USD691569S1 - LED chip - Google Patents

LED chip Download PDF

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Publication number
USD691569S1
USD691569S1 US29/388,240 US201129388240F USD691569S US D691569 S1 USD691569 S1 US D691569S1 US 201129388240 F US201129388240 F US 201129388240F US D691569 S USD691569 S US D691569S
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United States
Prior art keywords
led chip
view
ornamental design
design
led
Prior art date
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US29/388,240
Inventor
John A. Edmond
Michael J. Bergmann
Matthew Donofrio
Winston T. Parker
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CreeLED Inc
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Cree Inc
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Priority to US29/388,240 priority Critical patent/USD691569S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BERGMANN, MICHAEL J., DONOFRIO, MATTHEW, EDMOND, JOHN A., PARKER, WINSTON T.
Application granted granted Critical
Publication of USD691569S1 publication Critical patent/USD691569S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART MODULAR TECHNOLOGIES, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, CREELED, INC., SMART EMBEDDED COMPUTING, INC. reassignment SMART MODULAR TECHNOLOGIES, INC. RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
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FIG. 1 is a top perspective view of an LED chip showing our design;
FIG. 2 is a top view thereof;
FIG. 3 is a first side view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a different side view thereof;
FIG. 6 is an end view thereof;
FIG. 7 is an opposing end view thereof;
FIG. 8 is a top perspective view of the LED chip of FIG. 1 with the top surface removed;
FIG. 9 is a top view thereof;
FIG. 10 is a first side view thereof;
FIG. 11 is a bottom view thereof;
FIG. 12 is a different side view thereof;
FIG. 13 is an end view thereof; and,
FIG. 14 is an opposing end view thereof.
The broken lines are for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a LED chip, as shown and described.
US29/388,240 2011-03-25 2011-03-25 LED chip Active USD691569S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/388,240 USD691569S1 (en) 2011-03-25 2011-03-25 LED chip

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Application Number Priority Date Filing Date Title
US29/388,240 USD691569S1 (en) 2011-03-25 2011-03-25 LED chip

Publications (1)

Publication Number Publication Date
USD691569S1 true USD691569S1 (en) 2013-10-15

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US29/388,240 Active USD691569S1 (en) 2011-03-25 2011-03-25 LED chip

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD707641S1 (en) * 2013-08-01 2014-06-24 Epistar Corporation Light-emitting diode
USD730303S1 (en) * 2014-06-10 2015-05-26 High Power Opto, Inc. LED chip
USD794582S1 (en) * 2016-07-29 2017-08-15 Enraytek Optoelectronics Co., Ltd. LED chip
USD795822S1 (en) * 2016-07-29 2017-08-29 Enraytek Optoelectronics Co., Ltd. LED chip
USD863238S1 (en) * 2017-08-30 2019-10-15 Dowa Electronics Materials Co., Ltd. Light emitting diode chip
USD894851S1 (en) * 2018-09-04 2020-09-01 Epistar Corporation Light-emitting device
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD926713S1 (en) * 2019-03-22 2021-08-03 Epistar Corporation Light-emitting device
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip

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USD566056S1 (en) 2006-12-20 2008-04-08 Cree, Inc. LED chip
USD566057S1 (en) 2006-12-21 2008-04-08 Cree, Inc. LED chip
USD566665S1 (en) 2007-04-18 2008-04-15 Edison Opto Corporation Matrix type light emitting diode assembly
USD582866S1 (en) 2007-09-07 2008-12-16 Cree, Inc. LED chip
USD582865S1 (en) 2007-06-11 2008-12-16 Cree, Inc. LED chip
USD583338S1 (en) 2007-09-07 2008-12-23 Cree, Inc. LED chip
USD599748S1 (en) * 2008-06-12 2009-09-08 SemiLEDs Optoelectronics Co., Ltd. Light emitting diode device
US7843060B2 (en) * 2007-06-11 2010-11-30 Cree, Inc. Droop-free high output light emitting devices and methods of fabricating and operating same
US7888687B2 (en) * 2005-09-08 2011-02-15 Showa Denko K.K. Electrode for semiconductor light emitting device
USD635525S1 (en) 2009-04-22 2011-04-05 Cree, Inc. LED chip

