USD722601S1 - Detachable assembly of memory module - Google Patents

Detachable assembly of memory module Download PDF

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Publication number
USD722601S1
USD722601S1 US29/451,315 US201329451315F USD722601S US D722601 S1 USD722601 S1 US D722601S1 US 201329451315 F US201329451315 F US 201329451315F US D722601 S USD722601 S US D722601S
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United States
Prior art keywords
memory module
detachable assembly
detachable
assembly
view
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Application number
US29/451,315
Inventor
Yujen Yang
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A Data Technology Co Ltd
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A Data Technology Co Ltd
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Assigned to ADATA TECHNOLOGY CO., LTD. reassignment ADATA TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YANG, YUJEN
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FIG. 1 is a perspective view of a detachable assembly of memory module showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a perspective view showing the practical usage thereof.
The broken lines depict portions of the detachable assembly of memory module which form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a “detachable assembly of memory module,” as shown and described.
US29/451,315 2013-01-30 2013-03-29 Detachable assembly of memory module Active USD722601S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102300810 2013-01-30
TW102300810F TWD156231S (en) 2013-01-30 2013-01-30 Detachable assembly of memory module

Publications (1)

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USD722601S1 true USD722601S1 (en) 2015-02-17

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US29/451,315 Active USD722601S1 (en) 2013-01-30 2013-03-29 Detachable assembly of memory module

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US (1) USD722601S1 (en)
TW (1) TWD156231S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1056918S1 (en) * 2016-10-19 2025-01-07 Nintendo Co., Ltd. Cartridge for game apparatus

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US20140133085A1 (en) * 2012-11-12 2014-05-15 Inventec Corporation Memory combination and computer system using the same
US20140139994A1 (en) * 2012-11-16 2014-05-22 Inventec Corporation Memory expansion assembly
US20140160662A1 (en) * 2012-12-07 2014-06-12 Nvidia Corporation Bracket of add-in card of computer, add-in card system and computer
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US20140211404A1 (en) * 2013-01-30 2014-07-31 Adata Technology Co., Ltd. Detachable assembly and memory module using the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US5310376A (en) * 1991-02-07 1994-05-10 Combi Corporation Toy that can be assembled independently by a child
USD398004S (en) * 1996-10-29 1998-09-08 Intel Corporation Processor card assembly
USD399502S (en) * 1996-10-29 1998-10-13 Intel Corporation Processor card assembly
USD405440S (en) * 1996-11-01 1999-02-09 Intel Corporation Processor card assembly
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US20030203663A1 (en) * 1999-09-24 2003-10-30 Burns Carmen D. Flexible circuit connector for stacked chip module
US7768789B2 (en) * 2000-01-06 2010-08-03 Super Tatent Electronics, Inc. Hard drive with metal casing and ground pin standoff to reduce ESD damage to stacked PCBA's
US6491563B1 (en) * 2000-04-24 2002-12-10 Scott Bailey Ball and socket construction toy
US6535387B2 (en) * 2001-06-28 2003-03-18 Intel Corporation Heat transfer apparatus
US6765797B2 (en) * 2001-06-28 2004-07-20 Intel Corporation Heat transfer apparatus
US6922338B2 (en) * 2002-10-09 2005-07-26 Infineon Technologies Ag Memory module with a heat dissipation means
US7948763B2 (en) * 2003-08-21 2011-05-24 Chimei Innolux Corporation Module with flexible printed circuit
US7688592B2 (en) * 2004-02-23 2010-03-30 Infineon Technologies Ag Cooling system for devices having power semiconductors and method for cooling the device
US7345892B2 (en) * 2004-05-20 2008-03-18 Nec Corporation Semiconductor device, noise reduction method, and shield cover
US7221569B2 (en) * 2004-09-15 2007-05-22 Comptake Technology Co., Ltd. Memory heat-dissipating device
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US7606035B2 (en) * 2006-09-22 2009-10-20 Samsung Electronics Co., Ltd. Heat sink and memory module using the same
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US8248805B2 (en) * 2009-09-24 2012-08-21 International Business Machines Corporation System to improve an in-line memory module
US20130027870A1 (en) * 2010-03-08 2013-01-31 International Business Machines Corporation Liquid dimm cooling device
USD673505S1 (en) * 2010-07-05 2013-01-01 Omron Corporation Connector for flexible printed circuit board
US20130183913A1 (en) * 2010-10-01 2013-07-18 Saab Ab Mounting system for transmitter receiver modules
US8514584B2 (en) * 2011-06-30 2013-08-20 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Serial advanced technology attachment DIMM device
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US20130100627A1 (en) * 2011-10-25 2013-04-25 Hon Hai Precision Industry Co., Ltd. Expansion card and motherboard for supporting the expansion card
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US20140211405A1 (en) * 2013-01-30 2014-07-31 Adata Technology Co., Ltd. Safety detachable assembly and memory module using the same
US20140211406A1 (en) * 2013-01-30 2014-07-31 Hon Hai Precision Industry Co., Ltd. Storage device and motherboard for supporting the storage device
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1056918S1 (en) * 2016-10-19 2025-01-07 Nintendo Co., Ltd. Cartridge for game apparatus
USD1062742S1 (en) * 2016-10-19 2025-02-18 Nintendo Co., Ltd. Cartridge for game apparatus
US12469995B2 (en) 2016-10-19 2025-11-11 Nintendo Co., Ltd. Cartridge with differently spaced terminals

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