USD701180S1 - Radiator for an electronic device - Google Patents

Radiator for an electronic device Download PDF

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Publication number
USD701180S1
USD701180S1 US29/451,983 US201329451983F USD701180S US D701180 S1 USD701180 S1 US D701180S1 US 201329451983 F US201329451983 F US 201329451983F US D701180 S USD701180 S US D701180S
Authority
US
United States
Prior art keywords
radiator
electronic device
view
ornamental design
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/451,983
Inventor
Sang Il Park
Do Hyun Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zalman Tech Co Ltd
Original Assignee
Zalman Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zalman Tech Co Ltd filed Critical Zalman Tech Co Ltd
Assigned to ZALMAN TECH CO., LTD. reassignment ZALMAN TECH CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, DO HYUN, PARK, SANG IL
Application granted granted Critical
Publication of USD701180S1 publication Critical patent/USD701180S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top, front, and right side perspective view of a radiator for an electronic device, according to the present invention;
FIG. 2 is a front view of the a radiator for an electronic device of FIG. 1;
FIG. 3 is a rear view of the a radiator for an electronic device of FIG. 1;
FIG. 4 is a left side view of the a radiator for an electronic device of FIG. 1;
FIG. 5 is a right side view of the a radiator for an electronic device of
FIG. 1; and,
FIG. 6 is a top view of the a radiator for an electronic device of FIG. 1.
The bottom of the a radiator for an electronic device is flat and unornamented.
The portions of the disclosure that are shown in broken lines form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a radiator for an electronic device, as shown and described herein.
US29/451,983 2012-10-10 2013-04-10 Radiator for an electronic device Active USD701180S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2012-0048205 2012-10-10
KR20120048205 2012-10-10

Publications (1)

Publication Number Publication Date
USD701180S1 true USD701180S1 (en) 2014-03-18

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ID=50240703

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/451,983 Active USD701180S1 (en) 2012-10-10 2013-04-10 Radiator for an electronic device

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US (1) USD701180S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD896767S1 (en) * 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
US11859915B1 (en) 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure

Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5784257A (en) * 1997-02-21 1998-07-21 Chip Coolers, Inc. Heatsink assembly with adjustable retaining clip
USD492265S1 (en) * 2003-04-24 2004-06-29 Datech Technology Co., Ltd. Thermal efficient heat sink for electronic devices
US6829146B2 (en) * 2001-12-26 2004-12-07 Hewlett-Packard Development Company, L.P. Blindmate heat sink assembly
US20050103479A1 (en) * 2003-02-25 2005-05-19 Richardson Curtis A. Heat exchanger for heating of fuel cell combustion air
US20050150637A1 (en) * 2004-01-09 2005-07-14 Li-Kuang Tan Heat sink and multi-directional passages thereof
US6924979B2 (en) * 2001-07-30 2005-08-02 Hewlett-Packard Development Company, L.P. Mounting apparatus for coupling control circuitry to an air moving device
USD510325S1 (en) * 2003-10-15 2005-10-04 Asustek Computer Inc. Thermal module
US6964295B1 (en) * 2004-11-16 2005-11-15 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7000687B2 (en) * 2004-04-22 2006-02-21 Hon Hai Precision Industry Co., Ltd. Heat dissipating device
US20070023175A1 (en) * 2003-10-17 2007-02-01 Behr Gmbh & Co. Kg Stacked plate heat exchanger in particular an oil cooler for motor vehicles
US20070103871A1 (en) * 2005-11-07 2007-05-10 Ama Precision Inc. Heat dissipation module
US7249626B2 (en) * 2005-06-10 2007-07-31 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7363966B2 (en) * 2004-12-30 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US20080173426A1 (en) * 2007-01-19 2008-07-24 Ama Precision Inc. Clip module and heat-dissipation apparatus having the same
USD581883S1 (en) * 2007-05-04 2008-12-02 Asia Vital Components Co., Ltd. Heat sink
US20080295993A1 (en) * 2007-06-01 2008-12-04 Foxconn Technology Co., Ltd. Heat dissipation apparatus with heat pipes
USD604705S1 (en) * 2008-09-15 2009-11-24 Foxconn Technology Co., Ltd. Heat dissipation device
US20090314465A1 (en) * 2008-06-20 2009-12-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20100096103A1 (en) * 2008-08-11 2010-04-22 Rinnai Corporation Heat exchanger and water heater including the same
US20100172106A1 (en) * 2009-01-06 2010-07-08 Robert Liang Heatsink Assembly
US20130058107A1 (en) * 2008-07-15 2013-03-07 Nuventix, Inc. Advanced Synjet Cooler Design for LED Light Modules

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5784257A (en) * 1997-02-21 1998-07-21 Chip Coolers, Inc. Heatsink assembly with adjustable retaining clip
US6924979B2 (en) * 2001-07-30 2005-08-02 Hewlett-Packard Development Company, L.P. Mounting apparatus for coupling control circuitry to an air moving device
US6829146B2 (en) * 2001-12-26 2004-12-07 Hewlett-Packard Development Company, L.P. Blindmate heat sink assembly
US20050103479A1 (en) * 2003-02-25 2005-05-19 Richardson Curtis A. Heat exchanger for heating of fuel cell combustion air
USD492265S1 (en) * 2003-04-24 2004-06-29 Datech Technology Co., Ltd. Thermal efficient heat sink for electronic devices
USD510325S1 (en) * 2003-10-15 2005-10-04 Asustek Computer Inc. Thermal module
US20070023175A1 (en) * 2003-10-17 2007-02-01 Behr Gmbh & Co. Kg Stacked plate heat exchanger in particular an oil cooler for motor vehicles
US20050150637A1 (en) * 2004-01-09 2005-07-14 Li-Kuang Tan Heat sink and multi-directional passages thereof
US7000687B2 (en) * 2004-04-22 2006-02-21 Hon Hai Precision Industry Co., Ltd. Heat dissipating device
US6964295B1 (en) * 2004-11-16 2005-11-15 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7363966B2 (en) * 2004-12-30 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US7249626B2 (en) * 2005-06-10 2007-07-31 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20070103871A1 (en) * 2005-11-07 2007-05-10 Ama Precision Inc. Heat dissipation module
US20080173426A1 (en) * 2007-01-19 2008-07-24 Ama Precision Inc. Clip module and heat-dissipation apparatus having the same
USD581883S1 (en) * 2007-05-04 2008-12-02 Asia Vital Components Co., Ltd. Heat sink
US20080295993A1 (en) * 2007-06-01 2008-12-04 Foxconn Technology Co., Ltd. Heat dissipation apparatus with heat pipes
US20090314465A1 (en) * 2008-06-20 2009-12-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20130058107A1 (en) * 2008-07-15 2013-03-07 Nuventix, Inc. Advanced Synjet Cooler Design for LED Light Modules
US20100096103A1 (en) * 2008-08-11 2010-04-22 Rinnai Corporation Heat exchanger and water heater including the same
USD604705S1 (en) * 2008-09-15 2009-11-24 Foxconn Technology Co., Ltd. Heat dissipation device
US20100172106A1 (en) * 2009-01-06 2010-07-08 Robert Liang Heatsink Assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11859915B1 (en) 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD896767S1 (en) * 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD969760S1 (en) 2019-12-02 2022-11-15 Advanced Thermal Solutions, Inc. Fluid mover enclosure

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