USD745474S1 - Light emitting diode chip - Google Patents

Light emitting diode chip Download PDF

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Publication number
USD745474S1
USD745474S1 US29/489,892 US201429489892F USD745474S US D745474 S1 USD745474 S1 US D745474S1 US 201429489892 F US201429489892 F US 201429489892F US D745474 S USD745474 S US D745474S
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US
United States
Prior art keywords
light emitting
emitting diode
diode chip
view
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/489,892
Inventor
Hui-Ching Feng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epistar Corp
Original Assignee
Formosa Epitaxy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to FORMOSA EPITAXY INCORPORATION reassignment FORMOSA EPITAXY INCORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FENG, HUI-CHING
Application granted granted Critical
Publication of USD745474S1 publication Critical patent/USD745474S1/en
Assigned to EPISTAR CORPORATION reassignment EPISTAR CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FORMOSA EPITAXY INCORPORATION
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Description

FIG. 1 is a perspective view of a light emitting diode chip showing an embodiment of my new design;
FIG. 2 is a front view of the embodiment;
FIG. 3 is a rear view of the embodiment;
FIG. 4 is a left side view of the embodiment;
FIG. 5 is a right side view of the embodiment;
FIG. 6 is a top view of the embodiment; and,
FIG. 7 is a bottom view of the embodiment.
The broken line portions of the light emitting diode chip in FIGS. 1-7 represent unclaimed portions of the design and form no part thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a light emitting diode chip, as shown and described.
US29/489,892 2014-01-28 2014-05-05 Light emitting diode chip Active USD745474S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW103300552 2014-01-28
TW103300552 2014-01-28

Publications (1)

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USD745474S1 true USD745474S1 (en) 2015-12-15

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US29/489,892 Active USD745474S1 (en) 2014-01-28 2014-05-05 Light emitting diode chip

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD768094S1 (en) * 2014-10-30 2016-10-04 Epistar Corporation Light-emitting diode unit
USD769199S1 (en) * 2014-11-10 2016-10-18 Epistar Corporation Light-emitting diode unit
USD769831S1 (en) * 2014-10-28 2016-10-25 Epistar Corporation Light-emitting diode unit
USD777693S1 (en) * 2014-11-05 2017-01-31 Epistar Corporation Light-emitting diode unit
USD899384S1 (en) * 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device

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US20110291070A1 (en) * 2010-05-25 2011-12-01 Jong Hak Won Light emitting device, light emitting device package, and lighting system
US20120056232A1 (en) * 2010-09-06 2012-03-08 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing same
US20120153260A1 (en) * 2010-12-16 2012-06-21 Kim Seheon Chemically-etched nanostructures and related devices
US8415689B2 (en) * 2008-04-30 2013-04-09 Lg Innotek Co., Ltd. Semiconductor light emitting device
US20130285105A1 (en) * 2012-04-25 2013-10-31 Hon Hai Precision Industry Co., Ltd. Light emitting diode
US20130321902A1 (en) * 2012-06-05 2013-12-05 Electronics And Telecommunications Research Institute Low-loss flexible meta-material and method of fabricating the same
US8704249B2 (en) * 2012-02-14 2014-04-22 Toyoda Gosei Co., Ltd. Semiconductor light emitting device
US8749263B2 (en) * 2010-08-30 2014-06-10 Sharp Kabushiki Kaisha Semiconductor apparatus, inspection method thereof and electric device
US20140191650A1 (en) * 2011-07-11 2014-07-10 Korea University Research And Business Foundation Electric field emitting source, element using same, and production method therefor
US20140353709A1 (en) * 2013-05-28 2014-12-04 POSCO LED Co., Ltd. Light emitting diode
USD725052S1 (en) * 2014-04-30 2015-03-24 Epistar Corporation Light-emitting diode device

