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Emitter package

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USD615504S1
USD615504S1 US29292900 US29290007F USD615504S US D615504 S1 USD615504 S1 US D615504S1 US 29292900 US29292900 US 29292900 US 29290007 F US29290007 F US 29290007F US D615504 S USD615504 S US D615504S
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Design
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fig
view
package
emitter
shown
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US29292900
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Bernd Keller
Nicholas Medendorp, JR.
Thomas Cheng-Hsin Yuan
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Cree Inc
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Cree Inc
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Description

FIG. 1 is a perspective view of the first embodiment of an emitter package showing our design;

FIG. 2 is a top plan view of the emitter package shown in FIG. 1;

FIG. 3 is a bottom plan view of the emitter package shown in FIG. 1;

FIG. 4 is front elevation view of the emitter package shown in FIG. 1, with the back elevation view being a mirror image thereof;

FIG. 5 is a right side elevation view of the emitter package shown in FIG. 1, with the left side elevation view being a mirror image thereof;

FIG. 6 is a bottom perspective view of the emitter package shown in FIG. 1;

FIG. 7 is a top perspective view of the second embodiment of an emitter package showing our design;

FIG. 8 is a top plan view of the emitter package shown in FIG. 7;

FIG. 9 is a bottom plan view of the emitter package shown in FIG. 7;

FIG. 10 is front elevation view of the emitter package shown in FIG. 7, with the back elevation view being a mirror thereof;

FIG. 11 is a right side elevation view of the emitter package shown in FIG. 7, with the left side elevation view being a mirror image thereof;

FIG. 12 is a bottom perspective view of the emitter package shown in FIG. 7;

FIG. 13 is a perspective view of the third embodiment of an emitter package showing our design;

FIG. 14 is a top plan view of the emitter package shown in FIG. 13;

FIG. 15 is a bottom plan view of the emitter package shown in FIG. 13;

FIG. 16 is front elevation view of the emitter package shown in FIG. 13, with the back elevation view being a mirror image thereof;

FIG. 17 is a right side elevation view of the emitter package shown in FIG. 13, with the left side elevation view being a mirror image thereof;

FIG. 18 is a bottom perspective view of the emitter package shown in FIG. 13;

FIG. 19 is a perspective view of the fourth embodiment of an emitter package showing our design;

FIG. 20 is a top plan view of the emitter package shown in FIG. 19;

FIG. 21 is a bottom plan view of the emitter package shown in FIG. 19;

FIG. 22 is front elevation view of the emitter package shown in FIG. 19, with the back elevation view being a mirror image thereof;

FIG. 23 is a right side elevation view of the emitter package shown in FIG. 19, with the left side elevation view being a mirror image thereof;

FIG. 24 is a bottom perspective view of the emitter package shown in FIG. 19;

FIG. 25 is a perspective view of the fifth embodiment of an emitter package showing our design;

FIG. 26 is a top plan view of the emitter package shown in FIG. 25;

FIG. 27 is a bottom plan view of the emitter package shown in FIG. 25;

FIG. 28 is front elevation view of the emitter package shown in FIG. 25, with the back elevation view being a mirror image thereof;

FIG. 29 is a right side elevation view of the emitter package shown in FIG. 25, with the left side elevation view being a mirror image thereof;

FIG. 30 is a bottom perspective view of the emitter package shown in FIG. 25;

FIG. 31 is a perspective view of the sixth embodiment of an emitter package showing our design;

FIG. 32 is a top plan view of the emitter package shown in FIG. 31;

FIG. 33 is a bottom plan view of the emitter package shown in FIG. 31;

FIG. 34 is front elevation view of the emitter package shown in FIG. 31, with the back elevation view being a mirror image thereof;

FIG. 35 is a right side elevation view of the emitter package shown in FIG. 31, with the left side elevation view being a mirror image thereof; and,

FIG. 36 is a bottom perspective view of the emitter package shown in FIG. 31.

The broken line showing in the embodiments of FIGS. 1–6, 1318, 1924 and 2530 are for illustrative purposes only and forms no part of the claimed design. The external surface having stippling or irregular lines in the embodiments of FIGS. 25–30 and 3136 indicate a rough visual appearance of the side surfaces of the emitter package. The top layer can have be visually transparent or translucent as shown in the embodiments of FIGS. 1–6, 1318, 1924 and 2530, and in some embodiments can optically distort the layer below.

Claims (1)

  1. The ornamental design for an emitter package, as shown and described.
US29292900 2007-10-31 2007-10-31 Emitter package Active USD615504S1 (en)

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Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100133554A1 (en) * 2009-06-05 2010-06-03 Cree, Inc. Solid state lighting device
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
USD656906S1 (en) 2008-01-10 2012-04-03 Cree Hong Kong Limited LED package
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8492777B2 (en) 2010-04-09 2013-07-23 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8696159B2 (en) 2010-09-20 2014-04-15 Cree, Inc. Multi-chip LED devices
US9053958B2 (en) 2011-01-31 2015-06-09 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
USD741821S1 (en) 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
US9401103B2 (en) 2011-02-04 2016-07-26 Cree, Inc. LED-array light source with aspect ratio greater than 1
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
US9627361B2 (en) 2010-10-07 2017-04-18 Cree, Inc. Multiple configuration light emitting devices and methods
US9634209B2 (en) 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
US9640737B2 (en) 2011-01-31 2017-05-02 Cree, Inc. Horizontal light emitting diodes including phosphor particles
US9673363B2 (en) 2011-01-31 2017-06-06 Cree, Inc. Reflective mounting substrates for flip-chip mounted horizontal LEDs
US9685592B2 (en) 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US9831220B2 (en) 2011-01-31 2017-11-28 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion

Citations (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183100B2 (en)
US3760237A (en) 1972-06-21 1973-09-18 Gen Electric Solid state lamp assembly having conical light director
US4307297A (en) 1978-09-12 1981-12-22 U.S. Philips Corporation Opto-electronic device
US4511425A (en) 1983-06-13 1985-04-16 Dennison Manufacturing Company Heated pad decorator
US5040868A (en) 1989-05-31 1991-08-20 Siemens Aktiengesellschaft Surface-mountable opto-component
US5130761A (en) 1990-07-17 1992-07-14 Kabushiki Kaisha Toshiba Led array with reflector and printed circuit board
US5167556A (en) 1990-07-03 1992-12-01 Siemens Aktiengesellschaft Method for manufacturing a light emitting diode display means
US5703401A (en) 1995-05-10 1997-12-30 U.S. Philips Corporation Miniature semiconductor device for surface mounting
US5706177A (en) 1994-12-24 1998-01-06 Temic Telefunken Microelectronic Gmbh Multi-terminal surface-mounted electronic device
US5790298A (en) 1994-05-03 1998-08-04 Gentex Corporation Method of forming optically transparent seal and seal formed by said method
US5813753A (en) 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
US5907151A (en) 1996-05-24 1999-05-25 Siemens Aktiengesellschaft Surface mountable optoelectronic transducer and method for its production
US5959316A (en) 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6061160A (en) * 1996-05-31 2000-05-09 Dowa Mining Co., Ltd. Component device for optical communication
US6066861A (en) 1996-09-20 2000-05-23 Siemens Aktiengesellschaft Wavelength-converting casting composition and its use
EP1005085A2 (en) 1998-11-19 2000-05-31 Matsushita Electronics Corporation Resin-encapsulated electronic device
JP2000223752A (en) 1999-01-29 2000-08-11 Fuji Kiko Denshi Kk Optical semiconductor device and its forming method
US6183100B1 (en) 1997-10-17 2001-02-06 Truck-Lite Co., Inc. Light emitting diode 360° warning lamp
US6259608B1 (en) 1999-04-05 2001-07-10 Delphi Technologies, Inc. Conductor pattern for surface mount devices and method therefor
US6296367B1 (en) 1999-10-15 2001-10-02 Armament Systems And Procedures, Inc. Rechargeable flashlight with step-up voltage converter and recharger therefor
EP1187228A1 (en) 2000-02-09 2002-03-13 Nippon Leiz Corporation Light source
EP1187226A1 (en) 2000-09-01 2002-03-13 Citizen Electronics Co., Ltd. Surface-mount type light emitting diode and method of manufacturing same
US6359236B1 (en) 1992-07-24 2002-03-19 Tessera, Inc. Mounting component with leads having polymeric strips
US6376902B1 (en) 1997-07-29 2002-04-23 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelectronic structural element
US20020061174A1 (en) 2000-01-21 2002-05-23 Hans Hurt Electro-optical data transfer module
US20020123163A1 (en) 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
US6454437B1 (en) 1999-07-28 2002-09-24 William Kelly Ring lighting
US20020163001A1 (en) 2001-05-04 2002-11-07 Shaddock David Mulford Surface mount light emitting device package and fabrication method
US20020171911A1 (en) 2001-05-17 2002-11-21 Mamoru Maegawa Method for adjusting the hue of the light emitted by a light-emitting diode
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US20020195935A1 (en) 1999-12-30 2002-12-26 Harald Jager Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source
US6610563B1 (en) 1997-12-15 2003-08-26 Osram Opto Semiconductors Gmbh & Co. Ohg Surface mounting optoelectronic component and method for producing same
US6614058B2 (en) 2001-07-12 2003-09-02 Highlink Technology Corporation Light emitting semiconductor device with a surface-mounted and flip-chip package structure
US6624491B2 (en) 1998-06-30 2003-09-23 Osram Opto Semiconductors Gmbh & Co. Diode housing
US20030183852A1 (en) 2002-03-20 2003-10-02 Sharp Kabushiki Kaisha Light emitting device and manufacturing method thereof
US6680490B2 (en) 2001-06-15 2004-01-20 Toyoda Gosei Co., Ltd. Light-emitting device
US6686609B1 (en) 2002-10-01 2004-02-03 Ultrastar Limited Package structure of surface mounting led and method of manufacturing the same
US20040041222A1 (en) 2002-09-04 2004-03-04 Loh Ban P. Power surface mount light emitting die package
US20040047151A1 (en) 2000-08-23 2004-03-11 Georg Bogner Optoelectronic component and method for the production thereof, module and device comprising a module of this type
US6707069B2 (en) 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
