USD956833S1 - Plunger unit - Google Patents

Plunger unit Download PDF

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Publication number
USD956833S1
USD956833S1 US35/355,092 US35509241F USD956833S US D956833 S1 USD956833 S1 US D956833S1 US 35509241 F US35509241 F US 35509241F US D956833 S USD956833 S US D956833S
Authority
US
United States
Prior art keywords
plunger unit
plunger
unit
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US35/355,092
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USD927227S1 (en
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USD924224S1 (en
USD936443S1 (en
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Inventor
Hideo Ichihashi
Shin YAMANE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to US35/355,092 priority Critical patent/USD956833S1/en
Assigned to TOWA CORPORATION reassignment TOWA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ICHIHASHI, Hideo, YAMANE, SHIN
Application granted granted Critical
Publication of USD956833S1 publication Critical patent/USD956833S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H01L24/48—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Description

2. Plunger unit
2.1 : Front
2.2 : Back
2.3 : Top
2.4 : Bottom
2.5 : Right
2.6 : Left
2.7 : Perspective
The broken lines shown in the drawings represent portions of the plunger unit that form no part of the claimed design. Fig.2.1 is a front view of the plunger unit; fig.2.2 is a back view thereof; fig.2.3 is a top view thereof; fig.2.4 is a bottom view thereof; fig.2.5 is a right view thereof; fig.2.6 is a left view thereof; and fig.2.7 is a perspective view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a plunger unit, as shown and described.
US35/355,092 2019-10-31 2019-10-31 Plunger unit Active USD956833S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US35/355,092 USD956833S1 (en) 2019-10-31 2019-10-31 Plunger unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35/355,092 USD956833S1 (en) 2019-10-31 2019-10-31 Plunger unit

Publications (1)

Publication Number Publication Date
USD956833S1 true USD956833S1 (en) 2022-07-05

Family

ID=82199782

Family Applications (1)

Application Number Title Priority Date Filing Date
US35/355,092 Active USD956833S1 (en) 2019-10-31 2019-10-31 Plunger unit

Country Status (1)

Country Link
US (1) USD956833S1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851941A (en) * 1996-03-01 1998-12-22 Ngk Insulators, Ltd. Si/SiC-based sintered material having excellent corrosion resistance and kiln furniture
US7794408B2 (en) * 2003-03-28 2010-09-14 Ethicon, Inc. Tissue collection device and methods
USD714368S1 (en) * 2013-06-17 2014-09-30 Husky Injection Molding Systems Ltd. Mold
USD730416S1 (en) * 2010-11-12 2015-05-26 Husky Injection Molding Systems Ltd. Lock ring for use in a mold stack
US20150311095A1 (en) * 2014-04-24 2015-10-29 Towa Corporation Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member
US20160020187A1 (en) * 2014-07-18 2016-01-21 Towa Corporation Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member
US10170346B2 (en) * 2015-03-23 2019-01-01 Towa Corporation Resin sealing apparatus and resin sealing method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851941A (en) * 1996-03-01 1998-12-22 Ngk Insulators, Ltd. Si/SiC-based sintered material having excellent corrosion resistance and kiln furniture
US7794408B2 (en) * 2003-03-28 2010-09-14 Ethicon, Inc. Tissue collection device and methods
USD730416S1 (en) * 2010-11-12 2015-05-26 Husky Injection Molding Systems Ltd. Lock ring for use in a mold stack
USD714368S1 (en) * 2013-06-17 2014-09-30 Husky Injection Molding Systems Ltd. Mold
US20150311095A1 (en) * 2014-04-24 2015-10-29 Towa Corporation Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member
US20160020187A1 (en) * 2014-07-18 2016-01-21 Towa Corporation Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member
US10170346B2 (en) * 2015-03-23 2019-01-01 Towa Corporation Resin sealing apparatus and resin sealing method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Taiwanese Office Action corresponding to Taiwanese Application No. 109302259, dated Sep. 30, 2020, 5 pages.
Taiwanese Office Action corresponding to Taiwanese Application No. 109302269, dated Sep. 29, 2020, 4 pages.

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