USD836573S1 - Ring for a plasma processing apparatus - Google Patents
Ring for a plasma processing apparatus Download PDFInfo
- Publication number
- USD836573S1 USD836573S1 US29/610,998 US201729610998F USD836573S US D836573 S1 USD836573 S1 US D836573S1 US 201729610998 F US201729610998 F US 201729610998F US D836573 S USD836573 S US D836573S
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- US
- United States
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- processing apparatus
- plasma processing
- ring
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Description
This application contains subject matter related to the following co-pending U.S. design patent applications:
Application Ser. No. 29/610,995, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application Ser. No. 29/610,996, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application Ser. No. 29/610,999, filed herewith and entitled “Cover Ring for a Plasma Processing Apparatus”; and
Application Ser. No. 29/611,001, filed herewith and entitled “Discharge Chamber for a Plasma Processing Apparatus”.
The broken lines showing a rectangular box labeled 10 in the drawings in FIG. 9 form no part of the claimed design.
Claims (1)
- The ornamental design for a ring for a plasma processing apparatus, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-001754 | 2017-01-10 | ||
JPD2017-1754F JP1584784S (en) | 2017-01-31 | 2017-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD836573S1 true USD836573S1 (en) | 2018-12-25 |
Family
ID=59677648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/610,998 Active USD836573S1 (en) | 2017-01-31 | 2017-07-18 | Ring for a plasma processing apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | USD836573S1 (en) |
JP (1) | JP1584784S (en) |
TW (1) | TWD186396S (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
USD891636S1 (en) * | 2018-10-25 | 2020-07-28 | Hitachi High-Tech Corporation | Ring for a plasma processing apparatus |
USD896767S1 (en) * | 2019-12-02 | 2020-09-22 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD920935S1 (en) * | 2018-09-20 | 2021-06-01 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD971167S1 (en) * | 2019-08-28 | 2022-11-29 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
US11859915B1 (en) | 2019-01-31 | 2024-01-02 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
Citations (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5310453A (en) * | 1992-02-13 | 1994-05-10 | Tokyo Electron Yamanashi Limited | Plasma process method using an electrostatic chuck |
USD404372S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
US6068548A (en) * | 1997-12-17 | 2000-05-30 | Intel Corporation | Mechanically stabilized retaining ring for chemical mechanical polishing |
US6602116B1 (en) * | 1997-12-30 | 2003-08-05 | Applied Materials Inc. | Substrate retaining ring |
US20040025788A1 (en) * | 2000-11-10 | 2004-02-12 | Masahiro Ogasawara | Plasma processing device and exhaust ring |
USD490450S1 (en) * | 2002-05-20 | 2004-05-25 | Tokyo Electron Limited | Exhaust ring for semiconductor equipment |
USD494551S1 (en) | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
USD494552S1 (en) * | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
USD496008S1 (en) * | 2002-12-12 | 2004-09-14 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
US20050277375A1 (en) * | 2004-06-10 | 2005-12-15 | Young Richard T | Retaining ring assembly for use in chemical mechanical polishing |
USD552565S1 (en) * | 2005-09-08 | 2007-10-09 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
USD557226S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD557425S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD559994S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
US20080308230A1 (en) * | 2007-03-30 | 2008-12-18 | Tokyo Electron Limited | Plasma processing apparatus |
USD606952S1 (en) * | 2009-01-16 | 2009-12-29 | Asm Genitech Korea Ltd. | Plasma inducing plate for semiconductor deposition apparatus |
USD694790S1 (en) * | 2011-09-20 | 2013-12-03 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
USD697038S1 (en) * | 2011-09-20 | 2014-01-07 | Tokyo Electron Limited | Baffle plate |
USD699199S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode plate for a plasma processing apparatus |
USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
US20160158910A1 (en) * | 2013-07-11 | 2016-06-09 | Will Be S & T Co., Ltd. | Retainer ring for chemical-mechanical polishing device |
JP1551512S (en) | 2015-06-12 | 2016-06-13 | ||
USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD794585S1 (en) * | 2015-10-06 | 2017-08-15 | Ebara Corporation | Retainer ring for substrate |
USD797691S1 (en) * | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
USD799437S1 (en) * | 2015-08-25 | 2017-10-10 | Ebara Corporation | Substrate retaining ring |
USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
-
2017
- 2017-01-31 JP JPD2017-1754F patent/JP1584784S/ja active Active
- 2017-03-17 TW TW106301394F patent/TWD186396S/en unknown
- 2017-07-18 US US29/610,998 patent/USD836573S1/en active Active
Patent Citations (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5310453A (en) * | 1992-02-13 | 1994-05-10 | Tokyo Electron Yamanashi Limited | Plasma process method using an electrostatic chuck |
USD404372S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
US6068548A (en) * | 1997-12-17 | 2000-05-30 | Intel Corporation | Mechanically stabilized retaining ring for chemical mechanical polishing |
US6602116B1 (en) * | 1997-12-30 | 2003-08-05 | Applied Materials Inc. | Substrate retaining ring |
US20040025788A1 (en) * | 2000-11-10 | 2004-02-12 | Masahiro Ogasawara | Plasma processing device and exhaust ring |
USD490450S1 (en) * | 2002-05-20 | 2004-05-25 | Tokyo Electron Limited | Exhaust ring for semiconductor equipment |
USD494551S1 (en) | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
USD494552S1 (en) * | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
USD496008S1 (en) * | 2002-12-12 | 2004-09-14 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
US20050277375A1 (en) * | 2004-06-10 | 2005-12-15 | Young Richard T | Retaining ring assembly for use in chemical mechanical polishing |
USD559994S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD557226S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD557425S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD552565S1 (en) * | 2005-09-08 | 2007-10-09 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
US20080308230A1 (en) * | 2007-03-30 | 2008-12-18 | Tokyo Electron Limited | Plasma processing apparatus |
USD606952S1 (en) * | 2009-01-16 | 2009-12-29 | Asm Genitech Korea Ltd. | Plasma inducing plate for semiconductor deposition apparatus |
USD694790S1 (en) * | 2011-09-20 | 2013-12-03 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
USD697038S1 (en) * | 2011-09-20 | 2014-01-07 | Tokyo Electron Limited | Baffle plate |
USD699199S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode plate for a plasma processing apparatus |
USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
USD793976S1 (en) * | 2013-05-15 | 2017-08-08 | Ebara Corporation | Substrate retaining ring |
USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
US20160158910A1 (en) * | 2013-07-11 | 2016-06-09 | Will Be S & T Co., Ltd. | Retainer ring for chemical-mechanical polishing device |
JP1551512S (en) | 2015-06-12 | 2016-06-13 | ||
USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD799437S1 (en) * | 2015-08-25 | 2017-10-10 | Ebara Corporation | Substrate retaining ring |
USD794585S1 (en) * | 2015-10-06 | 2017-08-15 | Ebara Corporation | Retainer ring for substrate |
USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD797691S1 (en) * | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
Non-Patent Citations (4)
Title |
---|
Ichino et al., Design U.S. Appl. No. 29/610,995, filed Jul. 18, 2017. |
Ichino et al., Design U.S. Appl. No. 29/610,996, filed Jul. 18, 2017. |
Ichino et al., Design U.S. Appl. No. 29/610,999, filed Jul. 18, 2017. |
Nunomura et al., Design U.S. Appl. No. 29/611,001, filed Jul. 18, 2017. |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
USD920935S1 (en) * | 2018-09-20 | 2021-06-01 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
USD891636S1 (en) * | 2018-10-25 | 2020-07-28 | Hitachi High-Tech Corporation | Ring for a plasma processing apparatus |
US11859915B1 (en) | 2019-01-31 | 2024-01-02 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD971167S1 (en) * | 2019-08-28 | 2022-11-29 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
USD896767S1 (en) * | 2019-12-02 | 2020-09-22 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD969760S1 (en) | 2019-12-02 | 2022-11-15 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD986190S1 (en) | 2020-03-19 | 2023-05-16 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
Also Published As
Publication number | Publication date |
---|---|
JP1584784S (en) | 2017-08-28 |
TWD186396S (en) | 2017-11-01 |
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