USD694199S1 - Heat dissipating device - Google Patents
Heat dissipating device Download PDFInfo
- Publication number
- USD694199S1 USD694199S1 US29/438,467 US201229438467F USD694199S US D694199 S1 USD694199 S1 US D694199S1 US 201229438467 F US201229438467 F US 201229438467F US D694199 S USD694199 S US D694199S
- Authority
- US
- United States
- Prior art keywords
- heat dissipating
- dissipating device
- view
- heat
- elevational view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for a heat dissipating device, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/438,467 USD694199S1 (en) | 2012-11-30 | 2012-11-30 | Heat dissipating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/438,467 USD694199S1 (en) | 2012-11-30 | 2012-11-30 | Heat dissipating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD694199S1 true USD694199S1 (en) | 2013-11-26 |
Family
ID=49597042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/438,467 Active USD694199S1 (en) | 2012-11-30 | 2012-11-30 | Heat dissipating device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD694199S1 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD708591S1 (en) * | 2012-09-22 | 2014-07-08 | Apple Inc. | Fan component |
| USD829183S1 (en) * | 2017-06-15 | 2018-09-25 | Shenzhen Gaoyu Electronic Technology Co., Ltd. | Graphic card radiator |
| USD848960S1 (en) * | 2017-11-10 | 2019-05-21 | Auras Technology Co., Ltd. | Water cooling radiator |
| USD848962S1 (en) * | 2018-02-06 | 2019-05-21 | Auras Technology Co., Ltd. | Water cooling device |
| USD927435S1 (en) * | 2019-04-12 | 2021-08-10 | Shin-Etsu Polymer Co., Ltd. | Heat dissipating device for batteries or electric devices |
| USD965760S1 (en) * | 2020-01-02 | 2022-10-04 | Dynaeon Industrial Co., Ltd. | Cooling fan with two air outlets |
| US20250027513A1 (en) * | 2023-07-20 | 2025-01-23 | Minebea Mitsumi Inc. | Rotating device |
| USD1073040S1 (en) * | 2021-09-02 | 2025-04-29 | Delta Electronics, Inc. | Fan |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6751097B1 (en) * | 2003-04-08 | 2004-06-15 | Compal Electronics Inc. | Heat-radiating structure co-usable with heat-radiating window of a housing of an electronic appliance |
| US20060039113A1 (en) * | 2004-08-19 | 2006-02-23 | Compal Electronics, Inc. | Heat dissipating device with dust-collecting mechanism |
| US20080011461A1 (en) * | 2006-07-14 | 2008-01-17 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
| US20080105410A1 (en) * | 2006-11-03 | 2008-05-08 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
| US20080156460A1 (en) * | 2006-12-27 | 2008-07-03 | Foxconn Technology Co., Ltd. | Thermal module |
| US20090229791A1 (en) * | 2008-03-14 | 2009-09-17 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module assembly and heat sink assembly thereof |
| US7679907B2 (en) * | 2007-01-31 | 2010-03-16 | Kabushiki Kaisha Toshiba | Electronic apparatus and fin unit |
| US20100238628A1 (en) * | 2009-03-21 | 2010-09-23 | Foxconn Technology Co., Ltd. | Portable electronic device incorporating extendable thermal module |
| US20110030923A1 (en) * | 2009-08-04 | 2011-02-10 | Foxconn Technology Co., Ltd. | Thermal module |
| US7913749B2 (en) * | 2007-06-22 | 2011-03-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module with porous type heat dissipater |
| US20110080710A1 (en) * | 2009-10-02 | 2011-04-07 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| US7952872B1 (en) * | 2009-12-25 | 2011-05-31 | Kabushiki Kaisha Toshiba | Cooling device and electronic apparatus |
| US8233277B2 (en) * | 2010-04-27 | 2012-07-31 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with self-locking base |
| US20120320526A1 (en) * | 2011-06-15 | 2012-12-20 | Inventec Corporation | Heat dissipation device and electronic device using the same |
-
2012
- 2012-11-30 US US29/438,467 patent/USD694199S1/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6751097B1 (en) * | 2003-04-08 | 2004-06-15 | Compal Electronics Inc. | Heat-radiating structure co-usable with heat-radiating window of a housing of an electronic appliance |
| US20060039113A1 (en) * | 2004-08-19 | 2006-02-23 | Compal Electronics, Inc. | Heat dissipating device with dust-collecting mechanism |
| US20080011461A1 (en) * | 2006-07-14 | 2008-01-17 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
| US20080105410A1 (en) * | 2006-11-03 | 2008-05-08 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
| US20080156460A1 (en) * | 2006-12-27 | 2008-07-03 | Foxconn Technology Co., Ltd. | Thermal module |
| US7679907B2 (en) * | 2007-01-31 | 2010-03-16 | Kabushiki Kaisha Toshiba | Electronic apparatus and fin unit |
| US7913749B2 (en) * | 2007-06-22 | 2011-03-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module with porous type heat dissipater |
| US20090229791A1 (en) * | 2008-03-14 | 2009-09-17 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module assembly and heat sink assembly thereof |
| US20100238628A1 (en) * | 2009-03-21 | 2010-09-23 | Foxconn Technology Co., Ltd. | Portable electronic device incorporating extendable thermal module |
| US20110030923A1 (en) * | 2009-08-04 | 2011-02-10 | Foxconn Technology Co., Ltd. | Thermal module |
| US20110080710A1 (en) * | 2009-10-02 | 2011-04-07 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| US8379383B2 (en) * | 2009-10-02 | 2013-02-19 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| US7952872B1 (en) * | 2009-12-25 | 2011-05-31 | Kabushiki Kaisha Toshiba | Cooling device and electronic apparatus |
| US8233277B2 (en) * | 2010-04-27 | 2012-07-31 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with self-locking base |
| US20120320526A1 (en) * | 2011-06-15 | 2012-12-20 | Inventec Corporation | Heat dissipation device and electronic device using the same |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD708591S1 (en) * | 2012-09-22 | 2014-07-08 | Apple Inc. | Fan component |
| USD829183S1 (en) * | 2017-06-15 | 2018-09-25 | Shenzhen Gaoyu Electronic Technology Co., Ltd. | Graphic card radiator |
| USD848960S1 (en) * | 2017-11-10 | 2019-05-21 | Auras Technology Co., Ltd. | Water cooling radiator |
| USD848962S1 (en) * | 2018-02-06 | 2019-05-21 | Auras Technology Co., Ltd. | Water cooling device |
| USD848961S1 (en) * | 2018-02-06 | 2019-05-21 | Auras Technology Co., Ltd. | Water cooling device |
| USD927435S1 (en) * | 2019-04-12 | 2021-08-10 | Shin-Etsu Polymer Co., Ltd. | Heat dissipating device for batteries or electric devices |
| USD965760S1 (en) * | 2020-01-02 | 2022-10-04 | Dynaeon Industrial Co., Ltd. | Cooling fan with two air outlets |
| USD1073040S1 (en) * | 2021-09-02 | 2025-04-29 | Delta Electronics, Inc. | Fan |
| US20250027513A1 (en) * | 2023-07-20 | 2025-01-23 | Minebea Mitsumi Inc. | Rotating device |
| US12392357B2 (en) * | 2023-07-20 | 2025-08-19 | Minebea Mitsumi Inc. | Rotating device |
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