USD902448S1 - Light emitting diode package - Google Patents

Light emitting diode package Download PDF

Info

Publication number
USD902448S1
USD902448S1 US29/661,900 US201829661900F USD902448S US D902448 S1 USD902448 S1 US D902448S1 US 201829661900 F US201829661900 F US 201829661900F US D902448 S USD902448 S US D902448S
Authority
US
United States
Prior art keywords
light emitting
emitting diode
diode package
view
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/661,900
Inventor
Roshan Murthy
Peter Scott Andrews
Kenneth M. Davis
Jesse Reiherzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Creeled Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/661,900 priority Critical patent/USD902448S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DAVIS, KENNETH M., REIHERZER, JESSE, MURTHY, ROSHAN, ANDREWS, PETER SCOTT
Application granted granted Critical
Publication of USD902448S1 publication Critical patent/USD902448S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of a light emitting diode chip showing our design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is an end view thereof;
FIG. 5 is an opposing end view thereof:
FIG. 6 is a side view thereof;
FIG. 7 is an opposing side view thereof;
FIG. 8 is a top perspective view of a light emitting diode chip showing our design;
FIG. 9 is a top view thereof;
FIG. 10 is a bottom view thereof;
FIG. 11 is an end view thereof;
FIG. 12 is an opposing end view thereof:
FIG. 13 is a side view thereof; and,
FIG. 14 is an opposing side view thereof.
The broken lines shown in the drawings depict portions of the light emitting diode chip that form no part of the claimed design.
The break lines in some of the figures indicate that the portions shown within the break lines form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a light emitting diode package, as shown and described.
US29/661,900 2018-08-31 2018-08-31 Light emitting diode package Active USD902448S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/661,900 USD902448S1 (en) 2018-08-31 2018-08-31 Light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/661,900 USD902448S1 (en) 2018-08-31 2018-08-31 Light emitting diode package

Publications (1)

Publication Number Publication Date
USD902448S1 true USD902448S1 (en) 2020-11-17

Family

ID=73158541

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/661,900 Active USD902448S1 (en) 2018-08-31 2018-08-31 Light emitting diode package

Country Status (1)

Country Link
US (1) USD902448S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD918436S1 (en) * 2019-04-17 2021-05-04 Xiamen Eco Lighting Co., Ltd. Wall washer light
USD918435S1 (en) * 2019-04-17 2021-05-04 Xiamen Eco Lighting Co., Ltd. Wall washer light
USD936269S1 (en) * 2020-08-26 2021-11-16 Olympia Lighting, Inc. Illuminating ultraviolet troffer
USD936268S1 (en) * 2020-06-18 2021-11-16 Olympia Lighting, Inc. Light and ultraviolet troffer
USD1012342S1 (en) * 2023-09-30 2024-01-23 Hexiang Hu Step light