US6710373B2 (en) 1999-09-27 2004-03-23 Shih-Yi Wang Means for mounting photoelectric sensing elements, light emitting diodes, or the like
US20040079957A1 (en) 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
US20040080939A1 (en) 2001-04-23 2004-04-29 Jules Braddell Illuminator
US20040126913A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
US6770498B2 (en) * 2002-06-26 2004-08-03 Lingsen Precision Industries, Ltd. LED package and the process making the same
US6774401B2 (en) 2002-07-12 2004-08-10 Stanley Electric Co., Ltd. Light emitting diode
US20040227149A1 (en) 2003-04-30 2004-11-18 Cree, Inc. High powered light emitter packages with compact optics
US20040232435A1 (en) 2003-02-28 2004-11-25 Osram Opto Semiconductors Gmbh Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body
US20050023548A1 (en) 2003-07-31 2005-02-03 Bhat Jerome C. Mount for semiconductor light emitting device
CN1581527A (en) 2003-08-13 2005-02-16 西铁城电子股份有限公司 Luminous diode
CN1591924A (en) 2003-07-29 2005-03-09 西铁城电子股份有限公司 Surface-mounted LED and light emitting device with same
US20050051789A1 (en) * 2003-09-09 2005-03-10 Negley Gerald H. Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
US6872585B2 (en) 2001-09-03 2005-03-29 Toyoda Gosei Co., Ltd. LED device and manufacturing method thereof
US6876149B2 (en) 2002-01-31 2005-04-05 Citizen Electronics Co., Ltd. Double-face LED device for an electronic instrument
EP1521313A2 (en) 2003-10-03 2005-04-06 LumiLeds Lighting U.S., LLC Integrated reflector cup for a light emitting device mount
US20050072981A1 (en) 2002-02-19 2005-04-07 Ryoma Suenaga Light-emitting device and process for producing thereof
US20050077535A1 (en) 2003-10-08 2005-04-14 Joinscan Electronics Co., Ltd LED and its manufacturing process
US20050093005A1 (en) 2002-06-28 2005-05-05 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing it
US20050127377A1 (en) 2001-11-30 2005-06-16 Karlheinz Arndt Optoelectronic component
US6911678B2 (en) 2003-05-30 2005-06-28 Stanley Electric Co., Ltd. Glass-sealed light-emitting diode
US20050152127A1 (en) 2003-12-19 2005-07-14 Takayuki Kamiya LED lamp apparatus
US20050177320A1 (en) 2003-07-01 2005-08-11 Northwestern University Gas flow method for detection of preform defects based on transient pressure measurement
US20050179376A1 (en) 2004-02-13 2005-08-18 Fung Elizabeth C.L. Light emitting diode display device
US6940704B2 (en) 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
US6975011B2 (en) 1995-09-29 2005-12-13 Osram Gmbh Optoelectronic semiconductor component having multiple external connections
US6995510B2 (en) 2001-12-07 2006-02-07 Hitachi Cable, Ltd. Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
CN1744335A (en) 2004-08-31 2006-03-08 斯坦雷电气株式会社 Surface mount LED
US20060049477A1 (en) 2002-11-29 2006-03-09 Karlheinz Arndt Optoelectronic component
US7021797B2 (en) 2003-05-13 2006-04-04 Light Prescriptions Innovators, Llc Optical device for repositioning and redistributing an LED's light
US20060108594A1 (en) 2004-11-11 2006-05-25 Kazuyuki Iwasaki LED device and method for manufacturing the same
WO2006054228A2 (en) 2004-11-18 2006-05-26 Koninklijke Philips Electronics N.V. Illuminator and method for producing such illuminator
US7064907B2 (en) 2003-06-12 2006-06-20 Seiko Epson Corporation Optical part and its manufacturing method
US7066626B2 (en) 2003-04-09 2006-06-27 Citizen Electronics Co., Ltd. LED lamp
US20060157828A1 (en) 2002-09-17 2006-07-20 Osram Opto Semiconductor Gmbh Leadframe - based housing, leadframe strip, surface - mounted optoelectronic -component, and production method
US20060220046A1 (en) 2005-03-04 2006-10-05 Chuan-Pei Yu Led
US7119422B2 (en) 2004-11-15 2006-10-10 Unity Opto Technology Co., Ltd. Solid-state semiconductor light emitting device
US7224000B2 (en) * 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US7285802B2 (en) 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
US20070269586A1 (en) 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
US20080074032A1 (en) 2004-04-19 2008-03-27 Tadashi Yano Method for Fabricating Led Illumination Light Source and Led Illumination Light Source
USD572210S1 (en) * 2006-11-01 2008-07-01 Lg Innotek Co., Ltd. Light-emitting diode (LED)
USD572670S1 (en) * 2006-03-30 2008-07-08 Nichia Corporation Light emitting diode
USD576574S1 (en) * 2007-07-17 2008-09-09 Rohm Co., Ltd. Light emitting diode module

