WO1992019012A3 - Polypropylene wafer carrier - Google Patents

Polypropylene wafer carrier Download PDF

Info

Publication number
WO1992019012A3
WO1992019012A3 PCT/US1992/000506 US9200506W WO9219012A3 WO 1992019012 A3 WO1992019012 A3 WO 1992019012A3 US 9200506 W US9200506 W US 9200506W WO 9219012 A3 WO9219012 A3 WO 9219012A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
polypropylene
wafers
contact angle
polypropylenes
Prior art date
Application number
PCT/US1992/000506
Other languages
French (fr)
Other versions
WO1992019012A2 (en
Inventor
Kirk J Mikkelsen
Original Assignee
Fluroware Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1019920703197A priority Critical patent/KR930700975A/en
Application filed by Fluroware Inc filed Critical Fluroware Inc
Publication of WO1992019012A2 publication Critical patent/WO1992019012A2/en
Publication of WO1992019012A3 publication Critical patent/WO1992019012A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Abstract

Shipping containers for silicon wafers, the containers being of polypropylene from a double deashed random copolymer with minimal amounts of ethylene and additives in minimal amounts of high molecular weight hindered phenolics as the antioxidant/antiozonant, and minimum amounts of clarifier compound and flow enhancers. The test method of determining the hydrophobicity effect of polypropylenes on stored semiconductor wafers including cleaning organic contaminants from specimen wafers, from the inside of and cover of a glass jar and stand for holding the wafer; exposing the wafer to a quantity of polypropylene resin in the jar for a length of time at advanced temperatures; and measuring the sessile drop contact angle of DI water on the faces of the silicon wafers which have been exposed to various polypropylenes; minimum drop contact angle producing indications of the hydrophobicity effect of the polypropylene on the wafer.
PCT/US1992/000506 1991-04-11 1992-01-21 Polypropylene wafer carrier WO1992019012A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920703197A KR930700975A (en) 1991-04-11 1991-01-21 Polypropylene wafer carrier

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US68370591A 1991-04-11 1991-04-11
US683,705 1991-04-11

Publications (2)

Publication Number Publication Date
WO1992019012A2 WO1992019012A2 (en) 1992-10-29
WO1992019012A3 true WO1992019012A3 (en) 1992-12-10

Family

ID=24745120

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1992/000506 WO1992019012A2 (en) 1991-04-11 1992-01-21 Polypropylene wafer carrier

Country Status (5)

Country Link
EP (1) EP0533859A1 (en)
JP (1) JPH05508517A (en)
KR (1) KR930700975A (en)
CN (1) CN1065634A (en)
WO (1) WO1992019012A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9302230A (en) * 1993-12-21 1995-07-17 Fred Ernest Gardner Wave energy converter.
JPH0969557A (en) * 1995-08-30 1997-03-11 Shin Etsu Handotai Co Ltd Stocking/transporting method for wafer
EP0957514A4 (en) * 1996-03-29 2006-10-04 Tokyo Electron Ltd Instrument and mounting equipment used in clean room
JP2001298076A (en) * 2000-04-12 2001-10-26 Sony Corp Substrate carriage container
CN101070408B (en) * 2006-05-12 2010-08-18 中国科学院化学研究所 Roll-position-controllable polypropylene super hydrophobic film or block material and their preparing method
CN103943541A (en) * 2014-05-04 2014-07-23 上海先进半导体制造股份有限公司 Cover plate wafer box device
EP3455134A4 (en) * 2016-05-09 2020-01-22 Eric Loth Methods and systems for self-lubricating icephobic elastomer coatings

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3413837A1 (en) * 1984-04-12 1985-10-17 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen PACKING FOR SEMICONDUCTOR DISC
GB2199808A (en) * 1986-12-27 1988-07-20 Nippon Mining Co Packaging container
DE4024576A1 (en) * 1990-08-02 1992-02-06 Bosch Gmbh Robert DEVICE FOR SINGLE-SIDED ASSEMBLY OF A SEMICONDUCTOR DISC

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3413837A1 (en) * 1984-04-12 1985-10-17 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen PACKING FOR SEMICONDUCTOR DISC
GB2199808A (en) * 1986-12-27 1988-07-20 Nippon Mining Co Packaging container
DE4024576A1 (en) * 1990-08-02 1992-02-06 Bosch Gmbh Robert DEVICE FOR SINGLE-SIDED ASSEMBLY OF A SEMICONDUCTOR DISC

Also Published As

Publication number Publication date
WO1992019012A2 (en) 1992-10-29
EP0533859A1 (en) 1993-03-31
CN1065634A (en) 1992-10-28
JPH05508517A (en) 1993-11-25
KR930700975A (en) 1993-03-16

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