USD614152S1 - Substrate transfer device for semiconductor deposition apparatus - Google Patents

Substrate transfer device for semiconductor deposition apparatus Download PDF

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Publication number
USD614152S1
USD614152S1 US29/331,021 US33102109F USD614152S US D614152 S1 USD614152 S1 US D614152S1 US 33102109 F US33102109 F US 33102109F US D614152 S USD614152 S US D614152S
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US
United States
Prior art keywords
transfer device
deposition apparatus
substrate transfer
semiconductor deposition
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/331,021
Inventor
Jeong Ho Lee
Sang Jin Jeong
Young Seok Choi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asm Korea Ltd
Original Assignee
Genitech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Genitech Co Ltd filed Critical Genitech Co Ltd
Assigned to ASM GENITECH KOREA LTD. reassignment ASM GENITECH KOREA LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHOI, YOUNG SEOK, JEONG, SANG JIN, LEE, JEONG HO
Application granted granted Critical
Publication of USD614152S1 publication Critical patent/USD614152S1/en
Assigned to ASM KOREA LTD. reassignment ASM KOREA LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: ASM GENITECH KOREA, LTD.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a substrate transfer device that may be positioned in a semiconductor deposition apparatus, showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The ornamental design which is claimed is shown in solid lines in the drawings.

Claims (1)

  1. The ornamental design for a substrate transfer device for semiconductor deposition apparatus, as shown and described.
US29/331,021 2008-07-21 2009-01-16 Substrate transfer device for semiconductor deposition apparatus Expired - Lifetime USD614152S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2008-0031456 2008-07-21
KR20080031456 2008-07-21

Publications (1)

Publication Number Publication Date
USD614152S1 true USD614152S1 (en) 2010-04-20

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Family Applications (1)

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US29/331,021 Expired - Lifetime USD614152S1 (en) 2008-07-21 2009-01-16 Substrate transfer device for semiconductor deposition apparatus

Country Status (2)

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US (1) USD614152S1 (en)
TW (1) TWD133946S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD695240S1 (en) * 2011-10-20 2013-12-10 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
USD938373S1 (en) * 2019-10-25 2021-12-14 Applied Materials, Inc. Substrate transfer structure
USD997892S1 (en) * 2019-11-28 2023-09-05 Kokusai Electric Corporation End effector for handling wafers

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5826129A (en) * 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
US6132160A (en) * 1997-06-27 2000-10-17 Tokyo Electron Limited Substrate transferring apparatus
US6183183B1 (en) 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6234738B1 (en) * 1998-04-24 2001-05-22 Mecs Corporation Thin substrate transferring apparatus
US6293749B1 (en) 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6614201B2 (en) * 2000-02-07 2003-09-02 Tazmo Co., Ltd. Substrate transfer system
US20040070914A1 (en) * 2000-12-12 2004-04-15 David Ferreres Electrostatic device for holding an electronic component wafer
US20050034664A1 (en) 2001-11-08 2005-02-17 Koh Won Yong Apparatus for depositing
US6991419B2 (en) * 2001-04-16 2006-01-31 Samsung Electronics Co., Ltd. Method and apparatus for transferring a wafer
US20070031222A1 (en) * 2005-08-05 2007-02-08 Tokyo Electron Limited Substrate transfer apparatus and method, and storage medium
US7186297B2 (en) * 2000-12-15 2007-03-06 Kabushiki Kaisha Yaskawa Denki Wafer holding apparatus
USD559805S1 (en) * 2005-08-12 2008-01-15 Tokyo Electron Limited Stage arm for a semiconductor wafer delivery apparatus
US7578649B2 (en) * 2002-05-29 2009-08-25 Brooks Automation, Inc. Dual arm substrate transport apparatus

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5826129A (en) * 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
US6183183B1 (en) 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6132160A (en) * 1997-06-27 2000-10-17 Tokyo Electron Limited Substrate transferring apparatus
US6293749B1 (en) 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6234738B1 (en) * 1998-04-24 2001-05-22 Mecs Corporation Thin substrate transferring apparatus
US6614201B2 (en) * 2000-02-07 2003-09-02 Tazmo Co., Ltd. Substrate transfer system
US20040070914A1 (en) * 2000-12-12 2004-04-15 David Ferreres Electrostatic device for holding an electronic component wafer
US7186297B2 (en) * 2000-12-15 2007-03-06 Kabushiki Kaisha Yaskawa Denki Wafer holding apparatus
US6991419B2 (en) * 2001-04-16 2006-01-31 Samsung Electronics Co., Ltd. Method and apparatus for transferring a wafer
US20050034664A1 (en) 2001-11-08 2005-02-17 Koh Won Yong Apparatus for depositing
US7578649B2 (en) * 2002-05-29 2009-08-25 Brooks Automation, Inc. Dual arm substrate transport apparatus
US20070031222A1 (en) * 2005-08-05 2007-02-08 Tokyo Electron Limited Substrate transfer apparatus and method, and storage medium
USD559805S1 (en) * 2005-08-12 2008-01-15 Tokyo Electron Limited Stage arm for a semiconductor wafer delivery apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD695240S1 (en) * 2011-10-20 2013-12-10 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
USD938373S1 (en) * 2019-10-25 2021-12-14 Applied Materials, Inc. Substrate transfer structure
USD997892S1 (en) * 2019-11-28 2023-09-05 Kokusai Electric Corporation End effector for handling wafers

Also Published As

Publication number Publication date
TWD133946S1 (en) 2010-03-21

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