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Light emitting diode (LED) package

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Publication number
USD648686S1
USD648686S1 US29360791 US36079110F USD648686S US D648686 S1 USD648686 S1 US D648686S1 US 29360791 US29360791 US 29360791 US 36079110 F US36079110 F US 36079110F US D648686 S USD648686 S US D648686S
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US
Grant status
Grant
Patent type
Design
Prior art keywords
view
fig
design
diode
top
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29360791
Inventor
Christopher P. Hussell
Shuying Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cree Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Description

FIG. 1 is a top perspective view of an light emitting diode (LED) package showing our design;

FIG. 2 is a top view thereof;

FIG. 3 is a top end view thereof;

FIG. 4 is an opposing bottom end view thereof;

FIG. 5 is a bottom view thereof opposite the view of FIG. 2;

FIG. 6 is a side view thereof;

FIG. 7 is an opposing side view thereof; and,

FIG. 8 is a back perspective view thereof.

The broken lines immediately adjacent to the shaded areas represent the boundaries of the claimed design. Other broken lines are for illustrative purpose only and form no part of the claimed design. None of the broken lines form part of the claimed design.

Claims (1)

  1. The ornamental design for a light emitting diode (LED) package, as shown and described.
US29360791 2010-04-30 2010-04-30 Light emitting diode (LED) package Active USD648686S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29360791 USD648686S1 (en) 2010-04-30 2010-04-30 Light emitting diode (LED) package

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US29360791 USD648686S1 (en) 2010-04-30 2010-04-30 Light emitting diode (LED) package
US12825075 US8598602B2 (en) 2009-01-12 2010-06-28 Light emitting device packages with improved heat transfer
US29401692 USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package
US14094341 US9123874B2 (en) 2009-01-12 2013-12-02 Light emitting device packages with improved heat transfer

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US29338186 Continuation-In-Part USD641719S1 (en) 2009-06-05 2009-06-05 Light emitting diode
US29401692 Division USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package

Publications (1)

Publication Number Publication Date
USD648686S1 true USD648686S1 (en) 2011-11-15

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US29360791 Active USD648686S1 (en) 2010-04-30 2010-04-30 Light emitting diode (LED) package
US29401692 Active USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package

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Application Number Title Priority Date Filing Date
US29401692 Active USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package

Country Status (1)

Country Link
US (2) USD648686S1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9685592B2 (en) 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
WO2012116470A1 (en) 2011-03-02 2012-09-07 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device
USD777694S1 (en) * 2015-05-15 2017-01-31 Citizen Electronics Co., Ltd. Light-emitting diode
USD782989S1 (en) * 2015-05-15 2017-04-04 Citizen Electronics Co., Ltd. Light-emitting diode

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* Cited by examiner, † Cited by third party
Title
Co-pending U.S. Appl. No. 12/498,856 filed Jul. 7, 2009.
Description Model No. NS6G083 issued by Nichia Corporation—at least as early as Aug. 31, 2007.
Description Model No. NS6x083x issued by Nichia Corporation—at least as early as Feb. 17, 2007.
International Search Report/Written Opinion dated Jan. 5, 2011 for PCT/US2010/035379.
Non-Final Office Action for U.S. Appl. No. 12/479,318 dated Jun. 2, 2010.
Non-final Office Action for U.S. Appl. No. 12/479,318 dated Nov. 10, 2010.
Notice of Allowance for Japanese Design Appl. No. 2010-026186 dated Mar. 29, 2011.
Notice of Allowance for U.S. Appl. No. 29/353,652 dated Aug. 24, 2010.
Notice of Allowance for U.S. Appl. No. 29/353,652 dated Nov. 26, 2010.
Notice of Allowance for U.S. Appl. No. 29/365,939 dated Apr. 12, 2011.
Notice of Allowance for U.S. Appl. No. 29/365,939 dated Dec. 27, 2010.
Notice of Allowance from U.S. Appl. No. 29/330,657 dated Sep. 25, 2009.
Notice of Allowance from U.S. Appl. No. 29/338,186 dated Apr. 16, 2010.
Related CIP U.S. Appl. No. 12/969,267 filed Dec. 15, 2010 (Filed With Non-Publication Request).
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Supplemental Notice of Allowance for U.S. Appl. No. 29/338,186 dated May 20, 2011.
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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8497522B2 (en) 2009-06-05 2013-07-30 Cree, Inc. Solid state lighting device
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
USD708156S1 (en) * 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
USD704358S1 (en) 2011-01-03 2014-05-06 Cree, Inc. High brightness LED package
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion

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