USRE42346E1 - Solid state silicon-based condenser microphone - Google Patents

Solid state silicon-based condenser microphone Download PDF

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Publication number
USRE42346E1
USRE42346E1 US10/193,055 US19305502A USRE42346E US RE42346 E1 USRE42346 E1 US RE42346E1 US 19305502 A US19305502 A US 19305502A US RE42346 E USRE42346 E US RE42346E
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United States
Prior art keywords
chip
electronic circuit
condenser microphone
integrated electronic
circuit chip
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Expired - Lifetime
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US10/193,055
Inventor
Pirmin Rombach
Matthias Müllenborn
Ole Hansen
Matthias Heschel
Siebe Bouwstra
Maja Amskov Gravad
Henrick Laurids Hvims
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TDK Corp
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Epcos Pte Ltd
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Priority to US10/193,055 priority Critical patent/USRE42346E1/en
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Assigned to SONION ROSKILDE A/S reassignment SONION ROSKILDE A/S CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: MICROTRONIC A/S
Assigned to SONION MEMS A/S reassignment SONION MEMS A/S CORRECTED COVER SHEET TO CORRECT ASSIGNEE INFORMATION, PREVIOUSLY RECORDED AT REEL/FRAME 018266/0337 (ASSIGNMENT OF ASSIGNOR'S INTEREST) Assignors: SONION ROSKILDE A/S
Assigned to SONION MEMS A/S reassignment SONION MEMS A/S CORRECTION TO THE ASSIGNEE ON REEL/FRAME 018266/0337 Assignors: SONION ROSKILDE A/S
Priority to US11/903,207 priority patent/USRE42347E1/en
Publication of USRE42346E1 publication Critical patent/USRE42346E1/en
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Assigned to EPCOS PTE LTD reassignment EPCOS PTE LTD ASSET TRANSFER AGREEMENT Assignors: PULSE MEMS APS
Assigned to PULSE MEMS APS reassignment PULSE MEMS APS CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: PULSE MEMS A/S
Assigned to PULSE MEMS A/S reassignment PULSE MEMS A/S CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SONION MEMS A/S
Assigned to TDK CORPORATION reassignment TDK CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EPCOS PTE LTD
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones

Definitions

  • This invention related to miniature condenser microphones, and in particular to solid state silicon-based condenser microphones incorporating an integrated electronic circuit for transducer signal conditioning.
  • miniature microphones are suitable for use in miniature electroacoustic devices such as hearing instruments.
  • EP 561 566 discloses a solid state condenser microphone having a transducer chip and, on the same chip, an electronic circuit and a cavity forming an opening or sound inlet for the transducer.
  • the techniques and processes for manufacturing such electronic circuitry are quite different from the techniques and processes used in manufacturing the transducer elements. Consequently a chip having both an electronic circuit and an opening therein requires two (or possibly more) separate stages of production, usually at different facilities.
  • the invention provides a solid state silicon-based condenser microphone which is suitable for batch production. Several silicon chips are stacked, and the subsequent dicinig dicing of the stacked chips or discs is easier than with the prior art.
  • the invention makes it possible to make a very well defined sound inlet, which can optionally be covered with a sealing film or a filter preventing dust, moisture and other impurities from contaminating or obstructing the interior and the sound inlet of the microphone.
  • a sound inlet can theoretically be made as an opening in any of the chip surfaces including the fractures after dicing, but in practice the fractures are irregular surfaces and therefore less suitable for supporting a sealing film or a filter, since the irregular fractures could give rise to the sealing film or a filter becoming wrinkled and having leakages at its periphery where it is secured to the die surface.
  • a microphone according to the invention has an opening forming a sound inlet in the practically perfectly flat and polished faces of the wafer on which several individual microphones are arranged.
  • An integrated electronic circuit chip can be arranged on the same plane surface, which is perfectly suited for flip-chip mounting the electronic circuit chip.
  • An intermediate chip is arranged between the electronic circuit chip and the transducer chip.
  • the intermediate chip has another opening with feedthrough electrical connections on a surface of the opening.
  • the feedthrough connections establish electrical connections between the transducer element on the transducer chip and the electronic circuit chip. This gives a high degree of freedom in designing both the transducer chip and the electronic circuit chip and in particular their electrical terminations.
  • the invention uses a separate integrated electronic circuit chip, preferably a CMOS ASIC (Application Specific Integrated Circuit) which can be designed and manufactured separately and independent of the design and manufacture of the transducer portion of the microphone.
  • CMOS ASIC Application Specific Integrated Circuit
  • FIG. 1 is a cross section of a microphone according to the invention.
  • FIG. 2 is an enlarged view of a portion of the microphone in FIG. 1 .
  • the illustrated microphone has the following structure.
  • a silicon transducer chip 1 with a central opening etched therein carries a diaphragm 12 and a backplate 13 covering the central opening in the transducer chip.
  • the term “backplate” means a structural element which is relatively rigid as compared to the associated diaphragm, which in turn is relatively moveable.
  • the backplate can be placed on either side of the diaphragm.
  • the transducer chip with the diaphragm 12 and a backplate 13 are preferably manufactured as described in The copending Danish patent application PA 199800671.
  • the diaphragm 12 and the backplate 13 are both electrically conductive or semi-conductive and are arranged parallel and in close proximity to each other and with a well defined air gap in between, so that they form an electrical capacitor.
  • the backplate 13 has a plurality of perforations 19 making it acoustically transparent, and the diaphragm has a tiny vent hole 15 for equalising the static pressure on both sides of the diaphragm.
  • An electronic circuit chip 3 having an integrated circuit on a surface thereof is flip chip mounted with its circuit facing the transducer chip 1 and with an intermediate chip 2 between the transducer chip 1 and the electronic circuit chip 3 .
  • the intermediate chip 2 has a cavity 10 and a first through going opening 4 and a second through going opening 18 both communicating with the cavity 10 .
  • the intermediate chip 2 is secured to the transducer chip 1 by means of an electrically conductive solder ring 9 or by other means.
  • the electronic circuit chip 3 is secured to the intermediate chip 2 by means of an underfill material 6 .
  • the diaphragm 12 and the backplate 13 are electrically connected Lo to respective ones of solder bumps 8 , which connect the diaphragm 12 and the backplate 13 to electrical feedthrough conductors 14 on the surface of the cavity 10 and the opening 18 and further to the upper surface of the intermediate chip 2 where connections to the electronic circuit chip 3 are established via a conventional flip-chip interconnect method e.g. gold studs 7 with conductive adhesive. This is most clearly seen in FIG. 2 .
  • the opening 4 is covered with a filter 5 or a flexible sheet or diaphragm of acoustically transparent material.
  • the whole structure is encapsulated in a polymer encapsulation 16 leaving the filter 5 free.
  • the function of the above described structure is as follows.
  • the opening 4 functions as a sound inlet, and ambient sound pressure enters through the filter 5 covering the opening 4 to the cavity 10 functioning as a front chamber for the microphone.
  • the cavity 11 functions as a backchamber for the microphone.
  • the diaphragm 12 is movable relative to the backplate 13 in response to incident sound. When the diaphragm is moved in response to the incident sound, the electrical capacity of the electrical capacitor formed by the diaphragm 12 and the backplate 13 will vary in response to the incident sound.
  • the circuit on the integrated circuit chip 3 is electrically connected to the diaphragm 12 And and the backplate 13 via the electrical feedthrough conductors 14 , and the circuit is designed to detect variations in the electrical capacity of the capacitor formed by the diaphragm 12 and the backplate 13 .
  • the circuit has electrical connections for electrically connecting it to a power supply and other electronic circuitry in eg a hearing instrument.
  • the transducer element on the transducer chip is a condenser microphone with a diaphragm and a single backplate.
  • the transducer element has its diaphragm arranged between two backplates. Such a microphone can give balanced output signal which is less sensitive to electrical interference.

Abstract

A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

Description

RELATED APPLICATIONS
Notice: More than one reissue application has been filed for the reissue of U.S. Pat. No. 6,088,463. The reissue applications are application Ser. No. 10/193,055 (present application), filed Jul. 11, 2002, and application Ser. No. 11/903,207, filed Sep. 20, 2007, which are divisional reissues of U.S. Pat. No. 6,088,463, issued Jul. 11, 2000.
FIELD OF THE INVENTION
This invention related to miniature condenser microphones, and in particular to solid state silicon-based condenser microphones incorporating an integrated electronic circuit for transducer signal conditioning. Such miniature microphones are suitable for use in miniature electroacoustic devices such as hearing instruments.
BACKGROUND OF THE INVENTION
In the hearing instruments industry one of the primary goals is to make hearing instruments of small size while still maintaining good electroacoustic performance and operability giving good user friendliness and satisfaction. Technical performance data comprise such as sensitivity, stability, compactness, robustness and insensitivity to electromagnetic interference and to other external and environmental conditions. In the past, several attempts have been made to make microphones smaller while still maintaining good technical performance data.
EP 561 566 discloses a solid state condenser microphone having a transducer chip and, on the same chip, an electronic circuit and a cavity forming an opening or sound inlet for the transducer. The techniques and processes for manufacturing such electronic circuitry are quite different from the techniques and processes used in manufacturing the transducer elements. Consequently a chip having both an electronic circuit and an opening therein requires two (or possibly more) separate stages of production, usually at different facilities.
SUMMARY OF THE INVENTION
The invention provides a solid state silicon-based condenser microphone which is suitable for batch production. Several silicon chips are stacked, and the subsequent dicinig dicing of the stacked chips or discs is easier than with the prior art.
The invention makes it possible to make a very well defined sound inlet, which can optionally be covered with a sealing film or a filter preventing dust, moisture and other impurities from contaminating or obstructing the interior and the sound inlet of the microphone. A sound inlet can theoretically be made as an opening in any of the chip surfaces including the fractures after dicing, but in practice the fractures are irregular surfaces and therefore less suitable for supporting a sealing film or a filter, since the irregular fractures could give rise to the sealing film or a filter becoming wrinkled and having leakages at its periphery where it is secured to the die surface. A microphone according to the invention has an opening forming a sound inlet in the practically perfectly flat and polished faces of the wafer on which several individual microphones are arranged.
An integrated electronic circuit chip can be arranged on the same plane surface, which is perfectly suited for flip-chip mounting the electronic circuit chip.
An intermediate chip is arranged between the electronic circuit chip and the transducer chip. The intermediate chip has another opening with feedthrough electrical connections on a surface of the opening. The feedthrough connections establish electrical connections between the transducer element on the transducer chip and the electronic circuit chip. This gives a high degree of freedom in designing both the transducer chip and the electronic circuit chip and in particular their electrical terminations.
External electrical connections can be established economically and reliably, and thermal stresses can be avoided with the small size solid state silicon-based condenser microphone of the invention.
The invention uses a separate integrated electronic circuit chip, preferably a CMOS ASIC (Application Specific Integrated Circuit) which can be designed and manufactured separately and independent of the design and manufacture of the transducer portion of the microphone. This is advantageous since the techniques and processes for manufacturing integrated electronic circuit chips are different from those used in manufacturing transducer elements, and each production stage can thus be optimized individually and independent of each other.
BRIEF DESCRIPTION OF THE DRAWINGS
In the following the invention will be explained with reference to the drawings, in which:
FIG. 1 is a cross section of a microphone according to the invention, and
FIG. 2 is an enlarged view of a portion of the microphone in FIG. 1.
In the figures, for illustrative purposes, dimensions such as material thickness and mutual distances and possibly other proportions are not necessarily drawn to the same scale.
DETAILED DESCRIPTION OF THE INVENTION
The illustrated microphone has the following structure. A silicon transducer chip 1 with a central opening etched therein carries a diaphragm 12 and a backplate 13 covering the central opening in the transducer chip. In this context the term “backplate” means a structural element which is relatively rigid as compared to the associated diaphragm, which in turn is relatively moveable. The backplate can be placed on either side of the diaphragm. The transducer chip with the diaphragm 12 and a backplate 13 are preferably manufactured as described in The copending Danish patent application PA 199800671. The transducer chip 1 and a backchamber-chip 17 having a cavity etched therein, and together the transducer chip 1 and the backchamber-chip 17 form a closed backchamber 11 with the diaphragm 12 forming one wall of the backchamber 11. The diaphragm 12 and the backplate 13 are both electrically conductive or semi-conductive and are arranged parallel and in close proximity to each other and with a well defined air gap in between, so that they form an electrical capacitor.
The backplate 13 has a plurality of perforations 19 making it acoustically transparent, and the diaphragm has a tiny vent hole 15 for equalising the static pressure on both sides of the diaphragm.
An electronic circuit chip 3 having an integrated circuit on a surface thereof is flip chip mounted with its circuit facing the transducer chip 1 and with an intermediate chip 2 between the transducer chip 1 and the electronic circuit chip 3. The intermediate chip 2 has a cavity 10 and a first through going opening 4 and a second through going opening 18 both communicating with the cavity 10. The intermediate chip 2 is secured to the transducer chip 1 by means of an electrically conductive solder ring 9 or by other means.
The electronic circuit chip 3 is secured to the intermediate chip 2 by means of an underfill material 6.
The diaphragm 12 and the backplate 13 are electrically connected Lo to respective ones of solder bumps 8, which connect the diaphragm 12 and the backplate 13 to electrical feedthrough conductors 14 on the surface of the cavity 10 and the opening 18 and further to the upper surface of the intermediate chip 2 where connections to the electronic circuit chip 3 are established via a conventional flip-chip interconnect method e.g. gold studs 7 with conductive adhesive. This is most clearly seen in FIG. 2.
The opening 4 is covered with a filter 5 or a flexible sheet or diaphragm of acoustically transparent material. The whole structure is encapsulated in a polymer encapsulation 16 leaving the filter 5 free.
The function of the above described structure is as follows. The opening 4 functions as a sound inlet, and ambient sound pressure enters through the filter 5 covering the opening 4 to the cavity 10 functioning as a front chamber for the microphone. Through the perforations 19 in the backplate 13 the sound pressure reaches the diaphragm 12. The cavity 11 functions as a backchamber for the microphone. The diaphragm 12 is movable relative to the backplate 13 in response to incident sound. When the diaphragm is moved in response to the incident sound, the electrical capacity of the electrical capacitor formed by the diaphragm 12 and the backplate 13 will vary in response to the incident sound. The circuit on the integrated circuit chip 3 is electrically connected to the diaphragm 12 And and the backplate 13 via the electrical feedthrough conductors 14, and the circuit is designed to detect variations in the electrical capacity of the capacitor formed by the diaphragm 12 and the backplate 13. The circuit has electrical connections for electrically connecting it to a power supply and other electronic circuitry in eg a hearing instrument.
In the illustrated embodiment the transducer element on the transducer chip is a condenser microphone with a diaphragm and a single backplate. In an alternative embodiment the transducer element has its diaphragm arranged between two backplates. Such a microphone can give balanced output signal which is less sensitive to electrical interference.

Claims (16)

1. A solid state silicon-based condenser microphone comprising a silicon transducer chip (1) including a backplate (13) and a diaphragm (12) arranged substantially parallel to each other, thereby forming an electrical capacitor, the diaphragm (12) being movable relative to the backplate (13) in response to incident sound, an integrated electronic circuit chip (3) electrically coupled to the transducer chip (1), an intermediate layer (2) fixing the transducer chip (1) to the integrated electronic circuit chip (3) in a spaced relationship, with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side, the intermediate layer (2) having a first through going opening (4, 10) between its first side and its second side giving access of sound to the diaphragm.
2. A condenser microphone according to claim 1 wherein the intermediate layer (2) on a surface thereof has electrical conductors (14) electrically connecting the transducer chip (1) to the integrated circuit chip (3).
3. A condenser microphone according to claim 2 wherein the intermediate layer (2) has a second through going opening (18) with a surface on which the electrical conductors (14) electrically connecting the transducer chip (1) to the integrated circuit chip (3) are situated.
4. A condenser microphone according to claim 1 wherein the opening (4) in the intermediate layer is covered with a film (5) sealing the opening (4) on the second side of the intermediate layer (2).
5. A condenser microphone according to claim 1 wherein a cavity (11) is provided in the transducer chip (1) on a side of the diaphragm (12) opposite the intermediate layer (2).
6. A condenser microphone according to claim 5 wherein the cavity (11) is a closed cavity.
7. A condenser microphone according to claim 2 wherein the integrated electronic circuit chip (3) has a surface including electronic circuits with said surface facing the intermediate layer (2).
8. A condenser microphone according to claim 1 wherein the intermediate layer (2) is a silicon-based chip.
9. A solid state silicon-based condenser microphone, comprising:
a silicon-based transducer chip including a backplate and a diaphragm, said diaphragm being movable relative to said backplate in response to incident sound;
an integrated electronic circuit chip for receiving an electrical signal from said silicon-based transducer chip corresponding to said incident sound; and
an intermediate element fixing said silicon-based transducer chip to said integrated electronic circuit chip in a spaced relationship, said intermediate element including an electrical conductor coupling said integrated electronic circuit chip and said silicon-based transducer chip, said intermediate element further including a cavity and a first through going opening communicating with said cavity, said integrated electronic circuit chip being secured to said transducer chip by flip-chip mounting said integrated electronic circuit chip such that a circuit of said integrated electronic circuit chip faces said intermediate element.
10. The condenser microphone of claim 9, wherein said intermediate element includes a feed-through, said feed-through including a feed-through conductor leading to said integrated electronic circuit chip.
11. The condenser microphone of claim 10, wherein said electrical conductor coupling said integrated electronic circuit chip and said silicon-based transducer chip is said feed-through conductor.
12. The condenser microphone of claim 10, wherein said feed-through is an opening.
13. The condenser microphone of claim 9, wherein said intermediate element is a silicon-based chip.
14. The condenser microphone of claim 9, wherein said integrated electronic circuit chip is an ASIC.
15. The condenser microphone of claim 9, wherein said integrated electronic circuit chip is flip-chip mounted to said intermediate element.
16. The condenser microphone of claim 9, wherein said integrated electronic circuit chip is located on one side of said intermediate element and said silicon-based transducer chip is located on an opposing side of said intermediate element.
US10/193,055 1998-10-30 2002-07-11 Solid state silicon-based condenser microphone Expired - Lifetime USRE42346E1 (en)

