WO1992016822A2 - Fluid cooled contact mask - Google Patents
Fluid cooled contact mask Download PDFInfo
- Publication number
- WO1992016822A2 WO1992016822A2 PCT/GB1992/000513 GB9200513W WO9216822A2 WO 1992016822 A2 WO1992016822 A2 WO 1992016822A2 GB 9200513 W GB9200513 W GB 9200513W WO 9216822 A2 WO9216822 A2 WO 9216822A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mask
- apertures
- nozzles
- channels
- radiation
- Prior art date
Links
- 239000012530 fluid Substances 0.000 title claims description 9
- 230000005855 radiation Effects 0.000 claims abstract description 18
- 238000002679 ablation Methods 0.000 claims abstract description 14
- 239000012809 cooling fluid Substances 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000000608 laser ablation Methods 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 150000002430 hydrocarbons Chemical class 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 230000001351 cycling effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- VZPPHXVFMVZRTE-UHFFFAOYSA-N [Kr]F Chemical compound [Kr]F VZPPHXVFMVZRTE-UHFFFAOYSA-N 0.000 description 1
- ISQINHMJILFLAQ-UHFFFAOYSA-N argon hydrofluoride Chemical compound F.[Ar] ISQINHMJILFLAQ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000003887 surface segregation Methods 0.000 description 1
- HGCGQDMQKGRJNO-UHFFFAOYSA-N xenon monochloride Chemical compound [Xe]Cl HGCGQDMQKGRJNO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/08—Embodiments of or processes related to ink-jet heads dealing with thermal variations, e.g. cooling
Definitions
- This invention relates to masks for use in forming features in a surface by high energy pulses of laser radiation and in particular to a method of forming nozzles in an ink jet printhead having parallel Ink channels with which said nozzles respectively communicate.
- the preferred method of nozzle manufacture is to place a contact mask having apertures corresponding to nozzle locations in contact with a nozzle plate attached to the printhead. Exposure to successive pulses of UV light of high intensity causes the nozzles to be ablated. Rocking of the mask and printhead during the pulses enables the nozzles to be undercut so that the nozzle inlets are greater in area than the nozzle outlets.
- UV light pulses 0.3-Ucm .
- a contact mask tends to heat up during exposure to light energy density of this magnitude, which may result in the thermal expansion of the mask. It also causes the mask to become dished due to thermal stress cycling in the mask surface and the mask becomes progressively cracked and damaged, limiting its useful life.
- One recognised method of avoiding the problems resulting from a high energy density of radiation incident on the contact mask is to employ a projection mask at an expanded part in the path of the incident optical beam, i.e. at a location of the beam where the energy density is less than that at the ablating locations.
- a contact mask in contact with the printhead is to be preferred. Contact against the face of the mask, e.g. by locating dowels or by optical alignment, locates the printhead relative to the mask and reduces manufacturing tolerances, particularly in a process incorporating rocking.
- a further object is to provide an .improved method of forming nozzles in an ink jet printhead.
- the present invention consists in a mask for use in forming features on a surface by laser ablation comprising a baseplate which is located adjacent said surface and is formed with apertures through which respective locations of said surface are exposed to high energy radiation pulses of said laser to form said features, characterised in that channel means are provided adjoining regions of the mask exposed to said high energy pulses through which, during ablation of said surface, fluid is caused to flow to cool the mask.
- said channels means comprise enclosed channels adapted for connection to means for circulating cooling fluid therethrough.
- a heat exchanger is provided through which fluid heated in the channels is passed for heat extraction therefrom prior to recirculation.
- said mask on the surface thereof on which said laser radiation is incident is formed with a mirror surface to reflect said radiation.
- the mirror surface is a coating of aluminium.
- the mirror surface is a dielectric coating which is of thickness wavelength matched to the wavelength of the incident radiation.
- the surface of the mask may be such as flatwise to engage the surface in which features are to be ablated.
- the mask may be formed around the apertures therein with pads which contact the surface in which the features are to be formed respectively around those features.
- the invention further consists in the method of forming nozzles in an ink jet printhead having parallel ink channels with which said nozzles respectively communicate, characterised by bonding a polymer nozzle plate to corresponding ends of said ink channels, applying a contact mask to said nozzle plate, said mask being formed with apertures at the spacing of said nozzles circulating cooling fluid through channels formed in said mask and exposing said mask to high energy pulses of laser radiation at least in the regions of the mask including said apertures thereby to ablate said nozzles.
- FIGURE 1 is a side elevation partly in section of equipment used for laser ablation of features in a surface, in particular nozzles in a nozzle plate of an ink jet printhead, which includes a mask according to this invention; - -
- FIGURES 2a and 2b are respectively a sectional side elevation and a sectional plan view of the mask of Figure 1, the side elevation of Figure 2a being taken on the line Ila-IIa of Figure 2b and the plan view of Figure 2b being taken on the line Ilb-IIb of Figure 2a; and
- FIGURE 3 is a fragmentary sectional view illustrating details of the mask of the earlier figures.
- an excimer laser 10 affords a high energy optical beam 11 employed for forming features in a surface 12 which, in this case, is a surface of a nozzle plate 13 of an ink jet printhead 1 to which the plate 13 is bonded at corresponding ends of parallel channels 15 which extend in the printhead in a plane normal to that of the drawing.
- a high energy optical beam 11 employed for forming features in a surface 12 which, in this case, is a surface of a nozzle plate 13 of an ink jet printhead 1 to which the plate 13 is bonded at corresponding ends of parallel channels 15 which extend in the printhead in a plane normal to that of the drawing.
- the surface 12 is ablated by exposure to pulses of high energy UV light generated by the laser 10.
- the wavelengths of light chosen are typically 193.248 or 308 nm corresponding to photon emission at the excimer line of argon fluoride (ArF), krypton fluoride (KrF) or xenon chloride (Xe Cl).
- the pulse period generated by such lasers is typically 10 ⁇ 30ns, delivered at frequencies of up to 200Hz or higher.
- the energy density of the pulses may be concentrated, by means of a suitable lens 16, to a level depending on the ablation threshold of the surface 12. "typically where the surface is a polymer suitable for the nozzle plate for an ink jet printhead, the threshold energy
- _2 density for ablation is 0.1-0.2Jcm .
- an energy density in the _2 range 0.3-1Jem will be selected : but for the ablation of surfaces having a higher threshold energy density a higher exposure energy
- a projection mask disposed in the region of the lens 16 is used, but where small precise features are to be ablated, or rocking of the surface 12 is employed it is convenient to use a contact mask 17 including apertures 20 made in a base plate 19 of the mask which is located precisely relatively to the surface 12, e.g. by dowels or optical means (not shown).
- the mask 17 is exposed to the full energy density of the incident light pulse.
- a problem with the contact mask is that it may absorb energy during the period of exposure to light pulses and progressively heat up during the ablation process. As a result the mask may expand by thermal expansion, which limits the accuracy of manufacture of the nozzles. Further, it has a tendency to become dished, due to thermal stress cycling and its surface becomes cracked and damaged so that the mask has a limited life. These difficulties would generally be avoided with a projection mask where the energy density can be lower, and the rate of heating correspondingly less.
- the degree of heating of a contact mask depends upon the optical absorption or reflection coefficient of the mask at the wavelength of the incident light energy. For example, if the mask is formed of silicon, whose absorption coefficient is about O ⁇ , and of thickness
- the cooling fluid which is caused to flow through the channels 21 by means of a pump may be gas but in view of the limited space available for the channels is, preferably, a liquid such as water including inhibitants to limit oxidation or solubility of the channel walls or a hydrocarbon solvent.
- the channels 21 are formed in a cover 23 of the mask which is bonded to the base plate 19•
- Both the cover and base plate may be made of metal or silicon or a high temperature polymer bonded or glued together.
- the bond is a low vapour pressure bond such as a diffusion or solder bond.
- the apertures 20 comprise a line of apertures at the spacing of channel nozzles 25 which are ablated into the nozzle plate 13 by the beam 11 and respectively communicate with the channels 15 of the printhead. As shown in Figure 3.
- apertures 27 in the cover which overlie the apertures 20 in the base plate 19 may have a larger diameter than the apertures 20 to facilitate ablation of the nozzles 25 by relative rocking between the incident light beam 11 and the printhead 14 without shading or occluding the exit of the nozzles 25.
- the cooling channels 21 formed in the cover include deflectors 29 which impart sinous flow to the cooling liquid to ensure optimum heat absorption therein.
- the channels 21 are placed so as to cool, as much as practical, the area of the mask exposed to the incident light pulse on the mask.
- the surface of the cover 23 may be coated by a mirror surface (for example, an aluminium coating) . This limits the heat absorbed during the pulse period of typically 10-30 ns and thus reduces the peak temperature attained by the surface layer of the cover to typically 1-200°C temperature rise. Without the coating, the layer may reach 500-1000 C or more during the pulse causing the mask cover to deteriorate and distort, as well as increase the rate of heating of the mask.
- a mirror surface for example, an aluminium coating
- the material of the base plate 19 round the apertures 20 nay similarly be coated with a dielectric mirror coating.
- the choice of coating, i.e. metallised coating or dielectric coating, is made primarily to ensure that the life of the cooled mask when exposed to UV laser pulses is adequate for the manufacturing duty specified. For aluminium the threshold energy of ablation is limited by surface segregation of impurities in the
- the cooling channel 20 and the cooling channel is preferably, less than -Jk/f. As shown in
- K the thermal conductivity
- P the density
- c the specific heat of the mask material
- a contact pad 28 may be placed round each of the apertures 20 of the mask on the side of the base plate facing the nozzle plate 13 which ensures a good contact between the mask and surface 12 of the nozzle plate.
- the base plate may lie flush against the surface 12.
- the cooling channels are filled with cooling fluid, preferably liquid, which is circulated through an inlet 22 and an outlet (not shown) formed in the cover suitably at respective ends of the channels, so that the heat is continuously removed during ablation.
- the fluid is then passed prior to recirculation through a heat exchanger (not shown) , which dissipates the heat keeping the mask at a steady temperature, preferably less than 20-40 C above ambient or similar, when the thermal expansion of the cooled mask 17 is kept within acceptable limits.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4506914A JPH06506069A (en) | 1991-03-20 | 1992-03-20 | liquid cooling contact mask |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9105870.1 | 1991-03-20 | ||
GB919105870A GB9105870D0 (en) | 1991-03-20 | 1991-03-20 | Fluid cooled contact mask |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1992016822A2 true WO1992016822A2 (en) | 1992-10-01 |
WO1992016822A3 WO1992016822A3 (en) | 1992-12-23 |
Family
ID=10691866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB1992/000513 WO1992016822A2 (en) | 1991-03-20 | 1992-03-20 | Fluid cooled contact mask |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0576533A1 (en) |
JP (1) | JPH06506069A (en) |
CA (1) | CA2106477A1 (en) |
GB (1) | GB9105870D0 (en) |
WO (1) | WO1992016822A2 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2699844A1 (en) * | 1992-12-30 | 1994-07-01 | Snecma | Method and device for laser beam machining |
EP0776713A3 (en) * | 1995-11-09 | 1997-09-24 | Toyota Motor Co Ltd | A method for laminate forming a sand mould and a method for producing a casting using the same |
EP0867292A2 (en) * | 1997-03-28 | 1998-09-30 | Lexmark International, Inc. | Ink jet printer nozzle plates |
US6283584B1 (en) | 2000-04-18 | 2001-09-04 | Lexmark International, Inc. | Ink jet flow distribution system for ink jet printer |
WO2002014951A2 (en) * | 2000-08-14 | 2002-02-21 | Universität Gesamthochschule Kassel | Shadow mask and method for producing a shadow mask |
US6720236B2 (en) * | 2001-09-25 | 2004-04-13 | Seiko Epson Corporation | Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument |
US8017886B2 (en) * | 2005-04-21 | 2011-09-13 | Hewlett-Packard Development Company, L.P. | Laser welding system |
US20180106154A1 (en) * | 2016-10-13 | 2018-04-19 | General Electric Company | Contoured bondcoat for environmental barrier coatings and methods for making contoured bondcoats for environmental barrier coatings |
WO2018089080A1 (en) * | 2016-11-08 | 2018-05-17 | The Curators Of The University Of Missouri | Foil-based additive manufacturing system and method |
US10828720B2 (en) | 2015-10-13 | 2020-11-10 | The Curators Of The University Of Missouri | Foil-based additive manufacturing system and method |
WO2023061830A1 (en) * | 2021-10-15 | 2023-04-20 | TRUMPF Werkzeugmaschinen SE + Co. KG | Processing head and cooling element and cooling method therefor |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0265658A2 (en) * | 1986-10-29 | 1988-05-04 | International Business Machines Corporation | High energy laser mask and method of making same |
EP0495158A1 (en) * | 1990-12-21 | 1992-07-22 | Hewlett-Packard Company | Contact cooling of a projection mask |
EP0309146B1 (en) * | 1987-09-19 | 1993-01-13 | Xaar Limited | Manufacture of nozzles for ink jet printers |
-
1991
- 1991-03-20 GB GB919105870A patent/GB9105870D0/en active Pending
-
1992
- 1992-03-20 WO PCT/GB1992/000513 patent/WO1992016822A2/en not_active Application Discontinuation
- 1992-03-20 CA CA002106477A patent/CA2106477A1/en not_active Abandoned
- 1992-03-20 JP JP4506914A patent/JPH06506069A/en active Pending
- 1992-03-20 EP EP92907636A patent/EP0576533A1/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0265658A2 (en) * | 1986-10-29 | 1988-05-04 | International Business Machines Corporation | High energy laser mask and method of making same |
EP0309146B1 (en) * | 1987-09-19 | 1993-01-13 | Xaar Limited | Manufacture of nozzles for ink jet printers |
EP0495158A1 (en) * | 1990-12-21 | 1992-07-22 | Hewlett-Packard Company | Contact cooling of a projection mask |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 14, no. 2 (E-868)8 January 1989 & JP,A,01 251 612 ( TOKYO ELECTRON LTD ) 6 October 1989 * |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2699844A1 (en) * | 1992-12-30 | 1994-07-01 | Snecma | Method and device for laser beam machining |
EP0618036A1 (en) * | 1992-12-30 | 1994-10-05 | Societe Nationale D'etude Et De Construction De Moteurs D'aviation "Snecma" | Process and apparatus for machining with laser beam |
EP0776713A3 (en) * | 1995-11-09 | 1997-09-24 | Toyota Motor Co Ltd | A method for laminate forming a sand mould and a method for producing a casting using the same |
US5718279A (en) * | 1995-11-09 | 1998-02-17 | Toyota Jidosha Kabushiki Kaisha | Method for laminate forming a sand mould and a method for producing a casting using the same |
EP0867292A2 (en) * | 1997-03-28 | 1998-09-30 | Lexmark International, Inc. | Ink jet printer nozzle plates |
EP0867292A3 (en) * | 1997-03-28 | 1999-08-11 | Lexmark International, Inc. | Ink jet printer nozzle plates |
US6158843A (en) * | 1997-03-28 | 2000-12-12 | Lexmark International, Inc. | Ink jet printer nozzle plates with ink filtering projections |
US6283584B1 (en) | 2000-04-18 | 2001-09-04 | Lexmark International, Inc. | Ink jet flow distribution system for ink jet printer |
WO2002014951A2 (en) * | 2000-08-14 | 2002-02-21 | Universität Gesamthochschule Kassel | Shadow mask and method for producing a shadow mask |
WO2002014951A3 (en) * | 2000-08-14 | 2002-09-19 | Univ Gesamthochschule Kassel | Shadow mask and method for producing a shadow mask |
US7183043B2 (en) | 2000-08-14 | 2007-02-27 | Universitat Kassel | Shadow mask and method for producing a shadow mask |
US6720236B2 (en) * | 2001-09-25 | 2004-04-13 | Seiko Epson Corporation | Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument |
US6930021B2 (en) | 2001-09-25 | 2005-08-16 | Seiko Epson Corporation | Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument |
US8017886B2 (en) * | 2005-04-21 | 2011-09-13 | Hewlett-Packard Development Company, L.P. | Laser welding system |
US10828720B2 (en) | 2015-10-13 | 2020-11-10 | The Curators Of The University Of Missouri | Foil-based additive manufacturing system and method |
US20180106154A1 (en) * | 2016-10-13 | 2018-04-19 | General Electric Company | Contoured bondcoat for environmental barrier coatings and methods for making contoured bondcoats for environmental barrier coatings |
US20220010684A1 (en) * | 2016-10-13 | 2022-01-13 | General Electric Company | Contoured bondcoat for environmental barrier coatings and methods for making contoured bondcoats for environmental barrier coatings |
WO2018089080A1 (en) * | 2016-11-08 | 2018-05-17 | The Curators Of The University Of Missouri | Foil-based additive manufacturing system and method |
WO2023061830A1 (en) * | 2021-10-15 | 2023-04-20 | TRUMPF Werkzeugmaschinen SE + Co. KG | Processing head and cooling element and cooling method therefor |
Also Published As
Publication number | Publication date |
---|---|
GB9105870D0 (en) | 1991-05-08 |
JPH06506069A (en) | 1994-07-07 |
CA2106477A1 (en) | 1992-09-21 |
EP0576533A1 (en) | 1994-01-05 |
WO1992016822A3 (en) | 1992-12-23 |
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