USD713024S1 - Chemical vapor deposition fixture - Google Patents

Chemical vapor deposition fixture Download PDF

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Publication number
USD713024S1
USD713024S1 US29/437,564 US201229437564F USD713024S US D713024 S1 USD713024 S1 US D713024S1 US 201229437564 F US201229437564 F US 201229437564F US D713024 S USD713024 S US D713024S
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US
United States
Prior art keywords
vapor deposition
chemical vapor
deposition fixture
fixture
shows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/437,564
Inventor
William David Grove
Nicholas Peter Deskevich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silcotek Corp
Original Assignee
Silcotek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silcotek Corp filed Critical Silcotek Corp
Priority to US29/437,564 priority Critical patent/USD713024S1/en
Assigned to SILCOTEK CORP. reassignment SILCOTEK CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DESKEVICH, NICHOLAS PETER, GROVE, WILLIAM DAVID
Application granted granted Critical
Publication of USD713024S1 publication Critical patent/USD713024S1/en
Active legal-status Critical Current
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Description

FIG. 1 shows a perspective view of the chemical vapor deposition fixture.
FIG. 2 shows a front view thereof;
FIG. 3 shows a rear view thereof;
FIG. 4 shows a first side view thereof;
FIG. 5 shows a second side view thereof; and,
FIG. 6 shows the bottom view thereof.
The broken line showing of parts of the drawings is included for the purpose of illustrating use and environment and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. What is claimed is the chemical vapor deposition fixture, as shown and described.
US29/437,564 2012-11-19 2012-11-19 Chemical vapor deposition fixture Active USD713024S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/437,564 USD713024S1 (en) 2012-11-19 2012-11-19 Chemical vapor deposition fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/437,564 USD713024S1 (en) 2012-11-19 2012-11-19 Chemical vapor deposition fixture

Publications (1)

Publication Number Publication Date
USD713024S1 true USD713024S1 (en) 2014-09-09

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ID=51455802

Family Applications (1)

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US29/437,564 Active USD713024S1 (en) 2012-11-19 2012-11-19 Chemical vapor deposition fixture

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US (1) USD713024S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11131020B2 (en) 2015-09-01 2021-09-28 Silcotek Corp. Liquid chromatography system and component
US11618970B2 (en) 2019-06-14 2023-04-04 Silcotek Corp. Nano-wire growth
US12036765B2 (en) 2017-09-13 2024-07-16 Silcotek Corp Corrosion-resistant coated article and thermal chemical vapor deposition coating process
US12473635B2 (en) 2020-06-03 2025-11-18 Silcotek Corp. Dielectric article
US12522732B2 (en) 2010-10-05 2026-01-13 Silcotek Corp. Amorphous coating

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4329938A (en) * 1980-10-03 1982-05-18 The United States Of America As Represented By The Secretary Of The Navy Evaporator tool with remote substrate reorientation mechanism
US5534074A (en) * 1995-05-17 1996-07-09 Heraeus Amersil, Inc. Vertical boat for holding semiconductor wafers
USD428858S (en) * 1997-01-31 2000-08-01 Tokyo Electron Limited Quartz fin heat retaining tube
US6123804A (en) * 1999-02-22 2000-09-26 Applied Materials, Inc. Sectional clamp ring
US6133121A (en) * 1997-10-15 2000-10-17 Kabushiki Kaisha Toshiba Apparatus for supporting semiconductor wafers and semiconductor wafer processing method using supporting apparatus
US7252716B2 (en) * 2002-11-15 2007-08-07 Samsung Electronics Co., Ltd. Gas injection apparatus for semiconductor processing system
US7923069B2 (en) * 2002-04-16 2011-04-12 Applied Materials, Inc. Multi-station deposition apparatus and method
USD645487S1 (en) * 2009-03-20 2011-09-20 Foseco International Limited Holder for molten metal filters
US8308916B2 (en) * 2005-07-12 2012-11-13 Praxair S. T. Technology, Inc. Method for simultaneously coating a plurality of workpieces
US8366827B2 (en) * 2005-06-29 2013-02-05 Samsung Electronics Co., Ltd. Chamber inserts and apparatuses for processing a substrate
US8394201B2 (en) * 2008-01-24 2013-03-12 Samsung Electronics Co., Ltd. Atomic layer deposition apparatus
US8491963B2 (en) * 2005-02-17 2013-07-23 Snecma Propulsion Solide Method of densifying thin porous substrates by chemical vapor infiltration, and a loading device for such substrates
USD689107S1 (en) * 2012-11-19 2013-09-03 Silcotek Corp. Weldment fixture

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4329938A (en) * 1980-10-03 1982-05-18 The United States Of America As Represented By The Secretary Of The Navy Evaporator tool with remote substrate reorientation mechanism
US5534074A (en) * 1995-05-17 1996-07-09 Heraeus Amersil, Inc. Vertical boat for holding semiconductor wafers
USD428858S (en) * 1997-01-31 2000-08-01 Tokyo Electron Limited Quartz fin heat retaining tube
US6133121A (en) * 1997-10-15 2000-10-17 Kabushiki Kaisha Toshiba Apparatus for supporting semiconductor wafers and semiconductor wafer processing method using supporting apparatus
US6123804A (en) * 1999-02-22 2000-09-26 Applied Materials, Inc. Sectional clamp ring
US7923069B2 (en) * 2002-04-16 2011-04-12 Applied Materials, Inc. Multi-station deposition apparatus and method
US7252716B2 (en) * 2002-11-15 2007-08-07 Samsung Electronics Co., Ltd. Gas injection apparatus for semiconductor processing system
US8491963B2 (en) * 2005-02-17 2013-07-23 Snecma Propulsion Solide Method of densifying thin porous substrates by chemical vapor infiltration, and a loading device for such substrates
US8366827B2 (en) * 2005-06-29 2013-02-05 Samsung Electronics Co., Ltd. Chamber inserts and apparatuses for processing a substrate
US8308916B2 (en) * 2005-07-12 2012-11-13 Praxair S. T. Technology, Inc. Method for simultaneously coating a plurality of workpieces
US8394201B2 (en) * 2008-01-24 2013-03-12 Samsung Electronics Co., Ltd. Atomic layer deposition apparatus
USD645487S1 (en) * 2009-03-20 2011-09-20 Foseco International Limited Holder for molten metal filters
USD689107S1 (en) * 2012-11-19 2013-09-03 Silcotek Corp. Weldment fixture

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12522732B2 (en) 2010-10-05 2026-01-13 Silcotek Corp. Amorphous coating
US11131020B2 (en) 2015-09-01 2021-09-28 Silcotek Corp. Liquid chromatography system and component
US12037685B2 (en) 2015-09-01 2024-07-16 Silcotek Corp Liquid chromatography system and component
US12291778B2 (en) 2015-09-01 2025-05-06 Silcotek Corp. Liquid chromatography system and component
US12036765B2 (en) 2017-09-13 2024-07-16 Silcotek Corp Corrosion-resistant coated article and thermal chemical vapor deposition coating process
US11618970B2 (en) 2019-06-14 2023-04-04 Silcotek Corp. Nano-wire growth
US12473635B2 (en) 2020-06-03 2025-11-18 Silcotek Corp. Dielectric article

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