USRE35509E - Polyphenylene ether/polyamide blends having improved physical properties - Google Patents
Polyphenylene ether/polyamide blends having improved physical properties Download PDFInfo
- Publication number
- USRE35509E USRE35509E US08/273,347 US27334794A USRE35509E US RE35509 E USRE35509 E US RE35509E US 27334794 A US27334794 A US 27334794A US RE35509 E USRE35509 E US RE35509E
- Authority
- US
- United States
- Prior art keywords
- acid
- group
- composition according
- polyamide
- ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004952 Polyamide Substances 0.000 title claims abstract description 66
- 229920002647 polyamide Polymers 0.000 title claims abstract description 66
- 239000000203 mixture Substances 0.000 title claims abstract description 55
- 229920001955 polyphenylene ether Polymers 0.000 title claims abstract description 50
- 230000000704 physical effect Effects 0.000 title abstract description 3
- 125000003277 amino group Chemical group 0.000 claims abstract description 27
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 25
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 44
- 150000001875 compounds Chemical class 0.000 claims description 33
- -1 poly(2,6-diethyl-1,4-phenylene) Polymers 0.000 claims description 33
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 31
- 239000002253 acid Substances 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims description 18
- 229920001577 copolymer Polymers 0.000 claims description 18
- 229920006122 polyamide resin Polymers 0.000 claims description 15
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 13
- 239000011342 resin composition Substances 0.000 claims description 13
- 229920002292 Nylon 6 Polymers 0.000 claims description 11
- 125000001931 aliphatic group Chemical group 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 150000004985 diamines Chemical class 0.000 claims description 10
- 150000001408 amides Chemical class 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 150000008065 acid anhydrides Chemical class 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 150000003951 lactams Chemical class 0.000 claims description 8
- 239000007795 chemical reaction product Substances 0.000 claims description 7
- 125000000524 functional group Chemical group 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 6
- 150000001733 carboxylic acid esters Chemical class 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 6
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- 230000000379 polymerizing effect Effects 0.000 claims description 6
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 claims description 4
- 229920000265 Polyparaphenylene Polymers 0.000 claims description 4
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 4
- 150000001991 dicarboxylic acids Chemical class 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 150000003949 imides Chemical class 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 claims description 4
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 claims description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 4
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 4
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 claims description 4
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 3
- 125000004018 acid anhydride group Chemical group 0.000 claims description 3
- 239000001361 adipic acid Substances 0.000 claims description 3
- 235000011037 adipic acid Nutrition 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 150000001721 carbon Chemical group 0.000 claims description 3
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims description 3
- 239000003999 initiator Substances 0.000 claims description 3
- 150000002989 phenols Chemical class 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 claims description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 2
- DCAKVVTXKWWUGN-UHFFFAOYSA-N 3,3-dimethylazetidin-2-one Chemical compound CC1(C)CNC1=O DCAKVVTXKWWUGN-UHFFFAOYSA-N 0.000 claims description 2
- 150000005416 4-aminobenzoic acids Chemical class 0.000 claims description 2
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 claims description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 2
- QFNNDGVVMCZKEY-UHFFFAOYSA-N azacyclododecan-2-one Chemical compound O=C1CCCCCCCCCCN1 QFNNDGVVMCZKEY-UHFFFAOYSA-N 0.000 claims description 2
- CJYXCQLOZNIMFP-UHFFFAOYSA-N azocan-2-one Chemical compound O=C1CCCCCCN1 CJYXCQLOZNIMFP-UHFFFAOYSA-N 0.000 claims description 2
- YDLSUFFXJYEVHW-UHFFFAOYSA-N azonan-2-one Chemical compound O=C1CCCCCCCN1 YDLSUFFXJYEVHW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 230000007717 exclusion Effects 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 125000004438 haloalkoxy group Chemical group 0.000 claims description 2
- 125000001188 haloalkyl group Chemical group 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 229910052740 iodine Inorganic materials 0.000 claims description 2
- 150000002531 isophthalic acids Chemical class 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 239000011976 maleic acid Substances 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims description 2
- 229920000098 polyolefin Polymers 0.000 claims description 2
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 2
- 125000001424 substituent group Chemical group 0.000 claims description 2
- 150000003504 terephthalic acids Chemical class 0.000 claims description 2
- 150000002763 monocarboxylic acids Chemical class 0.000 claims 2
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 claims 1
- 229920000571 Nylon 11 Polymers 0.000 claims 1
- 229920003188 Nylon 3 Polymers 0.000 claims 1
- 229920001007 Nylon 4 Polymers 0.000 claims 1
- 229920000572 Nylon 6/12 Polymers 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 15
- 229920006380 polyphenylene oxide Polymers 0.000 description 14
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 11
- 239000000945 filler Substances 0.000 description 11
- 239000003063 flame retardant Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 239000003921 oil Substances 0.000 description 10
- 235000019198 oils Nutrition 0.000 description 10
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 10
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 8
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical class C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000001630 malic acid Substances 0.000 description 5
- 235000011090 malic acid Nutrition 0.000 description 5
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 150000001463 antimony compounds Chemical class 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 235000019253 formic acid Nutrition 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- NJMOHBDCGXJLNJ-UHFFFAOYSA-N trimellitic anhydride chloride Chemical compound ClC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 NJMOHBDCGXJLNJ-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 150000004756 silanes Chemical class 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- ULNRTPCFRBIMKL-GHVJWSGMSA-N (e)-2-tetracosenoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCC\C=C\C(O)=O ULNRTPCFRBIMKL-GHVJWSGMSA-N 0.000 description 2
- WSWCOQWTEOXDQX-UHFFFAOYSA-N 2,4-Hexadienoic acid Chemical compound CC=CC=CC(O)=O WSWCOQWTEOXDQX-UHFFFAOYSA-N 0.000 description 2
- PEGWVOACELENRK-UHFFFAOYSA-N 2-(2-amino-2-oxoethyl)-2-hydroxybutanedioic acid Chemical compound NC(=O)CC(O)(C(O)=O)CC(O)=O PEGWVOACELENRK-UHFFFAOYSA-N 0.000 description 2
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 2
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 2
- HZLCGUXUOFWCCN-UHFFFAOYSA-N 2-hydroxynonadecane-1,2,3-tricarboxylic acid Chemical compound CCCCCCCCCCCCCCCCC(C(O)=O)C(O)(C(O)=O)CC(O)=O HZLCGUXUOFWCCN-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- UIERETOOQGIECD-UHFFFAOYSA-N Angelic acid Natural products CC=C(C)C(O)=O UIERETOOQGIECD-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920004939 Cariflex™ Polymers 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- YIYBQIKDCADOSF-UHFFFAOYSA-N alpha-Butylen-alpha-carbonsaeure Natural products CCC=CC(O)=O YIYBQIKDCADOSF-UHFFFAOYSA-N 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 2
- GWHCXVQVJPWHRF-UHFFFAOYSA-N cis-tetracosenoic acid Natural products CCCCCCCCC=CCCCCCCCCCCCCCC(O)=O GWHCXVQVJPWHRF-UHFFFAOYSA-N 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229920002959 polymer blend Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 2
- YIYBQIKDCADOSF-ONEGZZNKSA-N trans-pent-2-enoic acid Chemical compound CC\C=C\C(O)=O YIYBQIKDCADOSF-ONEGZZNKSA-N 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- BITHHVVYSMSWAG-KTKRTIGZSA-N (11Z)-icos-11-enoic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCC(O)=O BITHHVVYSMSWAG-KTKRTIGZSA-N 0.000 description 1
- XSXIVVZCUAHUJO-AVQMFFATSA-N (11e,14e)-icosa-11,14-dienoic acid Chemical compound CCCCC\C=C\C\C=C\CCCCCCCCCC(O)=O XSXIVVZCUAHUJO-AVQMFFATSA-N 0.000 description 1
- WBBQTNCISCKUMU-PDBXOOCHSA-N (13Z,16Z,19Z)-docosatrienoic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCCCCCC(O)=O WBBQTNCISCKUMU-PDBXOOCHSA-N 0.000 description 1
- NIONDZDPPYHYKY-SNAWJCMRSA-N (2E)-hexenoic acid Chemical compound CCC\C=C\C(O)=O NIONDZDPPYHYKY-SNAWJCMRSA-N 0.000 description 1
- CWMPPVPFLSZGCY-VOTSOKGWSA-N (2E)-oct-2-enoic acid Chemical compound CCCCC\C=C\C(O)=O CWMPPVPFLSZGCY-VOTSOKGWSA-N 0.000 description 1
- YKHVVNDSWHSBPA-BLHCBFLLSA-N (2E,4E)-deca-2,4-dienoic acid Chemical compound CCCCC\C=C\C=C\C(O)=O YKHVVNDSWHSBPA-BLHCBFLLSA-N 0.000 description 1
- SZQQHKQCCBDXCG-BAHYSTIISA-N (2e,4e,6e)-hexadeca-2,4,6-trienoic acid Chemical compound CCCCCCCCC\C=C\C=C\C=C\C(O)=O SZQQHKQCCBDXCG-BAHYSTIISA-N 0.000 description 1
- ZUUFLXSNVWQOJW-MBIXAETLSA-N (2e,4e,6e)-octadeca-2,4,6-trienoic acid Chemical compound CCCCCCCCCCC\C=C\C=C\C=C\C(O)=O ZUUFLXSNVWQOJW-MBIXAETLSA-N 0.000 description 1
- FPRKGXIOSIUDSE-SYACGTDESA-N (2z,4z,6z,8z)-docosa-2,4,6,8-tetraenoic acid Chemical compound CCCCCCCCCCCCC\C=C/C=C\C=C/C=C\C(O)=O FPRKGXIOSIUDSE-SYACGTDESA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- YUFFSWGQGVEMMI-JLNKQSITSA-N (7Z,10Z,13Z,16Z,19Z)-docosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCCCC(O)=O YUFFSWGQGVEMMI-JLNKQSITSA-N 0.000 description 1
- YWWVWXASSLXJHU-AATRIKPKSA-N (9E)-tetradecenoic acid Chemical compound CCCC\C=C\CCCCCCCC(O)=O YWWVWXASSLXJHU-AATRIKPKSA-N 0.000 description 1
- CUXYLFPMQMFGPL-UHFFFAOYSA-N (9Z,11E,13E)-9,11,13-Octadecatrienoic acid Natural products CCCCC=CC=CC=CCCCCCCCC(O)=O CUXYLFPMQMFGPL-UHFFFAOYSA-N 0.000 description 1
- RVEKLXYYCHAMDF-UHFFFAOYSA-N (9Z,12Z)-9,12-hexadecadienoic acid Natural products CCCC=CCC=CCCCCCCCC(O)=O RVEKLXYYCHAMDF-UHFFFAOYSA-N 0.000 description 1
- 239000001373 (E)-2-methylpent-2-enoic acid Substances 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- UISKOSOSWPDCPD-CYYJNZCTSA-N (E)-octacos-2-enoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCC\C=C\C(O)=O UISKOSOSWPDCPD-CYYJNZCTSA-N 0.000 description 1
- SDVVLIIVFBKBMG-ONEGZZNKSA-N (E)-penta-2,4-dienoic acid Chemical compound OC(=O)\C=C\C=C SDVVLIIVFBKBMG-ONEGZZNKSA-N 0.000 description 1
- HVGRZDASOHMCSK-UHFFFAOYSA-N (Z,Z)-13,16-docosadienoic acid Natural products CCCCCC=CCC=CCCCCCCCCCCCC(O)=O HVGRZDASOHMCSK-UHFFFAOYSA-N 0.000 description 1
- KFSQJVOLYQRELE-HWKANZROSA-N (e)-2-ethylbut-2-enoic acid Chemical compound CC\C(=C/C)C(O)=O KFSQJVOLYQRELE-HWKANZROSA-N 0.000 description 1
- XKZKQTCECFWKBN-VOTSOKGWSA-N (e)-dec-4-enoic acid Chemical compound CCCCC\C=C\CCC(O)=O XKZKQTCECFWKBN-VOTSOKGWSA-N 0.000 description 1
- ATNNLHXCRAAGJS-QZQOTICOSA-N (e)-docos-2-enoic acid Chemical compound CCCCCCCCCCCCCCCCCCC\C=C\C(O)=O ATNNLHXCRAAGJS-QZQOTICOSA-N 0.000 description 1
- GCORITRBZMICMI-CMDGGOBGSA-N (e)-dodec-4-enoic acid Chemical compound CCCCCCC\C=C\CCC(O)=O GCORITRBZMICMI-CMDGGOBGSA-N 0.000 description 1
- IJBFSOLHRKELLR-BQYQJAHWSA-N (e)-dodec-5-enoic acid Chemical compound CCCCCC\C=C\CCCC(O)=O IJBFSOLHRKELLR-BQYQJAHWSA-N 0.000 description 1
- JLIDBLDQVAYHNE-IBPUIESWSA-N (s)-(+)-Abscisic acid Natural products OC(=O)\C=C(/C)\C=C\[C@@]1(O)C(C)=CC(=O)CC1(C)C JLIDBLDQVAYHNE-IBPUIESWSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- DMYOHQBLOZMDLP-UHFFFAOYSA-N 1-[2-(2-hydroxy-3-piperidin-1-ylpropoxy)phenyl]-3-phenylpropan-1-one Chemical compound C1CCCCN1CC(O)COC1=CC=CC=C1C(=O)CCC1=CC=CC=C1 DMYOHQBLOZMDLP-UHFFFAOYSA-N 0.000 description 1
- DGZQEAKNZXNTNL-UHFFFAOYSA-N 1-bromo-4-butan-2-ylbenzene Chemical class CCC(C)C1=CC=C(Br)C=C1 DGZQEAKNZXNTNL-UHFFFAOYSA-N 0.000 description 1
- FRPZMMHWLSIFAZ-UHFFFAOYSA-N 10-undecenoic acid Chemical compound OC(=O)CCCCCCCCC=C FRPZMMHWLSIFAZ-UHFFFAOYSA-N 0.000 description 1
