USH848H - Method of passivating a substrate surface - Google Patents

Method of passivating a substrate surface Download PDF

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Publication number
USH848H
USH848H US07/396,395 US39639589A USH848H US H848 H USH848 H US H848H US 39639589 A US39639589 A US 39639589A US H848 H USH848 H US H848H
Authority
US
United States
Prior art keywords
layer
passivating
active layer
substrate
substrate surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US07/396,395
Inventor
Peter R. Emtage
Thomas A. Temofonte
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United States Department of the Army
Original Assignee
United States Department of the Army
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United States Department of the Army filed Critical United States Department of the Army
Priority to US07/396,395 priority Critical patent/USH848H/en
Application granted granted Critical
Publication of USH848H publication Critical patent/USH848H/en
Abandoned legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/16Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169Thin semiconductor films on metallic or insulating substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/125The active layers comprising only Group II-VI materials, e.g. CdS, ZnS or CdTe
    • H10F71/1253The active layers comprising only Group II-VI materials, e.g. CdS, ZnS or CdTe comprising at least three elements, e.g. HgCdTe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/16Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169Thin semiconductor films on metallic or insulating substrates
    • H10F77/1696Thin semiconductor films on metallic or insulating substrates the films including Group II-VI materials, e.g. CdTe or CdS
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Definitions

  • This invention relates in general to a method of passivation of a substrate surface, and in particular to the passivation of a substrate surface by the introduction of a thin layer of (Hg,Cd)Te, of increased Cd content, on the substrate surface before growth of the desired composition of (Hg,Cd)Te.
  • the alloy family Hg 1-x Cd x Te has been used in infrared detection, the choice of the Cd fraction x allowing the choice of the infrared range. Both photoconductive and photovoltaic modes of detection have been used. Work has centered on growth by molecular beam epitaxy (MBE) and by metal-organic chemical vapor deposition (MOCVD). The compound has been grown on substrates of CdTe or lattice matched Cd 1-y Zn y Te. X-ray analysis however, has shown the existence of a damage layer presumably associated with lattice mismatch at the growth interface when CdTe is the substrate. Similar, but weaker, damage is expected on (Cd,Zn)Te substrates, because composition control in available material is poor.
  • MBE molecular beam epitaxy
  • MOCVD metal-organic chemical vapor deposition
  • the general object of this invention is to provide a method of passivating a substrate surface.
  • a more particular object of the invention is to provide a method of improving the efficiency of infrared devices by isolating the active layer from surface damage.
  • the passivating layer can be thin and of about 500 to 1500 angstroms in thickness. However, the passivating layer must be thick enough to contain the damage layer.
  • the doping of the passivating layer should be the same type as that of the active layer, so that photogenerated minority carriers are reflected from it.
  • the composition of the passivating layer should be close to that of the active layer, to avoid a new source of mismatch, but sufficiently far different to provide effective exclusion of minority carriers from the damage layer.
  • the passivating layer may be continuous with the active layer; a gradient in the Cd content, from high to low is expected to minimize damage in the active layer.

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  • Light Receiving Elements (AREA)

Abstract

The surface of a substrate is passivated by the introduction of a thin la of (Hg,Cd)Te, of increased Cd content, on the substrate surface before the growth of the desired composition of (Hg,Cd)Te.

Description

The Government has rights in this invention under Contract No. DAAB07-86-C-F069 with the Department of the Army.
This invention relates in general to a method of passivation of a substrate surface, and in particular to the passivation of a substrate surface by the introduction of a thin layer of (Hg,Cd)Te, of increased Cd content, on the substrate surface before growth of the desired composition of (Hg,Cd)Te.
BACKGROUND OF THE INVENTION
The alloy family Hg1-x Cdx Te has been used in infrared detection, the choice of the Cd fraction x allowing the choice of the infrared range. Both photoconductive and photovoltaic modes of detection have been used. Work has centered on growth by molecular beam epitaxy (MBE) and by metal-organic chemical vapor deposition (MOCVD). The compound has been grown on substrates of CdTe or lattice matched Cd1-y Zny Te. X-ray analysis however, has shown the existence of a damage layer presumably associated with lattice mismatch at the growth interface when CdTe is the substrate. Similar, but weaker, damage is expected on (Cd,Zn)Te substrates, because composition control in available material is poor.
Recent studies have shown strong electrical activity near the growth interface of (Hg,Cd)Te grown by MBE on CdTe.
17 3 in Large donor and trap densities of greater than 1017 /cm3 in roughly 300 angstroms have been inferred. Such properties must cause rapid recombination of photo-generated carriers near the interface, and degrade infrared response.
SUMMARY OF THE INVENTION
The general object of this invention is to provide a method of passivating a substrate surface. A more particular object of the invention is to provide a method of improving the efficiency of infrared devices by isolating the active layer from surface damage.
It has now been found that the aforementioned objects can be attained by the introduction of a passivating layer or thin layer of (Hg,Cd)Te of increased Cd content, on the substrate surface before growth of the photo-active layer of the desired composition of (Hg,Cd)Te.
The passivating layer can be thin and of about 500 to 1500 angstroms in thickness. However, the passivating layer must be thick enough to contain the damage layer. The doping of the passivating layer should be the same type as that of the active layer, so that photogenerated minority carriers are reflected from it. The composition of the passivating layer should be close to that of the active layer, to avoid a new source of mismatch, but sufficiently far different to provide effective exclusion of minority carriers from the damage layer. For example, the Cd fraction for long wavelength detection is close to x=0.21. For operation at a temperature of 77° K, a composition of x=0.27 in the passivating layer is more than sufficient to cause electrical isolation of the active layer from the growth interface. Higher temperatures will require greater increases in the Cd content of the passivating layer over that of the active layer.
The passivating layer may be continuous with the active layer; a gradient in the Cd content, from high to low is expected to minimize damage in the active layer.
We wish it to be understood that we do not desire to be limited to the exact details of construction shown and described for obvious modifications will occur to a person skilled in the art.

Claims (10)

What is claimed is:
1. Method of passivating a substrate surface to be used for growth of a photo-active layer of the alloy family Hg1-x Cdx Te to be used in infrared detection, where choice of the Cd fraction x allows choice of infrared range, said method comprising growing a layer of relatively wide band gap (Hg,Cd)Te before growth of the photo-active layer.
2. Method according to claim 1 wherein the layers are grown by molecular beam epitaxy (MBE).
3. Method according to claim 1 wherein the layers are grown by metal-organic chemical vapor deposition (MOCVD).
4. Method according to claim 1 wherein the substrate is selected from the group consisting of CdTe and lattice matched Cd1-y Zny Te.
5. Method according to claim 4 wherein the substrate is CdTe.
6. Method according to claim 4 wherein the substrate is lattice matched Cd1-y Zny Te.
7. Method according to claim 1 wherein the passivating layer is about 500 to 1500 angstroms in thickness.
8. Method according to claim 1 wherein the doping of the passivating layer is the same type as that of the active layer.
9. Method according to claim 1 wherein the composition of the passivating layer should be close to that of the active layer.
10. Method according to claim 1 wherein the passivating layer is continuous with the active layer.
US07/396,395 1989-08-17 1989-08-17 Method of passivating a substrate surface Abandoned USH848H (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US07/396,395 USH848H (en) 1989-08-17 1989-08-17 Method of passivating a substrate surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/396,395 USH848H (en) 1989-08-17 1989-08-17 Method of passivating a substrate surface

Publications (1)

Publication Number Publication Date
USH848H true USH848H (en) 1990-11-06

Family

ID=23567028

Family Applications (1)

Application Number Title Priority Date Filing Date
US07/396,395 Abandoned USH848H (en) 1989-08-17 1989-08-17 Method of passivating a substrate surface

Country Status (1)

Country Link
US (1) USH848H (en)

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