USD624031S1 - Light-emitting diode - Google Patents

Light-emitting diode Download PDF

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Publication number
USD624031S1
USD624031S1 US29/355,517 US35551710F USD624031S US D624031 S1 USD624031 S1 US D624031S1 US 35551710 F US35551710 F US 35551710F US D624031 S USD624031 S US D624031S
Authority
US
United States
Prior art keywords
light
emitting diode
view
elevational view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/355,517
Inventor
Teruo Takeuchi
Tatsuo Tonedachi
Kazuhisa Iwashita
Satoshi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IWASHITA, KAZUHISA, SHIMIZU, SATOSHI, TAKEUCHI, TERUO, TONEDACHI, TATSUO
Application granted granted Critical
Publication of USD624031S1 publication Critical patent/USD624031S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front perspective view of a light-emitting diode, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a bottom plan view thereof; the opposite side being a mirror image thereof;
FIG. 6 is a right side elevational view thereof; and,
FIG. 7 is a left side elevational view thereof.

Claims (1)

  1. The ornamental design for a light-emitting diode, as shown and described.
US29/355,517 2009-10-16 2010-02-09 Light-emitting diode Expired - Lifetime USD624031S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-024372 2009-10-16
JP2009024372 2009-10-16

Publications (1)

Publication Number Publication Date
USD624031S1 true USD624031S1 (en) 2010-09-21

Family

ID=42734346

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/355,517 Expired - Lifetime USD624031S1 (en) 2009-10-16 2010-02-09 Light-emitting diode

Country Status (2)

Country Link
US (1) USD624031S1 (en)
TW (1) TWD138654S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD710534S1 (en) * 2014-04-08 2014-08-05 Phoenix Products Company, Inc. Light fixture
USD710533S1 (en) * 2014-04-08 2014-08-05 Phoenix Products Company, Inc. Light fixture
USD710532S1 (en) * 2014-04-08 2014-08-05 Phoenix Products Company, Inc. Light fixture
USD894851S1 (en) * 2018-09-04 2020-09-01 Epistar Corporation Light-emitting device
USD926713S1 (en) * 2019-03-22 2021-08-03 Epistar Corporation Light-emitting device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020121684A1 (en) * 2001-01-12 2002-09-05 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US20030122225A1 (en) * 2001-12-27 2003-07-03 Mitsui High-Tec, Inc.. Lead frame and semiconductor device made using the lead frame
US6677667B1 (en) * 2000-11-28 2004-01-13 National Semiconductor Corporation Leadless leadframe package design that provides a greater structural integrity
US7298034B2 (en) * 2004-06-28 2007-11-20 Semiconductor Components Industries, L.L.C. Multi-chip semiconductor connector assemblies
USD581885S1 (en) 2007-06-14 2008-12-02 Panasonic Corporation Light source of light emitting diode
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6677667B1 (en) * 2000-11-28 2004-01-13 National Semiconductor Corporation Leadless leadframe package design that provides a greater structural integrity
US20020121684A1 (en) * 2001-01-12 2002-09-05 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US6734536B2 (en) * 2001-01-12 2004-05-11 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US20030122225A1 (en) * 2001-12-27 2003-07-03 Mitsui High-Tec, Inc.. Lead frame and semiconductor device made using the lead frame
US7298034B2 (en) * 2004-06-28 2007-11-20 Semiconductor Components Industries, L.L.C. Multi-chip semiconductor connector assemblies
USD581885S1 (en) 2007-06-14 2008-12-02 Panasonic Corporation Light source of light emitting diode
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD710534S1 (en) * 2014-04-08 2014-08-05 Phoenix Products Company, Inc. Light fixture
USD710533S1 (en) * 2014-04-08 2014-08-05 Phoenix Products Company, Inc. Light fixture
USD710532S1 (en) * 2014-04-08 2014-08-05 Phoenix Products Company, Inc. Light fixture
USD894851S1 (en) * 2018-09-04 2020-09-01 Epistar Corporation Light-emitting device
USD926713S1 (en) * 2019-03-22 2021-08-03 Epistar Corporation Light-emitting device

Also Published As

Publication number Publication date
TWD138654S1 (en) 2011-01-11

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