Citations (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177500A (en) 1991-09-11 1993-01-05 Eastman Kodak Company LED array printhead with thermally coupled arrays
US6034422A (en) 1995-09-29 2000-03-07 Dai Nippon Printing Co., Ltd. Lead frame, method for partial noble plating of said lead frame and semiconductor device having said lead frame
US6274399B1 (en) 1998-06-05 2001-08-14 Lumileds Lighting, U.S. Llc Method of strain engineering and impurity control in III-V nitride semiconductor films and optoelectronic devices
US6646330B2 (en) 2000-09-21 2003-11-11 Matsushita Electric Industrial Co., Ltd. Lead frame for semiconductor device, process for producing the same and semiconductor device using the same
US6649440B1 (en) 1999-06-08 2003-11-18 Lumileds Lighting U.S., Llc Aluminum indium gallium nitride-based LED having thick epitaxial layer for improved light extraction
US20040048219A1 (en) 2002-09-11 2004-03-11 Chang-Ju Yun Baking apparatus for manufacturing a semiconductor device
US20050127385A1 (en) 1996-06-26 2005-06-16 Osram Opto Semiconductors Gmbh & Co., Ohg, A Germany Corporation Light-radiating semiconductor component with a luminescence conversion element
EP1710846A1 (en) 2005-04-08 2006-10-11 Sharp Kabushiki Kaisha Light-emitting diode
US7344902B2 (en) 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
US7361938B2 (en) 2004-06-03 2008-04-22 Philips Lumileds Lighting Company Llc Luminescent ceramic for a light emitting device
USD572387S1 (en) * 2006-06-20 2008-07-01 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD573731S1 (en) * 2006-06-20 2008-07-22 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
US20090001490A1 (en) 2004-07-26 2009-01-01 Georg Bogner Optoelectronic Component that Emits Electromagnetic Radiation and Illumination Module
US20090051022A1 (en) 2007-08-24 2009-02-26 Denso Corporation Lead frame structure
US20090166665A1 (en) 2007-12-31 2009-07-02 Lumination Llc Encapsulated optoelectronic device
USD597502S1 (en) * 2007-06-14 2009-08-04 Panasonic Corporation Light source of light emitting diode
US20090316409A1 (en) 2008-06-24 2009-12-24 Yu-Sik Kim Sub-mount, light emitting device including sub-mount and methods of manufacturing such sub-mount and/or light emitting device
USD611628S1 (en) * 2006-06-20 2010-03-09 Panasonic Corporation Lighting apparatus
US7754507B2 (en) 2005-06-09 2010-07-13 Philips Lumileds Lighting Company, Llc Method of removing the growth substrate of a semiconductor light emitting device
US20100244060A1 (en) 2004-12-14 2010-09-30 Seoul Opto Device Co., Ltd. Light emitting device having a plurality of light emitting cells and package mounting the same
US7847303B2 (en) 2008-07-29 2010-12-07 Seoul Semiconductor Co., Ltd. Warm white light emitting apparatus and back light module comprising the same
US20100320928A1 (en) 2008-02-13 2010-12-23 Canon Components, Inc. White light emitting apparatus and line illuminator using the same in image reading apparatus
WO2011007275A1 (en) 2009-07-16 2011-01-20 Philips Lumileds Lighting Company, Llc Reflective substrate for leds
US20110031516A1 (en) 2009-08-07 2011-02-10 Koninklijke Philips Electronics N.V. Led with silicone layer and laminated remote phosphor layer
US20110049545A1 (en) 2009-09-02 2011-03-03 Koninklijke Philips Electronics N.V. Led package with phosphor plate and reflective substrate
US20110180822A1 (en) 2002-06-28 2011-07-28 Osram Opto Semiconductors Gmbh Optoelectronic Component
US20110254022A1 (en) 2010-04-16 2011-10-20 Haruaki Sasano Light emitting device
US8075165B2 (en) 2008-10-14 2011-12-13 Ledengin, Inc. Total internal reflection lens and mechanical retention and locating device