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US10/193,055 USRE42346E1 (en) 1998-10-30 2002-07-11 Solid state silicon-based condenser microphone
US11/903,207 USRE42347E1 (en) 1998-10-30 2007-09-20 Solid state silicon-based condenser microphone

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US09/182,668 US6088463A (en) 1998-10-30 1998-10-30 Solid state silicon-based condenser microphone
US10/193,055 USRE42346E1 (en) 1998-10-30 2002-07-11 Solid state silicon-based condenser microphone

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US09/182,668 Reissue US6088463A (en) 1998-10-30 1998-10-30 Solid state silicon-based condenser microphone

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US10/193,055 Expired - Lifetime USRE42346E1 (en) 1998-10-30 2002-07-11 Solid state silicon-based condenser microphone
US11/903,207 Expired - Lifetime USRE42347E1 (en) 1998-10-30 2007-09-20 Solid state silicon-based condenser microphone

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090067659A1 (en) * 2007-09-12 2009-03-12 Christian Wang Miniature microphone assembly with hydrophobic surface coating
US20090309174A1 (en) * 2008-06-17 2009-12-17 Infineon Technologies Ag Sensor module and semiconductor chip
US20110006381A1 (en) * 2007-12-07 2011-01-13 Epcos Ag Mems package and method for the production thereof
US9056760B2 (en) 2010-01-29 2015-06-16 Epcos Ag Miniaturized electrical component comprising an MEMS and an ASIC and production method