Patent Citations (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183100B2 (en)
US3760237A (en) 1972-06-21 1973-09-18 Gen Electric Solid state lamp assembly having conical light director
US4307297A (en) 1978-09-12 1981-12-22 U.S. Philips Corporation Opto-electronic device
US4511425A (en) 1983-06-13 1985-04-16 Dennison Manufacturing Company Heated pad decorator
US5040868A (en) 1989-05-31 1991-08-20 Siemens Aktiengesellschaft Surface-mountable opto-component
EP1187227A2 (en) 1989-05-31 2002-03-13 Osram Opto Semiconductors GmbH & Co. oHG Surface-mountable optical element and method of fabrication
US5167556A (en) 1990-07-03 1992-12-01 Siemens Aktiengesellschaft Method for manufacturing a light emitting diode display means
US5130761A (en) 1990-07-17 1992-07-14 Kabushiki Kaisha Toshiba Led array with reflector and printed circuit board
US6359236B1 (en) 1992-07-24 2002-03-19 Tessera, Inc. Mounting component with leads having polymeric strips
US5790298A (en) 1994-05-03 1998-08-04 Gentex Corporation Method of forming optically transparent seal and seal formed by said method
US5706177A (en) 1994-12-24 1998-01-06 Temic Telefunken Microelectronic Gmbh Multi-terminal surface-mounted electronic device
US5703401A (en) 1995-05-10 1997-12-30 U.S. Philips Corporation Miniature semiconductor device for surface mounting
US6975011B2 (en) 1995-09-29 2005-12-13 Osram Gmbh Optoelectronic semiconductor component having multiple external connections
US5907151A (en) 1996-05-24 1999-05-25 Siemens Aktiengesellschaft Surface mountable optoelectronic transducer and method for its production
US6061160A (en) * 1996-05-31 2000-05-09 Dowa Mining Co., Ltd. Component device for optical communication
US6066861A (en) 1996-09-20 2000-05-23 Siemens Aktiengesellschaft Wavelength-converting casting composition and its use
US5813753A (en) 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
US6376902B1 (en) 1997-07-29 2002-04-23 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelectronic structural element
US6759733B2 (en) 1997-07-29 2004-07-06 Osram Opto Semiconductors Gmbh Optoelectric surface-mountable structural element
US20040238930A1 (en) 1997-07-29 2004-12-02 Osram Opto Semiconductors Gmbh Surface-mountable light-emitting diode structural element
US6469321B2 (en) 1997-07-29 2002-10-22 Osram Opto Semiconductors Gmbh & Co. Ohg Surface-mountable light-emitting diode structural element
US6573580B2 (en) 1997-07-29 2003-06-03 Osram Opto Semiconductors Gmbh & Co. Ohg Surface-mountable light-emitting diode structural element
US6183100B1 (en) 1997-10-17 2001-02-06 Truck-Lite Co., Inc. Light emitting diode 360° warning lamp
US6946714B2 (en) 1997-12-15 2005-09-20 Osram Gmbh Surface mounting optoelectronic component and method for producing same
US20060022212A1 (en) 1997-12-15 2006-02-02 Osram Gmbh, A Germany Corporation Surface mounting optoelectronic component and method for producing same
US6610563B1 (en) 1997-12-15 2003-08-26 Osram Opto Semiconductors Gmbh & Co. Ohg Surface mounting optoelectronic component and method for producing same
US6624491B2 (en) 1998-06-30 2003-09-23 Osram Opto Semiconductors Gmbh & Co. Diode housing
US6858879B2 (en) 1998-06-30 2005-02-22 Osram Opto Semiconductors Gmbh Diode housing
US5959316A (en) 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
EP1005085A2 (en) 1998-11-19 2000-05-31 Matsushita Electronics Corporation Resin-encapsulated electronic device
JP2000223752A (en) 1999-01-29 2000-08-11 Fuji Kiko Denshi Kk Optical semiconductor device and its forming method
US6259608B1 (en) 1999-04-05 2001-07-10 Delphi Technologies, Inc. Conductor pattern for surface mount devices and method therefor
US6454437B1 (en) 1999-07-28 2002-09-24 William Kelly Ring lighting
US6710373B2 (en) 1999-09-27 2004-03-23 Shih-Yi Wang Means for mounting photoelectric sensing elements, light emitting diodes, or the like
US6296367B1 (en) 1999-10-15 2001-10-02 Armament Systems And Procedures, Inc. Rechargeable flashlight with step-up voltage converter and recharger therefor
US20020195935A1 (en) 1999-12-30 2002-12-26 Harald Jager Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source
US20020061174A1 (en) 2000-01-21 2002-05-23 Hans Hurt Electro-optical data transfer module
EP1187228A1 (en) 2000-02-09 2002-03-13 Nippon Leiz Corporation Light source
US20020123163A1 (en) 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
US6919586B2 (en) 2000-04-24 2005-07-19 Rohm Co., Ltd. Side-emission type semiconductor light-emitting device and manufacturing method thereof
US20040047151A1 (en) 2000-08-23 2004-03-11 Georg Bogner Optoelectronic component and method for the production thereof, module and device comprising a module of this type
EP1187226A1 (en) 2000-09-01 2002-03-13 Citizen Electronics Co., Ltd. Surface-mount type light emitting diode and method of manufacturing same
US6940704B2 (en) 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
US20040080939A1 (en) 2001-04-23 2004-04-29 Jules Braddell Illuminator
US20020163001A1 (en) 2001-05-04 2002-11-07 Shaddock David Mulford Surface mount light emitting device package and fabrication method
US20020171911A1 (en) 2001-05-17 2002-11-21 Mamoru Maegawa Method for adjusting the hue of the light emitted by a light-emitting diode