US20110309388A1 (en) 2010-06-16 2011-12-22 Ito Kosaburo Semiconductor light-emitting device and manufacturing method
US20120061692A1 (en) 2010-09-10 2012-03-15 Advanced Optoelectronic Technology, Inc. Light emitting diode package having interconnection structures
US20120086023A1 (en) 2010-10-08 2012-04-12 Guardian Industries Corp. Insulating glass (IG) or vacuum insulating glass (VIG) unit including light source, and/or methods of making the same
US20120107622A1 (en) 2010-10-28 2012-05-03 Nicholas Francis Borrelli Phosphor containing glass frit materials for led lighting applications
US20120104452A1 (en) 2010-10-29 2012-05-03 Nichia Corporation Light emitting apparatus and production method thereof
US8232564B2 (en) 2007-01-22 2012-07-31 Cree, Inc. Wafer level phosphor coating technique for warm light emitting diodes
US20120305949A1 (en) 2011-01-31 2012-12-06 Matthew Donofrio Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies
US20130033169A1 (en) 2011-08-05 2013-02-07 Ito Kosaburo Light emitting device and method for manufacturing the same
US8384097B2 (en) 2009-04-08 2013-02-26 Ledengin, Inc. Package for multiple light emitting diodes
US20130057593A1 (en) 2011-09-05 2013-03-07 Canon Kabushiki Kaisha Lighting apparatus
US20130092960A1 (en) 2007-10-31 2013-04-18 Ruud Lighting, Inc. Multi-Die LED Package
US20130221509A1 (en) 2010-11-02 2013-08-29 Dai Nippon Printing Co., Ltd. Lead frame for mounting led elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
US20130256710A1 (en) 2007-10-31 2013-10-03 Cree, Inc. Multi-chip light emitter packages and related methods
WO2013154818A1 (en) 2012-04-09 2013-10-17 Cree, Inc. Wafer level packaging of multiple light emitting diodes (leds) on a single carrier die
US8598793B2 (en) 2011-05-12 2013-12-03 Ledengin, Inc. Tuning of emitter with multiple LEDs to a single color bin
WO2014024108A1 (en) 2012-08-07 2014-02-13 Koninklijke Philips N.V. Led package and manufacturing method
USD703841S1 (en) * 2012-04-11 2014-04-29 Osram Gmbh LED lighting module
US20140217435A1 (en) 2011-01-21 2014-08-07 Cree, Inc. Light Emitting Diodes with Low Junction Temperature and Solid State Backlight Components Including Light Emitting Diodes with Low Junction Temperature
EP2768037A1 (en) 2011-10-11 2014-08-20 Panasonic Corporation Light-emission device, and illumination device using same
EP2819191A1 (en) 2012-02-20 2014-12-31 Sharp Kabushiki Kaisha Light emission device and illumination device
US20150028372A1 (en) 2013-07-26 2015-01-29 Shinko Electric Industries Co., Ltd. Light emitting device package and package for mounting light emitting device
US9024340B2 (en) 2007-11-29 2015-05-05 Nichia Corporation Light emitting apparatus and method for producing the same
US20150155447A1 (en) 2013-11-29 2015-06-04 Nichia Corporation Method of manufacturing light emitting device, and light emitting device
US20150204525A1 (en) 2013-03-11 2015-07-23 Yi Shen High-Definition LED Display Screen and Surface-Mounted LED Composite Lamp with Ultra-Small Point Distance Thereof
US20150263247A1 (en) 2014-03-17 2015-09-17 Toyoda Gosei Co., Ltd. Light Emitting Device
US20150262987A1 (en) 2014-03-12 2015-09-17 Toyoda Gosei Co., Ltd. Light Emitting Device And Method For Manufacturing The Same
US9192013B1 (en) 2014-06-06 2015-11-17 Cree, Inc. Lighting devices with variable gamut
US20150364660A1 (en) 2014-06-12 2015-12-17 Genesis Photonics Inc. Light emitting component
US20160074833A1 (en) 2014-09-12 2016-03-17 Paul Gregory O'BRIEN Nanostructured solar selective catalytic supports
US20160093777A1 (en) 2014-09-30 2016-03-31 Nichia Corporation Light emitting device and method of manufacturing the same
US20160126434A1 (en) 2014-10-31 2016-05-05 Nichia Corporation Light emitting device and adaptive driving beam headlamp system
USD756547S1 (en) * 2014-06-05 2016-05-17 Osram Gmbh Lighting device
US9461222B1 (en) 2015-06-30 2016-10-04 Epistar Corporation Light-emitting element and the light-emitting module thereof
US20160293811A1 (en) 2015-03-31 2016-10-06 Cree, Inc. Light emitting diodes and methods with encapsulation
US20160351846A1 (en) 2015-05-28 2016-12-01 Lg Display Co., Ltd. Organic light emitting display apparatus and method of manufacturing the same
US20170040183A1 (en) 2015-08-07 2017-02-09 Shinko Electric Industries Co., Ltd. Lead frame and semiconductor device
US20170154880A1 (en) 2015-11-30 2017-06-01 Nichia Corporation Method of manufacturing light emitting device
US9713211B2 (en) 2009-09-24 2017-07-18 Cree, Inc. Solid state lighting apparatus with controllable bypass circuits and methods of operation thereof
USD797321S1 (en) * 2016-02-19 2017-09-12 Epistar Corporation Light emitting unit
US20170301832A1 (en) 2014-01-07 2017-10-19 Koninklijke Philips N.V. Glueless light emitting device with phosphor converter
US9816691B2 (en) 2011-05-12 2017-11-14 Ledengin, Inc. Method and system for forming LED light emitters
US20170373225A1 (en) 2015-07-23 2017-12-28 Nichia Corporation Method of manufacturing light emitting device
US20180033924A1 (en) 2016-07-26 2018-02-01 Cree, Inc. Light emitting diodes, components and related methods
US9893243B2 (en) 2010-11-08 2018-02-13 Bridgelux, Inc. LED-based light source utilizing asymmetric conductors
US20180102449A1 (en) 2016-10-12 2018-04-12 Kateeva, Inc. Display Devices Utilizing Quantum Dots and Inkjet Printing Techniques Thereof
US20180103513A1 (en) 2016-10-12 2018-04-12 Everlight Electronics Co., Ltd. Light emitting device and led package structure
US20180102348A1 (en) 2016-10-06 2018-04-12 Osram Opto Semiconductors Gmbh Optoelectronic component and method of producing an optoelectronic component
US20180130776A1 (en) 2016-11-09 2018-05-10 Nichia Corporation Light emitting device
US20180190880A1 (en) 2016-12-30 2018-07-05 Lumileds Llc Phosphor deposition system for leds
US20180190885A1 (en) 2016-12-30 2018-07-05 Lite-On Technology Corporation Led package structure and chip-scale light emitting unit
US20180190881A1 (en) 2016-12-30 2018-07-05 Lite-On Opto Technology (Changzhou) Co., Ltd. Phosphor plate assembly, led package structure, and method for manufacturing led package structure
US10057983B1 (en) 2014-06-13 2018-08-21 Verily Life Sciences Llc Fabrication methods for bio-compatible devices using an etch stop and/or a coating
US10211187B2 (en) 2014-07-18 2019-02-19 Koninklijke Philips N.V. Light emitting diodes and reflector
US20190148346A1 (en) 2016-05-06 2019-05-16 Epcos Ag Multi-led system
US20190165231A1 (en) 2017-11-08 2019-05-30 SemiLEDs Optoelectronics Co., Ltd. Method For Making Light Emitting Device LED Arrays
USD851790S1 (en) * 2017-09-08 2019-06-18 Cree, Inc. Light emitting device
US20190312187A1 (en) 2018-04-04 2019-10-10 Stanley Electric Co., Ltd. Semiconductor light-emitting apparatus having light reflection adjusting member of gray resin and its manufacturing method
US20190363232A1 (en) 2018-05-25 2019-11-28 Cree, Inc. Light-emitting diode packages with individually controllable light-emitting diode chips
US20200075813A1 (en) 2018-08-31 2020-03-05 Cree, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
US10651353B2 (en) 2015-07-22 2020-05-12 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device including a reflective element

Patent Citations (91)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177500A (en) 1991-09-11 1993-01-05 Eastman Kodak Company LED array printhead with thermally coupled arrays
US6034422A (en) 1995-09-29 2000-03-07 Dai Nippon Printing Co., Ltd. Lead frame, method for partial noble plating of said lead frame and semiconductor device having said lead frame
US20050127385A1 (en) 1996-06-26 2005-06-16 Osram Opto Semiconductors Gmbh & Co., Ohg, A Germany Corporation Light-radiating semiconductor component with a luminescence conversion element
US6274399B1 (en) 1998-06-05 2001-08-14 Lumileds Lighting, U.S. Llc Method of strain engineering and impurity control in III-V nitride semiconductor films and optoelectronic devices
US6649440B1 (en) 1999-06-08 2003-11-18 Lumileds Lighting U.S., Llc Aluminum indium gallium nitride-based LED having thick epitaxial layer for improved light extraction
US6646330B2 (en) 2000-09-21 2003-11-11 Matsushita Electric Industrial Co., Ltd. Lead frame for semiconductor device, process for producing the same and semiconductor device using the same
US20110180822A1 (en) 2002-06-28 2011-07-28 Osram Opto Semiconductors Gmbh Optoelectronic Component
US20040048219A1 (en) 2002-09-11 2004-03-11 Chang-Ju Yun Baking apparatus for manufacturing a semiconductor device
US7361938B2 (en) 2004-06-03 2008-04-22 Philips Lumileds Lighting Company Llc Luminescent ceramic for a light emitting device
US20090001490A1 (en) 2004-07-26 2009-01-01 Georg Bogner Optoelectronic Component that Emits Electromagnetic Radiation and Illumination Module
US7344902B2 (en) 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
US20100244060A1 (en) 2004-12-14 2010-09-30 Seoul Opto Device Co., Ltd. Light emitting device having a plurality of light emitting cells and package mounting the same
EP1710846A1 (en) 2005-04-08 2006-10-11 Sharp Kabushiki Kaisha Light-emitting diode
US7754507B2 (en) 2005-06-09 2010-07-13 Philips Lumileds Lighting Company, Llc Method of removing the growth substrate of a semiconductor light emitting device
USD612958S1 (en) * 2006-06-20 2010-03-30 Panasonic Corporation Lighting apparatus
USD573731S1 (en) * 2006-06-20 2008-07-22 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD572387S1 (en) * 2006-06-20 2008-07-01 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD611628S1 (en) * 2006-06-20 2010-03-09 Panasonic Corporation Lighting apparatus
US8232564B2 (en) 2007-01-22 2012-07-31 Cree, Inc. Wafer level phosphor coating technique for warm light emitting diodes
USD597502S1 (en) * 2007-06-14 2009-08-04 Panasonic Corporation Light source of light emitting diode
US20090051022A1 (en) 2007-08-24 2009-02-26 Denso Corporation Lead frame structure
US20130092960A1 (en) 2007-10-31 2013-04-18 Ruud Lighting, Inc. Multi-Die LED Package
US20130256710A1 (en) 2007-10-31 2013-10-03 Cree, Inc. Multi-chip light emitter packages and related methods
US9024340B2 (en) 2007-11-29 2015-05-05 Nichia Corporation Light emitting apparatus and method for producing the same
US20090166665A1 (en) 2007-12-31 2009-07-02 Lumination Llc Encapsulated optoelectronic device
US20100320928A1 (en) 2008-02-13 2010-12-23 Canon Components, Inc. White light emitting apparatus and line illuminator using the same in image reading apparatus
US20090316409A1 (en) 2008-06-24 2009-12-24 Yu-Sik Kim Sub-mount, light emitting device including sub-mount and methods of manufacturing such sub-mount and/or light emitting device
US7847303B2 (en) 2008-07-29 2010-12-07 Seoul Semiconductor Co., Ltd. Warm white light emitting apparatus and back light module comprising the same
US8075165B2 (en) 2008-10-14 2011-12-13 Ledengin, Inc. Total internal reflection lens and mechanical retention and locating device
US8384097B2 (en) 2009-04-08 2013-02-26 Ledengin, Inc. Package for multiple light emitting diodes
WO2011007275A1 (en) 2009-07-16 2011-01-20 Philips Lumileds Lighting Company, Llc Reflective substrate for leds
US20110031516A1 (en) 2009-08-07 2011-02-10 Koninklijke Philips Electronics N.V. Led with silicone layer and laminated remote phosphor layer
US20110049545A1 (en) 2009-09-02 2011-03-03 Koninklijke Philips Electronics N.V. Led package with phosphor plate and reflective substrate
US9713211B2 (en) 2009-09-24 2017-07-18 Cree, Inc. Solid state lighting apparatus with controllable bypass circuits and methods of operation thereof
US20110254022A1 (en) 2010-04-16 2011-10-20 Haruaki Sasano Light emitting device
US20110309388A1 (en) 2010-06-16 2011-12-22 Ito Kosaburo Semiconductor light-emitting device and manufacturing method
US20120061692A1 (en) 2010-09-10 2012-03-15 Advanced Optoelectronic Technology, Inc. Light emitting diode package having interconnection structures
US20120086023A1 (en) 2010-10-08 2012-04-12 Guardian Industries Corp. Insulating glass (IG) or vacuum insulating glass (VIG) unit including light source, and/or methods of making the same
US20120107622A1 (en) 2010-10-28 2012-05-03 Nicholas Francis Borrelli Phosphor containing glass frit materials for led lighting applications
US20120104452A1 (en) 2010-10-29 2012-05-03 Nichia Corporation Light emitting apparatus and production method thereof
US20140239320A1 (en) 2010-10-29 2014-08-28 Nichia Corporation Light emitting apparatus and production method thereof
US20130221509A1 (en) 2010-11-02 2013-08-29 Dai Nippon Printing Co., Ltd. Lead frame for mounting led elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
US9893243B2 (en) 2010-11-08 2018-02-13 Bridgelux, Inc. LED-based light source utilizing asymmetric conductors
US20140217435A1 (en) 2011-01-21 2014-08-07 Cree, Inc. Light Emitting Diodes with Low Junction Temperature and Solid State Backlight Components Including Light Emitting Diodes with Low Junction Temperature
US20120305949A1 (en) 2011-01-31 2012-12-06 Matthew Donofrio Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies
US8598793B2 (en) 2011-05-12 2013-12-03 Ledengin, Inc. Tuning of emitter with multiple LEDs to a single color bin
US9816691B2 (en) 2011-05-12 2017-11-14 Ledengin, Inc. Method and system for forming LED light emitters
US20130033169A1 (en) 2011-08-05 2013-02-07 Ito Kosaburo Light emitting device and method for manufacturing the same
US20130057593A1 (en) 2011-09-05 2013-03-07 Canon Kabushiki Kaisha Lighting apparatus
EP2768037A1 (en) 2011-10-11 2014-08-20 Panasonic Corporation Light-emission device, and illumination device using same
EP2819191A1 (en) 2012-02-20 2014-12-31 Sharp Kabushiki Kaisha Light emission device and illumination device
WO2013154818A1 (en) 2012-04-09 2013-10-17 Cree, Inc. Wafer level packaging of multiple light emitting diodes (leds) on a single carrier die
USD703841S1 (en) * 2012-04-11 2014-04-29 Osram Gmbh LED lighting module
WO2014024108A1 (en) 2012-08-07 2014-02-13 Koninklijke Philips N.V. Led package and manufacturing method
US20150204525A1 (en) 2013-03-11 2015-07-23 Yi Shen High-Definition LED Display Screen and Surface-Mounted LED Composite Lamp with Ultra-Small Point Distance Thereof
US20150028372A1 (en) 2013-07-26 2015-01-29 Shinko Electric Industries Co., Ltd. Light emitting device package and package for mounting light emitting device
US20150155447A1 (en) 2013-11-29 2015-06-04 Nichia Corporation Method of manufacturing light emitting device, and light emitting device
US20170301832A1 (en) 2014-01-07 2017-10-19 Koninklijke Philips N.V. Glueless light emitting device with phosphor converter
US20150262987A1 (en) 2014-03-12 2015-09-17 Toyoda Gosei Co., Ltd. Light Emitting Device And Method For Manufacturing The Same
US20150263247A1 (en) 2014-03-17 2015-09-17 Toyoda Gosei Co., Ltd. Light Emitting Device
USD756547S1 (en) * 2014-06-05 2016-05-17 Osram Gmbh Lighting device
US9192013B1 (en) 2014-06-06 2015-11-17 Cree, Inc. Lighting devices with variable gamut
US20150364660A1 (en) 2014-06-12 2015-12-17 Genesis Photonics Inc. Light emitting component
US10057983B1 (en) 2014-06-13 2018-08-21 Verily Life Sciences Llc Fabrication methods for bio-compatible devices using an etch stop and/or a coating
US10211187B2 (en) 2014-07-18 2019-02-19 Koninklijke Philips N.V. Light emitting diodes and reflector
US20160074833A1 (en) 2014-09-12 2016-03-17 Paul Gregory O'BRIEN Nanostructured solar selective catalytic supports
US20160093777A1 (en) 2014-09-30 2016-03-31 Nichia Corporation Light emitting device and method of manufacturing the same
US20160126434A1 (en) 2014-10-31 2016-05-05 Nichia Corporation Light emitting device and adaptive driving beam headlamp system
US20160293811A1 (en) 2015-03-31 2016-10-06 Cree, Inc. Light emitting diodes and methods with encapsulation
US20160351846A1 (en) 2015-05-28 2016-12-01 Lg Display Co., Ltd. Organic light emitting display apparatus and method of manufacturing the same
US9461222B1 (en) 2015-06-30 2016-10-04 Epistar Corporation Light-emitting element and the light-emitting module thereof
US10651353B2 (en) 2015-07-22 2020-05-12 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device including a reflective element
US20170373225A1 (en) 2015-07-23 2017-12-28 Nichia Corporation Method of manufacturing light emitting device
US20170040183A1 (en) 2015-08-07 2017-02-09 Shinko Electric Industries Co., Ltd. Lead frame and semiconductor device
US20170154880A1 (en) 2015-11-30 2017-06-01 Nichia Corporation Method of manufacturing light emitting device
USD797321S1 (en) * 2016-02-19 2017-09-12 Epistar Corporation Light emitting unit
US20190148346A1 (en) 2016-05-06 2019-05-16 Epcos Ag Multi-led system
US20180033924A1 (en) 2016-07-26 2018-02-01 Cree, Inc. Light emitting diodes, components and related methods
US20180102348A1 (en) 2016-10-06 2018-04-12 Osram Opto Semiconductors Gmbh Optoelectronic component and method of producing an optoelectronic component
US20180102449A1 (en) 2016-10-12 2018-04-12 Kateeva, Inc. Display Devices Utilizing Quantum Dots and Inkjet Printing Techniques Thereof
US20180103513A1 (en) 2016-10-12 2018-04-12 Everlight Electronics Co., Ltd. Light emitting device and led package structure
US20180130776A1 (en) 2016-11-09 2018-05-10 Nichia Corporation Light emitting device
US20180190881A1 (en) 2016-12-30 2018-07-05 Lite-On Opto Technology (Changzhou) Co., Ltd. Phosphor plate assembly, led package structure, and method for manufacturing led package structure
US20180190885A1 (en) 2016-12-30 2018-07-05 Lite-On Technology Corporation Led package structure and chip-scale light emitting unit
US20180190880A1 (en) 2016-12-30 2018-07-05 Lumileds Llc Phosphor deposition system for leds
USD851790S1 (en) * 2017-09-08 2019-06-18 Cree, Inc. Light emitting device
US20190165231A1 (en) 2017-11-08 2019-05-30 SemiLEDs Optoelectronics Co., Ltd. Method For Making Light Emitting Device LED Arrays
US20190312187A1 (en) 2018-04-04 2019-10-10 Stanley Electric Co., Ltd. Semiconductor light-emitting apparatus having light reflection adjusting member of gray resin and its manufacturing method
US20190363232A1 (en) 2018-05-25 2019-11-28 Cree, Inc. Light-emitting diode packages with individually controllable light-emitting diode chips
US20190363223A1 (en) 2018-05-25 2019-11-28 Cree, Inc. Light-emitting diode packages
US20200075813A1 (en) 2018-08-31 2020-03-05 Cree, Inc. Light-emitting diodes, light-emitting diode arrays and related devices

Non-Patent Citations (30)

* Cited by examiner, † Cited by third party
Title
Advisory Action and Applicant-Initiated Interview Summary for U.S. Appl. No. 16/118,747, dated Aug. 24, 2020, 5 pages.
Advisory Action for U.S. Appl. No. 16/118,747, dated Aug. 18, 2020, 3 pages.
Advisory Action, Applicant-Initiated Interview Summary, and AFCP 2.0 Decision for U.S. Appl. No. 16/118,762, dated Apr. 24, 2020, 9 pages.
Author Unknown, "Black Silicon," Wikipedia [online], <https://web.archive.org/web/20150401161824/http://en.wikipedia.org/wiki/Black_Silicon> Apr. 1, 2015, 1 page.
Dupont, "DuPont™ Ti-Pure® titanium dioxide: Titanium Dioxide for Coatings," Product Brochure H-65969-2, Jun. 2007, 28 pages.
Examination Report for European Patent Application No. 17748998.6, dated Jan. 3, 2020, 7 pages.
Examination Report for European Patent Application No. 17748998.6, dated Jun. 25, 2020, 7 pages.
Final Office Action for U.S. Appl. No. 16/118,747, dated Jun. 9, 2020, 43 pages.
Final Office Action for U.S. Appl. No. 16/118,762, dated Feb. 14, 2020, 44 pages.
Final Office Action for U.S. Appl. No. 16/118,779, dated Jul. 16, 2020, 35 pages.
International Search Report and Written Opinion for International Patent Application No. PCT/US2019/028704, dated Sep. 9, 2019, 18 pages.
International Search Report and Written Opinion for International Patent Application No. PCT/US2019/028708, dated Sep. 9, 2019, 20 pages.
International Search Report and Written Opinion for International Patent Application No. PCT/US2020/038960, dated Aug. 11, 2020, 17 pages.
Invitation to Pay Additional Fees and Partial International Search for International Patent Application No. PCT/US2019/028704, dated Jul. 17, 2019, 14 pages.
Invitation to Pay Additional Fees and Partial International Search for International Patent Application No. PCT/US2019/028708, dated Jul. 17, 2019, 17 pages.
Nichia Corporation, "NC2W321AT: Specifications for White LED," Nichia STS-DA1-4323A <Cat.No. 160711>, [online], [retrieved on May 21, 2018] Retrieved from Nichia Corporation using Internet <URL: http://www.nichia.co.jp/en/product/led.html>, 16 pages.
Nichia Corporation, "NC3W321AT: Specifications for White LED," Nichia STS-DA1-4281A <Cat.No. 160603>, [online], [retrieved on May 21, 2018] Retrieved from Nichia Corporation using Internet <URL: http://www.nichia.co.jp/en/product/led.html>, 16 pages.
Nichia Corporation, "NC4W321AT: Specifications for White LED," Nichia STS-DA1-4325A <Cat.No. 160711>, [online], [retrieved on May 21, 2018] Retrieved from Nichia Corporation using Internet <URL: http://www.nichia.co.jp/en/product/led.html>, 16 pages.
Non-Final Office Action for U.S. Appl. No. 16,118,779, dated Jan. 10, 2020, 27 pages.
Non-Final Office Action for U.S. Appl. No. 16/118,747, dated Jan. 29, 2020, 28 pages.
Non-Final Office Action for U.S. Appl. No. 16/118,747, dated Sep. 8, 2020, 32 pages.
Non-Final Office Action for U.S. Appl. No. 16/118,762, dated May 26, 2020, 25 pages.
Non-Final Office Action for U.S. Appl. No. 16/118,762, dated Oct. 1, 2019, 36 pages.
Non-Final Office Action for U.S. Appl. No. 16/380,400, dated Jul. 27, 2020, 12 pages.
Non-Final Office Action for U.S. Appl. No. 16/380,400, dated Sep. 9, 2019, 13 pages.
Non-Final Office Action for U.S. Appl. No. 16/545,357, dated Jun. 24, 2020, 33 pages.
Notice of Allowance for U.S. Appl. No. 16/380,400, dated Mar. 17, 2020, 8 pages.
Notice of Allowance for U.S. Appl. No. 16/380,400, dated Nov. 27, 2019, 8 pages.
Notice of Allowance for U.S. Appl. No. 16/797,173, dated Aug. 24, 2020, 9 pages.
Notice of Allowance for U.S. Appl. No. 16/797,173, dated Jun. 22, 2020, 10 pages.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD918436S1 (en) * 2019-04-17 2021-05-04 Xiamen Eco Lighting Co., Ltd. Wall washer light
USD918435S1 (en) * 2019-04-17 2021-05-04 Xiamen Eco Lighting Co., Ltd. Wall washer light
USD936268S1 (en) * 2020-06-18 2021-11-16 Olympia Lighting, Inc. Light and ultraviolet troffer
USD936269S1 (en) * 2020-08-26 2021-11-16 Olympia Lighting, Inc. Illuminating ultraviolet troffer
USD1012342S1 (en) * 2023-09-30 2024-01-23 Hexiang Hu Step light

Similar Documents

Publication Publication Date Title
USD902448S1 (en) Light emitting diode package
USD917290S1 (en) Bottle
USD855247S1 (en) LED high mast light
USD659657S1 (en) Light emitting diode (LED) package
USD881319S1 (en) Sight
USD912300S1 (en) LED light
USD959040S1 (en) Light fixture
USD944646S1 (en) Bottle
USD901060S1 (en) Housing for light emitting diodes
USD891274S1 (en) Packaging tray
USD932897S1 (en) Bottle
USD1018957S1 (en) Light fixture
USD883805S1 (en) Packaging tray
USD908632S1 (en) Power module
USD910212S1 (en) Light bulb
USD910213S1 (en) Light bulb
USD910887S1 (en) Light bulb
USD1006264S1 (en) Light emitting diode package
USD910211S1 (en) Light bulb
USD910888S1 (en) Light bulb
USD926714S1 (en) Light emitting diode package
USD797066S1 (en) Integrated light emitting diode (LED) light engine
USD900355S1 (en) Optical module with at least one light emitting diode (LED)
USD938090S1 (en) Luminaire
USD1036711S1 (en) Light-emitting diode package

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY