USD784937S1 - Dummy wafer - Google Patents

Dummy wafer Download PDF

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Publication number
USD784937S1
USD784937S1 US29/524,897 US201529524897F USD784937S US D784937 S1 USD784937 S1 US D784937S1 US 201529524897 F US201529524897 F US 201529524897F US D784937 S USD784937 S US D784937S
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dummy wafer
view
dummy
wafer
design
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English (en)
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Yutaka Motoyama
Kohei Fukushima
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUKUSHIMA, KOHEI, MOTOYAMA, YUTAKA
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US29/524,897 2014-11-13 2015-04-24 Dummy wafer Active USD784937S1 (en)

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Application Number Priority Date Filing Date Title
JP2014-025306 2014-11-13
JPD2014-25306F JP1534136S (en:Method) 2014-11-13 2014-11-13

Publications (1)

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USD784937S1 true USD784937S1 (en) 2017-04-25

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US29/524,897 Active USD784937S1 (en) 2014-11-13 2015-04-24 Dummy wafer

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US (1) USD784937S1 (en:Method)
JP (1) JP1534136S (en:Method)
TW (1) TWD171960S (en:Method)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD897974S1 (en) * 2018-03-29 2020-10-06 Hamamatsu Photonics K.K. Semiconductor wafer

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US4460634A (en) 1979-12-29 1984-07-17 Masaaki Hasegawa Adhesive sheet and method for manufacturing the same
USD308247S (en) 1987-03-10 1990-05-29 Bramec Corporation Air conditioner support
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US5514439A (en) * 1994-10-14 1996-05-07 Sibley; Thomas Wafer support fixtures for rapid thermal processing
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US5766702A (en) 1995-10-05 1998-06-16 Lin; Chii-Hsiung Laminated ornamental glass
US5773110A (en) 1994-02-28 1998-06-30 Creative Minds Foundation Window painting apparatus and method
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USD417235S (en) 1998-12-10 1999-11-30 Mark Malik Personal identification number card
USD425113S (en) 1998-06-03 2000-05-16 The Mead Corporation Watermark on a paper
US6150023A (en) * 1995-05-19 2000-11-21 Kabushiki Kaisha Kobe Seiko Sho Dummy wafer
US6340514B1 (en) 1999-08-13 2002-01-22 Milliken & Company Cushioned rubber floor mat article comprising at least one integrated rubber protrusion and at least two layers of rubber
US6550092B1 (en) 2000-04-26 2003-04-22 S. C. Johnson & Son, Inc. Cleaning sheet with particle retaining cavities
US6589631B1 (en) 2000-10-04 2003-07-08 Milliken & Company Flashless rubber floor mat and method
US6610390B1 (en) 1999-08-13 2003-08-26 First Quality Nonwovens, Inc. Nonwoven with non-symmetrical bonding configuration
USD483187S1 (en) 2002-08-09 2003-12-09 Chiu-Fu Cheng Fabric with decorative pattern
US20050170616A1 (en) * 2004-02-03 2005-08-04 Disco Corporation Wafer dividing method
USD508180S1 (en) 2003-08-21 2005-08-09 Better Life Technology, Llc Floor covering
US6988942B2 (en) * 2000-02-17 2006-01-24 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US20060079160A1 (en) * 2004-10-12 2006-04-13 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
US7030046B2 (en) 2000-11-01 2006-04-18 The Procter & Gamble Company Multi-layer substrate for a premoistened wipe capable of controlled fluid release
USD540272S1 (en) 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD544452S1 (en) 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD552565S1 (en) 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD562568S1 (en) 2004-08-17 2008-02-26 Johnston Nik L Two-dimensional sheet material
US7462094B2 (en) * 2006-09-26 2008-12-09 Disco Corporation Wafer grinding method
USD589473S1 (en) 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
USD589472S1 (en) * 2006-10-10 2009-03-31 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
US7572173B2 (en) * 2006-11-24 2009-08-11 National Taiwan University Of Science And Technology Polishing apparatus and pad replacing method thereof
USD598380S1 (en) 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
US20090247057A1 (en) * 2005-09-14 2009-10-01 Ebara Corporation Polishing platen and polishing apparatus
US7632170B2 (en) * 2007-06-25 2009-12-15 Novellus Systems, Inc. CMP apparatuses with polishing assemblies that provide for the passive removal of slurry
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD621804S1 (en) 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
USD633673S1 (en) 2010-02-10 2011-03-01 The Libman Company Cloth
USD633672S1 (en) 2010-02-10 2011-03-01 The Libman Company Pad
USD651992S1 (en) 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD651991S1 (en) 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD655256S1 (en) 2010-08-17 2012-03-06 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD670917S1 (en) 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD674759S1 (en) 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD676672S1 (en) 2011-08-25 2013-02-26 Lg Hausys, Ltd. Sheet for vehicle seats
USD677062S1 (en) 2011-08-25 2013-03-05 Lg Hausys, Ltd. Sheet for vehicle seats
USD684551S1 (en) * 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
USD686175S1 (en) 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD695241S1 (en) 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD699201S1 (en) 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD699908S1 (en) 2012-08-04 2014-02-18 Hangzhou Jeenor Cleaning Supplies Co., Ltd. Big dot pattern wiper
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD733960S1 (en) * 2014-02-18 2015-07-07 Southpac Trust International Inc. Light fixture lens with elevated strip features
USD739363S1 (en) 2011-06-17 2015-09-22 Soraa, Inc. Array of triangular semiconductor dies
USD740035S1 (en) 2013-04-29 2015-10-06 Vorwek & Co. Interholding Gmbh Floor covering with dot pattern
USD751999S1 (en) 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice
USD761745S1 (en) 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
USD768115S1 (en) 2015-02-05 2016-10-04 Armen E. Kazanchian Module

Patent Citations (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US198816A (en) 1878-01-01 Improvement in carpet-linings
US415734A (en) 1889-11-26 Fire-kindler
US1769409A (en) 1928-05-11 1930-07-01 Charles L Armstrong Vermin repellent
US4244761A (en) 1977-09-09 1981-01-13 Societe Europeenne Des Produits Refractaires Thermally insulating slabs made of refractory fibers for the insulation of furnaces and the like
US4460634A (en) 1979-12-29 1984-07-17 Masaaki Hasegawa Adhesive sheet and method for manufacturing the same
USD273582S (en) 1981-09-08 1984-04-24 Bolt William S Holding pallet for PC boards
USD273860S (en) 1981-09-08 1984-05-15 Bolt William S Holding pallet for PC boards
US4374906A (en) * 1981-09-29 1983-02-22 United Technologies Corporation Ribbed electrode substrates
US4450212A (en) * 1982-09-30 1984-05-22 Engelhard Corporation Edge seal for a porous gas distribution plate of a fuel cell
USD308247S (en) 1987-03-10 1990-05-29 Bramec Corporation Air conditioner support
USD320361S (en) * 1989-06-02 1991-10-01 Tokyo Electron Limited Wafer probe plate holder
US5804281A (en) 1991-06-28 1998-09-08 The Proctor & Gamble Company Cellulosic fibrous structures having at least three regions distinguished by intensive properties
US5458938A (en) 1993-08-03 1995-10-17 Minnesota Mining And Manufacturing Company Mounting laminate having recessed adhesive areas
US5773110A (en) 1994-02-28 1998-06-30 Creative Minds Foundation Window painting apparatus and method
US5514439A (en) * 1994-10-14 1996-05-07 Sibley; Thomas Wafer support fixtures for rapid thermal processing
US6150023A (en) * 1995-05-19 2000-11-21 Kabushiki Kaisha Kobe Seiko Sho Dummy wafer
US5766702A (en) 1995-10-05 1998-06-16 Lin; Chii-Hsiung Laminated ornamental glass
US5662758A (en) 1996-01-10 1997-09-02 The Procter & Gamble Company Composite material releasably sealable to a target surface when pressed thereagainst and method of making
US5853840A (en) * 1996-06-25 1998-12-29 Nisshinbo Industries, Inc. Dummy wafer
USD425113S (en) 1998-06-03 2000-05-16 The Mead Corporation Watermark on a paper
USD417235S (en) 1998-12-10 1999-11-30 Mark Malik Personal identification number card
US6610390B1 (en) 1999-08-13 2003-08-26 First Quality Nonwovens, Inc. Nonwoven with non-symmetrical bonding configuration
US6340514B1 (en) 1999-08-13 2002-01-22 Milliken & Company Cushioned rubber floor mat article comprising at least one integrated rubber protrusion and at least two layers of rubber
US6988942B2 (en) * 2000-02-17 2006-01-24 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6550092B1 (en) 2000-04-26 2003-04-22 S. C. Johnson & Son, Inc. Cleaning sheet with particle retaining cavities
US6589631B1 (en) 2000-10-04 2003-07-08 Milliken & Company Flashless rubber floor mat and method
US7030046B2 (en) 2000-11-01 2006-04-18 The Procter & Gamble Company Multi-layer substrate for a premoistened wipe capable of controlled fluid release
USD483187S1 (en) 2002-08-09 2003-12-09 Chiu-Fu Cheng Fabric with decorative pattern
USD508180S1 (en) 2003-08-21 2005-08-09 Better Life Technology, Llc Floor covering
US20050170616A1 (en) * 2004-02-03 2005-08-04 Disco Corporation Wafer dividing method
USD562568S1 (en) 2004-08-17 2008-02-26 Johnston Nik L Two-dimensional sheet material
US20060079160A1 (en) * 2004-10-12 2006-04-13 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
USD540272S1 (en) 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD552565S1 (en) 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD544452S1 (en) 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
US20090247057A1 (en) * 2005-09-14 2009-10-01 Ebara Corporation Polishing platen and polishing apparatus
US7462094B2 (en) * 2006-09-26 2008-12-09 Disco Corporation Wafer grinding method
USD589472S1 (en) * 2006-10-10 2009-03-31 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
US7572173B2 (en) * 2006-11-24 2009-08-11 National Taiwan University Of Science And Technology Polishing apparatus and pad replacing method thereof
USD589473S1 (en) 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
US7632170B2 (en) * 2007-06-25 2009-12-15 Novellus Systems, Inc. CMP apparatuses with polishing assemblies that provide for the passive removal of slurry
USD598380S1 (en) 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD621804S1 (en) 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
USD633673S1 (en) 2010-02-10 2011-03-01 The Libman Company Cloth
USD633672S1 (en) 2010-02-10 2011-03-01 The Libman Company Pad
USD651992S1 (en) 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD651991S1 (en) 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD655256S1 (en) 2010-08-17 2012-03-06 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD704155S1 (en) 2010-08-19 2014-05-06 Epistar Corporation Wafer carrier
USD674759S1 (en) 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD670917S1 (en) 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD739363S1 (en) 2011-06-17 2015-09-22 Soraa, Inc. Array of triangular semiconductor dies
USD684551S1 (en) * 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
USD676672S1 (en) 2011-08-25 2013-02-26 Lg Hausys, Ltd. Sheet for vehicle seats
USD677062S1 (en) 2011-08-25 2013-03-05 Lg Hausys, Ltd. Sheet for vehicle seats
USD686175S1 (en) 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD695241S1 (en) 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD699908S1 (en) 2012-08-04 2014-02-18 Hangzhou Jeenor Cleaning Supplies Co., Ltd. Big dot pattern wiper
USD699201S1 (en) 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD751999S1 (en) 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice
USD740035S1 (en) 2013-04-29 2015-10-06 Vorwek & Co. Interholding Gmbh Floor covering with dot pattern
USD761745S1 (en) 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD733960S1 (en) * 2014-02-18 2015-07-07 Southpac Trust International Inc. Light fixture lens with elevated strip features
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD768115S1 (en) 2015-02-05 2016-10-04 Armen E. Kazanchian Module

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
U.S. Appl. No. 29/524,898, filed Apr. 24, 2015, Tokyo Electron Limited.
U.S. Appl. No. 29/524,912, filed Apr. 24, 2015, Tokyo Electron Limited.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD897974S1 (en) * 2018-03-29 2020-10-06 Hamamatsu Photonics K.K. Semiconductor wafer

Also Published As

Publication number Publication date
JP1534136S (en:Method) 2015-09-28
TWD171960S (zh) 2015-11-21

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