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000041432A2 (en) * 1999-01-07 2000-07-13 Sarnoff Corporation Hearing aid with large diaphragm microphone element including a printed circuit board
US6732588B1 (en) * 1999-09-07 2004-05-11 Sonionmems A/S Pressure transducer
US6522762B1 (en) * 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
US6782109B2 (en) * 2000-04-04 2004-08-24 University Of Florida Electromechanical acoustic liner
US7606608B2 (en) * 2000-05-02 2009-10-20 Sensys Medical, Inc. Optical sampling interface system for in-vivo measurement of tissue
US8623710B1 (en) 2000-11-28 2014-01-07 Knowles Electronics, Llc Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US6741709B2 (en) * 2000-12-20 2004-05-25 Shure Incorporated Condenser microphone assembly
GB2386031B (en) * 2000-12-22 2004-08-18 Bruel & Kjaer Sound & Vibratio A highly stable micromachined capacitive transducer
WO2002073792A2 (en) * 2001-03-09 2002-09-19 Techtronic A/S An electret condensor microphone preamplifier that is insensitive to leakage currents at the input
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US7298856B2 (en) * 2001-09-05 2007-11-20 Nippon Hoso Kyokai Chip microphone and method of making same
DE60221857T2 (en) * 2001-09-10 2008-05-08 Sonion A/S Acoustic miniature converter
AU2002365352A1 (en) * 2001-11-27 2003-06-10 Corporation For National Research Initiatives A miniature condenser microphone and fabrication method therefor
US6696645B2 (en) * 2002-05-08 2004-02-24 The Regents Of The University Of Michigan On-wafer packaging for RF-MEMS
US7072482B2 (en) 2002-09-06 2006-07-04 Sonion Nederland B.V. Microphone with improved sound inlet port
US6667189B1 (en) * 2002-09-13 2003-12-23 Institute Of Microelectronics High performance silicon condenser microphone with perforated single crystal silicon backplate
US7142682B2 (en) * 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US7466835B2 (en) 2003-03-18 2008-12-16 Sonion A/S Miniature microphone with balanced termination
DE10343292B3 (en) * 2003-09-18 2004-12-02 Siemens Audiologische Technik Gmbh Hearing aid e.g. for hearing impaired people, without separate microphone housing, has hearing aid housing and a microphone housing which are formed from a one-piece with housing having cover for acoustic isolation
EP1599067B1 (en) * 2004-05-21 2013-05-01 Epcos Pte Ltd Detection and control of diaphragm collapse in condenser microphones
US7929714B2 (en) * 2004-08-11 2011-04-19 Qualcomm Incorporated Integrated audio codec with silicon audio transducer
TWI260938B (en) * 2004-10-01 2006-08-21 Ind Tech Res Inst Dynamic pressure sensing structure
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JP2007081614A (en) * 2005-09-13 2007-03-29 Star Micronics Co Ltd Condenser microphone
WO2007042336A2 (en) * 2005-10-14 2007-04-19 Stmicroelectronics S.R.L. Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
DE102006011545B4 (en) * 2006-03-14 2016-03-17 Robert Bosch Gmbh Micromechanical combination component and corresponding manufacturing method
CN101427593B (en) * 2006-03-30 2012-09-19 普尔斯门斯公司 Single die MEMS acoustic transducer and manufacturing method
US8134375B2 (en) * 2006-05-17 2012-03-13 Nxp B.V. Capacitive MEMS sensor device
TWI319690B (en) * 2006-09-08 2010-01-11 Ind Tech Res Inst Structure and manufacturing method of inversed microphone module and microphone chip component
ATE550886T1 (en) * 2006-09-26 2012-04-15 Epcos Pte Ltd CALIBRATED MICROELECTROMECHANICAL MICROPHONE
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US7903835B2 (en) * 2006-10-18 2011-03-08 The Research Foundation Of State University Of New York Miniature non-directional microphone
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US8571249B2 (en) * 2009-05-29 2013-10-29 General Mems Corporation Silicon microphone package
TW201126654A (en) * 2010-01-22 2011-08-01 Lingsen Precision Ind Ltd Micro electro-mechanical package module
DE102010022204B4 (en) 2010-05-20 2016-03-31 Epcos Ag Electric component with flat design and manufacturing process
DE102011084541A1 (en) * 2011-10-14 2013-04-18 Robert Bosch Gmbh Microelectromechanical loudspeaker array and method of operating a micro-electro-mechanical loudspeaker array
US9374643B2 (en) 2011-11-04 2016-06-21 Knowles Electronics, Llc Embedded dielectric as a barrier in an acoustic device and method of manufacture
US20140003632A1 (en) * 2012-06-28 2014-01-02 Ams Ag Microphone arrangement
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US9181086B1 (en) 2012-10-01 2015-11-10 The Research Foundation For The State University Of New York Hinged MEMS diaphragm and method of manufacture therof
US9143870B2 (en) 2012-11-09 2015-09-22 Invensense, Inc. Microphone system with mechanically-coupled diaphragms
US8809973B2 (en) 2013-01-23 2014-08-19 Infineon Technologies Ag Chip package comprising a microphone structure and a method of manufacturing the same
US9173024B2 (en) * 2013-01-31 2015-10-27 Invensense, Inc. Noise mitigating microphone system
ITTO20130350A1 (en) 2013-04-30 2014-10-31 St Microelectronics Srl SLICE ASSEMBLY OF A MEMS SENSOR DEVICE AND RELATIVE MEMS SENSOR DEVICE
US9584889B2 (en) 2013-08-27 2017-02-28 Infineon Technologies Ag System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille
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Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3325961A1 (en) 1983-07-19 1985-01-31 Dietmar Hohm Silicon-based capacitive transducers incorporating silicon dioxide electret
US4922471A (en) 1988-03-05 1990-05-01 Sennheiser Electronic Kg Capacitive sound transducer
EP0490486A2 (en) 1990-12-07 1992-06-17 Wisconsin Alumni Research Foundation Micromachined differential pressure transducers and method of producing the same
US5146435A (en) 1989-12-04 1992-09-08 The Charles Stark Draper Laboratory, Inc. Acoustic transducer
EP0561566A2 (en) 1992-03-18 1993-09-22 Knowles Electronics, Inc. Solid state condenser and microphone
WO1993019343A1 (en) 1992-03-16 1993-09-30 Lynxvale Limited Micromechanical sensor
US5255246A (en) 1991-09-17 1993-10-19 Siemens Nederland N.V. Electroacoustic transducer of the electret type
US5303210A (en) * 1992-10-29 1994-04-12 The Charles Stark Draper Laboratory, Inc. Integrated resonant cavity acoustic transducer
WO1994025863A2 (en) 1993-05-05 1994-11-10 Siemens Aktiengesellschaft Process for depositing a large-surface layer through a mask and optional closure of said mask
WO1994030030A1 (en) 1993-06-04 1994-12-22 The Regents Of The University Of California Microfabricated acoustic source and receiver
US5452268A (en) 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
WO1995034917A1 (en) 1994-06-10 1995-12-21 The Regents Of The University Of California Cantilever pressure transducer
US5490220A (en) 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
US5531787A (en) 1993-01-25 1996-07-02 Lesinski; S. George Implantable auditory system with micromachined microsensor and microactuator
US5573679A (en) 1995-06-19 1996-11-12 Alberta Microelectronic Centre Fabrication of a surface micromachined capacitive microphone using a dry-etch process
WO1997001258A1 (en) 1995-06-23 1997-01-09 Microtronic A/S Micromechanical microphone
JPH0937382A (en) 1995-07-19 1997-02-07 Honda Motor Co Ltd Microphone
EP0783108A1 (en) 1996-01-08 1997-07-09 Siemens Aktiengesellschaft Micromechanical element with planarized cover over a cavity and method of fabrication
US5659195A (en) 1995-06-08 1997-08-19 The Regents Of The University Of California CMOS integrated microsensor with a precision measurement circuit
US5658710A (en) 1993-07-16 1997-08-19 Adagio Associates, Inc. Method of making superhard mechanical microstructures
US5677965A (en) 1992-09-11 1997-10-14 Csem Centre Suisse D'electronique Et De Microtechnique Integrated capacitive transducer
US5717631A (en) 1995-07-21 1998-02-10 Carnegie Mellon University Microelectromechanical structure and process of making same
US5740258A (en) 1995-06-05 1998-04-14 Mcnc Active noise supressors and methods for use in the ear canal
US5870482A (en) 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US6178249B1 (en) * 1998-06-18 2001-01-23 Nokia Mobile Phones Limited Attachment of a micromechanical microphone
US6806593B2 (en) * 1996-04-18 2004-10-19 California Institute Of Technology Thin film electret microphone

