USD645486S1 - Dielectric window for plasma processing device - Google Patents

Dielectric window for plasma processing device Download PDF

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Publication number
USD645486S1
USD645486S1 US29/369,644 US36964410F USD645486S US D645486 S1 USD645486 S1 US D645486S1 US 36964410 F US36964410 F US 36964410F US D645486 S USD645486 S US D645486S
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US
United States
Prior art keywords
processing device
plasma processing
dielectric window
dielectric
window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/369,644
Inventor
Wataru Yoshikawa
Naoki Matsumoto
Jun Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATSUMOTO, NAOKI, YOSHIKAWA, JUN, YOSHIKAWA, WATARU
Application granted granted Critical
Publication of USD645486S1 publication Critical patent/USD645486S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a dielectric window for plasma processing device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a cross-sectional view taken along line 6-6 of FIG. 2.

Claims (1)

  1. The ornamental design for a dielectric window for a plasma processing device, as shown and described.
US29/369,644 2010-03-31 2010-09-10 Dielectric window for plasma processing device Expired - Lifetime USD645486S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-008109 2010-03-31
JP2010008109 2010-03-31

Publications (1)

Publication Number Publication Date
USD645486S1 true USD645486S1 (en) 2011-09-20

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ID=44587438

Family Applications (1)

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US29/369,644 Expired - Lifetime USD645486S1 (en) 2010-03-31 2010-09-10 Dielectric window for plasma processing device

Country Status (2)

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US (1) USD645486S1 (en)
TW (1) TWD142852S1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD826300S1 (en) * 2016-09-30 2018-08-21 Oerlikon Metco Ag, Wohlen Rotably mounted thermal plasma burner for thermalspraying
USD909439S1 (en) * 2018-11-30 2021-02-02 Ferrotec (Usa) Corporation Two-piece crucible cover
USD921058S1 (en) * 2019-08-27 2021-06-01 Black & Decker Inc. Abrasive wheel

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4391034A (en) * 1980-12-22 1983-07-05 Ibm Corporation Thermally compensated shadow mask
US20010007302A1 (en) * 1997-05-16 2001-07-12 Liubo Hong Hybrid coil design for ionized deposition
US6280563B1 (en) * 1997-12-31 2001-08-28 Lam Research Corporation Plasma device including a powered non-magnetic metal member between a plasma AC excitation source and the plasma
US20060110546A1 (en) * 2002-09-30 2006-05-25 Vikharev Anatoly L High velocity method for deposing diamond films from a gaseous phase in shf discharge plasma and device for carrying out said method
US20080102538A1 (en) * 2006-10-27 2008-05-01 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and Method For Controlling Relative Particle Concentrations In A Plasma
US20090068934A1 (en) * 2007-09-04 2009-03-12 Samsung Electronics Co., Ltd. Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same
US20090314434A1 (en) * 2006-08-28 2009-12-24 Qiaoli Song Inductively coupled coil and inductively coupled plasma device using the same
US20100230273A1 (en) * 2006-06-22 2010-09-16 Shibaura Mechatronics Corporation Film forming apparatus and film forming method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4391034A (en) * 1980-12-22 1983-07-05 Ibm Corporation Thermally compensated shadow mask
US20010007302A1 (en) * 1997-05-16 2001-07-12 Liubo Hong Hybrid coil design for ionized deposition
US6280563B1 (en) * 1997-12-31 2001-08-28 Lam Research Corporation Plasma device including a powered non-magnetic metal member between a plasma AC excitation source and the plasma
US20060110546A1 (en) * 2002-09-30 2006-05-25 Vikharev Anatoly L High velocity method for deposing diamond films from a gaseous phase in shf discharge plasma and device for carrying out said method
US7694651B2 (en) * 2002-09-30 2010-04-13 Institute Of Applied Physics Ras High velocity method for deposing diamond films from a gaseous phase in SHF discharge plasma and device for carrying out said method
US20100230273A1 (en) * 2006-06-22 2010-09-16 Shibaura Mechatronics Corporation Film forming apparatus and film forming method
US20090314434A1 (en) * 2006-08-28 2009-12-24 Qiaoli Song Inductively coupled coil and inductively coupled plasma device using the same
US20080102538A1 (en) * 2006-10-27 2008-05-01 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and Method For Controlling Relative Particle Concentrations In A Plasma
US20090068934A1 (en) * 2007-09-04 2009-03-12 Samsung Electronics Co., Ltd. Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD826300S1 (en) * 2016-09-30 2018-08-21 Oerlikon Metco Ag, Wohlen Rotably mounted thermal plasma burner for thermalspraying
USD909439S1 (en) * 2018-11-30 2021-02-02 Ferrotec (Usa) Corporation Two-piece crucible cover
USD921058S1 (en) * 2019-08-27 2021-06-01 Black & Decker Inc. Abrasive wheel

Also Published As

Publication number Publication date
TWD142852S1 (en) 2011-09-21

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