- SCFWAOWWAANBPY-UHFFFAOYSA-N 2,2-dimethyl-3-butenoic acid Chemical compound C=CC(C)(C)C(O)=O SCFWAOWWAANBPY-UHFFFAOYSA-N 0.000 description 1
- YKHVVNDSWHSBPA-UHFFFAOYSA-N 2,4-Decadienoic acid Natural products CCCCCC=CC=CC(O)=O YKHVVNDSWHSBPA-UHFFFAOYSA-N 0.000 description 1
- OJMZQYGIPTULAQ-UHFFFAOYSA-N 2,5-dioxooxolane-3-carbonyl chloride Chemical compound ClC(=O)C1CC(=O)OC1=O OJMZQYGIPTULAQ-UHFFFAOYSA-N 0.000 description 1
- MZJKINAHEDNRTM-UHFFFAOYSA-N 2-(2-anilino-2-oxoethyl)-2-hydroxybutanedioic acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(=O)NC1=CC=CC=C1 MZJKINAHEDNRTM-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- UIERETOOQGIECD-ARJAWSKDSA-M 2-Methyl-2-butenoic acid Natural products C\C=C(\C)C([O-])=O UIERETOOQGIECD-ARJAWSKDSA-M 0.000 description 1
- JJYWRQLLQAKNAD-UHFFFAOYSA-N 2-Methyl-2-pentenoic acid Natural products CCC=C(C)C(O)=O JJYWRQLLQAKNAD-UHFFFAOYSA-N 0.000 description 1
- CWMPPVPFLSZGCY-UHFFFAOYSA-N 2-Octenoic Acid Natural products CCCCCC=CC(O)=O CWMPPVPFLSZGCY-UHFFFAOYSA-N 0.000 description 1
- ABGBGJXCHTWNJK-UHFFFAOYSA-N 2-[2-(dodecylamino)-2-oxoethyl]-2-hydroxybutanedioic acid Chemical compound CCCCCCCCCCCCNC(=O)CC(O)(C(O)=O)CC(O)=O ABGBGJXCHTWNJK-UHFFFAOYSA-N 0.000 description 1
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 1
- IMQYZLJIDNYQLX-UHFFFAOYSA-N 2-hydroxy-4-octadecoxy-2-(2-octadecoxy-2-oxoethyl)-4-oxobutanoic acid Chemical class CCCCCCCCCCCCCCCCCCOC(=O)CC(O)(C(O)=O)CC(=O)OCCCCCCCCCCCCCCCCCC IMQYZLJIDNYQLX-UHFFFAOYSA-N 0.000 description 1
- JJYWRQLLQAKNAD-PLNGDYQASA-N 2-methyl-2-pentenoic acid Chemical compound CC\C=C(\C)C(O)=O JJYWRQLLQAKNAD-PLNGDYQASA-N 0.000 description 1
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical class CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- OKJQSUPURXTNME-UHFFFAOYSA-N 2-prop-2-enylpent-4-enoic acid Chemical compound C=CCC(C(=O)O)CC=C OKJQSUPURXTNME-UHFFFAOYSA-N 0.000 description 1
- HQSBWLQFLLMPKC-BNFZFUHLSA-N 2E,4E-Dodecadienoic acid Chemical compound CCCCCCC\C=C\C=C\C(O)=O HQSBWLQFLLMPKC-BNFZFUHLSA-N 0.000 description 1
- AGULWIQIYWWFBJ-UHFFFAOYSA-N 3,4-dichlorofuran-2,5-dione Chemical compound ClC1=C(Cl)C(=O)OC1=O AGULWIQIYWWFBJ-UHFFFAOYSA-N 0.000 description 1
- IFPRFYJBSUMODH-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione prop-2-enoic acid Chemical compound OC(=O)C=C.O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 IFPRFYJBSUMODH-UHFFFAOYSA-N 0.000 description 1
- RSFQOQOSOMBPEJ-PLNGDYQASA-N 3-methyl-2Z-pentenoic acid Chemical compound CC\C(C)=C/C(O)=O RSFQOQOSOMBPEJ-PLNGDYQASA-N 0.000 description 1
- YYPNJNDODFVZLE-UHFFFAOYSA-N 3-methylbut-2-enoic acid Chemical compound CC(C)=CC(O)=O YYPNJNDODFVZLE-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- BDBZTOMUANOKRT-UHFFFAOYSA-N 4-[2-(4-aminocyclohexyl)propan-2-yl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1C(C)(C)C1CCC(N)CC1 BDBZTOMUANOKRT-UHFFFAOYSA-N 0.000 description 1
- HUXPKQXHDPXCMM-UHFFFAOYSA-N 5,6-dimethylheptane-1,6-diamine Chemical compound CC(N)(C)C(C)CCCCN HUXPKQXHDPXCMM-UHFFFAOYSA-N 0.000 description 1
- PXRKCOCTEMYUEG-UHFFFAOYSA-N 5-aminoisoindole-1,3-dione Chemical compound NC1=CC=C2C(=O)NC(=O)C2=C1 PXRKCOCTEMYUEG-UHFFFAOYSA-N 0.000 description 1
- SNULTPQANPFFQH-UHFFFAOYSA-N 6-methoxy-1h-1,3,5-triazine-2,4-dione Chemical compound COC1=NC(=O)NC(=O)N1 SNULTPQANPFFQH-UHFFFAOYSA-N 0.000 description 1
- RVEKLXYYCHAMDF-AOSYACOCSA-N 9,12-Hexadecadienoic acid Chemical compound CCC\C=C\C\C=C\CCCCCCCC(O)=O RVEKLXYYCHAMDF-AOSYACOCSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- YWWVWXASSLXJHU-UHFFFAOYSA-N 9E-tetradecenoic acid Natural products CCCCC=CCCCCCCCC(O)=O YWWVWXASSLXJHU-UHFFFAOYSA-N 0.000 description 1
- WWXUGNUFCNYMFK-UHFFFAOYSA-N Acetyl citrate Chemical compound CC(=O)OC(=O)CC(O)(C(O)=O)CC(O)=O WWXUGNUFCNYMFK-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 101100480489 Arabidopsis thaliana TAAC gene Proteins 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- SGVHBQGYRHGVTP-UHFFFAOYSA-N C(C(=C)C)(=O)O.C(=CC1=CC=CC=C1)/C/1=C/C(=O)OC1=O Chemical compound C(C(=C)C)(=O)O.C(=CC1=CC=CC=C1)/C/1=C/C(=O)OC1=O SGVHBQGYRHGVTP-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 241000790917 Dioxys <bee> Species 0.000 description 1
- 235000021294 Docosapentaenoic acid Nutrition 0.000 description 1
- 235000021292 Docosatetraenoic acid Nutrition 0.000 description 1
- 235000021297 Eicosadienoic acid Nutrition 0.000 description 1
- 101000885147 Enterococcus avium D-arabitol-phosphate dehydrogenase Proteins 0.000 description 1
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- VHOQXEIFYTTXJU-UHFFFAOYSA-N Isobutylene-isoprene copolymer Chemical compound CC(C)=C.CC(=C)C=C VHOQXEIFYTTXJU-UHFFFAOYSA-N 0.000 description 1
- GCORITRBZMICMI-UHFFFAOYSA-N Linderic acid Natural products CCCCCCCC=CCCC(O)=O GCORITRBZMICMI-UHFFFAOYSA-N 0.000 description 1
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 1
- BGRDGMRNKXEXQD-UHFFFAOYSA-N Maleic hydrazide Chemical compound OC1=CC=C(O)N=N1 BGRDGMRNKXEXQD-UHFFFAOYSA-N 0.000 description 1
- 239000005983 Maleic hydrazide Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 235000019483 Peanut oil Nutrition 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
- 101100386054 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CYS3 gene Proteins 0.000 description 1
- 241001125046 Sardina pilchardus Species 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229920001079 Thiokol (polymer) Polymers 0.000 description 1
- CUVLOCDGQCUQSI-KHPPLWFESA-N Tsuzuic acid Chemical compound CCCCCCCCC\C=C/CCC(O)=O CUVLOCDGQCUQSI-KHPPLWFESA-N 0.000 description 1
- CUVLOCDGQCUQSI-UHFFFAOYSA-N Tsuzusaeure Natural products CCCCCCCCCC=CCCC(O)=O CUVLOCDGQCUQSI-UHFFFAOYSA-N 0.000 description 1
- 229920006097 Ultramide® Polymers 0.000 description 1
- NIONDZDPPYHYKY-UHFFFAOYSA-N Z-hexenoic acid Natural products CCCC=CC(O)=O NIONDZDPPYHYKY-UHFFFAOYSA-N 0.000 description 1
- HHKDWDAAEFGBAC-LAGVYOHYSA-N [(1s,4s)-5-bicyclo[2.2.1]hept-2-enyl]-triethoxysilane Chemical compound C1[C@@H]2C([Si](OCC)(OCC)OCC)C[C@H]1C=C2 HHKDWDAAEFGBAC-LAGVYOHYSA-N 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 229920006222 acrylic ester polymer Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- JAZBEHYOTPTENJ-JLNKQSITSA-N all-cis-5,8,11,14,17-icosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O JAZBEHYOTPTENJ-JLNKQSITSA-N 0.000 description 1
- CUXYLFPMQMFGPL-SUTYWZMXSA-N all-trans-octadeca-9,11,13-trienoic acid Chemical compound CCCC\C=C\C=C\C=C\CCCCCCCC(O)=O CUXYLFPMQMFGPL-SUTYWZMXSA-N 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- UIERETOOQGIECD-ARJAWSKDSA-N angelic acid Chemical compound C\C=C(\C)C(O)=O UIERETOOQGIECD-ARJAWSKDSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000012661 block copolymerization Methods 0.000 description 1
- PVEOYINWKBTPIZ-UHFFFAOYSA-N but-3-enoic acid Chemical compound OC(=O)CC=C PVEOYINWKBTPIZ-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- FNAQSUUGMSOBHW-UHFFFAOYSA-H calcium citrate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O FNAQSUUGMSOBHW-UHFFFAOYSA-H 0.000 description 1
- 239000001354 calcium citrate Substances 0.000 description 1
- 239000001362 calcium malate Substances 0.000 description 1
- 235000011038 calcium malates Nutrition 0.000 description 1
- KHAVLLBUVKBTBG-UHFFFAOYSA-N caproleic acid Natural products OC(=O)CCCCCCCC=C KHAVLLBUVKBTBG-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- QDRSJFZQMOOSAF-IHWYPQMZSA-N cis-9-undecenoic acid Chemical compound C\C=C/CCCCCCCC(O)=O QDRSJFZQMOOSAF-IHWYPQMZSA-N 0.000 description 1
- SECPZKHBENQXJG-UHFFFAOYSA-N cis-palmitoleic acid Natural products CCCCCCC=CCCCCCCCC(O)=O SECPZKHBENQXJG-UHFFFAOYSA-N 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 235000012343 cottonseed oil Nutrition 0.000 description 1
- 239000002385 cottonseed oil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229920000359 diblock copolymer Polymers 0.000 description 1
- CVCXSNONTRFSEH-UHFFFAOYSA-N docosa-2,4-dienoic acid Chemical compound CCCCCCCCCCCCCCCCCC=CC=CC(O)=O CVCXSNONTRFSEH-UHFFFAOYSA-N 0.000 description 1
- HQSBWLQFLLMPKC-UHFFFAOYSA-N dodecadienoic acid Natural products CCCCCCCC=CC=CC(O)=O HQSBWLQFLLMPKC-UHFFFAOYSA-N 0.000 description 1
- 229960005135 eicosapentaenoic acid Drugs 0.000 description 1
- JAZBEHYOTPTENJ-UHFFFAOYSA-N eicosapentaenoic acid Natural products CCC=CCC=CCC=CCC=CCC=CCCCC(O)=O JAZBEHYOTPTENJ-UHFFFAOYSA-N 0.000 description 1
- 235000020673 eicosapentaenoic acid Nutrition 0.000 description 1
- IQLUYYHUNSSHIY-HZUMYPAESA-N eicosatetraenoic acid Chemical compound CCCCCCCCCCC\C=C\C=C\C=C\C=C\C(O)=O IQLUYYHUNSSHIY-HZUMYPAESA-N 0.000 description 1
- 229940108623 eicosenoic acid Drugs 0.000 description 1
- BITHHVVYSMSWAG-UHFFFAOYSA-N eicosenoic acid Natural products CCCCCCCCC=CCCCCCCCCCC(O)=O BITHHVVYSMSWAG-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-MDZDMXLPSA-N elaidic acid Chemical compound CCCCCCCC\C=C\CCCCCCCC(O)=O ZQPPMHVWECSIRJ-MDZDMXLPSA-N 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 229920005558 epichlorohydrin rubber Polymers 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- ZHYZQXUYZJNEHD-VQHVLOKHSA-N geranic acid Chemical compound CC(C)=CCC\C(C)=C\C(O)=O ZHYZQXUYZJNEHD-VQHVLOKHSA-N 0.000 description 1
- 229930008392 geranic acid Natural products 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000010460 hemp oil Substances 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 229960004232 linoleic acid Drugs 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- FSQQTNAZHBEJLS-UPHRSURJSA-N maleamic acid Chemical compound NC(=O)\C=C/C(O)=O FSQQTNAZHBEJLS-UPHRSURJSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- VKRWRNVGVPSVLA-UHFFFAOYSA-N n,n'-bis(2-phenylphenyl)oxamide Chemical compound C=1C=CC=C(C=2C=CC=CC=2)C=1NC(=O)C(=O)NC1=CC=CC=C1C1=CC=CC=C1 VKRWRNVGVPSVLA-UHFFFAOYSA-N 0.000 description 1
- CPHCIYGRSFZNRD-UHFFFAOYSA-N n-methyl-1-(4,5,6,7-tetrahydro-1h-indazol-3-yl)methanamine Chemical compound C1CCCC2=C1NN=C2CNC CPHCIYGRSFZNRD-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 239000004006 olive oil Substances 0.000 description 1
- 235000008390 olive oil Nutrition 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- SECPZKHBENQXJG-BQYQJAHWSA-N palmitelaidic acid Chemical compound CCCCCC\C=C\CCCCCCCC(O)=O SECPZKHBENQXJG-BQYQJAHWSA-N 0.000 description 1
- 239000000312 peanut oil Substances 0.000 description 1
- HVAMZGADVCBITI-UHFFFAOYSA-N pent-4-enoic acid Chemical compound OC(=O)CCC=C HVAMZGADVCBITI-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- SVICABYXKQIXBM-UHFFFAOYSA-L potassium malate Chemical compound [K+].[K+].[O-]C(=O)C(O)CC([O-])=O SVICABYXKQIXBM-UHFFFAOYSA-L 0.000 description 1
- 239000001415 potassium malate Substances 0.000 description 1
- 235000011033 potassium malate Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 235000019512 sardine Nutrition 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000008159 sesame oil Substances 0.000 description 1
- 235000011803 sesame oil Nutrition 0.000 description 1
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 235000010199 sorbic acid Nutrition 0.000 description 1
- 101150035983 str1 gene Proteins 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- UIERETOOQGIECD-ONEGZZNKSA-N tiglic acid Chemical compound C\C=C(/C)C(O)=O UIERETOOQGIECD-ONEGZZNKSA-N 0.000 description 1
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 description 1
- HMFPLNNQWZGXAH-OCOZRVBESA-N trans-2-hexacosenoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCC\C=C\C(O)=O HMFPLNNQWZGXAH-OCOZRVBESA-N 0.000 description 1
- XKZKQTCECFWKBN-UHFFFAOYSA-N trans-4-decenoic acid Natural products CCCCCC=CCCC(O)=O XKZKQTCECFWKBN-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- ZHYZQXUYZJNEHD-UHFFFAOYSA-N trans-geranic acid Natural products CC(C)=CCCC(C)=CC(O)=O ZHYZQXUYZJNEHD-UHFFFAOYSA-N 0.000 description 1
- LKOVPWSSZFDYPG-WUKNDPDISA-N trans-octadec-2-enoic acid Chemical compound CCCCCCCCCCCCCCC\C=C\C(O)=O LKOVPWSSZFDYPG-WUKNDPDISA-N 0.000 description 1
- UIUWNILCHFBLEQ-NSCUHMNNSA-N trans-pent-3-enoic acid Chemical compound C\C=C\CC(O)=O UIUWNILCHFBLEQ-NSCUHMNNSA-N 0.000 description 1
- 235000013337 tricalcium citrate Nutrition 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 229960002703 undecylenic acid Drugs 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N xylylenediamine group Chemical group C=1(C(=CC=CC1)CN)CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
Definitions
- the present invention relates to a compatibilized resin composition comprising a polyphenylene ether type resin and a polyamide resin.