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3325961A1 (en) 1983-07-19 1985-01-31 Dietmar Hohm Silicon-based capacitive transducers incorporating silicon dioxide electret
US4922471A (en) 1988-03-05 1990-05-01 Sennheiser Electronic Kg Capacitive sound transducer
US5146435A (en) 1989-12-04 1992-09-08 The Charles Stark Draper Laboratory, Inc. Acoustic transducer
EP0490486A2 (en) 1990-12-07 1992-06-17 Wisconsin Alumni Research Foundation Micromachined differential pressure transducers and method of producing the same
US5255246A (en) 1991-09-17 1993-10-19 Siemens Nederland N.V. Electroacoustic transducer of the electret type
WO1993019343A1 (en) 1992-03-16 1993-09-30 Lynxvale Limited Micromechanical sensor
US5490220A (en) 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
EP0561566A2 (en) 1992-03-18 1993-09-22 Knowles Electronics, Inc. Solid state condenser and microphone
US5677965A (en) 1992-09-11 1997-10-14 Csem Centre Suisse D'electronique Et De Microtechnique Integrated capacitive transducer
US5303210A (en) * 1992-10-29 1994-04-12 The Charles Stark Draper Laboratory, Inc. Integrated resonant cavity acoustic transducer
US5531787A (en) 1993-01-25 1996-07-02 Lesinski; S. George Implantable auditory system with micromachined microsensor and microactuator
WO1994025863A2 (en) 1993-05-05 1994-11-10 Siemens Aktiengesellschaft Process for depositing a large-surface layer through a mask and optional closure of said mask
WO1994030030A1 (en) 1993-06-04 1994-12-22 The Regents Of The University Of California Microfabricated acoustic source and receiver
US5658710A (en) 1993-07-16 1997-08-19 Adagio Associates, Inc. Method of making superhard mechanical microstructures
WO1995034917A1 (en) 1994-06-10 1995-12-21 The Regents Of The University Of California Cantilever pressure transducer
US5452268A (en) 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
US5740258A (en) 1995-06-05 1998-04-14 Mcnc Active noise supressors and methods for use in the ear canal
US5659195A (en) 1995-06-08 1997-08-19 The Regents Of The University Of California CMOS integrated microsensor with a precision measurement circuit
US5573679A (en) 1995-06-19 1996-11-12 Alberta Microelectronic Centre Fabrication of a surface micromachined capacitive microphone using a dry-etch process
WO1997001258A1 (en) 1995-06-23 1997-01-09 Microtronic A/S Micromechanical microphone
JPH0937382A (en) 1995-07-19 1997-02-07 Honda Motor Co Ltd Microphone
US5717631A (en) 1995-07-21 1998-02-10 Carnegie Mellon University Microelectromechanical structure and process of making same
US5970315A (en) 1995-07-21 1999-10-19 Carnegie Mellon University Microelectromechanical structure and process of making same
EP0783108A1 (en) 1996-01-08 1997-07-09 Siemens Aktiengesellschaft Micromechanical element with planarized cover over a cavity and method of fabrication
US6806593B2 (en) * 1996-04-18 2004-10-19 California Institute Of Technology Thin film electret microphone
US5870482A (en) 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US6178249B1 (en) * 1998-06-18 2001-01-23 Nokia Mobile Phones Limited Attachment of a micromechanical microphone

Non-Patent Citations (14)

* Cited by examiner, † Cited by third party
Title
Bay, Jesper, et al., "Design Of A Silicon Microphone With Differential Read-Out Of A Sealed Double Parallel-Plate Capacitor," Sensors and Actuators A, vol. 53, pp. 232-236 (1996).
Bouwstra, Siebe, et al., "Silicon Microphones-A Danish Perspective," J. Micromech. Microeng., vol. 8, pp. 64-68 (1998).
Chowdhury, Sazzadur, et al., "MEMS Acousto-Magnetic Components For Use In A Hearing Instrument," Presentation at SPIE's Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 14 pages (May 9-11, 2000).
Dehé, A., et al., "Silicon Micromachined Microphone Chip At Siemens," 4 pages (no date).
Emkay Innovative Products, "Surface Mount Microphones: A New Options for OEMs," EPN, 2 pages (Jun. 11, 2002).
Emkay Innovative Products, Brochure for "SiSonic(TM) Silicon Microphone," 2 pages (no date).
Emkay Innovative Products, Brochure for "SiSonic™ Silicon Microphone," 2 pages (no date).
Emkay Innovative Products, Press Release for "Advancement In Silicon Technology Leads To Partnership With Institute Of Microelectronics-Singapore," 2 pages (Jan. 9, 1998).
Hsu, P.-C, et al., "A High Sensitivity Polysilicon Diaphragm Condenser Microphone," Presentation at MEMS Conference, 6 pages (Jan. 25-29, 1998).
Müllenborn, Matthias, "Microsystems For Hearing Instruments," Micro Structure Bulletin, No. 3, 1 page (Aug. 1998).
Ouellette, Jennifer, "The Incredible Shrinking Microphone," The Industrial Physicist, 3 pages (Aug. 1999).
Scheeper, P. R., et al., "Fabrication Of Silicon Condenser Microphones Using Single Wafer Technology," Journal Of Microelectromechanical Systems, vol. 1, No. 3, pp. 147-154 (Sep. 1992).
SonionMEMS, Brochure for Silicon Microphone, 4 pages (no date).
van der Donk, A.G.H., et al., "Preliminary Results Of A Silicon Condenser Microphone With Internal Feedback," IEEE, pp. 262-265 (1991).

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* Cited by examiner, † Cited by third party
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US8542850B2 (en) * 2007-09-12 2013-09-24 Epcos Pte Ltd Miniature microphone assembly with hydrophobic surface coating
US20110006381A1 (en) * 2007-12-07 2011-01-13 Epcos Ag Mems package and method for the production thereof
US8674498B2 (en) 2007-12-07 2014-03-18 Epcos Ag MEMS package and method for the production thereof
US20090309174A1 (en) * 2008-06-17 2009-12-17 Infineon Technologies Ag Sensor module and semiconductor chip
US8604566B2 (en) * 2008-06-17 2013-12-10 Infineon Technologies Ag Sensor module and semiconductor chip
US9090453B2 (en) 2008-06-17 2015-07-28 Infineon Technologies Ag Sensor module and semiconductor chip
US9533874B2 (en) 2008-06-17 2017-01-03 Infineon Technologies Ag Sensor module and semiconductor chip
US9056760B2 (en) 2010-01-29 2015-06-16 Epcos Ag Miniaturized electrical component comprising an MEMS and an ASIC and production method

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