USD915309S1 - Light emitting diode chip - Google Patents
Light emitting diode chip Download PDFInfo
- Publication number
- USD915309S1 USD915309S1 US29/713,754 US201929713754F USD915309S US D915309 S1 USD915309 S1 US D915309S1 US 201929713754 F US201929713754 F US 201929713754F US D915309 S USD915309 S US D915309S
- Authority
- US
- United States
- Prior art keywords
- light emitting
- emitting diode
- diode chip
- view
- design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Broken lines depictions of transparent cavity lens of the light emitting diode chip shown in the drawings indicate unclaimed portions of the design, and thus illustrative purpose only and form no part of the claimed design.
Claims (1)
- The ornamental design for a light emitting diode chip, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-12241F JP1655195S (en) | 2019-06-04 | 2019-06-04 | |
| JP2019-012241 | 2019-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD915309S1 true USD915309S1 (en) | 2021-04-06 |
Family
ID=69780761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/713,754 Active USD915309S1 (en) | 2019-06-04 | 2019-11-19 | Light emitting diode chip |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD915309S1 (en) |
| JP (1) | JP1655195S (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1057674S1 (en) * | 2023-02-08 | 2025-01-14 | Autosystems, A Division Of Magna Exteriors Inc. | Light emitting chip scale package |
| USD1060278S1 (en) * | 2022-03-09 | 2025-02-04 | Creeled, Inc. | Light-emitting diode package |
| US12355013B2 (en) | 2022-04-21 | 2025-07-08 | Creeled, Inc. | Emission height arrangements in light-emitting diode packages and related devices and methods |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050173721A1 (en) * | 2004-02-05 | 2005-08-11 | Citizen Electronics Co. Ltd. | Surface-mount type light emitting diode and method for manufacturing it |
| USD521948S1 (en) * | 2004-10-19 | 2006-05-30 | Rohm Co., Ltd. | Light emitting diode |
| US20100155752A1 (en) * | 2008-12-24 | 2010-06-24 | Lim Woo Sik | Semiconductor light emitting device |
| US20130049565A1 (en) * | 2011-08-26 | 2013-02-28 | Su Jung JUNG | Light emitting device package |
| US20130141920A1 (en) * | 2011-12-06 | 2013-06-06 | Cree, Inc. | Light emitter devices and methods with reduced dimensions and improved light output |
| US20150171274A1 (en) * | 2013-12-17 | 2015-06-18 | Industrial Technology Research Institute | Led structure |
| US20150340581A1 (en) * | 2012-11-30 | 2015-11-26 | Seoul Semiconductor Co., Ltd. | Light emitting diode and method of manufacturing the same |
| US20160079478A1 (en) * | 2014-09-15 | 2016-03-17 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device package |
| USD778849S1 (en) * | 2015-11-05 | 2017-02-14 | Dowa Electronics Materials Co., Ltd. | Light emitting diode chip |
| US20170069606A1 (en) * | 2014-12-18 | 2017-03-09 | Cree, Inc. | Light emitting diodes, components and related methods |
| US20170179352A1 (en) * | 2015-12-16 | 2017-06-22 | Samsung Electronics Co., Ltd. | Circuit board for mounting of semiconductor light emitting device and semiconductor light emitting device package using the same |
| US20180151790A1 (en) * | 2016-11-25 | 2018-05-31 | Lg Innotek Co., Ltd. | Semiconductor device package |
| USD857638S1 (en) | 2017-08-23 | 2019-08-27 | Dowa Electronics Materials Co., Ltd. | Light emitting diode chip |
| US20200013759A1 (en) * | 2017-08-28 | 2020-01-09 | Lumens Co., Ltd. | Light emitting element for pixel and led display module |
| US20200350468A1 (en) * | 2017-12-22 | 2020-11-05 | Lg Innotek Co., Ltd. | Semiconductor device package |
-
2019
- 2019-06-04 JP JPD2019-12241F patent/JP1655195S/ja active Active
- 2019-11-19 US US29/713,754 patent/USD915309S1/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050173721A1 (en) * | 2004-02-05 | 2005-08-11 | Citizen Electronics Co. Ltd. | Surface-mount type light emitting diode and method for manufacturing it |
| USD521948S1 (en) * | 2004-10-19 | 2006-05-30 | Rohm Co., Ltd. | Light emitting diode |
| US20100155752A1 (en) * | 2008-12-24 | 2010-06-24 | Lim Woo Sik | Semiconductor light emitting device |
| US20130049565A1 (en) * | 2011-08-26 | 2013-02-28 | Su Jung JUNG | Light emitting device package |
| US20130141920A1 (en) * | 2011-12-06 | 2013-06-06 | Cree, Inc. | Light emitter devices and methods with reduced dimensions and improved light output |
| US20150340581A1 (en) * | 2012-11-30 | 2015-11-26 | Seoul Semiconductor Co., Ltd. | Light emitting diode and method of manufacturing the same |
| US20150171274A1 (en) * | 2013-12-17 | 2015-06-18 | Industrial Technology Research Institute | Led structure |
| US20160079478A1 (en) * | 2014-09-15 | 2016-03-17 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device package |
| US20170069606A1 (en) * | 2014-12-18 | 2017-03-09 | Cree, Inc. | Light emitting diodes, components and related methods |
| USD778849S1 (en) * | 2015-11-05 | 2017-02-14 | Dowa Electronics Materials Co., Ltd. | Light emitting diode chip |
| US20170179352A1 (en) * | 2015-12-16 | 2017-06-22 | Samsung Electronics Co., Ltd. | Circuit board for mounting of semiconductor light emitting device and semiconductor light emitting device package using the same |
| US20180151790A1 (en) * | 2016-11-25 | 2018-05-31 | Lg Innotek Co., Ltd. | Semiconductor device package |
| USD857638S1 (en) | 2017-08-23 | 2019-08-27 | Dowa Electronics Materials Co., Ltd. | Light emitting diode chip |
| US20200013759A1 (en) * | 2017-08-28 | 2020-01-09 | Lumens Co., Ltd. | Light emitting element for pixel and led display module |
| US20200350468A1 (en) * | 2017-12-22 | 2020-11-05 | Lg Innotek Co., Ltd. | Semiconductor device package |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1060278S1 (en) * | 2022-03-09 | 2025-02-04 | Creeled, Inc. | Light-emitting diode package |
| US12355013B2 (en) | 2022-04-21 | 2025-07-08 | Creeled, Inc. | Emission height arrangements in light-emitting diode packages and related devices and methods |
| USD1057674S1 (en) * | 2023-02-08 | 2025-01-14 | Autosystems, A Division Of Magna Exteriors Inc. | Light emitting chip scale package |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1655195S (en) | 2020-03-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |