USD651990S1 - Semiconductor manufacturing equipment - Google Patents

Semiconductor manufacturing equipment Download PDF

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Publication number
USD651990S1
USD651990S1 US29/371,214 US37121410F USD651990S US D651990 S1 USD651990 S1 US D651990S1 US 37121410 F US37121410 F US 37121410F US D651990 S USD651990 S US D651990S
Authority
US
United States
Prior art keywords
semiconductor manufacturing
manufacturing equipment
view
equipment
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/371,214
Inventor
Masakazu Shimada
Takashi Nogami
Satoshi Aizawa
Seiyo Nakashima
Tomoyuki Yamada
Shinobu Sugiura
Yukinori Aburatani
Mitsuhiro Nagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Hitachi Kokusai Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Assigned to HITACHI KOKUSAI ELECTRIC INC. reassignment HITACHI KOKUSAI ELECTRIC INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAGATA, MITSUHIRO, NOGAMI, TAKASHI, AIZAWA, SATOSHI, YAMADA, TOMOYUKI, SUGIURA, SHINOBU, ABURATANI, YUKINORI, NAKASHIMA, SEIYO, SHIMADA, MASAKAZU
Application granted granted Critical
Publication of USD651990S1 publication Critical patent/USD651990S1/en
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI KOKUSAI ELECTRIC INC.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of an semiconductor manufacturing equipment showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a right side elevational view thereof.

Claims (1)

  1. We claim the ornamental design for a semiconductor manufacturing equipment, as shown and described.
US29/371,214 2010-06-01 2010-11-29 Semiconductor manufacturing equipment Expired - Lifetime USD651990S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010013455 2010-06-01
JP2010-013455 2010-06-01

Publications (1)

Publication Number Publication Date
USD651990S1 true USD651990S1 (en) 2012-01-10

Family

ID=45419482

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/371,214 Expired - Lifetime USD651990S1 (en) 2010-06-01 2010-11-29 Semiconductor manufacturing equipment

Country Status (2)

Country Link
US (1) USD651990S1 (en)
TW (1) TWD143036S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1098056S1 (en) * 2022-03-30 2025-10-14 Daikin Fintech, Ltd. Substrate processing apparatus

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5810538A (en) * 1994-05-12 1998-09-22 Kokusai Electric Co., Ltd. Semiconductor manufacturing equipment and method for carrying wafers in said equipment
US6547660B1 (en) * 1999-07-02 2003-04-15 Tokyo Electron Limited Semiconductor manufacturing facility, semiconductor manufacturing apparatus and semiconductor manufacturing method
US6580087B1 (en) * 1999-10-15 2003-06-17 Sony Corporation Inspection apparatus
US6945746B2 (en) * 2002-02-21 2005-09-20 Asm Japan K.K. Semiconductor manufacturing equipment and maintenance method
US7039499B1 (en) * 2002-08-02 2006-05-02 Seminet Inc. Robotic storage buffer system for substrate carrier pods
US20060120833A1 (en) * 2001-08-31 2006-06-08 Bonora Anthony C Wafer engine
US20070098527A1 (en) * 2005-07-11 2007-05-03 Hall Daniel A Equipment storage for substrate processing apparatus
US20080166208A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Wet clean system design
US20080317581A1 (en) * 2003-09-08 2008-12-25 Akitaka Makino Vacuum Processing Apparatus
US7607879B2 (en) * 2004-06-15 2009-10-27 Brooks Automation, Inc. Substrate processing apparatus with removable component module
USD607424S1 (en) * 2006-03-30 2010-01-05 Tokyo Electron Limited Wafer carrying-in/out apparatus
US20110123300A1 (en) * 2005-03-07 2011-05-26 Kawasaki Jukogyo Kabushiki Kaisha Method of assembling substrate transfer device and transfer system unit for the same
US20110236159A1 (en) * 2010-03-24 2011-09-29 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5810538A (en) * 1994-05-12 1998-09-22 Kokusai Electric Co., Ltd. Semiconductor manufacturing equipment and method for carrying wafers in said equipment
US6547660B1 (en) * 1999-07-02 2003-04-15 Tokyo Electron Limited Semiconductor manufacturing facility, semiconductor manufacturing apparatus and semiconductor manufacturing method
US6580087B1 (en) * 1999-10-15 2003-06-17 Sony Corporation Inspection apparatus
US20060120833A1 (en) * 2001-08-31 2006-06-08 Bonora Anthony C Wafer engine
US6945746B2 (en) * 2002-02-21 2005-09-20 Asm Japan K.K. Semiconductor manufacturing equipment and maintenance method
US7039499B1 (en) * 2002-08-02 2006-05-02 Seminet Inc. Robotic storage buffer system for substrate carrier pods
US20080317581A1 (en) * 2003-09-08 2008-12-25 Akitaka Makino Vacuum Processing Apparatus
US7607879B2 (en) * 2004-06-15 2009-10-27 Brooks Automation, Inc. Substrate processing apparatus with removable component module
US20110123300A1 (en) * 2005-03-07 2011-05-26 Kawasaki Jukogyo Kabushiki Kaisha Method of assembling substrate transfer device and transfer system unit for the same
US20070098527A1 (en) * 2005-07-11 2007-05-03 Hall Daniel A Equipment storage for substrate processing apparatus
USD607424S1 (en) * 2006-03-30 2010-01-05 Tokyo Electron Limited Wafer carrying-in/out apparatus
US20080166208A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Wet clean system design
US20110236159A1 (en) * 2010-03-24 2011-09-29 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1098056S1 (en) * 2022-03-30 2025-10-14 Daikin Fintech, Ltd. Substrate processing apparatus

Also Published As

Publication number Publication date
TWD143036S1 (en) 2011-10-01

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