Patent Citations (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2280631A (en) * 1938-06-16 1942-04-21 Burgess Battery Co Facing sheet for sound absorbing material
US4032944A (en) * 1975-03-11 1977-06-28 U.S. Philips Corporation Semiconductor device for generating incoherent radiation and method of manufacturing same
US4189027A (en) * 1976-08-19 1980-02-19 United Technologies Corporation Sound suppressor liners
US6012543A (en) * 1997-03-07 2000-01-11 Nissan Motor Co., Ltd. Sound isolation plate structure
USD410973S (en) * 1998-03-18 1999-06-15 Interlego Ag Toy building element
USD412189S (en) * 1998-03-18 1999-07-20 Interlego Ag Toy building element
US6764196B2 (en) * 2001-03-29 2004-07-20 Bendrix B. Bailey Lighting system
US20030001477A1 (en) * 2001-06-29 2003-01-02 Daisuke Sasaguri Electron-emitting device, electron source, and image-forming apparatus
US20060160409A1 (en) * 2001-08-09 2006-07-20 Matsushita Electric Industrial Co., Ltd. Card type led illumination source
US6870125B2 (en) * 2001-12-03 2005-03-22 Sony Corporation Crystal layer separation method, laser irradiation method and method of fabricating devices using the same
USD511329S1 (en) * 2003-07-09 2005-11-08 Nichia Corporation Light emitting diode
USD510912S1 (en) * 2003-09-15 2005-10-25 Nichia Corporation Light emitting diode
US20050184647A1 (en) * 2004-02-25 2005-08-25 Cheol-Hyeon Chang Electron emission device
US7621654B2 (en) * 2004-03-26 2009-11-24 Panasonic Corporation LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module
US20060022575A1 (en) * 2004-07-30 2006-02-02 Kyung-Sun Ryu Electron emission device and method of manufacturing
US20060208628A1 (en) * 2004-08-30 2006-09-21 Chang-Soo Lee Electron emission device and method for manufacturing the same
US7710014B2 (en) * 2005-03-31 2010-05-04 Samsung Sdi Co., Ltd. Electron emission device, electron emission display device using the same and method of manufacturing the same
US20060261725A1 (en) * 2005-05-19 2006-11-23 Lee Sang-Jin Electron emission device, electron emission display, and manufacturing method of the electron emission device
US20070096624A1 (en) * 2005-10-31 2007-05-03 Sang-Jo Lee Electron emission device
US7786491B2 (en) * 2006-02-02 2010-08-31 Panasonic Corporation Semiconductor light-emitting device comprising a plurality of semiconductor layers
US20070176206A1 (en) * 2006-02-02 2007-08-02 Choi Jun-Hee Method of manufacturing field emission device
US20080030117A1 (en) * 2006-07-19 2008-02-07 Tsinghua University Field emission microelectronic device
US20080116782A1 (en) * 2006-11-20 2008-05-22 Byoung-Kuk Kim Light emission device and display device
US20110220872A1 (en) * 2006-12-11 2011-09-15 Showa Denko K.K. Compound semiconductor light-emitting device and method for manufacturing the same
US20100208761A1 (en) * 2007-05-04 2010-08-19 The Board Of Trustees Of The University Of Illnois Quantum well active region with three dimensional barriers and fabrication
US7690809B2 (en) * 2007-11-14 2010-04-06 Taiwan Green Energy Co., Ltd. LED lighting device inlaid on a ceiling
US8415689B2 (en) * 2008-04-30 2013-04-09 Lg Innotek Co., Ltd. Semiconductor light emitting device
USD616506S1 (en) * 2009-01-27 2010-05-25 Lego A/S Element of a toy construction set
US20110291070A1 (en) * 2010-05-25 2011-12-01 Jong Hak Won Light emitting device, light emitting device package, and lighting system
US20110291120A1 (en) * 2010-06-01 2011-12-01 Samsung Electronics Co., Ltd. Light Emitting Devices Using Connection Structures And Methods Of Manufacturing The Same
USD646647S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
US8749263B2 (en) * 2010-08-30 2014-06-10 Sharp Kabushiki Kaisha Semiconductor apparatus, inspection method thereof and electric device
US20120056232A1 (en) * 2010-09-06 2012-03-08 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing same
US20120153260A1 (en) * 2010-12-16 2012-06-21 Kim Seheon Chemically-etched nanostructures and related devices
US8569739B2 (en) * 2010-12-16 2013-10-29 California Institute Of Technology Chemically-etched nanostructures and related devices
US20140191650A1 (en) * 2011-07-11 2014-07-10 Korea University Research And Business Foundation Electric field emitting source, element using same, and production method therefor
US8704249B2 (en) * 2012-02-14 2014-04-22 Toyoda Gosei Co., Ltd. Semiconductor light emitting device
US20130285105A1 (en) * 2012-04-25 2013-10-31 Hon Hai Precision Industry Co., Ltd. Light emitting diode
US20130321902A1 (en) * 2012-06-05 2013-12-05 Electronics And Telecommunications Research Institute Low-loss flexible meta-material and method of fabricating the same
US20140353709A1 (en) * 2013-05-28 2014-12-04 POSCO LED Co., Ltd. Light emitting diode
USD725052S1 (en) * 2014-04-30 2015-03-24 Epistar Corporation Light-emitting diode device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD769831S1 (en) * 2014-10-28 2016-10-25 Epistar Corporation Light-emitting diode unit
USD768094S1 (en) * 2014-10-30 2016-10-04 Epistar Corporation Light-emitting diode unit
USD777693S1 (en) * 2014-11-05 2017-01-31 Epistar Corporation Light-emitting diode unit
USD824864S1 (en) 2014-11-05 2018-08-07 Epistar Corporation Light-emitting diode unit
USD769199S1 (en) * 2014-11-10 2016-10-18 Epistar Corporation Light-emitting diode unit
USD899384S1 (en) * 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD920933S1 (en) 2019-11-04 2021-06-01 Putco, Inc. Surface-mount device

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