USD623153S1 - Portion of a light-emitting diode - Google Patents

Portion of a light-emitting diode Download PDF

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Publication number
USD623153S1
USD623153S1 US29/355,755 US35575510F USD623153S US D623153 S1 USD623153 S1 US D623153S1 US 35575510 F US35575510 F US 35575510F US D623153 S USD623153 S US D623153S
Authority
US
United States
Prior art keywords
light
emitting diode
view
elevational view
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/355,755
Inventor
Teruo Takeuchi
Tatsuo Tonedachi
Kazuhisa Iwashita
Satoshi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IWASHITA, KAZUHISA, SHIMIZU, SATOSHI, TAKEUCHI, TERUO, TONEDACHI, TATSUO
Application granted granted Critical
Publication of USD623153S1 publication Critical patent/USD623153S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front perspective view of a portion of a light-emitting diode, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a bottom plan view thereof; the opposite side being a mirror image thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a left side elevational view thereof;
FIG. 8 is a front perspective view of the light-emitting diode of FIG. 1; and,
FIG. 9 is a rear perspective view of the light-emitting diode of FIG. 1.
The broken lines immediately adjacent to the shaded region form an unclaimed boundary of the design. The broken line showing of the remainder of the light-emitting diode is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for a portion of a light-emitting diode, as shown and described.
US29/355,755 2009-10-16 2010-02-12 Portion of a light-emitting diode Expired - Lifetime USD623153S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-024373 2009-10-16
JP2009024373 2009-10-16

Publications (1)

Publication Number Publication Date
USD623153S1 true USD623153S1 (en) 2010-09-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/355,755 Expired - Lifetime USD623153S1 (en) 2009-10-16 2010-02-12 Portion of a light-emitting diode

Country Status (1)

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US (1) USD623153S1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020121684A1 (en) * 2001-01-12 2002-09-05 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US20030122225A1 (en) * 2001-12-27 2003-07-03 Mitsui High-Tec, Inc.. Lead frame and semiconductor device made using the lead frame
US6677667B1 (en) * 2000-11-28 2004-01-13 National Semiconductor Corporation Leadless leadframe package design that provides a greater structural integrity
US6713317B2 (en) * 2002-08-12 2004-03-30 Semiconductor Components Industries, L.L.C. Semiconductor device and laminated leadframe package
US7298034B2 (en) * 2004-06-28 2007-11-20 Semiconductor Components Industries, L.L.C. Multi-chip semiconductor connector assemblies
USD581885S1 (en) 2007-06-14 2008-12-02 Panasonic Corporation Light source of light emitting diode
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6677667B1 (en) * 2000-11-28 2004-01-13 National Semiconductor Corporation Leadless leadframe package design that provides a greater structural integrity
US20020121684A1 (en) * 2001-01-12 2002-09-05 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US6734536B2 (en) * 2001-01-12 2004-05-11 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US20030122225A1 (en) * 2001-12-27 2003-07-03 Mitsui High-Tec, Inc.. Lead frame and semiconductor device made using the lead frame
US6713317B2 (en) * 2002-08-12 2004-03-30 Semiconductor Components Industries, L.L.C. Semiconductor device and laminated leadframe package
US7298034B2 (en) * 2004-06-28 2007-11-20 Semiconductor Components Industries, L.L.C. Multi-chip semiconductor connector assemblies
USD581885S1 (en) 2007-06-14 2008-12-02 Panasonic Corporation Light source of light emitting diode
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures

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