US6680490B2 (en) 2001-06-15 2004-01-20 Toyoda Gosei Co., Ltd. Light-emitting device
US6614058B2 (en) 2001-07-12 2003-09-02 Highlink Technology Corporation Light emitting semiconductor device with a surface-mounted and flip-chip package structure
US6872585B2 (en) 2001-09-03 2005-03-29 Toyoda Gosei Co., Ltd. LED device and manufacturing method thereof
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US20050127377A1 (en) 2001-11-30 2005-06-16 Karlheinz Arndt Optoelectronic component
US6995510B2 (en) 2001-12-07 2006-02-07 Hitachi Cable, Ltd. Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
US6707069B2 (en) 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
US6876149B2 (en) 2002-01-31 2005-04-05 Citizen Electronics Co., Ltd. Double-face LED device for an electronic instrument
US20050072981A1 (en) 2002-02-19 2005-04-07 Ryoma Suenaga Light-emitting device and process for producing thereof
US20030183852A1 (en) 2002-03-20 2003-10-02 Sharp Kabushiki Kaisha Light emitting device and manufacturing method thereof
US6770498B2 (en) * 2002-06-26 2004-08-03 Lingsen Precision Industries, Ltd. LED package and the process making the same
US20050093005A1 (en) 2002-06-28 2005-05-05 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing it
US6900511B2 (en) 2002-06-28 2005-05-31 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing it
US6774401B2 (en) 2002-07-12 2004-08-10 Stanley Electric Co., Ltd. Light emitting diode
US7224000B2 (en) * 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US20040079957A1 (en) 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
CN1679168A (en) 2002-09-04 2005-10-05 克立公司 Power surface mount light emitting die package
US20040041222A1 (en) 2002-09-04 2004-03-04 Loh Ban P. Power surface mount light emitting die package
US20060157828A1 (en) 2002-09-17 2006-07-20 Osram Opto Semiconductor Gmbh Leadframe - based housing, leadframe strip, surface - mounted optoelectronic -component, and production method
US7102213B2 (en) 2002-09-17 2006-09-05 Osram Opto Semiconductors Gmbh Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method
US6686609B1 (en) 2002-10-01 2004-02-03 Ultrastar Limited Package structure of surface mounting led and method of manufacturing the same
US20060049477A1 (en) 2002-11-29 2006-03-09 Karlheinz Arndt Optoelectronic component
US20040126913A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
US20040232435A1 (en) 2003-02-28 2004-11-25 Osram Opto Semiconductors Gmbh Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body
US7066626B2 (en) 2003-04-09 2006-06-27 Citizen Electronics Co., Ltd. LED lamp
US20040227149A1 (en) 2003-04-30 2004-11-18 Cree, Inc. High powered light emitter packages with compact optics
US7021797B2 (en) 2003-05-13 2006-04-04 Light Prescriptions Innovators, Llc Optical device for repositioning and redistributing an LED's light
US6911678B2 (en) 2003-05-30 2005-06-28 Stanley Electric Co., Ltd. Glass-sealed light-emitting diode
US7064907B2 (en) 2003-06-12 2006-06-20 Seiko Epson Corporation Optical part and its manufacturing method
US20050177320A1 (en) 2003-07-01 2005-08-11 Northwestern University Gas flow method for detection of preform defects based on transient pressure measurement
CN1591924A (en) 2003-07-29 2005-03-09 西铁城电子股份有限公司 Surface-mounted LED and light emitting device with same
US20050023548A1 (en) 2003-07-31 2005-02-03 Bhat Jerome C. Mount for semiconductor light emitting device
CN1581527A (en) 2003-08-13 2005-02-16 西铁城电子股份有限公司 Luminous diode
US20050051789A1 (en) * 2003-09-09 2005-03-10 Negley Gerald H. Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
EP1521313A2 (en) 2003-10-03 2005-04-06 LumiLeds Lighting U.S., LLC Integrated reflector cup for a light emitting device mount
US20050077535A1 (en) 2003-10-08 2005-04-14 Joinscan Electronics Co., Ltd LED and its manufacturing process
WO2005043627A1 (en) 2003-10-22 2005-05-12 Cree, Inc. Power surface mount light emitting die package
US20050152127A1 (en) 2003-12-19 2005-07-14 Takayuki Kamiya LED lamp apparatus
US20050179376A1 (en) 2004-02-13 2005-08-18 Fung Elizabeth C.L. Light emitting diode display device
US20080074032A1 (en) 2004-04-19 2008-03-27 Tadashi Yano Method for Fabricating Led Illumination Light Source and Led Illumination Light Source
CN1744335A (en) 2004-08-31 2006-03-08 斯坦雷电气株式会社 Surface mount LED
US20060108594A1 (en) 2004-11-11 2006-05-25 Kazuyuki Iwasaki LED device and method for manufacturing the same
US7119422B2 (en) 2004-11-15 2006-10-10 Unity Opto Technology Co., Ltd. Solid-state semiconductor light emitting device
WO2006054228A3 (en) 2004-11-18 2006-08-03 Samber Marc A De Illuminator and method for producing such illuminator
WO2006054228A2 (en) 2004-11-18 2006-05-26 Koninklijke Philips Electronics N.V. Illuminator and method for producing such illuminator
US7285802B2 (en) 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
US20060220046A1 (en) 2005-03-04 2006-10-05 Chuan-Pei Yu Led
USD572670S1 (en) * 2006-03-30 2008-07-08 Nichia Corporation Light emitting diode
US20070269586A1 (en) 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
USD572210S1 (en) * 2006-11-01 2008-07-01 Lg Innotek Co., Ltd. Light-emitting diode (LED)
USD576574S1 (en) * 2007-07-17 2008-09-09 Rohm Co., Ltd. Light emitting diode module

