USD615505S1 - LED package - Google Patents
LED package Download PDFInfo
- Publication number
- USD615505S1 USD615505S1 US29/340,831 US34083109F USD615505S US D615505 S1 USD615505 S1 US D615505S1 US 34083109 F US34083109 F US 34083109F US D615505 S USD615505 S US D615505S
- Authority
- US
- United States
- Prior art keywords
- led package
- view
- package
- led
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
Claims (1)
- The ornamental design for a LED package, substantially as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/340,831 USD615505S1 (en) | 2009-07-27 | 2009-07-27 | LED package |
TW099300323F TWD138500S (en) | 2009-07-27 | 2010-01-26 | Led package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/340,831 USD615505S1 (en) | 2009-07-27 | 2009-07-27 | LED package |
Publications (1)
Publication Number | Publication Date |
---|---|
USD615505S1 true USD615505S1 (en) | 2010-05-11 |
Family
ID=42139756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/340,831 Expired - Lifetime USD615505S1 (en) | 2009-07-27 | 2009-07-27 | LED package |
Country Status (2)
Country | Link |
---|---|
US (1) | USD615505S1 (en) |
TW (1) | TWD138500S (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8698184B2 (en) | 2011-01-21 | 2014-04-15 | Cree, Inc. | Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature |
USD738832S1 (en) * | 2006-04-04 | 2015-09-15 | Cree, Inc. | Light emitting diode (LED) package |
USD762184S1 (en) * | 2014-11-13 | 2016-07-26 | Mitsubishi Electric Corporation | Light emitting diode |
USD768584S1 (en) * | 2014-11-13 | 2016-10-11 | Mitsubishi Electric Corporation | Light source module |
USD780704S1 (en) * | 2014-08-27 | 2017-03-07 | Mitsubishi Electric Corporation | Light source module |
US9735198B2 (en) | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
US9780268B2 (en) | 2006-04-04 | 2017-10-03 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
US10134961B2 (en) | 2012-03-30 | 2018-11-20 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
US10222032B2 (en) | 2012-03-30 | 2019-03-05 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
USD903908S1 (en) * | 2019-01-22 | 2020-12-01 | Zac Cutt | Modular illumination device |
USD1009814S1 (en) * | 2020-04-01 | 2024-01-02 | Xiamen San'an Optoelectronics Technology Co., Ltd. | LED chip |
USD1022930S1 (en) * | 2020-03-30 | 2024-04-16 | Quanzhou San'an Semiconductor Technology Co., Ltd. | LED chip |
-
2009
- 2009-07-27 US US29/340,831 patent/USD615505S1/en not_active Expired - Lifetime
-
2010
- 2010-01-26 TW TW099300323F patent/TWD138500S/en unknown
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD738832S1 (en) * | 2006-04-04 | 2015-09-15 | Cree, Inc. | Light emitting diode (LED) package |
US9780268B2 (en) | 2006-04-04 | 2017-10-03 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
US8698184B2 (en) | 2011-01-21 | 2014-04-15 | Cree, Inc. | Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature |
US10222032B2 (en) | 2012-03-30 | 2019-03-05 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
US11004890B2 (en) | 2012-03-30 | 2021-05-11 | Creeled, Inc. | Substrate based light emitter devices, components, and related methods |
US9735198B2 (en) | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
US10134961B2 (en) | 2012-03-30 | 2018-11-20 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
USD780704S1 (en) * | 2014-08-27 | 2017-03-07 | Mitsubishi Electric Corporation | Light source module |
USD768584S1 (en) * | 2014-11-13 | 2016-10-11 | Mitsubishi Electric Corporation | Light source module |
USD762184S1 (en) * | 2014-11-13 | 2016-07-26 | Mitsubishi Electric Corporation | Light emitting diode |
USD903908S1 (en) * | 2019-01-22 | 2020-12-01 | Zac Cutt | Modular illumination device |
USD1022930S1 (en) * | 2020-03-30 | 2024-04-16 | Quanzhou San'an Semiconductor Technology Co., Ltd. | LED chip |
USD1009814S1 (en) * | 2020-04-01 | 2024-01-02 | Xiamen San'an Optoelectronics Technology Co., Ltd. | LED chip |
Also Published As
Publication number | Publication date |
---|---|
TWD138500S (en) | 2011-01-01 |
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