- the invention also relates to molded articles prepared from the resin composition, with or without a filler, which show improved properties in surface appearance, impact strength, very small warp and good heat resistance.
- Polyphenylene ether is useful as a resin material for molding because of its good mechanical and electrical properties. However, it has poor oil-resistance. In order to solve this disadvantage, it is known that polyphenylene ether can be blended with polyamide which is resistant to oil (see, for example, Japanese Patent Laid-Open No. 16525/1981). The resulting composition exhibits improved oil resistance as compared to polyphenylene ether alone. However, polyphenylene ether and polyamide show poor compatibility with each other and, accordingly, properties intrinsic to these two resins, e.g., the excellent mechanical properties, are not fully exhibited when the resins are combined.
- Finholt U.S. Pat. No. 3,379,792 discloses polymer blends wherein the processability of polyphenylene ether resins may be improved by blending with from 0.1 to 25% by weight of a polyamide.
- the advantages of the Finholt invention are limited by the fact that when the concentration of the polyamide exceeds 20% by weight, appreciable losses in other physical properties result. Specifically, there is no, or at best poor, compatibility between the polyphenylene ether and the polyamide such that phase separation of the resins occurs on molding or the molded article is inferior in mechanical properties.
- Ueno et al. U.S. Pat. No. 4,315,086 disclosed polyphenylene ether blends having improved mechanical resistance without a loss of other mechanical properties by blending therewith a polyamide and a specific compound selected from the group consisting essentially of (A) liquid diene polymers, (B) epoxy compounds and (C) compounds having in the molecule both of (i) an ethylene carbon-carbon double bond or carbon-carbon triple bond and (ii) a carboxylic acid, acid anhydride, acid amide, imide, carboxylic acid ester, amino or hydroxy group.
- A liquid diene polymers
- B epoxy compounds
- C compounds having in the molecule both of (i) an ethylene carbon-carbon double bond or carbon-carbon triple bond and (ii) a carboxylic acid, acid anhydride, acid amide, imide, carboxylic acid ester, amino or hydroxy group.
- Kasahara et al. discloses the use of a copolymer comprising units of a vinyl aromatic compound and either an alpha, beta-unsaturated dicarboxylic acid anhydride or an imide compound thereof as a modifier to an impact resistant polyphenylene ether-polyamide blend for improved heat resistance and oil resistance.
- Aycock et al. (U.S. Pat. No. 4,600,741) discloses the use of an acyl functional compatibilizer, preferably the reaction product of polyphenylene ether with trimellitic anhydride acid chloride, for polyphenylene ether-polyamide blends.
- the FIGURE is a graph showing relation between a terminal group ratio of polyamide and a warp.
- a compatibilized resin composition comprising (a) a polyphenylene ether type resin, (b) a polyamide resin, and (c) a compatibilizer for (a) and (b) and, additionally if desired the below-described optional materials mechanical strength, such as impact resistance, and surface appearance of a molded article of the resin composition are improved, while maintaining oil resistance of the molded article by the use of a polyamide resin in which the amount of terminal amino group is greater than the amount of terminal carboxyl group.
- compositions of the present invention also exhibit lower warp in a molded article prepared from a compatibilized resin composition comprising (a) a polyphenylene ether type resin, (b) a polyamide resin, (c) a compatibilizer for (a) and (b) and a filler, and such compositions exhibit improved mechanical strength.
- a compatibilized resin composition comprising (a) a polyphenylene ether type resin, (b) a polyamide resin, (c) a compatibilizer for (a) and (b) and a filler, and such compositions exhibit improved mechanical strength. This is attained by the use of a polyamide resin having the above-mentioned particular terminal group ratio in the aforesaid resins/filler composition.
- the present invention provides a compatibilized resin composition comprising:
- the compatibilized resin compositions of the present invention comprise:
- compatibilized resin compositions of the present invention in addition to components (a), (b) and (c), can further comprise:
- the polyphenylene ether type resin used herein is known per se and is generically defined by the general formula: ##STR1## wherein R 1 , R 2 , R 3 and R 4 are a monovalent substituent selected from a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group, a haloalkyl and haloalkoxy group in which at least 2 carbon atoms are present between a halogen atom and a phenyl ring with the exclusion of those having tertiary alpha-carbon atoms and n is an integer representing the degree of polymerization and is preferably at least 50.
- the polymer may be a homopolymer or a copolymer of two or more comonomers represented by the above general formula.
- R 1 and R 2 are an alkyl group of 1 to 4 carbon atoms
- R 3 and R 4 are a hydrogen atom or an alkyl group of 1 to 4 carbon atoms.
- Exemplary preferable polyphenylene ethers are poly(2,6-diethyl-1,4-phenylene) ether, poly(2-methyl-6-ethyll,4-phenylene) ether, poly(2-methyl-6-1,4-phenylene) ether, poly(2-methyl-6-propyl-1,4-phenylene) ether, poly(2,6-dipropyl-1,4-phenylene) ether, poly(2-ethyl-6-propyl-1,4-phenylene) ether, and poly(2,6-dipropyl-1,4-phenylene) ether.
- Particularly preferred is poly(2,6-dimethyl-1,4-phenylene) ether.
- a typical polyphenylene ether copolymer is a copolymer in which a part of the aforesaid polyphenylene ether recurring unit is replaced with tri-alkyl substituted phenol, such as 2,3,6-trimethyl phenol.
- styrene type compounds may be grafted onto these polyphenylene ethers to yield copolymers.
- Illustrative of styrene type compound-grafted polyphenylene ethers are copolymers grafted with styrene, alpha-methyl styrene, vinyl toluene and chlorostyrene.
- Polyamide resins are known per se.
- Polyamides suitable for the preparation of the compositions of the present invention may be obtained by polymerizing a mono-aminomonocarboxylic acid or a lactam thereof having at least 2 carbon atoms between the amino and carboxylic acid group; or by polymerizing a diamine which contains at least 2 carbon atoms between the amino groups and a dicarboxylic acid; or by polymerizing a monoaminocarboxylic acid or a lactam thereof as defined above together with a diamine and a dicarboxylic acid.
- the dicarboxylic acid may be used in the form of a functional derivative thereof, for example an ester or acid chloride.
- Examples of the aforementioned monoaminomono carboxylic acids of lactams thereof which are useful in preparing the polyamides include those compounds containing from 2 to 16 carbon atoms between the amino and carboxylic acid groups, said carbon atoms forming a ring with the --CO--NH-- group in the case of a lactam.
- aminocarboxylic acids and lactams there may be mentioned gamma-aminocaproic acid, butyrolactam, pivalolactam, caprolactam, capryllactam, enantholactam, undecanolactam, dodecanolactam and 3- and 4-aminobenzoic acids.
- diamines suitable for preparing the polyamides include diamines of the general formula
- n is an integer of from 2 to 16, such as trimethylenediamine, tetramethylenediamine, pentamethylenediamine, octamethylenediamine and especially hexamethylenediamine.
- the dicarboxylic acids may be aromatic, for example isophthalic and terephthalic acids.
- Preferred dicarboxylic acids are of the formula
- Y represents a divalent aliphatic group containing at least 2 carbon atoms
- examples of such acids are sebacic acid, octadecanedoic acid, suberic acid, glutaric acid, pimelic acid and adipic acid.
- polyamides or nylons include for example polyamides 6, 6/6, 11, 12, 6/3, 6/4, 6/10 and 6/12 as well as polyamides resulting from terephthalic acid and trimethyl hexamethylene diamide, polyamides resulting from solipic acid and meta xylylenediamines, polyamides resulting from adipic acid, azelaic acid and 2,2-bis-(p-aminocyclohexyl) propane and polyamides resulting from terephthalic acid and 4,4'-diaminodicyclohexylmethane.
- Preferred polyamides are the polyamides 6, 6/6, 4/6, 11 and 12, most preferably polyamides 6/6 or polyamide 6.
- the amount of terminal amine group is greater than the amount of terminal carboxylic group in the polyamide.
- Such polyamides may be obtained by adding an excessive amount of, for instance, compounds having a group reactive with a carboxylic group, such a diamines, to a polymerization system of the polyamide.
- such polyamides may be obtained by reacting the polyamide with, for instance, compounds having a group reactive with a carboxylic group after polymerization of the polyamide.
- the terminal amine group is present also in a minimum amount sufficient to interact with the compatibilizer, component (c), to help effect compatabilization between (a) and (b).
- Polyphenylene ethers, component (a), and polyamides in which the amount of terminal amino group is greater than the amount of a terminal carboxyl group, component (b), are blended in any proportion, preferably in a range of 5 to 80 parts by weight and a range of 95 to 20 parts by weight, respectively. If the amount of component (b) exceeds the above limitation, the desired properties of component (a) are difficult to maintain. On the other hand, if the amount of component (b) falls below the lower limit, the purpose of adding component (b), i.e., improvement of the oil resistance level, is difficult to attain.
- a weight ratio of component (a) to component (b) is 30 to 70 : 70 to 30.
- component (c) is blended in an amount of 0.01 to 10 parts by weight, preferably 0.01 to 5 parts by weight, more preferably 0.1 to 2 parts by weight, to each 100 parts by weight of the total of components (a) and (b). If the amount is less than 0.01 parts by weight, the desired effect as a compatibilizer is not attained. On the other hand, if the amount exceeds 10 parts by weight, surface appearance of the molded article is sometimes poor.
- Component (c) of the present invention can be any compound or group of compounds known to effect compatibility between a polyphenylene ether resin, component (a), and a polyamide resin, component (b). Mixtures of compatibilizers can be used.
- Suitable compatibilizers preferably include:
- a silane compound having in its molecular structure both (a) at least one silicon atom which is bonded to a carbon atom via an oxygen bridge and (b) at least an ethylene carbon-to-carbon double bond or a carbon-to-carbon triple bond and/or a functional group selected from an amine group and a mercapto group, the functional group not being bonded directly to the silicon atom;
- a functionalized polyphenylene ether consisting of a reaction product of (a) a polyphenylene ether and (b) a compound of the general formula (i)--Z--(ii), wherein (i) is at least a group of the formula [X--C(O)] with X ⁇ F, Cl, Br, I, OH, --OR, or --O--C(O)--R with R ⁇ H, alkyl or aryl, wherein (ii) is at least a carboxylic acid, acid anhydride, acid amide, imido, carboxylic acid ester, amino or hydroxyl group, and in which the groups (i) and (ii) are covalently bonded together via a bridge Z, Z being a bivalent hydrocarbon radical;
- This compatibilizer can be present in the preferred amount of from 0.5 to 100 parts by weight per 100 parts by weight of polyamide plus polyphenylene ether;
- agents for improving the compatibility mentioned in (iv) and (vii) can replace the polyphenylene ether, component (a) in the polymer mixtures according to the invention, entirely or partly.
- Component (c) used in the present invention when of type (i) includes maleic anhydride, maleic acid, fumaric acid, maleimide, maleic hydrazide, reaction products of maleic anhydride with diamines such as those having the following structures ##STR2## (wherein R represents an aliphatic or aromatic group), methyl nadic anhydride, dichloromaleic anhydride, maleic amide, natural oils such as soy bean oil, tung oil, castor oil, linseed oil, hempseed oil, cottonseed oil, sesame oil, rapeseed oil, peanut oil, tsubaki oil, olive oil, coconut oil and sardine oil, epoxidated natural oils such as epoxidated soy bean oil, unsaturated carboxylic acids such as acrylic acid, butenoic acid, crotonic acid, vinylacetic acid, methyacrylic acid, pentenoic acid, angelic acid, tiglic acid, 2-pentenoic acid, 3-penteno
- Compound (c) may have two or more of the aforesaid unsaturated bonds (1) and/or two of more of the aforesaid functional groups (2).
- Component (c) used in the present invention when of type (ii), the saturated aliphatic polycarboxylic acid or a derivative thereof, is represented by the formula:
- R is a linear or branched chain, saturated aliphatic hydrocarbon of from 2 to 20, preferably 2 to 10, carbon atoms;
- R I is selected from the group consisting of hydrogen, alkyl, aryl, acyl and carbonyl and dioxy group of 1 to 10, preferably 1 to 6, more preferably 1 to 4, carbon atoms, most preferably hydrogen;
- R II is selected from the group consisting of hydrogen, alkyl and aryl group of from 1 to 20 carbon atoms, preferably from 1 to 10 carbon atoms; each of R III and R IV is selected from the group consisting of hydrogen, an alkyl and aryl group of from 1 to 10, preferably from 1 to 6, most preferably 1 to 4, carbon atoms;
- m is equal to 1 and (n+s) is greater than or equal to 2, preferably equal to 2 or 3, and n and s are each greater than or equal to zero and (OR I ) is in an alpha or beta position to a carbonyl group and at least two carbonyl groups are
- Examples of the derivatives of the saturated aliphatic polcarboxylic acids according to the invention include esters, amides, anhydrides, hydrates and salts of the saturated aliphatic polycarboxylic acids.
- Illustrative of the saturated aliphatic polycarboxylic acids are citric acid, malic acid and agaricic acid.
- acid esters include acetyl citrate and mono- or di- stearyl citrates and the like.
- Suitable acid amides include for example N,N'-diethyl citric acid amide; N,N'-dipropyl citric acid amide; N-phenyl citric acid amide; N-dodecyl citric acid amide; N,N'-didocecyl citric acid amide and N-dodecyl malic acid amide.
- component (c) when a saturated aliphatic polycarboxylic acid is citric or malic acid.
- the salts include calcium malates, calcium citrate, potassium malate and potassium citrate.
- Component (c) used in the present invention when of type (iii), includes the agents mentioned to improve the compatibility which have at least one silicon atom which is bonded to a carbon atom via an oxygen bridge.
- at least an alkoxy group or an acetoxy group will usually be present in the silane.
- silicon atoms which are bonded together via an oxygen bridge, i.e. siloxane groups may be present in the silane derivative.
- the silane derivatives must have at least one of the following characteristic features, namely the presence in the molecule of one or more carbon-to-carbon double bonds or triple bonds, an amino group and/or a mercapto group. The carbon-to-carbon double or triple bond may be coupled directly to the silicon atom.
- the mercapto group or the amino group may not be coupled directly to a silicon atom.
- suitable silane derivatives are: gamma aminopropyl triethoxy silane; vinyl-tris-(2-methoxyethoxy) silane; 5-(bicycloheptenyl) triethoxy silane and gamma mer- capto-propyl trimethoxy silane.
- Component (c) used in the present invention when of type (iv), includes the agents mentioned for improving the compatibility which can be obtained by reacting a polyphenylene ether with, for example, chloroethyanoyl succinic anhydride; trimellitic anhydride acid chloride; chloroformyl succinic anhydride; 1-acetoxyacetyl-3,4-dibenzoic acid anhydride; trimellitic anhydride acid acetic anhydride and the acid chloride of terephthalic acid.
- the compounds formed can be purified by precipitation in methanol or acetone.
- These agents may be used in combination with primary or secondary amines, for example, butyl amine, dibutyl amine, n-octadecyl amine.
- Preferred are the polyphenylene ethers functionalized with trimellitic anhydride acid chloride and the method by which they can be obtained is described in Aycock et al., U.S. Pat. No. 4,600,741.
- Component (c) used in the present invention when of type (vi), includes the compounds mentioned in EP-A No.0 046 040 and EP-A No.0 147 874.
- Examples of these compounds are styrene maleic acid anhydride copolymers, styrene-maleic acid anhydride methacrylate terpolymers, styrene-maleic acid anhydride acrylate terpolymers, and the rubber-modified variants of these compounds.
- Component (c) used in the present invention when of type (vii), includes the compounds and their mode of preparation which are disclosed in Japanese Patent Application Nos. 59/059724; 59/086,653 and 59/066,452.
- Component (c) of this type relates to the reaction product of (a) a 1,2-substituted olefinic compound with carboxylic group or acid anhydride group (for example, maleic acid anhydride), (b) a polyphenylene ether and (c) a radical initiator (for example, benzoyl peroxide).
- the optional rubbery material (d) used in the present invention includes natural or synthetic polymeric materials elastic at room temperature.
- natural rubber butadiene polymer, butadiene-styrene copolymer including random copolymer, block copolymer, graft copolymer and any other structures, isoprene polymer, chlorobutadiene polymer, butadiene-acrylonitrile copolymer, isobutylene polymer, isobutylene-butadiene copolymer, isobuty- lene-isoprene copolymer, acrylic ester polymer, ethylenepropylene copolymer, ethylene-propylene-diene copolymer, Thiokol rubber, polysulfide rubber, polyurethane rubber, polyether rubber such as polypropylene oxide, and epichlorohydrin rubber.
- These optional rubbery materials may be prepared by any of known methods, such as emulsion polymerization or solution polymerization, using any of known catalysts such as peroxides, trialkyl aluminum, lithium halide or nickel catalysts.
- the rubbery materials may have various degrees of crosslinking and various ratios between micro-structures such as cis, trans and vinyl. They may be particles of various average sizes.
- the copolymers may be random copolymers, block copolymers or graft copolymers.
- the rubbery materials may also be copolymers with other monomers such as olefins, dienes, aromatic vinyl compounds, acrylic acid, acrylic esters and methacrylic ester.
- comonomers may be copolymerized in any manner of random copolymerization, block copolymerization or graft copolymerization.
- Illustrative of these monomers are, for instance, ethylene, propylene, styrene, chlorostyrene, alpha-methylstyrene, butadiene, isoprene, chlorobutadiene, butene, isobutylene, acrylic acid, methyl acrylate, ethyl acrylate, butyl acrylate, methyl methacrylate and acrylonitrile.
- Partially modified rubbery materials may also be used in the invention, such as polybutadiene having hydroxy or carboxy-modified terminals, and partially hydrogenated styrene-butadiene block copolymers.
- rubbery material (d) When used, rubbery material (d) preferably is blended in an amount of 0 to 20 parts by weight to each 100 parts by weight of the total of components (a) and (b). Component (d) is used to improve impact resistance of a molded article. In the case of a molded article which does not contain component (d), surface appearance is remarkably improved, though improvement on impact resistance is not as good.
- Optional filler (e) when used in the present invention includes inorganic and organic fillers which are usually added to plastics, such as glass fibers, carbon fibers, metal fibers, glass beads, asbestos, wollastonite, calcium carbonate, talc and barium sulfate. These may be used alone or in combination.
- glass fibers are preferably used, which preferably have a fiber diameter of 6 to 30 microns and a fiber length of 30 microns or more.
- the composition of the invention preferably contains 5 to 150 parts by weight of the filler per 100 parts by weight of the total amount of components (a) and (b). If the filler is contained in an amount outside the above range, it may not be possible to obtain a composition having the improved desired properties. That is, if the amount is less than 5 parts by weight, the desired reinforcing effect may not be attained. On the other hand, if the amount exceeds 150 parts by weight, surface appearance of a molded article is sometimes poor.
- optional flame retardant (f) if phosphorous type flame retardants usually used in polyphenylene oxide resins or nitrogen type flame retardants usually used in polyamides are used herein, their effect is present but small. However, halogen type flame retardants yield excellent fire resistance. When optional antimony compound (g) is used together with optional flame retardant (f), fire resistance is further enhanced. Particularly, halogenated flame retardants such as brominated polystyrene, brominated polyphenylene oxide, brominated bisphenol series epoxy compounds, are proper because these do not cause bleeding. Above all, brominated polystyrene is a flame retardant which has such excellent heat stability that its discoloring is least when a resin composition resides in molding machine at 280° C. for 10 minutes. Compositions which contain neither component (f) nor component (g) may also be possible for use in a field where fire resistance is not required.
- compositions may contain other additives which are usually used, such as pigments and stabilizers, as occasion demands.
- the present invention essentially resides in that a mole-ratio of the terminal amino group and the terminal carboxy group in the polyamide utilized (hereinafter referred to as a terminal group ratio) is greater than 1 and component (c) is blended with components (a) and (b) yielding a compatibilized compositions.
- a mole-ratio of the terminal amino group and the terminal carboxy group in the polyamide utilized hereinafter referred to as a terminal group ratio
- polyamide resins have a terminal group ratio of 1 or less.
- an end-sealing agent is sometimes added to the polymerization components in order to properly control melt viscosity.
- the terminal group ratio of such polyamides is less than 1.
- a polyamide having a terminal group ratio of more than 1 is used according to the invention, mechanical strength and appearance of a molded article are remarkably improved,, compared with a polyamide having a terminal group ratio of 1 or less. This was not an expected result by any means. Decisive theoretical explanation for the above has not yet been found.
- the average size of polyphenylene oxide particles dispersed in a polyamide matrix is small and size distribution is narrow in the present invention. It is surprising that the difference in the terminal group ratio makes such a great difference in a molded article.
- the terminal group ratio of the polyamides utilized in the present invention should be greater than 1.01, preferably is 1.1 or more, more preferably is 1.3 or more.
- the aforesaid components (a) to (c) alone, or with the optional components (d) to (g) alone or in combination, may be mixed in any order and heat melted to be injection molded.
- the resin compositions according to the invention yield molded articles having highly improved mechanical strength and surface appearance.
- Poly(2,6-dimethyl-1,4-phenylene) ether was used as component (a) in the Examples.
- Two types of nylon-6 were used as component (b).
- the first type of polyamide had a terminal amino group of 8.4 ⁇ 10 -5 mole/g and a terminal carboxyl group of 1.8 ⁇ 10 -5 mole/g.
- the second type of polyamide had a terminal amino group of 4.6 ⁇ 10 -5 mole/g. and a terminal carboxyl group of 7.0 ⁇ 10 -5 mole/g.
- Molecular weight of both polyamides was 13,000.
- a polyamide having a predetermined terminal group ratio was prepared by admixing these two types of polyamides in a proper mixing ratio. Similar results on a molded article were obtained using a polyamide whose terminal group ratio was adjusted during polymerization instead of the blended polyamide from the two types of polyamides.
- a blend of the above components was extruded at 290° C. through a twin screw extruder with pressure-reducing vent to prepare pellets.
- a molded article was produced by an injection molding machine set to a cylinder temperature of 280° C., an injection pressure of 1200 kg/cm 2 and a mold temperature of 80° C.
- the molded article was evaluated by an Izod impact test according to JIS(Japanese Industrial Standard) K7110. Surface appearance was evaluated with the naked eye.
- a scanning electron microscope (SEM) was used to examine the state of polyphenylene ether dispersed in a polyamide matrix in the molded article. A small piece was cut out from the Izod test piece and processed by a microtome. It was then subjected to solvent etching in methylene chloride for 2 minutes while sonicating, and coated with gold. Subsequently it was observed by SEM.
- compositions using the same polyphenylene ether resin and polyamide resins as in Examples 1-4 were prepared, and molded under the same conditions and subjected to similar tests.
- the results of the Izod impact test and particle size distribution and surface appearance observations are set forth in Tables III and IV.
- Citric Acid, malic acid and n-phenyl citric amide were used as component (c).
- SBS styrene-butadiene-styrene block copolymer, Cariflex TR 1101, Shell Chemical Company
- compositions using the same polyphenylene ether resin and polyamide resins as in Examples 1-4 were prepared and molded under the same conditions and subjected to similar tests.
- the results of the Izod impact, warp and bending strength tests are set forth in Tables V and VI.
- Citric acid was used as component (c).
- SBS styrene-butadiene-styrene block copolymer, Cariflex TR 1101, Shell Chemical Company
- Chopped glass fibers were used as the filler (e).
- Tables V and VI show the relation between the terminal group ratio and warp in Comparisons 8 and 9 and Examples 12, 13 and 14 where only the terminal group ratio of polyamide was varied. It is noted that the warp is remarkably decreased by making the amount of the terminal amine group greater than the amount of the carboxyl group.
- Poly(2,6-dimethyl-1,4-phenylene) ether was used as component (a) in the Examples.
- Two types of Nylon-6 were used as component (b).
- the low amine content "regular" Nylon-6 had a terminal amine concentration of 3.6 ⁇ 10 -5 equivalents/g. and is available under the trade designation of Ultramid B3 from BASF Corporation. It had a Reduced Viscosity of 142 ml/g. calculated by dissolving 0.5 g of the polyamide 90% formic acid, measured at 25° C. by means of Ubelohde viscosity.
- the "high amine content” Nylon-6 had a terminal amine concentration of 6.9 ⁇ 10 -5 equivalents/g.
- Capron XPN 1250 from Allied Chemical Corporation. It had a Reduced Viscosity of 149 ml/g. calculated by dissolving 0.5 g of the polyamide in 90% formic acid, measured at 25° C. by means of Ubelohde viscosity.
- polyphenylene functionalized with trimellitic anhydride acid chloride was used as component (c).
- Hydrogenated styrene-isoprene diblock copolymer was used as component (d).
- a blend of the above components was extruded at about 275° C. through a Werner-Pfleiderer twin screw 28 mm extruder with pressure-reducing vacuum to prepare pellets. Using the pellets, a molded article was produced from each composition by an injection molding machine set to a cylinder temperature of about 275° C.
- the molded articles were evaluated for Izod Impact strength and Charpy impact strength according to ASTM D 256, Puncture impact according to DIN 53443 and Flexural modulus and Flexural strength according to ASTM 790.
- Poly(2,6-dimethyl-1,4-phenylene) ether was used as component(a) in the Examples.
- Three types of Nylon-6.6 were used as component (b).
- the low amine content "regular" Nylon-6,6 had a terminal amine concentration of 4.4 ⁇ 10 -5 equivalents/g. and is available under the trade designation of Fabelnly 45 APDH from Tubize Corp. It had a Reduced Viscosity of 132.5 ml/g. calculated by dissolving 0.5 g of the polyamide in 90% formic acid, measured at 25° C. by means of Ubelohde viscosity.
- the two high amine content Nylon-6,6s were experimental samples which had a terminal amine concentrations of 7.0 ⁇ 10 -5 equivalents/g.
- Citric acid-1-hydrate was used as component (c).
- Styrene-butadiene-styrene triblock copolymer was used as component (d).
- a blend of the above components was extruded at at about 275° C. through a Werner-Pfleiderer twin screw 28 mm extruder with pressure-reducing vacuum to prepare pellets.
- a molded article was produced from each composition by an injection molding machine set to a cylinder temperature of about 285° C.
- the molded articles were evaluated for Izod impact strength and Charpy impact strength according to ASTM D 256, and Puncture impact according to DIN 53443.
- compositions using the same polyphenylene ether resin and polyamide resins as in Examples 1-4 were prepared and molded under the same conditions and tested.
- the results of the flammability and warp tests are set forth in Table X.
- Citric acid was used as component (c).
- Chopped glass fibers were used as component (e).
- Various flame retardants, listed in the Table, were used as component (f) and antimony trioxide was used as component (g).
Abstract
Compatiblized mixtures of a polyphenylene ether, a polyamide and a compatibilizer are described. The mixtures have improved physical properties as a result of using in the mixtures a polyamide having a terminal amine group to terminal carboxyl group ratio of greater than 1.
Description
The present invention relates to a compatibilized resin composition comprising a polyphenylene ether type resin and a polyamide resin. The invention also relates to molded articles prepared from the resin composition, with or without a filler, which show improved properties in surface appearance, impact strength, very small warp and good heat resistance.
Polyphenylene ether is useful as a resin material for molding because of its good mechanical and electrical properties. However, it has poor oil-resistance. In order to solve this disadvantage, it is known that polyphenylene ether can be blended with polyamide which is resistant to oil (see, for example, Japanese Patent Laid-Open No. 16525/1981). The resulting composition exhibits improved oil resistance as compared to polyphenylene ether alone. However, polyphenylene ether and polyamide show poor compatibility with each other and, accordingly, properties intrinsic to these two resins, e.g., the excellent mechanical properties, are not fully exhibited when the resins are combined.
In order to improve this, the attempt has been made to enhance impact resistance while obtaining improved oil resistance by adding a compound having (a) a carbon-carbon double or triple bond and (b) a carboxyl, acid anhydride, acid amide, imide, carboxylic ester or epoxy group (Japanese Patent Publication (unexamined) No.56-26913). However, shaped articles prepared from this composition have a tendency to show poor surface appearance.
Finholt (U.S. Pat. No. 3,379,792) discloses polymer blends wherein the processability of polyphenylene ether resins may be improved by blending with from 0.1 to 25% by weight of a polyamide. However, the advantages of the Finholt invention are limited by the fact that when the concentration of the polyamide exceeds 20% by weight, appreciable losses in other physical properties result. Specifically, there is no, or at best poor, compatibility between the polyphenylene ether and the polyamide such that phase separation of the resins occurs on molding or the molded article is inferior in mechanical properties.
Ueno et al. (U.S. Pat. No. 4,315,086) disclosed polyphenylene ether blends having improved mechanical resistance without a loss of other mechanical properties by blending therewith a polyamide and a specific compound selected from the group consisting essentially of (A) liquid diene polymers, (B) epoxy compounds and (C) compounds having in the molecule both of (i) an ethylene carbon-carbon double bond or carbon-carbon triple bond and (ii) a carboxylic acid, acid anhydride, acid amide, imide, carboxylic acid ester, amino or hydroxy group.
Finally, Kasahara et al. (EP No. 46040) discloses the use of a copolymer comprising units of a vinyl aromatic compound and either an alpha, beta-unsaturated dicarboxylic acid anhydride or an imide compound thereof as a modifier to an impact resistant polyphenylene ether-polyamide blend for improved heat resistance and oil resistance.
Aycock et al. (U.S. Pat. No. 4,600,741) discloses the use of an acyl functional compatibilizer, preferably the reaction product of polyphenylene ether with trimellitic anhydride acid chloride, for polyphenylene ether-polyamide blends.
The FIGURE is a graph showing relation between a terminal group ratio of polyamide and a warp.
It has now been found that in a compatibilized resin composition comprising (a) a polyphenylene ether type resin, (b) a polyamide resin, and (c) a compatibilizer for (a) and (b) and, additionally if desired the below-described optional materials mechanical strength, such as impact resistance, and surface appearance of a molded article of the resin composition are improved, while maintaining oil resistance of the molded article by the use of a polyamide resin in which the amount of terminal amino group is greater than the amount of terminal carboxyl group.
The compositions of the present invention also exhibit lower warp in a molded article prepared from a compatibilized resin composition comprising (a) a polyphenylene ether type resin, (b) a polyamide resin, (c) a compatibilizer for (a) and (b) and a filler, and such compositions exhibit improved mechanical strength. This is attained by the use of a polyamide resin having the above-mentioned particular terminal group ratio in the aforesaid resins/filler composition.
Thus, the present invention provides a compatibilized resin composition comprising:
(a) a polyphenylene ether resin
(b) a polyamide resin in which the amount of terminal amino group is greater than the amount of terminal carboxyl group, and
(c) a compatibilizer compound for (a) and (b).
Preferably, the compatibilized resin compositions of the present invention comprise:
(a) 5 to 80 parts by weight of a polyphenylene ether type resin,
(b) 95 to 20 parts by weight of a polyamide resin in which the amount of terminal amino group is greater than the amount of terminal carboxyl group, and
(c) 0.01 to 10 parts by weight of a compatibilizer compound based upon the total amount of components (a) and (b).
The compatibilized resin compositions of the present invention, in addition to components (a), (b) and (c), can further comprise:
optionally, (d) a rubbery material,
optionally, (e) a filler,
optionally, (f) a flame retardant, and
optionally, (g) an antimony-compound.
These optional components can be used singly or in any combination and the preferred amount of optional components are:
optionally, (d) 0 to 20 parts by weight of a rubbery material per 100 parts by weight of the total amount of components (a) and (b),
optionally, (e) 5 to 150 parts by weight of a filler per 100 parts by weight of the total amount of components (a) and (b),
optionally, (f) 0 to 40 parts by weight of a flame retardant per 100 parts by weight of the total amount of components (a) and (b), and optionally, (g) 0 to 20 parts by weight of an antimony compound per 100 parts by weight of the total amount of components (a) and (b).
The polyphenylene ether type resin used herein is known per se and is generically defined by the general formula: ##STR1## wherein R1, R2, R3 and R4 are a monovalent substituent selected from a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group, a haloalkyl and haloalkoxy group in which at least 2 carbon atoms are present between a halogen atom and a phenyl ring with the exclusion of those having tertiary alpha-carbon atoms and n is an integer representing the degree of polymerization and is preferably at least 50. The polymer may be a homopolymer or a copolymer of two or more comonomers represented by the above general formula. In preferred examples R1 and R2 are an alkyl group of 1 to 4 carbon atoms, and R3 and R4 are a hydrogen atom or an alkyl group of 1 to 4 carbon atoms. Exemplary preferable polyphenylene ethers are poly(2,6-diethyl-1,4-phenylene) ether, poly(2-methyl-6-ethyll,4-phenylene) ether, poly(2-methyl-6-1,4-phenylene) ether, poly(2-methyl-6-propyl-1,4-phenylene) ether, poly(2,6-dipropyl-1,4-phenylene) ether, poly(2-ethyl-6-propyl-1,4-phenylene) ether, and poly(2,6-dipropyl-1,4-phenylene) ether. Particularly preferred is poly(2,6-dimethyl-1,4-phenylene) ether.
A typical polyphenylene ether copolymer is a copolymer in which a part of the aforesaid polyphenylene ether recurring unit is replaced with tri-alkyl substituted phenol, such as 2,3,6-trimethyl phenol.
Further, styrene type compounds may be grafted onto these polyphenylene ethers to yield copolymers. Illustrative of styrene type compound-grafted polyphenylene ethers are copolymers grafted with styrene, alpha-methyl styrene, vinyl toluene and chlorostyrene.
Polyamide resins are known per se. Polyamides suitable for the preparation of the compositions of the present invention may be obtained by polymerizing a mono-aminomonocarboxylic acid or a lactam thereof having at least 2 carbon atoms between the amino and carboxylic acid group; or by polymerizing a diamine which contains at least 2 carbon atoms between the amino groups and a dicarboxylic acid; or by polymerizing a monoaminocarboxylic acid or a lactam thereof as defined above together with a diamine and a dicarboxylic acid. The dicarboxylic acid may be used in the form of a functional derivative thereof, for example an ester or acid chloride.
Examples of the aforementioned monoaminomono carboxylic acids of lactams thereof which are useful in preparing the polyamides include those compounds containing from 2 to 16 carbon atoms between the amino and carboxylic acid groups, said carbon atoms forming a ring with the --CO--NH-- group in the case of a lactam. As particular examples of aminocarboxylic acids and lactams there may be mentioned gamma-aminocaproic acid, butyrolactam, pivalolactam, caprolactam, capryllactam, enantholactam, undecanolactam, dodecanolactam and 3- and 4-aminobenzoic acids.
Examples of diamines suitable for preparing the polyamides include diamines of the general formula
H.sub.2 N(CH.sub.2).sub.n NH.sub.2
wherein n is an integer of from 2 to 16, such as trimethylenediamine, tetramethylenediamine, pentamethylenediamine, octamethylenediamine and especially hexamethylenediamine.
The dicarboxylic acids may be aromatic, for example isophthalic and terephthalic acids. Preferred dicarboxylic acids are of the formula
HOOC--Y--COOH
wherein Y represents a divalent aliphatic group containing at least 2 carbon atoms, and examples of such acids are sebacic acid, octadecanedoic acid, suberic acid, glutaric acid, pimelic acid and adipic acid.
Typical examples of the polyamides or nylons, as these are often called, include for example polyamides 6, 6/6, 11, 12, 6/3, 6/4, 6/10 and 6/12 as well as polyamides resulting from terephthalic acid and trimethyl hexamethylene diamide, polyamides resulting from solipic acid and meta xylylenediamines, polyamides resulting from adipic acid, azelaic acid and 2,2-bis-(p-aminocyclohexyl) propane and polyamides resulting from terephthalic acid and 4,4'-diaminodicyclohexylmethane. Preferred polyamides are the polyamides 6, 6/6, 4/6, 11 and 12, most preferably polyamides 6/6 or polyamide 6.
In the present invention, what is essential is that the amount of terminal amine group is greater than the amount of terminal carboxylic group in the polyamide. Such polyamides may be obtained by adding an excessive amount of, for instance, compounds having a group reactive with a carboxylic group, such a diamines, to a polymerization system of the polyamide. Alternatively, such polyamides may be obtained by reacting the polyamide with, for instance, compounds having a group reactive with a carboxylic group after polymerization of the polyamide. The terminal amine group is present also in a minimum amount sufficient to interact with the compatibilizer, component (c), to help effect compatabilization between (a) and (b).
Polyphenylene ethers, component (a), and polyamides in which the amount of terminal amino group is greater than the amount of a terminal carboxyl group, component (b), are blended in any proportion, preferably in a range of 5 to 80 parts by weight and a range of 95 to 20 parts by weight, respectively. If the amount of component (b) exceeds the above limitation, the desired properties of component (a) are difficult to maintain. On the other hand, if the amount of component (b) falls below the lower limit, the purpose of adding component (b), i.e., improvement of the oil resistance level, is difficult to attain. Preferably, a weight ratio of component (a) to component (b) is 30 to 70 : 70 to 30.
For best results, component (c) is blended in an amount of 0.01 to 10 parts by weight, preferably 0.01 to 5 parts by weight, more preferably 0.1 to 2 parts by weight, to each 100 parts by weight of the total of components (a) and (b). If the amount is less than 0.01 parts by weight, the desired effect as a compatibilizer is not attained. On the other hand, if the amount exceeds 10 parts by weight, surface appearance of the molded article is sometimes poor. Component (c) of the present invention can be any compound or group of compounds known to effect compatibility between a polyphenylene ether resin, component (a), and a polyamide resin, component (b). Mixtures of compatibilizers can be used.
Suitable compatibilizers preferably include:
(i) a compound having (1) one or more of a carbon-carbon double or triple bond and (2) one or more functional groups selected from a carboxyl, acid anhydride, acid amide, imide, carboxylic ester or epoxy group;
(ii) a saturated aliphatic polycarboxylic acid or derivative thereof;
(iii) a silane compound having in its molecular structure both (a) at least one silicon atom which is bonded to a carbon atom via an oxygen bridge and (b) at least an ethylene carbon-to-carbon double bond or a carbon-to-carbon triple bond and/or a functional group selected from an amine group and a mercapto group, the functional group not being bonded directly to the silicon atom;
(iv) a functionalized polyphenylene ether consisting of a reaction product of (a) a polyphenylene ether and (b) a compound of the general formula (i)--Z--(ii), wherein (i) is at least a group of the formula [X--C(O)] with X═F, Cl, Br, I, OH, --OR, or --O--C(O)--R with R═H, alkyl or aryl, wherein (ii) is at least a carboxylic acid, acid anhydride, acid amide, imido, carboxylic acid ester, amino or hydroxyl group, and in which the groups (i) and (ii) are covalently bonded together via a bridge Z, Z being a bivalent hydrocarbon radical;
(v) an oxidized polyolefin wax, optionally in combination with an organic phosphite;
(vi) a copolymer with units of a vinylaromatic compound and of an alpha-beta unsaturated dicarboxylic acid or dicarboxylic acid anhydride or a copolymer with units of a vinylaromatic compound of an imide compound of an alphabeta unsaturated dicarboxylic acid. This compatibilizer can be present in the preferred amount of from 0.5 to 100 parts by weight per 100 parts by weight of polyamide plus polyphenylene ether; and
(vii) the reaction product of (a) 1,2-substituted olefinic compound with carboxyl group or acid anhydride group, (b) a polyphenylene ether and (c) a radical initiator. This compatibilizer can be present in the preferred amount of from 0.5 to 150 parts by weight per 100 parts by weight of polyamide plus polyphenylene ether.
The agents for improving the compatibility mentioned in (iv) and (vii) can replace the polyphenylene ether, component (a) in the polymer mixtures according to the invention, entirely or partly.
Component (c) used in the present invention when of type (i) includes maleic anhydride, maleic acid, fumaric acid, maleimide, maleic hydrazide, reaction products of maleic anhydride with diamines such as those having the following structures ##STR2## (wherein R represents an aliphatic or aromatic group), methyl nadic anhydride, dichloromaleic anhydride, maleic amide, natural oils such as soy bean oil, tung oil, castor oil, linseed oil, hempseed oil, cottonseed oil, sesame oil, rapeseed oil, peanut oil, tsubaki oil, olive oil, coconut oil and sardine oil, epoxidated natural oils such as epoxidated soy bean oil, unsaturated carboxylic acids such as acrylic acid, butenoic acid, crotonic acid, vinylacetic acid, methyacrylic acid, pentenoic acid, angelic acid, tiglic acid, 2-pentenoic acid, 3-pentenoic acid, alpha-ethylacrylic acid, beta-methylcrotonic acid, 4-pentenoic acid, 2-hexenoic acid, 2-methyl-2-pentenoic acid, 3-methyl-2-pentenoic acid, alphaethylcrotonic acid, 2,2-dimethyl-3-butenoic acid, 2-heptenoic acid, 2-octenoic acid, 4-decenoic acid, 9-undecenoic acid, 10-undecenoic acid, 4-dodecenoic acid, 5-dodecenoic acid, 4-tetradecenoic acid, 9-tetradecenoic acid, 9-hexadecenoic acid, 2-octadecenoic acid, 9-octadecenoic acid, eicosenoic acid, docosenoic acid, erucic acid, tetracosenoic acid, micolipenic acid, 2,4-pentadienoic acid, 2,4-hexadienoic acid, diallylacetic acid, geranic acid, 2,4-decadienoic acid, 2,4-dodecadienoic acid, 9,12-hexadecadienoic acid, 9,12-octadecedienoic acid, hexadecatrienoic acid, linolic acid, linolenic acid, octadecatrienoic acid, eicosadienoic acid, eicosatrieoic acid, eicosatetraenoic acid, recinolic acid, eleostearic acid, oleic acid, eicosapentaenoic acid, erucinic acid, docosadienoic acid, docosatrienoic acid, docosatetraenoic acid, docosapentaenoic acid, tetracosenoic acid, hexacosenoic acid, hexacodienoic acid, octacosenoic acid and triacontenoic acid, or esters, acid amides and acid anhydrides of these unsaturated carboxylic acids, adducts of low molecular weight polymers (e.g., average molecular weight of about 500 to 10,000) or high molecular weight polymers (e.g., average molecular weight 10,000 or more) of, for instance, butadiene and isoprene and isoprene with maleic anhydride, or derivatives of these polymers in which a carboxyl group or epoxy group is introduced.
Compound (c) may have two or more of the aforesaid unsaturated bonds (1) and/or two of more of the aforesaid functional groups (2).
Component (c) used in the present invention, when of type (ii), the saturated aliphatic polycarboxylic acid or a derivative thereof, is represented by the formula:
(R.sup.I O).sub.m R(COOR.sup.II).sub.n (CONR.sup.III R.sup.IV).sub.s
wherein R is a linear or branched chain, saturated aliphatic hydrocarbon of from 2 to 20, preferably 2 to 10, carbon atoms; RI is selected from the group consisting of hydrogen, alkyl, aryl, acyl and carbonyl and dioxy group of 1 to 10, preferably 1 to 6, more preferably 1 to 4, carbon atoms, most preferably hydrogen; RII is selected from the group consisting of hydrogen, alkyl and aryl group of from 1 to 20 carbon atoms, preferably from 1 to 10 carbon atoms; each of RIII and RIV is selected from the group consisting of hydrogen, an alkyl and aryl group of from 1 to 10, preferably from 1 to 6, most preferably 1 to 4, carbon atoms; m is equal to 1 and (n+s) is greater than or equal to 2, preferably equal to 2 or 3, and n and s are each greater than or equal to zero and (ORI) is in an alpha or beta position to a carbonyl group and at least two carbonyl groups are separated by 2 to 6 carbon atoms.
Examples of the derivatives of the saturated aliphatic polcarboxylic acids according to the invention include esters, amides, anhydrides, hydrates and salts of the saturated aliphatic polycarboxylic acids. Illustrative of the saturated aliphatic polycarboxylic acids are citric acid, malic acid and agaricic acid. Illustrative of acid esters include acetyl citrate and mono- or di- stearyl citrates and the like. Suitable acid amides include for example N,N'-diethyl citric acid amide; N,N'-dipropyl citric acid amide; N-phenyl citric acid amide; N-dodecyl citric acid amide; N,N'-didocecyl citric acid amide and N-dodecyl malic acid amide. Preferably, component (c) when a saturated aliphatic polycarboxylic acid, is citric or malic acid. The salts include calcium malates, calcium citrate, potassium malate and potassium citrate.
Component (c) used in the present invention, when of type (iii), includes the agents mentioned to improve the compatibility which have at least one silicon atom which is bonded to a carbon atom via an oxygen bridge. For that purpose, at least an alkoxy group or an acetoxy group will usually be present in the silane. Moreover, silicon atoms which are bonded together via an oxygen bridge, i.e. siloxane groups, may be present in the silane derivative. In addition, the silane derivatives must have at least one of the following characteristic features, namely the presence in the molecule of one or more carbon-to-carbon double bonds or triple bonds, an amino group and/or a mercapto group. The carbon-to-carbon double or triple bond may be coupled directly to the silicon atom. The mercapto group or the amino group may not be coupled directly to a silicon atom. Examples of suitable silane derivatives are: gamma aminopropyl triethoxy silane; vinyl-tris-(2-methoxyethoxy) silane; 5-(bicycloheptenyl) triethoxy silane and gamma mer- capto-propyl trimethoxy silane.
Component (c) used in the present invention, when of type (iv), includes the agents mentioned for improving the compatibility which can be obtained by reacting a polyphenylene ether with, for example, chloroethyanoyl succinic anhydride; trimellitic anhydride acid chloride; chloroformyl succinic anhydride; 1-acetoxyacetyl-3,4-dibenzoic acid anhydride; trimellitic anhydride acid acetic anhydride and the acid chloride of terephthalic acid. The compounds formed can be purified by precipitation in methanol or acetone. These agents may be used in combination with primary or secondary amines, for example, butyl amine, dibutyl amine, n-octadecyl amine. Preferred are the polyphenylene ethers functionalized with trimellitic anhydride acid chloride and the method by which they can be obtained is described in Aycock et al., U.S. Pat. No. 4,600,741.
Component (c) used in the present invention, when of type (vi), includes the compounds mentioned in EP-A No.0 046 040 and EP-A No.0 147 874. Examples of these compounds are styrene maleic acid anhydride copolymers, styrene-maleic acid anhydride methacrylate terpolymers, styrene-maleic acid anhydride acrylate terpolymers, and the rubber-modified variants of these compounds.
Component (c) used in the present invention, when of type (vii), includes the compounds and their mode of preparation which are disclosed in Japanese Patent Application Nos. 59/059724; 59/086,653 and 59/066,452. Component (c) of this type relates to the reaction product of (a) a 1,2-substituted olefinic compound with carboxylic group or acid anhydride group (for example, maleic acid anhydride), (b) a polyphenylene ether and (c) a radical initiator (for example, benzoyl peroxide).
The optional rubbery material (d) used in the present invention includes natural or synthetic polymeric materials elastic at room temperature. Illustrative of such are natural rubber, butadiene polymer, butadiene-styrene copolymer including random copolymer, block copolymer, graft copolymer and any other structures, isoprene polymer, chlorobutadiene polymer, butadiene-acrylonitrile copolymer, isobutylene polymer, isobutylene-butadiene copolymer, isobuty- lene-isoprene copolymer, acrylic ester polymer, ethylenepropylene copolymer, ethylene-propylene-diene copolymer, Thiokol rubber, polysulfide rubber, polyurethane rubber, polyether rubber such as polypropylene oxide, and epichlorohydrin rubber.
These optional rubbery materials may be prepared by any of known methods, such as emulsion polymerization or solution polymerization, using any of known catalysts such as peroxides, trialkyl aluminum, lithium halide or nickel catalysts. The rubbery materials may have various degrees of crosslinking and various ratios between micro-structures such as cis, trans and vinyl. They may be particles of various average sizes. Further, the copolymers may be random copolymers, block copolymers or graft copolymers. The rubbery materials may also be copolymers with other monomers such as olefins, dienes, aromatic vinyl compounds, acrylic acid, acrylic esters and methacrylic ester. These comonomers may be copolymerized in any manner of random copolymerization, block copolymerization or graft copolymerization. Illustrative of these monomers are, for instance, ethylene, propylene, styrene, chlorostyrene, alpha-methylstyrene, butadiene, isoprene, chlorobutadiene, butene, isobutylene, acrylic acid, methyl acrylate, ethyl acrylate, butyl acrylate, methyl methacrylate and acrylonitrile. Partially modified rubbery materials may also be used in the invention, such as polybutadiene having hydroxy or carboxy-modified terminals, and partially hydrogenated styrene-butadiene block copolymers.
When used, rubbery material (d) preferably is blended in an amount of 0 to 20 parts by weight to each 100 parts by weight of the total of components (a) and (b). Component (d) is used to improve impact resistance of a molded article. In the case of a molded article which does not contain component (d), surface appearance is remarkably improved, though improvement on impact resistance is not as good.
Optional filler (e) when used in the present invention includes inorganic and organic fillers which are usually added to plastics, such as glass fibers, carbon fibers, metal fibers, glass beads, asbestos, wollastonite, calcium carbonate, talc and barium sulfate. These may be used alone or in combination. Among these fillers, glass fibers are preferably used, which preferably have a fiber diameter of 6 to 30 microns and a fiber length of 30 microns or more.
When a filler (e) is used, the composition of the invention preferably contains 5 to 150 parts by weight of the filler per 100 parts by weight of the total amount of components (a) and (b). If the filler is contained in an amount outside the above range, it may not be possible to obtain a composition having the improved desired properties. That is, if the amount is less than 5 parts by weight, the desired reinforcing effect may not be attained. On the other hand, if the amount exceeds 150 parts by weight, surface appearance of a molded article is sometimes poor.
Regarding optional flame retardant (f), if phosphorous type flame retardants usually used in polyphenylene oxide resins or nitrogen type flame retardants usually used in polyamides are used herein, their effect is present but small. However, halogen type flame retardants yield excellent fire resistance. When optional antimony compound (g) is used together with optional flame retardant (f), fire resistance is further enhanced. Particularly, halogenated flame retardants such as brominated polystyrene, brominated polyphenylene oxide, brominated bisphenol series epoxy compounds, are proper because these do not cause bleeding. Above all, brominated polystyrene is a flame retardant which has such excellent heat stability that its discoloring is least when a resin composition resides in molding machine at 280° C. for 10 minutes. Compositions which contain neither component (f) nor component (g) may also be possible for use in a field where fire resistance is not required.
Further, the compositions may contain other additives which are usually used, such as pigments and stabilizers, as occasion demands.
The present invention essentially resides in that a mole-ratio of the terminal amino group and the terminal carboxy group in the polyamide utilized (hereinafter referred to as a terminal group ratio) is greater than 1 and component (c) is blended with components (a) and (b) yielding a compatibilized compositions. Highly improved mechanical strength and excellent surface appearance of a molded article have unexpectedly been attained by the use of the compatibilized resin composition according to this invention.
Conventional polyamide resins have a terminal group ratio of 1 or less. In the case of polyamides for injection molding, an end-sealing agent is sometimes added to the polymerization components in order to properly control melt viscosity. The terminal group ratio of such polyamides is less than 1. When a polyamide having a terminal group ratio of more than 1 is used according to the invention, mechanical strength and appearance of a molded article are remarkably improved,, compared with a polyamide having a terminal group ratio of 1 or less. This was not an expected result by any means. Decisive theoretical explanation for the above has not yet been found. According to electron micrography of molded articles, the average size of polyphenylene oxide particles dispersed in a polyamide matrix is small and size distribution is narrow in the present invention. It is surprising that the difference in the terminal group ratio makes such a great difference in a molded article. The terminal group ratio of the polyamides utilized in the present invention should be greater than 1.01, preferably is 1.1 or more, more preferably is 1.3 or more.
The aforesaid components (a) to (c) alone, or with the optional components (d) to (g) alone or in combination, may be mixed in any order and heat melted to be injection molded. The resin compositions according to the invention yield molded articles having highly improved mechanical strength and surface appearance.
The invention is explained below in further detail by the examples, which should not be construed to limit the invention in any manner.
Poly(2,6-dimethyl-1,4-phenylene) ether was used as component (a) in the Examples. Two types of nylon-6 were used as component (b). The first type of polyamide had a terminal amino group of 8.4×10-5 mole/g and a terminal carboxyl group of 1.8×10-5 mole/g. The second type of polyamide had a terminal amino group of 4.6×10-5 mole/g. and a terminal carboxyl group of 7.0×10-5 mole/g. Molecular weight of both polyamides was 13,000. A polyamide having a predetermined terminal group ratio was prepared by admixing these two types of polyamides in a proper mixing ratio. Similar results on a molded article were obtained using a polyamide whose terminal group ratio was adjusted during polymerization instead of the blended polyamide from the two types of polyamides.
Maleic anhydride was used as component (c).
A blend of the above components was extruded at 290° C. through a twin screw extruder with pressure-reducing vent to prepare pellets. Using the pellets, a molded article was produced by an injection molding machine set to a cylinder temperature of 280° C., an injection pressure of 1200 kg/cm2 and a mold temperature of 80° C.
The molded article was evaluated by an Izod impact test according to JIS(Japanese Industrial Standard) K7110. Surface appearance was evaluated with the naked eye. A scanning electron microscope (SEM) was used to examine the state of polyphenylene ether dispersed in a polyamide matrix in the molded article. A small piece was cut out from the Izod test piece and processed by a microtome. It was then subjected to solvent etching in methylene chloride for 2 minutes while sonicating, and coated with gold. Subsequently it was observed by SEM.
The results are shown in TABLES I and II.
TABLE I ______________________________________ Izod Weight Impact Ratio NH.sub.2 / With De- PPO/PA/ COOH Notch Drop struc- Maleic Ratio in Kg Impact tion Anhydride Polyamide cm/cm Kg cm State ______________________________________Comparison 1 50/50 0.5 0.66 7 70brittle Comparison 2 50/50 0.5 0.92 7 251 brittle Example 1 50/50 0.5 1.15 7 464 ductile Example 2 50/50 0.5 1.55 8 600 ductile Example 3 50/50 0.5 2.14 8 605 ductile Example 4 50/50 0.5 4.77 8 600ductile Comparison 3 50/50 -- 1.55 4 50 brittle ______________________________________ PPO: Component (a) PA: Component (b)
TABLE II ______________________________________ PPO Dispersion State Particle Size Appearance of Particle Size Distribution Molded Article ______________________________________Comparison 1 large broadbad Comparison 2 large broad bad Example 1 small narrow good Example 2 small narrow good Example 3 small narrow good Example 4 small narrowgood Comparison 3 large broad bad ______________________________________ Electron microscopic photographs of the molded articles obtained in Comparison 1 (NH.sub.2 /COOH = 0.66), Comparison 2 (0.92), Example 2 (1.55) and Example 4 (4.77) show the differences in particle size and siz distribution of polyphenylene ether.
Compositions using the same polyphenylene ether resin and polyamide resins as in Examples 1-4 were prepared, and molded under the same conditions and subjected to similar tests. The results of the Izod impact test and particle size distribution and surface appearance observations are set forth in Tables III and IV.
Citric Acid, malic acid and n-phenyl citric amide were used as component (c). SBS (styrene-butadiene-styrene block copolymer, Cariflex TR 1101, Shell Chemical Company) was used as component (d).
TABLE III ______________________________________ Izod Impact NH.sub.2 / with PPO/PA/Carboxylic COOH Notch compound/SBS Ratio in Kg (weight ratio) Polyamide cm/cm ______________________________________ Comparison 4 50/50/1 (citric acid)/0 0.66 5 5 50/50/1 (citric acid)/10 0.66 7 6 50/50/1 (citric acid)/10 0.92 15 Example 5 50/50/1 (citric acid)/10 1.15 25 6 50/50/1 (citric acid)/10 1.55 28 7 50/50/1 (citric acid)/0 1.55 6 8 50/50/1 (malic acid)/10 2.14 27 9 50/50/1 (PCA)/10 2.14 28 10 50/50/1 (citric acid)/10 2.14 29 11 50/50/1 (citric acid)/10 4.77 49 Comparison 7 50/50/0/10 1.55 4 ______________________________________ PCA: nphenyl citric amide
TABLE IV ______________________________________ PPO/SBS Dispersion State Appearance of Particle Size Distribution Molded Article ______________________________________Comparison 4 large broad bad 5 large broad bad 6 large broad bad Example 5 small narrow good 6 small narrow good 7 small narrow good 8 small narrow good 9 small narrow good 10 small narrow good 11 small narrow good Comparison 7 Poor Dispersion particularly bad ______________________________________ Electron microscopic photographs photographs of the molded pieces according to Example 6, Example 11,Comparison 5 and Comparison 7 show th differences in particle size and size distribution of polyphenylene ether
Compositions using the same polyphenylene ether resin and polyamide resins as in Examples 1-4 were prepared and molded under the same conditions and subjected to similar tests. The results of the Izod impact, warp and bending strength tests are set forth in Tables V and VI.
Citric acid was used as component (c). SBS (styrene-butadiene-styrene block copolymer, Cariflex TR 1101, Shell Chemical Company) was used as component (d). Chopped glass fibers were used as the filler (e).
TABLE V ______________________________________ PPO/PA/Citric NH2/COOH Izod Impact Acid/GF/SBS Ratio of with Notch (weight ratio) Polyamide (kg cm/cm) ______________________________________ Comparison 8 35/35/0.7/30/0 0.66 6.0 9 35/35/0.7/30/0 0.92 6.4 Example 12 35/35/0.7/30/0 1.15 7.0 13 35/35/0.7/30/0 1.55 7.4 14 35/35/0.7/30/0 4.77 7.2 15 35/35/0.7/30/5 1.55 9.6Comparison 10 35/35/0/30/0 1.55 5.5 ______________________________________ PPO: Component (a), polyphenylene ether PA: Component (b), nylon6 SBS: Component (d), stylenebutadiene-stylene block copolymer GF: Component (e), chopped glass
TABLE VI ______________________________________ Warp Bending Stength (mm) (kg/cm.sup.2) ______________________________________ Comparison 8 14.8 1470 9 9.8 1550 Example 12 4.0 1680 13 2.2 1760 14 3.0 1720 15 3.1 1700Comparison 10 18.2 1410 ______________________________________
The results in Tables V and VI show the relation between the terminal group ratio and warp in Comparisons 8 and 9 and Examples 12, 13 and 14 where only the terminal group ratio of polyamide was varied. It is noted that the warp is remarkably decreased by making the amount of the terminal amine group greater than the amount of the carboxyl group.
Poly(2,6-dimethyl-1,4-phenylene) ether was used as component (a) in the Examples. Two types of Nylon-6 were used as component (b). The low amine content "regular" Nylon-6 had a terminal amine concentration of 3.6×10-5 equivalents/g. and is available under the trade designation of Ultramid B3 from BASF Corporation. It had a Reduced Viscosity of 142 ml/g. calculated by dissolving 0.5 g of the polyamide 90% formic acid, measured at 25° C. by means of Ubelohde viscosity. The "high amine content" Nylon-6 had a terminal amine concentration of 6.9×10-5 equivalents/g. and is available under the trade designation of Capron XPN 1250 from Allied Chemical Corporation. It had a Reduced Viscosity of 149 ml/g. calculated by dissolving 0.5 g of the polyamide in 90% formic acid, measured at 25° C. by means of Ubelohde viscosity.
Polyphenylene functionalized with trimellitic anhydride acid chloride was used as component (c). Hydrogenated styrene-isoprene diblock copolymer was used as component (d).
A blend of the above components was extruded at about 275° C. through a Werner-Pfleiderer twin screw 28 mm extruder with pressure-reducing vacuum to prepare pellets. Using the pellets, a molded article was produced from each composition by an injection molding machine set to a cylinder temperature of about 275° C.
The molded articles were evaluated for Izod Impact strength and Charpy impact strength according to ASTM D 256, Puncture impact according to DIN 53443 and Flexural modulus and Flexural strength according to ASTM 790.
The results are shown in TABLES VII and VIII.
TABLE VII ______________________________________ Izod PPO/PPO- Izod Impact TAAC/PA/SI Terminal Amine Impact -30° C. Example (weight ratio).sup.1 concentration (J/M) (J/M) ______________________________________ Compar- 21.5/21.5/45/12 3.6 × 10.sup.-5 eq./g. 551 220 ison 11 Example 21.5/21.5/45/12 6.9 × 10.sup.-5 eq./g. 656 263 16 Compar- 35/8/45/12 3.6 × 10.sup.-5 eq./g. 225 163 ison 12 Example 35/8/45/12 6.9 × 10.sup.-5 eq./g. 711 178 17 ______________________________________ .sup.1 All compositions also contained a processing aid (0.3 pbw); a stabilizer (0.4 pbw) and TiO.sub.2 (0.5 pbw).
TABLE VIII __________________________________________________________________________ Charpy Puncture Charpy Impact Puncture Impact Flexural Impact -30° C. Impact -30° C. Flexural Strength Example (KJ/m.sup.2) (KJ/m.sup.2).sup.2 (J) (J) Modulus (MPa) __________________________________________________________________________ Comparison 11 41.2 24.3 94 65 1710 86.0 Example 16 47.8 32.9 97 47 2030 85.6 Comparison 12 26.6 20.7 38 7 1620 73.0 Example 17 45.7 27.9 73 10 1830 81.4 __________________________________________________________________________
Poly(2,6-dimethyl-1,4-phenylene) ether was used as component(a) in the Examples. Three types of Nylon-6.6 were used as component (b). The low amine content "regular" Nylon-6,6 had a terminal amine concentration of 4.4×10-5 equivalents/g. and is available under the trade designation of Fabelnly 45 APDH from Tubize Corp. It had a Reduced Viscosity of 132.5 ml/g. calculated by dissolving 0.5 g of the polyamide in 90% formic acid, measured at 25° C. by means of Ubelohde viscosity. The two high amine content Nylon-6,6s were experimental samples which had a terminal amine concentrations of 7.0×10-5 equivalents/g. (for A) and 8.4×10-5 equivalents/g. (for B), respectively. They had Reduced Viscosities of 132 ml/g and 128 ml/g calculated by dissolving 0.5 g of the polyamide in 90% formic acid, measured at 25° C. by means of Ubelohde viscosity.
Citric acid-1-hydrate was used as component (c). Styrene-butadiene-styrene triblock copolymer was used as component (d).
A blend of the above components was extruded at at about 275° C. through a Werner-Pfleiderer twin screw 28 mm extruder with pressure-reducing vacuum to prepare pellets.
In these Examples, a portion of each of the amines was added "downstream" of the extruder "throat", showing that the order of compounding the ingredients is not critical to the present invention.
Using the pellets thus formed, a molded article was produced from each composition by an injection molding machine set to a cylinder temperature of about 285° C.
The molded articles were evaluated for Izod impact strength and Charpy impact strength according to ASTM D 256, and Puncture impact according to DIN 53443.
The results are shown in TABLE IX.
TABLE IX __________________________________________________________________________ PPO/Citric Acid- Izod Impact Charpy Impact Puncture 1-Hydrate/PA.sup.1 /SBS (J/M) (KJ/M.sup.2) Impact Example (weight ratio).sup.2 RT -30° C. RT -30° C. RT -30° C. __________________________________________________________________________ Comparison 13 49/0.7/41/10 249 126 18.3 11.3 99 56 Example 18 49/0.7/41(A)/10 321 162 19.9 12.2 144 64 Example 19 49/0.7/41(B)/10 298 177 21.4 12.4 136 56 __________________________________________________________________________ .sup.1 10 pbw of each polyamide was precompounded; 31 pbw of each polyamide was added downstream .sup.2 All compositions also contained a stabilizer (0.4 pbw) and TiO.sub.2 (0.5 pbw).
Compositions using the same polyphenylene ether resin and polyamide resins as in Examples 1-4 were prepared and molded under the same conditions and tested. The results of the flammability and warp tests are set forth in Table X.
Citric acid was used as component (c). Chopped glass fibers were used as component (e). Various flame retardants, listed in the Table, were used as component (f) and antimony trioxide was used as component (g).
TABLE X __________________________________________________________________________ PPO/PA/Citric Acid/ GF/Flame Retardant/ NH2/COOH Ratio Warp Example Sb.sub.2 O.sub.3 (weight ratio) Of Polyamide (mm) Flammability __________________________________________________________________________ Comparison 14 15/35/0.5/30/20 (TPP)/-- 1.55 -- total loss byfire Comparison 15 15/35/0.5/30/20 (methyl cyanurate)/-- 1.55 -- total loss by fire Example 20 15/35/0.5/30/15 (BS)/5 1.55 2.8 V-O Example 21 15/35/0.5/30/15 (B-PPO)/5 1.55 3.2 V-O Example 22 15/35/0.5/30/15 (B-E)/5 1.55 3.5 V-O Example 23 15/35/0.5/30/15 (DBD)/5 1.55 3.2 V-O Example 24 15/35/0.5/30/20 (BS)/5 1.55 3.4 V-O __________________________________________________________________________ TPP: Triphenyl phosphate BS: Bromoinated styrene (pyrocheck 68PB, Nissan Ferroorganus Chemical Co. BPPO: Brominated polyphenyleneoxide (PO44P, Great Lakes Chemicals) BE: Brominated bisphenol type epoxy compound (EBR787, Massumaga Chemical Co.) DBD: Decabromodiphenylether (EB10FP. Massumaga Chemical Co.)
The above mentioned patents, patent applications and other publications are incorporated herein by reference.
Other modifications and variations of the invention are possible and will occur to those skilled in the art in light of the above-detailed disclosure. It is to be understood, therefore, that changes may be made in the particular embodiments shown without departing from the spirit of the invention or its scope as defined in the appended claims.
Claims (27)
1. A resin composition comprising:
(a) a polyphenylene ether resin;
(b) a polyamide resin in which the amount of terminal amino group is greater than the amount of terminal carboxyl group; and
(c) a compatibilizer compound for (a) and (b).
2. A composition according to claim 1 in which the polyphenylene ether is defined by the formula ##STR3## wherein R1, R2, R3 and R4 are a monovalent substituent selected from the group consisting of a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group, a haloalkyl and haloalkoxy group in which at least 2 carbon atoms are present between a halogen atom and a phenyl ring with the exclusion of those having tertiary alpha-carbon atoms and n is an integer representing a degree of polymerization.
3. A composition according to claim 2 in which the polyphenylene ether is selected from the group consisting of poly(2,6-diethyl-1,4-phenylene) ether, poly(2-methyl-6-ethyl-1,4-phenylene) ether, poly(2-methyl-6-ethyl-1,4-phenylene) ether, poly(2-methyl-6-propyl-1,4-phenylene) ether, poly(2,6-dipropyl-1,4-phenylene) ether, poly(2-ethyl-6-propyl-1,4-phenylene) ether, poly(2,6-dipropyl-1,4-phenylene) ether, and poly(2,6-dimethyl1,4-phenylene) ether.
4. A composition according to claim 3 in which the polyphenylene ether is poly(2,6-dimethyl-1,4-phenylene (ether).
5. A composition according to claim 1 in which the polyphenylene ether is a copolymer of two or more polyphenylene ether comonomers.
6. A composition according to claim 5 in which the polyphenylene ether copolymer is a copolymer in which part of the polyphenylene ether recurring unit is replaced with a tri-alkyl substituted phenol.
7. A composition according to claim 6 in which said tri-alkyl substituted phenol is 2,3,6-trimethyl phenol.
8. A composition according to claim 1 in which the polyamide is obtained by polymerizing a monoamino monocarboxylic acid or a lactam thereof having at least two carbon atoms between amino and a carboxylic acid.
9. A composition according to claim 1 in which the polyamide is obtained by polymerizing a diamine, which contains at least two carbon atoms between the amino groups, and a dicarboxylic acid.
10. A composition according to claim 1 in which the polyamide is obtained by polymerizing a monoamino carboxylic acid or a lactam thereof with a diamine and a dicarboxylic acid.
11. A composition according to claim 8 in which the monoamino monocarboxylic acid or lactam thereof is selected from the group consisting of gamma aminocaproic, acid, butyrolactam, pivalolactam, caprolactam, capryllactam, enantholactam, undecanolactam, dodecanolactam and 3- and 4-amino benzoic acids.
12. A composition according to claim 9 in which the diamine is of the formula H2 -N(CH2)n NH2 wherein n is an integer of from 2 to 16.
13. A composition according to claim 12 in which the diamine is selected from the group consisting of the trimethylene diamine, tetramethylene diamine, pentamethylene diamine, octamethylene diamine and hexamethylene diamine.
14. A composition according to claim 9 in which the dicarboxylic acid is aromatic.
15. A composition according to claim 14 in which the dicarboxylic acid is selected from the group consisting of isophthalic and terephthalic acids.
16. A composition according to claim 8 in which the dicarboxylic acid of the formula HOOC--Y--COOH wherein Y represents a divalent aliphatic group containing at least two carbon atoms.
17. A composition according to claim 16 in which the dicarboxylic acid is selected from the group consisting of sebacic acid, octadecanedioc acid, suberic acid, glutaric acid, pimelic acid and adipic acid.
18. A composition according to claim 1 in which the polyamide is selected from the group consisting of polyamide 6, polyamide 6/6, polyamide 11, polyamide 121, polyamide 6/3, polyamide 6/4, polyamide 6/10 nd polyamide 6/12.
19. A composition according to claim 1, in which component (c) is selected from the group consisting of
(i) a compound having (1) one or more of a carbon-carbon double or triple, bonds and (2) one or more functional groups selected from carboxyl, acid anhydride, acid amide, imide, carboxylic ester or epoxy group;
(ii) a saturated aliphatic polycarboxylic acid or derivative thereof;
(iii) a silane compound having in its molecular structure both (a) at least one silicon atom which is bonded to a carbon atom via an oxygen bridge and (b) at least an ethylene carbon-to-carbon double bond, a carbon-to-carbon triple bond, or a functional group selected from the group consisting of an amine group and a mercapto group, the functional group not being bonded directly to the silicon atom or mixtures of (b);
(iv) a functionalized polyethylene ether consisting of a reaction product or (a) a polyphenylene ether and (b) a compound of the general formula (i)--Z--(ii), wherein (i) is at least a group of the formula [X--C(O)] with X being F, Cl, Br, I, OH, --OR, or --O--C(O)--R with R being alkyl or aryl, wherein (ii) is at least a carboxylic acid, acid anhydride, acid amide imido, carboxylic acid ester, amino or hydroxyl group, in which the groups (i) and (ii) are covalently bonded together via a bridge Z, Z being a bivalent hydrocarbon radical;
(v) an oxidized polyolefin wax, optionally in combination with an organic phosphite;
(vi) a copolymer with units of a vinylaromatic compound and of an alpha-beta unsaturated dicarboxylic acid or dicarboxylic acid anhydride or a copolymer with units of a vinylaromatic compound of an imide compound of an alpha-beta unsaturated dicarboxylic acid;
(vii) the reaction product of (a) 1,2-substituted olefinic compound with carboxyl group of acid anhydride groups, (B) a polyphenylene ether and (c) a radical initiator.
20. A composition according to claim 19, in which component (c) is selected from the group consisting of maleic anhydride, citric acid, maleic acid, N-phenyl citric polyphenylene functionalized with trimetallic anhydride acid chloride and citric acid-1-hydrate.
21. A composition according to claim 1, in which component (a) is present in the amount of from 5 to 80 parts by weight; component (b) is present in the amount of from about 95 to about 20 parts by weight based upon 100 parts by weight of (a) and (b); and component (c) is present in an amount of from about 0.01 to about 10 parts by weight of the total amount of (a) and (b).
22. A resin composition comprising:
(a) a polyphenylene ether resin;
(b) a polyamide resin in which the ratio of terminal amino groups to terminal carboxyl groups is greater than 1:01; and
(c) a compatibilizer compound for (a) and (b).
23. A composition according to claim 22 wherein the ratio of terminal amino groups to terminal carboxyl groups is greater than about 1.1.
24. A composition according to claim 22 wherein the ratio terminal amino groups to terminal carboxyl groups is greater than 1.3.
25. A composition according to claim 22 wherein the ratio of terminal amino groups to terminal carboxyl groups is from about 1.5 to about 4.77.
