USD644191S1 - Portion of a light-emitting diode - Google Patents

Portion of a light-emitting diode Download PDF

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Publication number
USD644191S1
USD644191S1 US29/381,723 US201029381723F USD644191S US D644191 S1 USD644191 S1 US D644191S1 US 201029381723 F US201029381723 F US 201029381723F US D644191 S USD644191 S US D644191S
Authority
US
United States
Prior art keywords
light
emitting diode
view
elevational view
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/381,723
Inventor
Satoshi Shimizu
Kazuhisa Iwashita
Tatsuo Tonedachi
Kazuhiro Inoue
Teruo Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INOUE, KAZUHIRO, IWASHITA, KAZUHISA, SHIMIZU, SATOSHI, TAKEUCHI, TERUO, TONEDACHI, TATSUO
Application granted granted Critical
Publication of USD644191S1 publication Critical patent/USD644191S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front perspective view of a portion of a light-emitting diode, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side elevational view thereof;
FIG. 8 is a left side elevational view thereof;
FIG. 9 is a front perspective view thereof, wherein the broken lines are shown for illustrative purposes only and form no part of the claimed design and,
FIG. 10 is a rear perspective view thereof, wherein the broken lines are shown for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a portion of a light-emitting diode, as shown and described.
US29/381,723 2010-09-29 2010-12-22 Portion of a light-emitting diode Expired - Lifetime USD644191S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-023298 2010-02-04
JP2010023298 2010-09-29

Publications (1)

Publication Number Publication Date
USD644191S1 true USD644191S1 (en) 2011-08-30

Family

ID=44486628

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/381,723 Expired - Lifetime USD644191S1 (en) 2010-09-29 2010-12-22 Portion of a light-emitting diode

Country Status (1)

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US (1) USD644191S1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD656110S1 (en) * 2011-04-28 2012-03-20 Kabushiki Kaisha Toshiba Light-emitting diode
USD656469S1 (en) * 2011-04-28 2012-03-27 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
USD658606S1 (en) * 2010-09-29 2012-05-01 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
USD674360S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674357S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674363S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674358S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674359S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674362S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040000702A1 (en) * 2002-06-27 2004-01-01 Semiconductor Components Industries, Llc Integrated circuit and laminated leadframe package
USD506187S1 (en) * 2004-10-12 2005-06-14 Harvatek Corporation Metal base design for surface mount device LED (light emitting diode)
USD509809S1 (en) * 2004-08-10 2005-09-20 Harvatek Corporation Metal base design for surface mount device LED
USD511328S1 (en) * 2004-06-23 2005-11-08 Harvatek Corporation Light-emitting diode
US20050248336A1 (en) * 2003-08-26 2005-11-10 Nirmal Sharma Current sensor
US20060145318A1 (en) * 2005-01-05 2006-07-06 Xiaotian Zhang DFN semiconductor package having reduced electrical resistance
US20060214273A1 (en) * 2005-03-22 2006-09-28 Bily Wang LED package structure and method making of the same
US7242076B2 (en) * 2004-05-18 2007-07-10 Fairchild Semiconductor Corporation Packaged integrated circuit with MLP leadframe and method of making same
USD576571S1 (en) * 2007-06-14 2008-09-09 Rohm Co., Ltd. Light emitting diode module
US20090174048A1 (en) * 2008-01-09 2009-07-09 Yong Liu Die package including substrate with molded device
USD599303S1 (en) * 2007-12-05 2009-09-01 Seoul Semiconductor Co., Ltd. Light emitting diode (LED)
US20090278241A1 (en) * 2008-05-08 2009-11-12 Yong Liu Semiconductor die package including die stacked on premolded substrate including die
US20100032819A1 (en) * 2008-08-07 2010-02-11 Kai Liu Compact Co-packaged Semiconductor Dies with Elevation-adaptive Interconnection Plates
US7709754B2 (en) * 2003-08-26 2010-05-04 Allegro Microsystems, Inc. Current sensor
US7714334B2 (en) * 2007-08-16 2010-05-11 Lin Peter P W Polarless surface mounting light emitting diode
US7759775B2 (en) * 2004-07-20 2010-07-20 Alpha And Omega Semiconductor Incorporated High current semiconductor power device SOIC package
US7868432B2 (en) * 2006-02-13 2011-01-11 Fairchild Semiconductor Corporation Multi-chip module for battery power control

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040000702A1 (en) * 2002-06-27 2004-01-01 Semiconductor Components Industries, Llc Integrated circuit and laminated leadframe package
US7709754B2 (en) * 2003-08-26 2010-05-04 Allegro Microsystems, Inc. Current sensor
US20050248336A1 (en) * 2003-08-26 2005-11-10 Nirmal Sharma Current sensor
US7242076B2 (en) * 2004-05-18 2007-07-10 Fairchild Semiconductor Corporation Packaged integrated circuit with MLP leadframe and method of making same
USD511328S1 (en) * 2004-06-23 2005-11-08 Harvatek Corporation Light-emitting diode
US7759775B2 (en) * 2004-07-20 2010-07-20 Alpha And Omega Semiconductor Incorporated High current semiconductor power device SOIC package
USD509809S1 (en) * 2004-08-10 2005-09-20 Harvatek Corporation Metal base design for surface mount device LED
USD506187S1 (en) * 2004-10-12 2005-06-14 Harvatek Corporation Metal base design for surface mount device LED (light emitting diode)
US20060145318A1 (en) * 2005-01-05 2006-07-06 Xiaotian Zhang DFN semiconductor package having reduced electrical resistance
US20060214273A1 (en) * 2005-03-22 2006-09-28 Bily Wang LED package structure and method making of the same
US7868432B2 (en) * 2006-02-13 2011-01-11 Fairchild Semiconductor Corporation Multi-chip module for battery power control
USD576571S1 (en) * 2007-06-14 2008-09-09 Rohm Co., Ltd. Light emitting diode module
US7714334B2 (en) * 2007-08-16 2010-05-11 Lin Peter P W Polarless surface mounting light emitting diode
USD599303S1 (en) * 2007-12-05 2009-09-01 Seoul Semiconductor Co., Ltd. Light emitting diode (LED)
US20090174048A1 (en) * 2008-01-09 2009-07-09 Yong Liu Die package including substrate with molded device
US20090278241A1 (en) * 2008-05-08 2009-11-12 Yong Liu Semiconductor die package including die stacked on premolded substrate including die
US20100032819A1 (en) * 2008-08-07 2010-02-11 Kai Liu Compact Co-packaged Semiconductor Dies with Elevation-adaptive Interconnection Plates

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD658606S1 (en) * 2010-09-29 2012-05-01 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
USD656110S1 (en) * 2011-04-28 2012-03-20 Kabushiki Kaisha Toshiba Light-emitting diode
USD656469S1 (en) * 2011-04-28 2012-03-27 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
USD674360S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674357S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674363S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674358S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674359S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674362S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package

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