FIG. 1 is a perspective view of one embodiment of a solder dot for circuit board showing our new design;
FIG. 2 is a plan view thereof;
FIG. 3 is a left side elevational view thereof the right, front and rear elevation views being identical to the left side;
FIG. 4 is a perspective view of another embodiment of a solder dot for circuit board showing our new design;
FIG. 5 is a plan view thereof;
FIG. 6 is a left side elevational view thereof.
FIG. 7 is a perspective view of a solder dot for circuit board showing our new design shown in an alternate environment;
FIG. 8 is a plan view thereof;
FIG. 9 is a left side elevational view thereof the right, front and rear elevation views being identical to the left side.
FIG. 10 is a perspective view of a solder dot for circuit board showing our new design shown in an alternate environment;
FIG. 11 is a plan view thereof; and,
FIG. 12 is a left side elevational view thereof the right, front and rear elevation views being identical to the left side.
The solder dot is shown broken away in FIGS. 4, 6,10, and 12 of the drawing to indicated indeterminate length, it being understood that it has a uniform shape and appearance through its length.
The left side elevational view of one embodiment of the solder dot for circuit board is the same with a right side elevational view, a front elevational view, and a rear elevational view thereof, therefore, they are not shown. The left side elevational views of the another embodiments of the solder dot for circuit board are the same with a corresponding right side elevational view, a corresponding front elevational view, and a corresponding rear elevational view thereof, therefore, they are not shown. The broken lines showing are for illustrative purposes only and forms no part of the claimed design.