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
JP 2001 060072A , Abstract, Matsushita Electric Ind. Co Ltd., March 6, 222001.
Kim J.K et al. "Strongly Enhanced Phosphor Efficiency in GaInN White Light-Emitting Diodes Using Remote Phosphor Configuration and Diffuse Reflector Cup" Japanese Journal of Applied Physics, Japan Society of Applied Physics, Tokyo, JP, vol. 44, No. 20-23, Jan. 1, 2005 XP-001236966, pp. 649-651.
Nicha Corp., White LED Part No. NSPW312BS, Specification for Nichia White Led, Model NSPW312BS. Jan. 14, 2004.
Nichia Corp. White LED Part No. NSPW300BS, Specification for Nichia White LED , Model NSPW300BS., Jan. 14, 2004.

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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USD656906S1 (en) 2008-01-10 2012-04-03 Cree Hong Kong Limited LED package
USD671661S1 (en) 2008-01-10 2012-11-27 Cree Hong Kong Limited LED package
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US9685592B2 (en) 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
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US20100133554A1 (en) * 2009-06-05 2010-06-03 Cree, Inc. Solid state lighting device
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US8492777B2 (en) 2010-04-09 2013-07-23 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
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US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
USD708156S1 (en) * 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
US9041042B2 (en) 2010-09-20 2015-05-26 Cree, Inc. High density multi-chip LED devices
US8696159B2 (en) 2010-09-20 2014-04-15 Cree, Inc. Multi-chip LED devices
US9627361B2 (en) 2010-10-07 2017-04-18 Cree, Inc. Multiple configuration light emitting devices and methods
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USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
USD704358S1 (en) 2011-01-03 2014-05-06 Cree, Inc. High brightness LED package
US9053958B2 (en) 2011-01-31 2015-06-09 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
US9831220B2 (en) 2011-01-31 2017-11-28 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
US9673363B2 (en) 2011-01-31 2017-06-06 Cree, Inc. Reflective mounting substrates for flip-chip mounted horizontal LEDs
US9640737B2 (en) 2011-01-31 2017-05-02 Cree, Inc. Horizontal light emitting diodes including phosphor particles
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US9401103B2 (en) 2011-02-04 2016-07-26 Cree, Inc. LED-array light source with aspect ratio greater than 1
US9634209B2 (en) 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
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US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD741821S1 (en) 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
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USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
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