26. A composition according to claim 25 wherein components (a) and (b) are present in substantially equal amounts.
27. A composition according to claim 26 wherein component (a) is present in an amount of about 50 parts by weight, component (b) is present in an amount of about 50 parts by weight and component (c) is present in an amount of about 0.5 parts by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/273,347 USRE35509E (en) | 1986-03-07 | 1994-07-15 | Polyphenylene ether/polyamide blends having improved physical properties |
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61-48504 | 1986-03-07 | ||
JP4850486 | 1986-03-07 | ||
JP61-78383 | 1986-04-07 | ||
JP61078383A JPH0692535B2 (en) | 1986-03-07 | 1986-04-07 | Resin composition |
JP61-82277 | 1986-04-11 | ||
JP61082277A JPH0692537B2 (en) | 1986-04-11 | 1986-04-11 | Resin and filler composition |
JP61091371A JPH0692536B2 (en) | 1986-04-22 | 1986-04-22 | Resin composition |
JP61-91371 | 1986-04-22 | ||
US07/022,836 US4873276A (en) | 1986-03-07 | 1987-03-06 | Polyphenylene ether/polyamide blends having mproved physical properties |
US08/273,347 USRE35509E (en) | 1986-03-07 | 1994-07-15 | Polyphenylene ether/polyamide blends having improved physical properties |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/022,836 Reissue US4873276A (en) | 1986-03-07 | 1987-03-06 | Polyphenylene ether/polyamide blends having mproved physical properties |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE35509E true USRE35509E (en) | 1997-05-13 |
Family
ID=27550319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/273,347 Expired - Lifetime USRE35509E (en) | 1986-03-07 | 1994-07-15 | Polyphenylene ether/polyamide blends having improved physical properties |
Country Status (1)
Country | Link |
---|---|
US (1) | USRE35509E (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050038203A1 (en) * | 2003-08-16 | 2005-02-17 | Elkovitch Mark D. | Poly (arylene ether)/polyamide composition |
US20060231809A1 (en) * | 2005-04-15 | 2006-10-19 | Fishburn James R | Poly(arylene ether)/polyamide composition |
US20090146109A1 (en) * | 2007-12-06 | 2009-06-11 | Sabic Innovative Plastics Ip Bv | Thermoplastic poly(arylene ether)/polyamide blends and method of making |
Citations (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3375228A (en) * | 1967-05-10 | 1968-03-26 | Gen Electric | Hot capping of polyphenylene ethers |
US3379875A (en) * | 1966-02-21 | 1968-04-23 | Gen Electric | Stabilized polyphenylene oxide composition |
US3379792A (en) * | 1965-08-12 | 1968-04-23 | Gen Electric | Polymer blend of a polyphenylene oxide and a polyamide |
US3402143A (en) * | 1967-10-05 | 1968-09-17 | Gen Electric | Method for decolorization and capping polyphenylene ethers |
US3573254A (en) * | 1968-12-23 | 1971-03-30 | Gen Electric | Reductive capping of poly(phenylene oxides) |
US3822227A (en) * | 1970-08-01 | 1974-07-02 | Bayer Ag | Homogeneous mixtures of polyamides and polyolefins |
US4137212A (en) * | 1977-01-28 | 1979-01-30 | Basf Aktiengesellschaft | Flameproofed nylon molding compositions |
US4141880A (en) * | 1978-01-03 | 1979-02-27 | Velsicol Chemical Corporation | Flame retarded nylon composition |
US4148843A (en) * | 1977-12-23 | 1979-04-10 | General Electric Company | Compositions of capped polyphenylene oxides and alkenyl aromatic resins |
US4156773A (en) * | 1977-05-26 | 1979-05-29 | General Electric Company | Process for capping quinone-coupled polyphenylene oxides |
US4213910A (en) * | 1977-09-10 | 1980-07-22 | Bayer Aktiengesellschaft | Process for the preparation of 1-amino-4-bromoanthraquinone-2-sulphonic acid I |
US4231910A (en) * | 1979-02-08 | 1980-11-04 | Dow Corning Corporation | Primer composition |
US4258144A (en) * | 1979-11-21 | 1981-03-24 | Phillips Petroleum Company | Polyphenylene ether blends |
US4315086A (en) * | 1979-08-08 | 1982-02-09 | Sumitomo Chemical Company, Limited | Resin compositions |
EP0046040A1 (en) * | 1980-08-13 | 1982-02-17 | Asahi Kasei Kogyo Kabushiki Kaisha | A highly heat-resistant thermoplastic resin composition having high oil-resistance and articles molded therefrom |
US4335126A (en) * | 1977-03-10 | 1982-06-15 | Degussa Aktiengesellschaft | 1-[3-(3,4,5-Trimethoxyphenoxy)-2-hydroxy-propyl]-4-aryl-piperazine-derivatives having pharmaceutical activity |
US4338421A (en) * | 1979-07-20 | 1982-07-06 | Sumitomo Chemical Company, Limited | Resin composition |
US4383082A (en) * | 1981-12-01 | 1983-05-10 | General Electric Company | Polyphenylene ether resin compositions containing polyolefin in high amount |
US4387189A (en) * | 1980-09-20 | 1983-06-07 | Basf Aktiengesellschaft | Thermoplastic molding materials containing polymers with polyphenylene ether groups and styrene polymers |
JPS58117250A (en) * | 1981-12-29 | 1983-07-12 | Asahi Chem Ind Co Ltd | Reinforced resin composition with excellent moldability and its preparation |
JPS58213364A (en) * | 1982-06-05 | 1983-12-12 | Casio Comput Co Ltd | Small sized electronic calculator |
JPS5927942A (en) * | 1982-08-09 | 1984-02-14 | Asahi Chem Ind Co Ltd | Thermoplastic polymer composition having good heat resistance |
US4433088A (en) * | 1981-02-26 | 1984-02-21 | General Electric Company | Polyphenylene ether compositions and process |
JPS5959724A (en) * | 1982-09-29 | 1984-04-05 | Unitika Ltd | Production of modified thermoplastic resin |
JPS5966452A (en) * | 1982-10-08 | 1984-04-14 | Unitika Ltd | Resin composition |
JPS5986653A (en) * | 1982-11-08 | 1984-05-18 | Unitika Ltd | Resin composition |
EP0129825A2 (en) * | 1983-06-28 | 1985-01-02 | General Electric Company | Modified blends of polyphenylene ether resin and a polyamide |
EP0131445A2 (en) * | 1983-07-06 | 1985-01-16 | Mitsubishi Gas Chemical Company, Inc. | Polyphenylene ether resin composition |
US4496690A (en) * | 1981-11-30 | 1985-01-29 | Borg-Warner Chemicals, Inc. | Alloys of styrenic resins and polyamides |
WO1985000944A1 (en) * | 1983-08-16 | 1985-02-28 | The Variable Speech Control Company ("Vsc") | Audio channel stacking with speech compression for narrow band transmission with provision for dialed calls |
US4532306A (en) * | 1983-10-21 | 1985-07-30 | Mitsubishi Gas Chemical Company, Inc. | Polyphenylene ether resin composition |
WO1985005372A1 (en) * | 1984-05-21 | 1985-12-05 | General Electric Company | Modified polyphenylene ether-polyamide compositions and process |
US4600741A (en) * | 1984-09-27 | 1986-07-15 | General Electric Company | Polyphenylene ether-polyamide blends |
US4614773A (en) * | 1984-01-10 | 1986-09-30 | Mitsubishi Gas Chemical Company, Inc. | Novel polyphenylene ether resin composition |
EP0147874B1 (en) * | 1984-01-05 | 1987-12-16 | General Electric Company | Polymer mixture comprising a polyphenylene ether and a polyamide |
US4732938A (en) * | 1985-12-06 | 1988-03-22 | Borg-Warner Chemicals, Inc. | Thermoplastic polyamide--polyphenylene ether compositions |
-
1994
- 1994-07-15 US US08/273,347 patent/USRE35509E/en not_active Expired - Lifetime
Patent Citations (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3379792A (en) * | 1965-08-12 | 1968-04-23 | Gen Electric | Polymer blend of a polyphenylene oxide and a polyamide |
US3379875A (en) * | 1966-02-21 | 1968-04-23 | Gen Electric | Stabilized polyphenylene oxide composition |
US3375228A (en) * | 1967-05-10 | 1968-03-26 | Gen Electric | Hot capping of polyphenylene ethers |
US3402143A (en) * | 1967-10-05 | 1968-09-17 | Gen Electric | Method for decolorization and capping polyphenylene ethers |
US3573254A (en) * | 1968-12-23 | 1971-03-30 | Gen Electric | Reductive capping of poly(phenylene oxides) |
US3822227A (en) * | 1970-08-01 | 1974-07-02 | Bayer Ag | Homogeneous mixtures of polyamides and polyolefins |
US4137212A (en) * | 1977-01-28 | 1979-01-30 | Basf Aktiengesellschaft | Flameproofed nylon molding compositions |
US4335126A (en) * | 1977-03-10 | 1982-06-15 | Degussa Aktiengesellschaft | 1-[3-(3,4,5-Trimethoxyphenoxy)-2-hydroxy-propyl]-4-aryl-piperazine-derivatives having pharmaceutical activity |
US4156773A (en) * | 1977-05-26 | 1979-05-29 | General Electric Company | Process for capping quinone-coupled polyphenylene oxides |
US4213910A (en) * | 1977-09-10 | 1980-07-22 | Bayer Aktiengesellschaft | Process for the preparation of 1-amino-4-bromoanthraquinone-2-sulphonic acid I |
US4148843A (en) * | 1977-12-23 | 1979-04-10 | General Electric Company | Compositions of capped polyphenylene oxides and alkenyl aromatic resins |
US4141880A (en) * | 1978-01-03 | 1979-02-27 | Velsicol Chemical Corporation | Flame retarded nylon composition |
US4231910A (en) * | 1979-02-08 | 1980-11-04 | Dow Corning Corporation | Primer composition |
US4338421A (en) * | 1979-07-20 | 1982-07-06 | Sumitomo Chemical Company, Limited | Resin composition |
US4315086A (en) * | 1979-08-08 | 1982-02-09 | Sumitomo Chemical Company, Limited | Resin compositions |
US4258144A (en) * | 1979-11-21 | 1981-03-24 | Phillips Petroleum Company | Polyphenylene ether blends |
EP0046040A1 (en) * | 1980-08-13 | 1982-02-17 | Asahi Kasei Kogyo Kabushiki Kaisha | A highly heat-resistant thermoplastic resin composition having high oil-resistance and articles molded therefrom |
US4339376A (en) * | 1980-08-13 | 1982-07-13 | Asahi-Dow Limited | Highly heat-resistant thermoplastic resin composition having high oil-resistance |
US4387189A (en) * | 1980-09-20 | 1983-06-07 | Basf Aktiengesellschaft | Thermoplastic molding materials containing polymers with polyphenylene ether groups and styrene polymers |
US4433088A (en) * | 1981-02-26 | 1984-02-21 | General Electric Company | Polyphenylene ether compositions and process |
US4496690A (en) * | 1981-11-30 | 1985-01-29 | Borg-Warner Chemicals, Inc. | Alloys of styrenic resins and polyamides |
US4383082A (en) * | 1981-12-01 | 1983-05-10 | General Electric Company | Polyphenylene ether resin compositions containing polyolefin in high amount |
JPS58117250A (en) * | 1981-12-29 | 1983-07-12 | Asahi Chem Ind Co Ltd | Reinforced resin composition with excellent moldability and its preparation |
JPS58213364A (en) * | 1982-06-05 | 1983-12-12 | Casio Comput Co Ltd | Small sized electronic calculator |
JPS5927942A (en) * | 1982-08-09 | 1984-02-14 | Asahi Chem Ind Co Ltd | Thermoplastic polymer composition having good heat resistance |
JPS5959724A (en) * | 1982-09-29 | 1984-04-05 | Unitika Ltd | Production of modified thermoplastic resin |
JPS5966452A (en) * | 1982-10-08 | 1984-04-14 | Unitika Ltd | Resin composition |
JPS5986653A (en) * | 1982-11-08 | 1984-05-18 | Unitika Ltd | Resin composition |
EP0129825A2 (en) * | 1983-06-28 | 1985-01-02 | General Electric Company | Modified blends of polyphenylene ether resin and a polyamide |
EP0131445A2 (en) * | 1983-07-06 | 1985-01-16 | Mitsubishi Gas Chemical Company, Inc. | Polyphenylene ether resin composition |
WO1985000944A1 (en) * | 1983-08-16 | 1985-02-28 | The Variable Speech Control Company ("Vsc") | Audio channel stacking with speech compression for narrow band transmission with provision for dialed calls |
US4532306A (en) * | 1983-10-21 | 1985-07-30 | Mitsubishi Gas Chemical Company, Inc. | Polyphenylene ether resin composition |
EP0147874B1 (en) * | 1984-01-05 | 1987-12-16 | General Electric Company | Polymer mixture comprising a polyphenylene ether and a polyamide |
US4614773A (en) * | 1984-01-10 | 1986-09-30 | Mitsubishi Gas Chemical Company, Inc. | Novel polyphenylene ether resin composition |
WO1985005372A1 (en) * | 1984-05-21 | 1985-12-05 | General Electric Company | Modified polyphenylene ether-polyamide compositions and process |
US4600741A (en) * | 1984-09-27 | 1986-07-15 | General Electric Company | Polyphenylene ether-polyamide blends |
US4732938A (en) * | 1985-12-06 | 1988-03-22 | Borg-Warner Chemicals, Inc. | Thermoplastic polyamide--polyphenylene ether compositions |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050038203A1 (en) * | 2003-08-16 | 2005-02-17 | Elkovitch Mark D. | Poly (arylene ether)/polyamide composition |
US7182886B2 (en) * | 2003-08-16 | 2007-02-27 | General Electric Company | Poly (arylene ether)/polyamide composition |
US20060231809A1 (en) * | 2005-04-15 | 2006-10-19 | Fishburn James R | Poly(arylene ether)/polyamide composition |
US7413684B2 (en) | 2005-04-15 | 2008-08-19 | Sabic Innovative Plastics Ip B.V. | Poly(arylene ether)/polyamide composition |
US20090146109A1 (en) * | 2007-12-06 | 2009-06-11 | Sabic Innovative Plastics Ip Bv | Thermoplastic poly(arylene ether)/polyamide blends and method of making |
US8858839B2 (en) | 2007-12-06 | 2014-10-14 | Sabic Global Technologies B.V. | Thermoplastic poly(arylene ether)/polyamide blends and method of making |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4873276A (en) | Polyphenylene ether/polyamide blends having mproved physical properties | |
US4822836A (en) | Polyphenylene ether/polyamide blends having improved melt flow characteristics | |
US4743651A (en) | Resin composition of polyphenylene ether and polyamide | |
EP0260314B1 (en) | Polyphenylene ether/polyamide blends having improved physical properties | |
US5310821A (en) | Polyphenylene ether resin compositions | |
US5290881A (en) | Polymer mixture comprising a polyphenylene ether and a polyarylene sulphide | |
JP2506031B2 (en) | Composition containing polyphenylene ether resin and polyamide resin | |
JPH06287446A (en) | Thermoplastic resin composition | |
JPH0668071B2 (en) | Method for producing modified polyphenylene ether-polyamide composition | |
JPS63199754A (en) | Modification of impact resistance of polyphenylene ether-polyamide composition | |
US5397838A (en) | Polyphenylene ether resin compositions | |
US5670576A (en) | Polyamide resin composition | |
US5559185A (en) | Thermoplastic resin composition | |
USRE35509E (en) | Polyphenylene ether/polyamide blends having improved physical properties | |
US5872187A (en) | Polyamide resin composition | |
JP2648786B2 (en) | Composition containing polyphenylene ether resin and polyamide resin showing improved properties | |
EP0337814A2 (en) | Thermoplastic resin composition | |
JPS62250050A (en) | Resin composition | |
JP2945041B2 (en) | Molding resin composition | |
CS9100779A2 (en) | Thermoplastic material on base of polyenylenether and polyamide | |
JPH107900A (en) | Polyether imide resin composition and its production | |
JPH05306369A (en) | Thermoplastic resin composition | |
JPH0525386A (en) | Thermoplastic resin composition and its production | |
JPH0551523A (en) | Impact-resistant resin composition | |
JP3358496B2 (en) | Thermoplastic resin composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FEPP | Fee payment procedure |
Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 12 |