USD689833S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD689833S1
USD689833S1 US29/406,718 US201129406718F USD689833S US D689833 S1 USD689833 S1 US D689833S1 US 201129406718 F US201129406718 F US 201129406718F US D689833 S USD689833 S US D689833S
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US
United States
Prior art keywords
semiconductor device
view
ornamental design
design
taken along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/406,718
Inventor
Motohito Hori
Tatsuo Nishizawa
Yoshinari Ikeda
Eiji Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HORI, MOTOHITO, IKEDA, YOSHINARI, MOCHIZUKI, EIJI, NISHIZAWA, TATSUO
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Description

FIG. 1 is a front, top, right side perspective view of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a right side view thereof; and,
FIG. 8 is a cross sectional view taken along line 8-8 of FIG. 4.
The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/406,718 2011-05-19 2011-11-18 Semiconductor device Active USD689833S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2011-011203 2011-05-19
JP2011011203 2011-05-19

Publications (1)

Publication Number Publication Date
USD689833S1 true USD689833S1 (en) 2013-09-17

Family

ID=49122732

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/406,718 Active USD689833S1 (en) 2011-05-19 2011-11-18 Semiconductor device

Country Status (1)

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US (1) USD689833S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD724554S1 (en) * 2014-02-19 2015-03-17 Fuji Electric Co., Ltd. Semiconductor module
USD819037S1 (en) * 2016-01-22 2018-05-29 Shenzhen Longsys Electronics Co., Ltd. SSD storage module

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD436085S1 (en) * 1999-06-18 2001-01-09 Fujikura, Ltd. Piezoelectric conversion type semiconductor device
US6364958B1 (en) * 2000-05-24 2002-04-02 Applied Materials, Inc. Plasma assisted semiconductor substrate processing chamber having a plurality of ground path bridges
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US20050229849A1 (en) * 2004-02-13 2005-10-20 Applied Materials, Inc. High productivity plasma processing chamber
US7147719B2 (en) * 1998-07-03 2006-12-12 Applied Materials, Inc. Double slit-valve doors for plasma processing
USD569183S1 (en) * 2007-04-19 2008-05-20 Vin Singlz Limited Tumbler
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
USD572084S1 (en) * 2007-04-19 2008-07-01 Vin Singlz Limited Tumbler
USD580228S1 (en) * 2007-09-10 2008-11-11 Hugh Hayden Reversible beverage cup
USD581738S1 (en) * 2007-04-25 2008-12-02 Pi-Design Ag Double walled glass
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD592457S1 (en) * 2007-03-27 2009-05-19 Mansfield Bryan D Drinking vessel
USD593969S1 (en) * 2006-10-10 2009-06-09 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US7985663B2 (en) * 2008-05-27 2011-07-26 Kabushiki Kaisha Toshiba Method for manufacturing a semiconductor device
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
US8338940B2 (en) * 2008-03-28 2012-12-25 Nec Corporation Semiconductor device
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7147719B2 (en) * 1998-07-03 2006-12-12 Applied Materials, Inc. Double slit-valve doors for plasma processing
USD436085S1 (en) * 1999-06-18 2001-01-09 Fujikura, Ltd. Piezoelectric conversion type semiconductor device
US6364958B1 (en) * 2000-05-24 2002-04-02 Applied Materials, Inc. Plasma assisted semiconductor substrate processing chamber having a plurality of ground path bridges
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US20050229849A1 (en) * 2004-02-13 2005-10-20 Applied Materials, Inc. High productivity plasma processing chamber
USD593969S1 (en) * 2006-10-10 2009-06-09 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
USD592457S1 (en) * 2007-03-27 2009-05-19 Mansfield Bryan D Drinking vessel
USD569183S1 (en) * 2007-04-19 2008-05-20 Vin Singlz Limited Tumbler
USD572084S1 (en) * 2007-04-19 2008-07-01 Vin Singlz Limited Tumbler
USD581738S1 (en) * 2007-04-25 2008-12-02 Pi-Design Ag Double walled glass
USD580228S1 (en) * 2007-09-10 2008-11-11 Hugh Hayden Reversible beverage cup
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
US8338940B2 (en) * 2008-03-28 2012-12-25 Nec Corporation Semiconductor device
US7985663B2 (en) * 2008-05-27 2011-07-26 Kabushiki Kaisha Toshiba Method for manufacturing a semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
e-Front runners—Development of New-Generation Power Semiconductor SiC Module—Sep. 29, 2010—p. 1.
e-Front runners—Three Year Rolling Plan Power Semiconductor Business Strategy—Nov. 17, 2011—pp. 1-21.
Masafumi Norio et al.—New Power Module Structure with Low Thermal Impedance and High Reliability for SiC Devices; PCIM Europe 2011, May 11, 2011, Nuremberg, Germany; pp. 229-234.
Masafumi Norio et al.—Packaging Technologies for SiC Power Modules—vol. 84 No. 5 Nov. 10, 2011—pp. 5.
N. Nashida et al.—New Power Module Structure with High Power Density and High Reliability for SiC Devices-Sep. 8, 2011, pp. 233-236.
Yoshinari Ikeda et al.—Investigation on Wirebond-less Power Module Structure with High-Density packaging and High Reliability; Proceedings of the 23rd International Symposium on Power Semiconductor Devices & IC's, May 23, 2011 San Diego, CA; pp. 272-275.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD724554S1 (en) * 2014-02-19 2015-03-17 Fuji Electric Co., Ltd. Semiconductor module
USD819037S1 (en) * 2016-01-22 2018-05-29 Shenzhen Longsys Electronics Co., Ltd. SSD storage module

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