USD614152S1 - Substrate transfer device for semiconductor deposition apparatus - Google Patents
Substrate transfer device for semiconductor deposition apparatus Download PDFInfo
- Publication number
- USD614152S1 USD614152S1 US29/331,021 US33102109F USD614152S US D614152 S1 USD614152 S1 US D614152S1 US 33102109 F US33102109 F US 33102109F US D614152 S USD614152 S US D614152S
- Authority
- US
- United States
- Prior art keywords
- transfer device
- deposition apparatus
- substrate transfer
- semiconductor deposition
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000008021 deposition Effects 0.000 title claims description 3
- 239000004065 semiconductor Substances 0.000 title claims description 3
- 239000000758 substrate Substances 0.000 title claims description 3
Images
Description
The ornamental design which is claimed is shown in solid lines in the drawings.
Claims (1)
- The ornamental design for a substrate transfer device for semiconductor deposition apparatus, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR30-2008-0031456 | 2008-07-21 | ||
| KR20080031456 | 2008-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD614152S1 true USD614152S1 (en) | 2010-04-20 |
Family
ID=42103655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/331,021 Expired - Lifetime USD614152S1 (en) | 2008-07-21 | 2009-01-16 | Substrate transfer device for semiconductor deposition apparatus |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD614152S1 (en) |
| TW (1) | TWD133946S1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD695240S1 (en) * | 2011-10-20 | 2013-12-10 | Tokyo Electron Limited | Arm for wafer transportation for manufacturing semiconductor |
| USD701498S1 (en) * | 2011-10-20 | 2014-03-25 | Tokyo Electron Limited | Arm for wafer transportation for manufacturing semiconductor |
| USD785578S1 (en) * | 2016-03-22 | 2017-05-02 | Asm Ip Holding B.V. | Substrate supporting arm for semiconductor manufacturing apparatus |
| USD938373S1 (en) * | 2019-10-25 | 2021-12-14 | Applied Materials, Inc. | Substrate transfer structure |
| USD997892S1 (en) * | 2019-11-28 | 2023-09-05 | Kokusai Electric Corporation | End effector for handling wafers |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5826129A (en) * | 1994-06-30 | 1998-10-20 | Tokyo Electron Limited | Substrate processing system |
| US6132160A (en) * | 1997-06-27 | 2000-10-17 | Tokyo Electron Limited | Substrate transferring apparatus |
| US6183183B1 (en) | 1997-01-16 | 2001-02-06 | Asm America, Inc. | Dual arm linear hand-off wafer transfer assembly |
| US6234738B1 (en) * | 1998-04-24 | 2001-05-22 | Mecs Corporation | Thin substrate transferring apparatus |
| US6293749B1 (en) | 1997-11-21 | 2001-09-25 | Asm America, Inc. | Substrate transfer system for semiconductor processing equipment |
| US6614201B2 (en) * | 2000-02-07 | 2003-09-02 | Tazmo Co., Ltd. | Substrate transfer system |
| US20040070914A1 (en) * | 2000-12-12 | 2004-04-15 | David Ferreres | Electrostatic device for holding an electronic component wafer |
| US20050034664A1 (en) | 2001-11-08 | 2005-02-17 | Koh Won Yong | Apparatus for depositing |
| US6991419B2 (en) * | 2001-04-16 | 2006-01-31 | Samsung Electronics Co., Ltd. | Method and apparatus for transferring a wafer |
| US20070031222A1 (en) * | 2005-08-05 | 2007-02-08 | Tokyo Electron Limited | Substrate transfer apparatus and method, and storage medium |
| US7186297B2 (en) * | 2000-12-15 | 2007-03-06 | Kabushiki Kaisha Yaskawa Denki | Wafer holding apparatus |
| USD559805S1 (en) * | 2005-08-12 | 2008-01-15 | Tokyo Electron Limited | Stage arm for a semiconductor wafer delivery apparatus |
| US7578649B2 (en) * | 2002-05-29 | 2009-08-25 | Brooks Automation, Inc. | Dual arm substrate transport apparatus |
-
2008
- 2008-12-15 TW TW097307075F patent/TWD133946S1/en unknown
-
2009
- 2009-01-16 US US29/331,021 patent/USD614152S1/en not_active Expired - Lifetime
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5826129A (en) * | 1994-06-30 | 1998-10-20 | Tokyo Electron Limited | Substrate processing system |
| US6183183B1 (en) | 1997-01-16 | 2001-02-06 | Asm America, Inc. | Dual arm linear hand-off wafer transfer assembly |
| US6132160A (en) * | 1997-06-27 | 2000-10-17 | Tokyo Electron Limited | Substrate transferring apparatus |
| US6293749B1 (en) | 1997-11-21 | 2001-09-25 | Asm America, Inc. | Substrate transfer system for semiconductor processing equipment |
| US6234738B1 (en) * | 1998-04-24 | 2001-05-22 | Mecs Corporation | Thin substrate transferring apparatus |
| US6614201B2 (en) * | 2000-02-07 | 2003-09-02 | Tazmo Co., Ltd. | Substrate transfer system |
| US20040070914A1 (en) * | 2000-12-12 | 2004-04-15 | David Ferreres | Electrostatic device for holding an electronic component wafer |
| US7186297B2 (en) * | 2000-12-15 | 2007-03-06 | Kabushiki Kaisha Yaskawa Denki | Wafer holding apparatus |
| US6991419B2 (en) * | 2001-04-16 | 2006-01-31 | Samsung Electronics Co., Ltd. | Method and apparatus for transferring a wafer |
| US20050034664A1 (en) | 2001-11-08 | 2005-02-17 | Koh Won Yong | Apparatus for depositing |
| US7578649B2 (en) * | 2002-05-29 | 2009-08-25 | Brooks Automation, Inc. | Dual arm substrate transport apparatus |
| US20070031222A1 (en) * | 2005-08-05 | 2007-02-08 | Tokyo Electron Limited | Substrate transfer apparatus and method, and storage medium |
| USD559805S1 (en) * | 2005-08-12 | 2008-01-15 | Tokyo Electron Limited | Stage arm for a semiconductor wafer delivery apparatus |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD695240S1 (en) * | 2011-10-20 | 2013-12-10 | Tokyo Electron Limited | Arm for wafer transportation for manufacturing semiconductor |
| USD701498S1 (en) * | 2011-10-20 | 2014-03-25 | Tokyo Electron Limited | Arm for wafer transportation for manufacturing semiconductor |
| USD785578S1 (en) * | 2016-03-22 | 2017-05-02 | Asm Ip Holding B.V. | Substrate supporting arm for semiconductor manufacturing apparatus |
| USD938373S1 (en) * | 2019-10-25 | 2021-12-14 | Applied Materials, Inc. | Substrate transfer structure |
| USD997892S1 (en) * | 2019-11-28 | 2023-09-05 | Kokusai Electric Corporation | End effector for handling wafers |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD133946S1 (en) | 2010-03-21 |
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