USD690276S1 - Electromagnetic interference shield - Google Patents

Electromagnetic interference shield Download PDF

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Publication number
USD690276S1
USD690276S1 US29/433,695 US201229433695F USD690276S US D690276 S1 USD690276 S1 US D690276S1 US 201229433695 F US201229433695 F US 201229433695F US D690276 S USD690276 S US D690276S
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US
United States
Prior art keywords
electromagnetic interference
interference shield
shield
electromagnetic
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/433,695
Inventor
Richard William Shaw
Richard R Gevehausen
Li Tien Chang
Aiken Lin
Jason Chang
Chih Liang Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Priority to US29/433,695 priority Critical patent/USD690276S1/en
Assigned to HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. reassignment HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, JASON, CHANG, LI-TIEN, LI, CHIH LIANG, LIN, AIKEN, GEVESHAUSEN, RICHARD R., SHAW, RICHARD WILLIAM
Application granted granted Critical
Publication of USD690276S1 publication Critical patent/USD690276S1/en
Active legal-status Critical Current
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Description

FIG. 1 is an exploded side perspective view of an electromagnetic interference shield of the present invention;
FIG. 2 is a side perspective view of the electromagnetic interference shield;
FIG. 3 is a top view of the electromagnetic interference shield; and,
FIG. 4 is a bottom view of the electromagnetic interference shield.
The broken line showing in FIGS. 1 and 2 represents unclaimed subject matter and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an electromagnetic interference shield, as shown and described.
US29/433,695 2012-10-03 2012-10-03 Electromagnetic interference shield Active USD690276S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/433,695 USD690276S1 (en) 2012-10-03 2012-10-03 Electromagnetic interference shield

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/433,695 USD690276S1 (en) 2012-10-03 2012-10-03 Electromagnetic interference shield

Publications (1)

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USD690276S1 true USD690276S1 (en) 2013-09-24

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US29/433,695 Active USD690276S1 (en) 2012-10-03 2012-10-03 Electromagnetic interference shield

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD866492S1 (en) * 2017-07-05 2019-11-12 Ningbo Newland Magnet Industry Corporation Limited Magnet plate
USD922337S1 (en) * 2020-01-25 2021-06-15 Veea Inc. Electromagnetic interference shield
USD922338S1 (en) * 2020-01-25 2021-06-15 Veea Inc. Electromagnetic interference shield
USD949106S1 (en) * 2019-11-18 2022-04-19 Maurer Magnetic Ag Demagnetization apparatus

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5838550A (en) * 1997-08-28 1998-11-17 Hewlett-Packard Company Grounding clip for shielded modular connector
US6008990A (en) * 1998-11-23 1999-12-28 Liu; Yen-Wen Cartridge type CPU module cooling structure
US6346672B1 (en) * 2000-07-03 2002-02-12 Chin Fu Horng Structure for preventing electromagnetic interference of central processing unit
US6566597B2 (en) * 2001-01-09 2003-05-20 Hon Hai Precision Ind. Co., Ltd. Shield assembly for computer enclosure and pressing machine for making it
US6661676B1 (en) * 2002-08-21 2003-12-09 Global Sun Technology Inc. Protective shielding assembly for electric facilities
US6671183B2 (en) * 2002-01-17 2003-12-30 Denso Corporation Electronic equipment having two circuit boards overlapping only partly
US6711019B2 (en) * 2001-06-29 2004-03-23 Matsushita Electric Industrial Co., Ltd. Mounting fitting of heat sink and method of removing the same
US6776625B2 (en) * 2002-12-06 2004-08-17 Hon Hai Precision Ind. Co., Ltd. Land grid array connector assembly with reinforcement
US7005738B2 (en) * 2001-01-30 2006-02-28 Thermal Corp. Semiconductor package with lid heat spreader
US7170014B1 (en) * 2005-06-18 2007-01-30 Hon Hai Precision Industry Co., Ltd. Electromagnetic interference shield apparatus
US7436661B2 (en) * 2005-05-11 2008-10-14 Microsoft Corporation Two-compartment AC adaptor
USD580376S1 (en) * 2006-10-12 2008-11-11 Semi-Photonics Co., Ltd. Lead frame for a four-pin light-emitting diode device
US7529092B2 (en) * 2004-04-15 2009-05-05 Thomson Licensing Electromagnetic interference shield and heat sink apparatus
US7697296B2 (en) * 2007-07-20 2010-04-13 International Business Machines Corporation Method and apparatus for securing a microprocessor and heat sink using fewer mounting holes
US8059410B2 (en) * 2009-04-10 2011-11-15 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5838550A (en) * 1997-08-28 1998-11-17 Hewlett-Packard Company Grounding clip for shielded modular connector
US6008990A (en) * 1998-11-23 1999-12-28 Liu; Yen-Wen Cartridge type CPU module cooling structure
US6346672B1 (en) * 2000-07-03 2002-02-12 Chin Fu Horng Structure for preventing electromagnetic interference of central processing unit
US6566597B2 (en) * 2001-01-09 2003-05-20 Hon Hai Precision Ind. Co., Ltd. Shield assembly for computer enclosure and pressing machine for making it
US7005738B2 (en) * 2001-01-30 2006-02-28 Thermal Corp. Semiconductor package with lid heat spreader
US6711019B2 (en) * 2001-06-29 2004-03-23 Matsushita Electric Industrial Co., Ltd. Mounting fitting of heat sink and method of removing the same
US6671183B2 (en) * 2002-01-17 2003-12-30 Denso Corporation Electronic equipment having two circuit boards overlapping only partly
US6661676B1 (en) * 2002-08-21 2003-12-09 Global Sun Technology Inc. Protective shielding assembly for electric facilities
US6776625B2 (en) * 2002-12-06 2004-08-17 Hon Hai Precision Ind. Co., Ltd. Land grid array connector assembly with reinforcement
US7529092B2 (en) * 2004-04-15 2009-05-05 Thomson Licensing Electromagnetic interference shield and heat sink apparatus
US7436661B2 (en) * 2005-05-11 2008-10-14 Microsoft Corporation Two-compartment AC adaptor
US7170014B1 (en) * 2005-06-18 2007-01-30 Hon Hai Precision Industry Co., Ltd. Electromagnetic interference shield apparatus
USD580376S1 (en) * 2006-10-12 2008-11-11 Semi-Photonics Co., Ltd. Lead frame for a four-pin light-emitting diode device
US7697296B2 (en) * 2007-07-20 2010-04-13 International Business Machines Corporation Method and apparatus for securing a microprocessor and heat sink using fewer mounting holes
US8059410B2 (en) * 2009-04-10 2011-11-15 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD866492S1 (en) * 2017-07-05 2019-11-12 Ningbo Newland Magnet Industry Corporation Limited Magnet plate
USD949106S1 (en) * 2019-11-18 2022-04-19 Maurer Magnetic Ag Demagnetization apparatus
USD1028895S1 (en) 2019-11-18 2024-05-28 Maurer Magnetic Ag Demagnetization apparatus
USD1028896S1 (en) 2019-11-18 2024-05-28 Maurer Magnetic Ag Demagnetization apparatus
USD922337S1 (en) * 2020-01-25 2021-06-15 Veea Inc. Electromagnetic interference shield
USD922338S1 (en) * 2020-01-25 2021-06-15 Veea Inc. Electromagnetic interference shield

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