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6383835B1 (en) 1995-09-01 2002-05-07 Canon Kabushiki Kaisha IC package having a conductive material at least partially filling a recess
US6097040A (en) 1997-07-23 2000-08-01 Sharp Kabushiki Kaisha Semiconductor light emitting device that prevents current flow in a portion thereof directly under an electrode wire bonding pad
US6498592B1 (en) 1999-02-16 2002-12-24 Sarnoff Corp. Display tile structure using organic light emitting materials
US6614056B1 (en) * 1999-12-01 2003-09-02 Cree Lighting Company Scalable led with improved current spreading structures
US6255129B1 (en) 2000-09-07 2001-07-03 Highlink Technology Corporation Light-emitting diode device and method of manufacturing the same
US6870519B2 (en) 2001-03-28 2005-03-22 Intel Corporation Methods for tiling multiple display elements to form a single display
US7289089B2 (en) 2001-08-03 2007-10-30 Sony Corporation Light emitting unit
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US6518598B1 (en) 2001-12-21 2003-02-11 Epitech Corporation Ltd III-nitride LED having a spiral electrode
US20030222263A1 (en) 2002-06-04 2003-12-04 Kopin Corporation High-efficiency light-emitting diodes
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US7095061B2 (en) 2002-06-13 2006-08-22 Philips Lumileds Lighting Company, Llc Contacting scheme for large and small area semiconductor light emitting flip chip devices
US6847052B2 (en) 2002-06-17 2005-01-25 Kopin Corporation Light-emitting diode device geometry
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TWD109667S1 (en) 2003-09-09 2006-03-11 日亞化學工業股份有限公司 Light emitting diode
USD522466S1 (en) 2003-09-09 2006-06-06 Nichia Corporation Light emitting diode
USD521952S1 (en) 2004-02-23 2006-05-30 Kabushiki Kaisha Toshiba Semiconductor device
US20060131600A1 (en) 2004-03-05 2006-06-22 Junichi Nakaoka Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member
US20060049422A1 (en) 2004-08-31 2006-03-09 Iwao Shoji Surface mount LED
US20060226437A1 (en) 2005-04-08 2006-10-12 Sharp Kabushiki Kaisha Light-emitting diode
US7598532B2 (en) 2005-04-08 2009-10-06 Sharp Kabushiki Kaisha Light-emitting diode
US20060237735A1 (en) * 2005-04-22 2006-10-26 Jean-Yves Naulin High-efficiency light extraction structures and methods for solid-state lighting
TWD112798S1 (en) 2005-04-28 2006-09-01 東芝照明技術股份有限公司 Lighting diode modules
US7888687B2 (en) * 2005-09-08 2011-02-15 Showa Denko K.K. Electrode for semiconductor light emitting device
US20070075323A1 (en) 2005-09-30 2007-04-05 Tdk Corporation Light emitting apparatus
US7671468B2 (en) 2005-09-30 2010-03-02 Tdk Corporation Light emitting apparatus
US7429755B2 (en) 2005-10-13 2008-09-30 Advanced Optoelectronic Technology, Inc. High power light emitting diode
US20070085089A1 (en) 2005-10-13 2007-04-19 Advanced Optoelectronic Technology Inc. High power light emitting diode
US20070085095A1 (en) * 2005-10-17 2007-04-19 Samsung Electro-Mechanics Co., Ltd. Nitride based semiconductor light emitting diode
US20070138585A1 (en) 2005-12-16 2007-06-21 Hsin Chung H Image sensor package
USD566056S1 (en) 2006-12-20 2008-04-08 Cree, Inc. LED chip
USD566057S1 (en) 2006-12-21 2008-04-08 Cree, Inc. LED chip
USD566665S1 (en) 2007-04-18 2008-04-15 Edison Opto Corporation Matrix type light emitting diode assembly
USD582865S1 (en) 2007-06-11 2008-12-16 Cree, Inc. LED chip
US7843060B2 (en) * 2007-06-11 2010-11-30 Cree, Inc. Droop-free high output light emitting devices and methods of fabricating and operating same
USD602450S1 (en) * 2007-09-07 2009-10-20 Cree, Inc. LED chip
USD583338S1 (en) 2007-09-07 2008-12-23 Cree, Inc. LED chip
USD582866S1 (en) 2007-09-07 2008-12-16 Cree, Inc. LED chip
USD599748S1 (en) * 2008-06-12 2009-09-08 SemiLEDs Optoelectronics Co., Ltd. Light emitting diode device
USD635525S1 (en) 2009-04-22 2011-04-05 Cree, Inc. LED chip

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD707641S1 (en) * 2013-08-01 2014-06-24 Epistar Corporation Light-emitting diode
USD730303S1 (en) * 2014-06-10 2015-05-26 High Power Opto, Inc. LED chip
USD794582S1 (en) * 2016-07-29 2017-08-15 Enraytek Optoelectronics Co., Ltd. LED chip
USD795822S1 (en) * 2016-07-29 2017-08-29 Enraytek Optoelectronics Co., Ltd. LED chip
USD863238S1 (en) * 2017-08-30 2019-10-15 Dowa Electronics Materials Co., Ltd. Light emitting diode chip
USD894851S1 (en) * 2018-09-04 2020-09-01 Epistar Corporation Light-emitting device
USD926713S1 (en) * 2019-03-22 2021-08-03 Epistar Corporation Light-emitting device
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD920933S1 (en) 2019-11-04 2021-06-01 Putco, Inc. Surface-mount device
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip

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