficiencies of the prior art are overcome or
alleviated by the microwave circuit material of the present invention. In accordance with the present invention, a new and improved laminated microwave circuit material comprises a non-woven glass web (5 to 20 vol. %) impregnated with a cyanate ester resin (35 to 68 vol. %) and filled with a low dielectric constant (e.g., silica) or high dielectric constant (e.g., titania, alumina or other suitable materials)
particulate filler (25-55 vol. %) or mixtures of high and low dielectric constant fillers (e.g., silica, titania, alumina or other suitable materials) for intermediate dielectric constant levels. Preferably, the filler is coated with a material which renders the filler hydrophobic such as silane, titanate or
zirconate coatings. This circuit material is
preferably formulated to be flame retardant.
The microwave circuit material of the present invention has many features and advantages relative to prior art microwave materials including prior art cyanate ester/woven glass materials. For example, the combination of resin, non-woven glass web and filler provides a low dissipation factor (Df) of less than 0.008 thereby permitting the material of the present invention to be used in relatively demanding consumer and commercial applications (and some less demanding military applications).
The use of a non-woven glass web (5 to 20 vol. %) is a critical feature of this invention as it permits the final laminate to obtain a wide range of cyanate ester resin (35 to 68 vol. %) and a relatively large amount of particulate filler (25 to 55 vol. %). In contrast, prior art woven glass webs are not suitable or useful with the present invention as woven glass will not permit the relatively large amounts of filler associated with the present invention. In addition, nonwoven webs provide significant improvements to woven webs in that woven webs tend to propagate fractures along the woven glass layers while nonwoven webs, due to the random nature of the fiber's direction, do not exhibit such tendency for fracture propagation. The reduction in fracture propagation using the nonwoven web of this invention leads to improved (e.g., faster and more reliable) drilling (for feature formation) since the tendency of the woven glass to fracture requires slower drilling to avoid cracks and fractures between the woven glass layers.
The ability to include a relatively wide volume range of cyanate ester resin and large amounts of particulate filler to the laminated microwave circuit material of this invention is important for several reasons. First, while the cyanate ester is a
relatively expensive resin, the use of this resin in a range of 35 to 68 vol. % leads to relatively low Df of less than 0.008. This low Df is important,
particularly when compared to higher Df associated with prior art epoxy, polyimide and cyanate ester/woven web microwave circuit materials. Second, the use of particulate filler in the range of 25 to 55 vol. % is important in that (a) the large amount of filler provides the ability to specifically tailor the final dielectric constant of the laminate in the range of 3 to at least 10 or higher; (b) the large amount of filler lowers the coefficient of thermal expansion (CTE) of the substrate in the z direction to improve the plated throughole reliability; (c) the large content of the relatively inexpensive filler lowers the required amount of cyanate ester thereby lowering the overall cost of the final laminate; and (d) the
particulate filler acts to arrest any crack or fracture propagation.
The above-discussed and other features and
advantages of the present invention will be appreciated and understood by those skilled in the art from the following detailed description and drawings.
Brief Description of the Drawings:
Referring now to the drawings, wherein like elements are numbered alike in the several FIGURES: FIGURE 1 is a cross-sectional elevation view of a microwave circuit laminate in accordance with the present invention; and
FIGURE 2 is a cross-sectional elevation view of a multilayer circuit laminate in accordance with the present invention.
Description of the Preferred Embodiment:
Referring to FIGURE 1, the present invention comprises a microwave circuit material 10 composed of a substrate 12 laminated on one or both outer planar surfaces to a foil of conductive material 14, 14'
(generally copper). Substrate 12 comprises a non-woven glass web impregnated with a cyanate ester resin and filled with particulate filler material. Preferably, substrate 12 also includes flame retarding compounds, a catalyst system for curing the cyanate ester resin, and a hydrophobic coating on the particulate filler.
The cyanate ester resin is present in an amount of 35 to 68 vol. % with respect to the volume of substrate 12. The cyanate ester resin used in this invention is from the family of aryl dicyanate monomers and their prepolymers containing the ring-forming cyanate
(O-C≡N) functional group, and more particularly is an ester of bisphenols and cyanic acid which
cyclotrimerize to substituted triazine rings upon heating. Curing of the cyanate ester resin forms a thermoset plastic comprising three dimensional networks of oxygen-linked triazine rings and bisphenol units (termed polycyanurates). In accordance with the present invention, three particularly advantageous and preferred cyanate ester resins are Quatrex 7187 resin available from Dow Plastics, REX 366 resin and
derivatives (such as REX 379) available from
Rhone-Poulene, Inc. (now Ciba-Geigy, Inc.) and the AroCy B resin family (such as B-50) also available from Ciba-Geigy Corp.
The fibrous carrier used in this invention must be a non-woven web (as opposed to a woven web or fabric) in order to absorb (or carry) large amounts of resin and particulate filler. In addition, the non-woven web must be made of primarily glass fibers (as opposed to polymeric fibers) to maintain a sufficiently low Df (less than 0.008), to be thermally stable during solder reflow operations and to also maintain a low materials cost. The non-woven glass web is present in an amount of 5-20 vol. % with respect to the volume of the substrate 12. The non-woven glass fiber is preferably E-glass or D-glass and a particularly preferred and advantageous non-woven glass fiber web is Viledon Style T 1786 or T 1792 available from Freudenberg Nonwovens, Viledon Industrial Products Div., Chelmsford,
Massachusetts.
The particulate filler is present in an amount of 25-55 vol. % and is selected to manipulate the K' of the microwave circuit material 10 to be either in the range of 3 to at least 10 or higher. The particulate filler used in the present invention must be
electrically non-conductive. A suitable low K' filler preferably comprises fused silica (Si0„) particles. In general, the particle size cutoff should be less than 60 microns and more preferably less than 45 microns. By "cut-off size", it is meant the largest detectable equivalent spherical diameter (e.g., overall average diameter) of each particle. The shape of the particles may vary and is not critical to the
functioning of the microwave circuit material of this invention. Two particularly preferred and advantageous silica filler particles are Denka spherical type FB-35 available from Performance Materials Division of Denki Kagaku Kogyo Kabushiki Kaisha, Tokyo, Japan and GP-7I available from Harbison-Walker Refractories, Calhoun, Georgia. A high K' filler preferably comprises titania (TiO2), alumina, barium nanotitanate or barium
tetratitanate. The high K' fillers similarly have a particle size cut-off of less than 60 microns,
preferably less than 45 microns. Particularly
preferred and advantageous high K' fillers include TiOnia VC available from SCM Chemicals.
In addition to manipulating the K' and the Df of the circuit laminate, the particulate filler also lowers the coefficient of thermal expansion (CTE) of the substrate 12 in the z direction. The CTE of the filler and the composition of the dielectric is
selected such that the filler will lower the CTE in the Z direction of substrate 12 close to 16 pρm/°C.
Typical CTE values of the circuit material of the present invention are 30-35 ρpm/°C. These low CTE fillers provide improved plated through hole
reliability.
Preferably, the filler particles are coated with a material which renders the filler hydrophobic and therefore lessens the water absorption of the circuit material 10. Suitable hydrophobic coatings are silane, titanate and zirconate coatings. Examples of specific silanes, titanates and zirconates useful in the present invention are described in coassigned U.S. Patent Nos . 4,849,284 and 5,024,871 as well as U.S. Application S.N. 279,474 filed December 2, 1988 (now U.S.
Patent ), all of which are incorporated herein by reference. These coating materials also provide improvements to circuit fabrication processes such as plating and etching. The hydrophobic material is initially coated onto the particulate filler in an amount of about 1 to 2 weight % with respect to the filler particles. The curing of the cyanate ester resin requires a catalyst. Preferably, this catalyst is cobalt
acetylacetonate or manganese acetylacetonate, either of which is combined with nonyl phenol co-catalyst. An effective amount of catalyst used to catalize curing of the cyanate ester is in the range of 50 to 150 ppm of the active metal ion with respect to the cyanate ester resin. Preferably, 100 ppm of catalyst is used. The preferred co-catalyst amount is 2% relative to the reactive cyanate ester resin components.
Aromatic brominated compounds are added to the formulation to render the dielectric material flame retardant. Such compounds are decabromo-di phenyl oxide (Saytex 102), tetradecabromo-diphenoxy benzene (Saytex 120), and ethylene bis-tetrabromo phthalimide (Saytex BT-93) all from Ethyl Corporation. The brominated compounds are present in an amount of 2-4 vol. %. Preferably, the flame retardant is used in an amount effective to obtain a flammability rating or class of 94V-0.
Substrate 12 has a thickness of about 0.005 to 0.060 inch (preferably 0.02 to 0.03 inch) while conductive sheets 14, 14' may range in thickness between 18 micron and 70 micron. Substrate 12 is a rigid material with a Tg in the range of 180 to
260°C. This high Tg is advantageous in that the CTE of a glassy material is about 5 times smaller than the CTE in the rubbery state; and is comparatively higher than the Tg of typical epoxy based microwave circuit materials (about 130ºC).
The microwave circuit material of the present invention is preferably made from the following lamination process: PROCESS
The cyanate ester in solution (typically 85% solids in MEK or methylene chloride) is first mixed with the catalyst system at room temperature, to thoroughly dissolve the catalyst and the co-catalyst in the resin solution. The particulate filler or mixture of fillers and the flame retarding compounds are then added to the resin, and thoroughly mixed to form a homogenous suspension. The particulate filled cyanate ester resin is then combined with the non-woven web by using one of several processes including: extrusion, casting or calendering. The saturated web is then passed through an oven at about 170°C to completely remove the solvent, and to B-stage the cyanate ester resin. Curing of the dielectric between two sheets of copper is carried out in a flat bed lamination press, at 170-180°C for about one hour. Post curing is invoked at 225°C for 1-3 hours.
The following non-limiting examples for the present invention are set forth below in Examples 1-17:
The circuit composite laminate described above is also well suited for use in the manufacture of
multilayer circuits. In the case of multilayer
circuits, one or more discrete layers of bond plys (B-staged sheets) are stacked between sheets of the above-described cyanate ester based microwave circuit laminate. Lamination conditions depend upon the multilayer circuit features (e.g., througholes, vias, circuit lines, pads, etc.) and the type of conductive material (e.g., copper) and thickness (e.g., one ounce, two ounce, etc.).
Preferably, the bonding ply is a cyanate ester pre-preg (or B-stage) composite of the type described herein optionally differing only in a lower particulate filler concentration (as low as 10%) and also a lower catalyst concentration (as low as 10 ppm). Lower filler concentrations provide improved flow leading to improved bonding; while lower catalyst concentrations are designed to control the resin polymerization during initial manufacturing of the bond ply (B-stage
prepreg). Thus, the composition of a bonding ply in accordance with the present invention will be in the same ranges as described above with the exception that the filler range is 10-55% and the catalyst
concentration is 10-150 ppm.
Manufacture of the bonding ply of this invention is essentially similar to the manufacture of the circuit laminate of this invention wherein a continuous
lamination process is utilized. The manufacturing process for the bonding ply uses a carrier sheet which serves as a release material. This carrier sheet may be a silicone coated paper, a polymeric film or any other suitable carrier. Examples of suitable polymeric films are polyimide film (e.g., Kapton film from
DuPont) or polyester film (e.g., Mylar film from
DuPont). Turning now to FIGURE 2, a multilayer microwave circuit board in accordance with the present invention is shown generally at 16. Multilayer board 16
comprises a plurality of layers of substrate material 18, 20 and 22, all of which are comprised of an
electrical substrate material in accordance with the present invention. Each substrate layer 18, 20 and 22 has a conductive pattern 24, 26, 28, and 30,
respectively thereon. Note that a substrate layer having a circuit pattern thereon defines a circuit substrate. Vias 32 and 34 interconnect selected circuit patterns in a known manner.
In accordance with the present invention, separate sheets 36 and 38 of substrate material having a
composition in accordance with the prepreg formulation of the present invention are used as an adhesive or bond ply to laminate individual circuit substrates together. In a preferred method of forming such a laminate, a stack-up of circuit substrates alternated with one or more layers of the bond ply is made. This stack-up is then cured at a sufficient temperature and pressure whereby the entire multilayer assembly is bonded together to form a homogeneous construction with consistent electrical and mechanical properties
throughout.
While preferred embodiments have been shown and described, various modifications and substitutions may be made thereto without departing from the spirit and scope of the invention. Accordingly, it is to be understood that the present invention has been
described by way of illustrations and not limitation.
What is claimed is:
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US84749792 true | 1992-03-13 | 1992-03-13 | |
US847,497 | 1992-03-13 | ||
US1248793 true | 1993-01-28 | 1993-01-28 | |
US012,487 | 1993-01-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1993017860A1 true true WO1993017860A1 (en) | 1993-09-16 |
Family
ID=26683615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1993/002277 WO1993017860A1 (en) | 1992-03-13 | 1993-03-12 | Cyanate ester microwave circuit material |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO1993017860A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996039457A1 (en) * | 1995-06-05 | 1996-12-12 | Minnesota Mining And Manufacturing Company | Aromatic cyanate ester silane coupling agents |
US5912377A (en) * | 1995-06-05 | 1999-06-15 | Minnesota Mining And Manufacturing Company | Aromatic cyanate ester silane coupling agents |
US6306669B1 (en) | 1998-04-17 | 2001-10-23 | Kabushki Kaisha Toshiba | Method of manufacturing semiconductor device |
EP1517595A2 (en) * | 2003-09-19 | 2005-03-23 | Hitachi Chemical Co., Ltd. | Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4956393A (en) * | 1988-08-29 | 1990-09-11 | Basf Aktiengesellschaft | Structures exhibiting improved transmission of ultrahigh frequency electromagnetic radiation and structural materials which allow their construction |
US4999699A (en) * | 1990-03-14 | 1991-03-12 | International Business Machines Corporation | Solder interconnection structure and process for making |
US5077115A (en) * | 1990-05-08 | 1991-12-31 | Rogers Corporation | Thermoplastic composite material |
US5134421A (en) * | 1988-08-29 | 1992-07-28 | Basf Aktiengesellschaft | Structures exhibiting improved transmission of ultrahigh frequency electromagnetic radiation and structural materials which allow their construction |
US5143785A (en) * | 1990-08-20 | 1992-09-01 | Minnesota Mining And Manufacturing Company | Cyanate ester adhesives for electronic applications |
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4956393A (en) * | 1988-08-29 | 1990-09-11 | Basf Aktiengesellschaft | Structures exhibiting improved transmission of ultrahigh frequency electromagnetic radiation and structural materials which allow their construction |
US5134421A (en) * | 1988-08-29 | 1992-07-28 | Basf Aktiengesellschaft | Structures exhibiting improved transmission of ultrahigh frequency electromagnetic radiation and structural materials which allow their construction |
US4999699A (en) * | 1990-03-14 | 1991-03-12 | International Business Machines Corporation | Solder interconnection structure and process for making |
US5077115A (en) * | 1990-05-08 | 1991-12-31 | Rogers Corporation | Thermoplastic composite material |
US5143785A (en) * | 1990-08-20 | 1992-09-01 | Minnesota Mining And Manufacturing Company | Cyanate ester adhesives for electronic applications |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996039457A1 (en) * | 1995-06-05 | 1996-12-12 | Minnesota Mining And Manufacturing Company | Aromatic cyanate ester silane coupling agents |
US5912377A (en) * | 1995-06-05 | 1999-06-15 | Minnesota Mining And Manufacturing Company | Aromatic cyanate ester silane coupling agents |
US6217943B1 (en) | 1996-06-05 | 2001-04-17 | 3M Innovative Properties Company | Aromatic cyanate ester silane coupling agents |
US6306669B1 (en) | 1998-04-17 | 2001-10-23 | Kabushki Kaisha Toshiba | Method of manufacturing semiconductor device |
EP1517595A2 (en) * | 2003-09-19 | 2005-03-23 | Hitachi Chemical Co., Ltd. | Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof |
EP1517595A3 (en) * | 2003-09-19 | 2008-04-02 | Hitachi Chemical Co., Ltd. | Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof |
US8420210B2 (en) | 2003-09-19 | 2013-04-16 | Hitachi Chemical Company, Ltd. | Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5162977A (en) | Printed circuit board having an integrated decoupling capacitive element | |
US4769270A (en) | Substrate for a printed circuit board | |
US5571609A (en) | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof | |
US4874826A (en) | Method of preparing polyphenylene oxide composition and laminates using such compositions | |
US6071836A (en) | Polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof | |
US7508076B2 (en) | Information handling system including a circuitized substrate having a dielectric layer without continuous fibers | |
US4897301A (en) | Flexible sheet reinforced with poly(aromatic amide) non-woven fabric and use thereof | |
US6016598A (en) | Method of manufacturing a multilayer printed wire board | |
US5103293A (en) | Electronic circuit packages with tear resistant organic cores | |
US20020038725A1 (en) | Circuit board and production of the same | |
US6150456A (en) | High dielectric constant flexible polyimide film and process of preparation | |
US6124023A (en) | Prepreg for laminate and process for producing printed wiring-board using the same | |
US5126192A (en) | Flame retardant, low dielectric constant microsphere filled laminate | |
US4876120A (en) | Tailorable multi-layer printed wiring boards of controlled coefficient of thermal expansion | |
EP0248617A2 (en) | Process for making substrates for printed circuit boards | |
US5198295A (en) | Ceramic filled fluoropolymeric composite material | |
US20070177331A1 (en) | Non-flaking capacitor material, capacitive substrate having an internal capacitor therein including said non-flaking capacitor material, and method of making a capacitor member for use in a capacitive substrate | |
US4997702A (en) | Shape retaining flexible electrical circuit | |
JPH07147464A (en) | Circuit substrate connecting material and manufacture of multilayer circuit substrate using it | |
CN101735456A (en) | High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby | |
US20020182958A1 (en) | Multilayer printed wiring board | |
US5319244A (en) | Triazine thin film adhesives | |
JP2007176169A (en) | Prepreg, substrate and semiconductor apparatus | |
JP2000038464A (en) | Film for heat-resistant laminate and raw plate using the same and used for printed wiring board and production of the board | |
JP2003246849A (en) | Epoxy resin composition, and prepreg, laminate board and printed wiring board using the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): DE GB JP |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE |
|
122 | Ep: pct application non-entry in european phase | ||
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |